KR101336828B1 - Heat sink for light emitting device array - Google Patents

Abstract

The present invention relates to a heat sink for an optical element array, in which a plurality of units can be combined according to a required output to release heat generated from a plurality of unit optical element arrays, thereby reducing mold cost and management cost for manufacturing a heat sink. will be.
The heat sink for the optical element array of the present invention is made of a heat conducting material and a plurality of heat dissipation fins are arranged side by side in the width direction, and the left end, the right end, or both ends are formed with coupling grooves or coupling protrusions that are coupled with other heat sink blocks. And a heat sink block having a heat dissipation fin portion and a substrate fixing portion protruding from an upper surface of the heat dissipation fin portion to fix the unit optical device array substrate.
In the above-described configuration, three or more heat sink blocks are assembled to form a heat sink, wherein the heat sink block is a right heat sink block and an intermediate heat sink block respectively disposed at right, middle, and left ends of the heat sink. And the left heat sink block.
The coupling protrusion or the coupling groove is characterized in that it has a sliding dovetail coupling structure.

Description

Heat sink for light emitting device array

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink for an optical element array, and more particularly, to a heat sink for an optical element array in which a plurality are coupled to dissipate heat generated in a plurality of unit optical element arrays according to a required output.

In general, a light emitting diode (LED), which is a semiconductor light emitting diode, is attracting attention in various fields as an environmentally friendly light source that does not cause pollution. Recently, as the use range of LED is extended to various fields such as indoor / outdoor lighting, automotive headlights, and back-light units (BLUs) of display devices, high light efficiency and excellent heat emission characteristics are required. In order to obtain a high-efficiency LED, it is necessary to first improve the material or structure of the LED, but also need to improve the structure of the LED package and the materials used therefor.

Such high-efficiency LEDs generate high temperatures, and if they are not effectively emitted, the temperature of the LEDs becomes high, which deteriorates the characteristics thereof, thereby decreasing the service life. Therefore, efforts are being made to effectively dissipate the heat generated from the LED in a highly efficient LED package.

Hereinafter, various devices that emit light, including LEDs, are collectively referred to as an "optical device", and a product in which two or more optical devices are arranged side by side in a matrix form is called an "optical device array." The horizontal arrangement of) is called a row and the vertical arrangement is called a column. Accordingly, optical devices arranged vertically in each column are connected in parallel with each other, while optical devices arranged horizontally in each row are connected in series with each other.

1A to 1C are perspective views illustrating various examples of a heat sink for a conventional optical element array, respectively. First, FIG. 1A shows an optical element array, for example, in which three optical elements are arranged in parallel on an aluminum substrate 10 and three optical elements are consumed in total 30 W. In FIG. 1B, for example, an aluminum substrate ( An array of optical elements is shown which dissipates a total of 60 W, with four optical elements arranged in parallel and six in parallel in 30). In FIG. 1C, for example, eight and in parallel to an aluminum substrate 50 are shown. An optical device array is shown in which six optical devices are placed, consuming a total of 120 W of power. In FIG. 1, reference numerals 12, 32, and 52 denote vertical insulating layers that insulate each row from adjacent rows, and 14, 34, and 54 represent optical elements 16, 36, and 56 mounted thereon. A groove-shaped cavity made of a light beam is shown. The cavities 14, 34, and 54 contain a transparent or fluorescent material that protects the optical elements 16, 36, and 56. Ash (not shown) may be enclosed.

However, according to the conventional optical element array product as shown in FIG. 1, heat sinks 20, 40, and (of different sizes and shapes according to power consumption (hereinafter referred to as 'output') required by the product. Due to the requirement of 60), not only the mold cost for manufacturing the heat sink for each output is increased, but also the management cost for separately managing many different types of heat sinks has been increased.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and can reduce the mold cost and management cost for heat sink manufacturing by allowing a plurality of units to be combined to release heat generated from a plurality of unit optical device arrays according to a required output. An object of the present invention is to provide a heat sink for an optical element array.

The heat sink for the optical element array of the present invention for achieving the above object is made of a heat conducting material and a plurality of heat dissipation fins are arranged side by side in the width direction and coupled to the other end of the heat sink block on the left end, right end or both ends And a heat sink block including a heat dissipation fin part having a groove or a coupling protrusion formed thereon and a substrate fixing part protruding from an upper surface of the heat dissipation fin part to fix the unit optical device array substrate.

In the above-described configuration, three or more heat sink blocks are assembled to form a heat sink, wherein the heat sink block is a right heat sink block and an intermediate heat sink block respectively disposed at right, middle, and left ends of the heat sink. And the left heat sink block.

The coupling protrusion or the coupling groove is characterized in that it has a sliding dovetail coupling structure.

The substrate fixing part is integrally formed with the heat dissipation fin part, and has a wall protruding in a vertical direction from an upper surface of the heat dissipation fin part and a fixing head extending by a predetermined length in left, right or both directions of the upper end of the wall. On the other hand, the heat dissipation fin portion is formed with a coupling blade insertion hole in the width direction, the substrate fixing portion is made of a synthetic resin material is coupled to the heat dissipation fin portion and the other body, the coupling blade inserted into the coupling blade insertion hole, the center portion of the coupling wing The wall and the unit optical element array substrate having a predetermined height in the width direction is characterized in that it comprises a fixed head extending from both ends of the upper end of the wall so as not to be separated upward.

The fixed head is characterized in that the cross section of the upper and lower light shape.

At least one through hole is formed in the wall to penetrate the wall laterally, and the through hole includes a compression spring and two contact balls that are externally applied by both of the compression springs to the side of the adjacent unit optical device array substrate. It is characterized in that the conductive connector in contact with the built-in.

At least one through hole is formed in the wall to penetrate the wall laterally, and the through hole includes a compression spring and two contact balls that are externally applied by both of the compression springs to the side of the adjacent unit optical device array substrate. It is characterized in that the conductive connector in contact with the built-in.

According to the heat sink for an optical element array of the present invention, a plurality of units can be combined according to a required output to release heat generated from a plurality of unit optical element arrays, thereby reducing mold cost and management cost for manufacturing the heat sink. .

1A to 1C are perspective views each showing various examples of a conventional heat sink for an optical element array.
2A to 2C are perspective views showing the structure of the middle, left and right heat sink blocks of the heat sink for an optical device array according to one embodiment of the present invention, respectively.
3A to 3C are perspective views showing the structure of the middle, left and right heat sink blocks of the heat sink for an optical device array according to another embodiment of the present invention, respectively.
4 illustrates a structure of a conductive connector for electrically connecting a unit optical device array substrate.
5A and 5B are respectively a perspective view and a cross-sectional view taken along line AA of an optical device array product using the heat sink block shown in FIG.
6A and 6B are a perspective view and a cross-sectional view taken along line AA of an optical device array product using the heat sink block shown in FIG. 3, respectively.
7A and 7B illustrate a principle of implementing an optical device array product by connecting unit optical device array substrates in series and in parallel.
8 is a perspective view of an optical device array product using a heat sink block according to another embodiment of the present invention.
9A and 9B are cross-sectional views taken along line AA and BB of the optical device array product shown in FIG. 8, respectively.
FIG. 10 is an exploded perspective view illustrating a structure of the substrate fixing part of FIG. 8. FIG.
11A and 11B are cross-sectional views illustrating a state in which an encapsulant is applied to the optical device array products of FIGS. 5B and 6B, respectively.

Hereinafter, a preferred embodiment of a heat sink for an optical element array of the present invention will be described in detail.

2A to 2C are perspective views showing the structure of the middle, left and right heat sink blocks of the heat sink for the optical element array according to the exemplary embodiment of the present invention, respectively. FIGS. 5A and 5B are the heat shown in FIG. A perspective view and an AA cross-sectional view of an optical device array product using a sink block. First, as shown in FIGS. 2 and 5, the intermediate heat sink block 100 according to the present invention may be formed of a material having good thermal conductivity, for example, aluminum, and is formed at a lower portion of the intermediate heat sink block 100. ) Is formed at the center portion of the heat dissipation fin unit 110 and the upper surface of the heat dissipation fin unit 110 which are arranged side by side in the width direction (the direction toward the front and rear surfaces in the drawing; It may be made including a substrate fixing part 120 for fixing the.

In the above-described configuration, the coupling protrusion 114 and the coupling groove 116 are at the same height so that the heat sink block and the sliding dovetail may be coupled to the right end and the right end of the heat dissipation fin unit 110. It is formed side by side in the width direction. The substrate fixing part 120 has a predetermined height, that is, a height equal to the thickness of the unit optical device array substrate 70 at the center of the upper surface of the heat dissipation fin part 110, and the wall 122 and the unit light arranged in the width direction. It consists of a fixed head 124 extending slightly larger than the horizontal length of the wall 122 at the top of the wall 122 so that the element array substrate 70 does not deviate upwards, in this case the reflection efficiency of the light generated in the optical device. In order to increase the horizontal longitudinal section of the fixing head 124 is implemented in the upper and lower light (上 峽 下 廣) shape, that is, the horizontal longitudinal section of the substrate fixing part 120 is preferably implemented in a shade or mushroom shape.

On the other hand, the wall 122 may be provided with a conductive connector 130 for electrically connecting the adjacent unit optical element array substrate 70, which will be described later.

Next, the left and right heat sink blocks 200 and 300 also include heat dissipation fin parts 210 and 310 and substrate fixing parts 220 and 320 like the middle heat sink block 100. The approximate width of the width may be about half that of the intermediate heat sink block 100. In addition, the coupling groove 214 is formed only on the right side of the heat dissipation fin unit 210 of the left heat sink block 200, while the coupling protrusion 314 is formed only on the left side of the heat dissipation fin unit 310 of the right heat sink block 300. Can be formed. Each substrate fixing portion 220, 320 also has walls 222, 322 and fixing heads 224, 324, in which case the fixing head 224 of the left heatsink block 200. ) May only extend to the right of the wall 222, while the fixing head 324 of the right heatsink block 300 may extend only to the left of the wall 322. Heat sink blocks 100, 200, and 300 according to the embodiment shown in FIG. 2 may be cut and used by appropriate lengths after being manufactured by an extrusion process, and the middle, left and right heat sink blocks 100 may be used. Three molds will be required to manufacture (), (200) and (300). On the other hand, according to the present embodiment, since the coupling is performed only by the heat sink block itself without adopting an external coupling means (coupling rod to be described later), the number of parts is reduced and the coupling process is simplified.

3A to 3C are perspective views showing the structure of the middle, left and right heat sinks of an optical element array heat sink according to another embodiment of the present invention, respectively. FIGS. 6A and 6B are heat sinks shown in FIG. 3, respectively. A perspective view and a cross-sectional view taken along the line AA of the optical device array product using the block, the same reference numerals are given to the same configuration as in Fig. 2 and the detailed description thereof is omitted. 3 and 6, according to the intermediate heat sink block 100 ′ according to the present embodiment, coupling grooves 116 l and 116 r in the width direction at the same height on both sides of the heat dissipation fin part 110 ′. ) Is formed. As a result, when the two adjacent heat sink blocks according to the present embodiment face each other, a butterfly-shaped coupling groove, that is, a coupling groove that is narrower and wider toward both sides, is formed. By inserting the coupling rod 400 into the coupling groove, two adjacent heat sink blocks are firmly coupled. Accordingly, the coupling grooves 214 'and 314' are formed on the right side of the heat dissipation fin 210 'of the left heat sink block 200' and the left side of the heat dissipation fin 310 of the right heat sink block 300 '. ) Will be formed. The bonding rod 400 may be made of the same material as that of the heat sink blocks 100 ', 200', and 300 ', for example, aluminum, or made of another material, for example, a synthetic resin material.

On the other hand, in the present embodiment, the substrate fixing parts 220 and 320 of the left heat sink block 200 ′ and the right heat sink block 300 ′ are walls 222 and 322 of each of the heat dissipation fin parts 210. '), 310 is formed to be spaced apart from the left end and the right end by a predetermined interval, the space provided in this way (hereinafter referred to as the "circuit board mounting portion") 230, 330 is to be mounted on the various circuit boards of the product Could be. 3 and 5, since the left and right heat sink blocks 200 'and 300' are symmetrically formed, only one direction is cut after cutting the same length from one mold. In other words, the left and right heat sink blocks 200 'and 300' may be used, and thus the number of molds for manufacturing the heat sink blocks is reduced to two.

4 is a diagram illustrating a structure of a conductive connector for electrically connecting a unit optical device array substrate. As shown in FIG. 4, according to the heat sink for an optical element array of the present invention, the conductive connector 130 penetrates one or more (serial connection) or two or more (parallel connection) penetrating the wall 122. It may be implemented as a ball connector installed in the ball (122a). Specifically, the diameter of the through hole 122a is the same as the diameter of the contact balls 132 and 138, and one side end of the through hole 122a, for example, the right end of the through hole 122a, may not be detached from the contact ball. It consists of a small diameter end portion (122b) slightly smaller than the diameter of 132, the female thread (122c) is formed on the main surface of the other end, for example, the right end of the through hole (122a), the male screw (136c) on the outer peripheral surface It is formed and screwed with the fixed stopper 136, the through-hole 136a is formed in the outer end surface is formed a small diameter end portion 136b of a diameter smaller than the diameter of the contact ball 138. In the above-described configuration, by the tension of the compression spring 134 interposed between the contact balls 132, 138 in the state in which the contact balls 132, 138 are accommodated on both sides of the through hole 122a. The contact balls 132 and 138 are subjected to an external force, and by such a structure, the heat sink blocks 100 and 100 ', 200 and 200', and 300 and 300 'are coupled to each other. In this state, the optical element array substrate 70 can be accommodated in the width direction of the substrate fixing parts 120, 220, and 320. The contact balls 132, 138 and the tension spring 134 will of course be implemented with a metal material with good electrical conductivity.

On the other hand, in the middle, left and right heatsink block (100; 100 '), (200; 200'), (300; 300 ') except the inclined portions of the fixed head 122, 222, 322 The upper surface and the walls 122, 222, 322 and the through hole 122a of the portion, that is, the heat radiation fins 110, 210, 210 ', 210', and 310 'are unit light. It is preferable to be anodized for electrical insulation between the element array substrate 70. The inclined portions of the fixed heads 124, 224, and 324 are preferably not anodized to increase the light reflection efficiency, and a silver plated layer may be further formed.

7A and 7B illustrate a principle of implementing an optical device array product by connecting unit optical device arrays in series and in parallel. In FIG. 7, reference numerals 70 and 70 ′ denote unit optical element array substrates, 72 indicates a vertical insulation layer, 74 indicates a cavity, 76 indicates an optical element, and 78 indicates an increase in contact area with contact balls 132 and 138. The semi-circular ball contact grooves formed in the unit optical element array substrates 70 and 70 'are shown. Thus, the contact balls 132 and 138 of the conductive connector 130 and the unit optical element array substrate ( It is possible to reduce both the poor contact and the electrical resistance between 70 and 70 '.

8 is a perspective view of an optical device array product using a heat sink block according to still another embodiment of the present invention. FIGS. 9A and 9B are cross-sectional views taken along line AA and BB of the heat sink shown in FIG. 8, respectively. FIG. 8 is a perspective view illustrating a substrate fixing part in FIG. 8. 8 to 10, according to the present embodiment, the conductive connector embedded in the substrate fixing part 500 is in contact with the unit optical device array substrate 70 on the upper surface of the unit optical device array substrate 70. For this purpose, all parts of the substrate fixing part 500 except for the conductive connector may be made of a synthetic resin material.

In detail, the substrate fixing part 500 includes a coupling blade 510 formed at a lower portion thereof, a wall 520 and a unit optical device array substrate 70 arranged in a width direction at a central portion of the coupling blade 510. A fixing head 530 extending slightly larger than the horizontal length of the wall 520 at the top of the wall 520 so as not to deviate upwards, and a conductive connector embedded in the fixing head 530, in this case an optical In order to increase the reflection efficiency of the light generated by the device, the horizontal longitudinal section of the fixing head 530 is implemented in the form of light and down light, that is, the horizontal longitudinal section of the substrate fixing part 500 is preferably implemented in a lampshade or mushroom shape. In order to increase the reflection efficiency of the light generated in the metal plating layer, for example, a silver plating layer is preferably formed on the inclined portion.

Meanwhile, in manufacturing the above-described substrate fixing part 500, two through holes 532a into which the contact ball 554 and the compression spring 552 constituting the conductive connector are inserted, and these two through holes 532a and The contact ball 554 and the compression spring 552 are connected to each through hole 532a in a state where the fixed head lower portion 532 having the conductive rod receiving hole 532c communicating therewith is separated from the upper fixed head upper portion 534. The sequential insertion is followed by the insertion of the conductive rod 540 onto the compression spring 552, and again covering the top of the fixing head 534 thereon to complete the manufacture. The lower head 532 and the upper head 534 may be bonded by an adhesive or bonded by ultrasonic welding. In the drawings, reference numerals 534a and 532b represent coupling protrusions and coupling grooves formed and formed at the fixed head upper portion 534 and the fixed head lower portion 532, respectively.

Next, in the present embodiment, the coupling blade insertion hole 150 in which the coupling blade 510 is fitted in the width direction of the heat dissipation fin portion of the intermediate heat sink block 100 ″ to conform to the structure of the substrate fixing part 500 described above. It is formed in the width direction.

11A and 11B are cross-sectional views illustrating a state in which an encapsulant is formed on the optical device array products of FIGS. 5B and 6B, respectively. First, as shown in FIG. 11A, the encapsulant may be formed to cover each unit optical element array substrate, or as illustrated in FIG. 11B, to cover all of the plurality of unit optical element array substrates. In order to prevent it from being displayed, it shows a departure prevention groove formed in the inclined portion of the fixed head. The encapsulant may be implemented in a convex lens shape.

The heat sink for an optical element array of the present invention is not limited to the above-described embodiment, and various modifications can be performed within the range allowed by the technical idea of the present invention. For example, in the above-described embodiment, the description has been made with the output of the unit optical device array substrate as 30 W, but may be formed differently. In addition, the adjacent unit optical device array substrates may be electrically connected by separate conductors without forming a conductive connector in the substrate fixing part. Two or more coupling protrusions or coupling grooves coupled to the heat dissipation fins may be formed up and down. You can do it. In addition, the structure of the substrate fixing unit shown in FIGS. 2 and 3 may also be modified to have a conductive connector in a manner of being in contact with the top surface of the unit optical element array substrate, as shown in FIG. The substrate fixing part may change its structure to have a conductive connector in a manner of being in contact with the side of the unit optical element array substrate as shown in FIGS. 2 and 3.

10, 30, 50: optical element array substrate, 12, 32, 52, 72: vertical insulating layer,
14, 34, 54, 74: cavity, 16, 36, 56, 76: optical element,
20, 40, 60: heat sink, 70, 70 ': substrate,
78: ball contact groove,
100, 100 ', 100 ": middle heat sink block, 110, 210, 210', 310, 310 ': heat sink fins,
112, 212, 312: heat sink fins, 114, 314: engaging projection,
116, 214, 116l, 116r, 214 ', 314': coupling groove,
120, 220, 320: substrate fixing part, 122, 222, 322: wall,
124, 224, 324: fixed head, 122a: through hole,
122b: small diameter end, 122c: female thread,
130: conductive connector, 132, 138: contact ball,
134: compression spring, 136: fixing stopper,
136a: through hole, 136b: small diameter end,
136c: male thread, 150: blade insertion hole,
200, 200 ': left heat sink block, 230, 330: circuit board seating portion,
300, 300 ': right heatsink block, 400: bond bar, 500: substrate holding part,
510: combined wing, 520: wall,
530: fixed head, 532: lower fixed head,
532a: through hole, 532b: coupling groove,
534: upper fixed head, 534a: engaging projection,
540: conductive rod, 552 compression spring,
554: contact ball, 600, 700: encapsulant,
H: Breakaway prevention groove

Claims (8)

A heat dissipation fin part formed of a heat conducting material and having a plurality of heat dissipation fins arranged side by side in a width direction and having a coupling groove or a coupling protrusion coupled to another heat sink block at a left end, a right end, or both ends; And
It is made to include a heat sink block having a; and a substrate fixing portion coupled to the top surface of the heat dissipation fin portion to fix the unit optical device array substrate,
Coupling blade insertion hole is formed in the heat radiation fin portion in the width direction,
The substrate fixing part is made of a synthetic resin material and is coupled to the heat dissipation fin part separately, the coupling blade is inserted into the coupling blade insertion hole, the wall and the unit optical element array arranged in the width direction with a predetermined height at the central portion of the coupling blade And a fixing head extending from both ends of the wall to both ends thereof so that the substrate does not escape upward. The heat sink block of claim 1, wherein at least three heat sink blocks are coupled to each other, and the coupling grooves or coupling protrusions formed on the heat dissipation fins of the respective heat sink blocks are coupled to the coupling protrusions or coupling grooves of the adjacent heat sink blocks, respectively. A heat sink for an optical element array, comprising a sink. The heat sink of claim 2, wherein the coupling protrusion and the coupling groove between the adjacent heat sink blocks have a structure that is fitted in a sliding manner. A heat dissipation fin part formed of a heat conducting material and having a plurality of heat dissipation fins arranged side by side in a width direction and having a coupling groove or a coupling protrusion coupled to another heat sink block at a left end, a right end, or both ends; And
The unit optical element array substrate is formed integrally with the heat dissipation fin unit and includes a wall protruding in a vertical direction from an upper surface of the heat dissipation fin unit and a fixing head extending by a predetermined length in the left, right, or both directions of the upper end of the wall. It comprises a heat sink block having a substrate fixing;
At least one through hole is formed in the wall to penetrate the wall laterally, and the through hole includes a compression spring and two contact balls that are externally applied by both of the compression springs to the side of the adjacent unit optical device array substrate. The heat sink for an optical element array, characterized in that the conductive connector is in contact with the contact. The heat sink of claim 4, wherein at least three heat sink blocks are coupled to each other, and a coupling groove or a coupling protrusion formed at a heat dissipation fin of each of the heat sink blocks to be coupled is coupled to a coupling protrusion or coupling groove of an adjacent heat sink block. Heat sink for an optical device array, characterized in that the configuration. The heat sink for an optical element array according to claim 1 or 4, wherein the fixing head has a cross-sectional light shape in cross-section thereof. 3. The method according to claim 1 or 2,
At least one through hole is formed in the wall to penetrate the wall laterally, and the through hole includes a compression spring and two contact balls that are externally applied by both of the compression springs to the side of the adjacent unit optical device array substrate. The heat sink for an optical element array, characterized in that the conductive connector is in contact with the contact. delete

Images