KR101175165B1 - 증발장치, 증착장치 및 증착장치에 있어서의 증발장치의전환방법 - Google Patents
증발장치, 증착장치 및 증착장치에 있어서의 증발장치의전환방법 Download PDFInfo
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- KR101175165B1 KR101175165B1 KR1020067022161A KR20067022161A KR101175165B1 KR 101175165 B1 KR101175165 B1 KR 101175165B1 KR 1020067022161 A KR1020067022161 A KR 1020067022161A KR 20067022161 A KR20067022161 A KR 20067022161A KR 101175165 B1 KR101175165 B1 KR 101175165B1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/246—Replenishment of source material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
- F04D17/08—Centrifugal pumps
- F04D17/16—Centrifugal pumps for displacing without appreciable compression
- F04D17/168—Pumps specially adapted to produce a vacuum
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (4)
- 삭제
- 진공하에서 소정의 재료를 증발시키는 증발장치로서,배기장치에 접속됨과 아울러 상부에 증발된 증발재료를 방출할 수 있는 재료 방출구멍이 형성된 증발용 용기와, 이 증발용 용기 내에 승강장치에 의해 승강 가능하게 설치됨과 아울러 재료를 수납한 재료 수납용기를 적재할 수 있는 적재대가 구비되고,상기 증발용 용기의 재료 방출구멍의 주위에, 상기 재료 수납용기가 적재대를 통해서 상승되었을 때에 그 외주를 덮음으로써 증발재료의 상기 증발용 용기 내로의 방출을 억제하는 통형상의 격벽부재가 설치되고,상기 적재대 및 격벽부재에 상기 재료 수납용기를 가열하는 가열장치가 설치되며,또 상기 적재대측에, 상기 적재대가 승강장치에 의해 상승되었을 때에 격벽부재의 하단부에 접촉해서 상기 격벽부재 내의 증발재료의 배출을 저지할 수 있는 접촉부가 설치된 것을 특징으로 하는 증발장치.
- 제2항에 기재된 2대 이상의 증발장치와, 진공하에서 피증착부재에 증발재료를 증착시키는 1개의 증착용 용기와, 이 증착용 용기와 상기 각 증발장치의 재료 방출구멍 사이에 걸쳐서 형성된 재료 이송통로가 구비된 증착장치로서,상기 재료 이송통로의 일단측이 상기 증착용 용기측에 접속되고 또한 타단측이 분기되어서 각각 상기 각 증발장치의 재료 방출구멍에 접속되고,또한 이들 분기된 재료 이송통로의 도중에 개폐밸브가 각각 배치된 것을 특징으로 하는 증착장치.
- 2대이상의 증발장치를 이용하여 1개의 증착용 용기에 증발재료를 공급해서 증착을 행하도록 한 제3항에 기재된 증착장치에 있어서 사용되는 증발장치를 전환하는 방법으로서:한쪽의 증발장치에 있어서 재료가 부족상태로 되기 전에, 다른 쪽의 증발장치의 재료 수납용기를 격벽부재 내에 상승시켜서, 가열장치에서 재료의 증발온도보다 낮은 소정온도로 가열하는 예비 가열스텝;낮은 온도로 가열된 재료 수납용기를 격벽부재로부터 하강시켜서, 상기 재료 수납용기 내에서 기화된 불순물을 배기장치에 의해 외부로 배출하는 불순물 배출스텝;불순물의 배출 후에 다시 격벽부재 내에 재료 수납용기를 상승시켜서 재료의 증발온도로 가열하는 본 가열스텝; 및상기 한쪽의 증발장치의 재료 이송통로에 설치된 개폐밸브를 폐쇄함과 아울러 다른 쪽의 증발장치의 재료 이송통로에 설치된 개폐밸브를 개방하는 스텝이 구비된 것을 특징으로 하는 증착장치에 있어서의 증발장치의 전환방법.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004189282A JP4570403B2 (ja) | 2004-06-28 | 2004-06-28 | 蒸発装置、蒸着装置および蒸着装置における蒸発装置の切替方法 |
| JPJP-P-2004-00189282 | 2004-06-28 | ||
| PCT/JP2005/010948 WO2006001205A1 (ja) | 2004-06-28 | 2005-06-15 | 蒸発装置、蒸着装置および蒸着装置における蒸発装置の切替方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20070024519A KR20070024519A (ko) | 2007-03-02 |
| KR101175165B1 true KR101175165B1 (ko) | 2012-08-20 |
Family
ID=35776668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020067022161A Expired - Fee Related KR101175165B1 (ko) | 2004-06-28 | 2006-10-25 | 증발장치, 증착장치 및 증착장치에 있어서의 증발장치의전환방법 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4570403B2 (ko) |
| KR (1) | KR101175165B1 (ko) |
| CN (1) | CN100558929C (ko) |
| TW (1) | TWI398535B (ko) |
| WO (1) | WO2006001205A1 (ko) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009149916A (ja) * | 2006-09-14 | 2009-07-09 | Ulvac Japan Ltd | 真空蒸気処理装置 |
| JP5036264B2 (ja) * | 2006-09-19 | 2012-09-26 | 日立造船株式会社 | 真空蒸着装置 |
| TWI353389B (en) * | 2007-02-09 | 2011-12-01 | Au Optronics Corp | Evaporation coater and evaporation source replacem |
| JP5153410B2 (ja) * | 2008-03-31 | 2013-02-27 | Hoya株式会社 | レンズ成膜方法、蒸着装置及びレンズの製造方法 |
| US8741062B2 (en) * | 2008-04-22 | 2014-06-03 | Picosun Oy | Apparatus and methods for deposition reactors |
| KR101084234B1 (ko) | 2009-11-30 | 2011-11-16 | 삼성모바일디스플레이주식회사 | 증착원, 이를 구비하는 증착 장치 및 박막 형성 방법 |
| DE102010017895A1 (de) * | 2010-04-21 | 2011-10-27 | Ald Vacuum Technologies Gmbh | Vorrichtung zum Beschichten von Substraten nach dem EB/PVD-Verfahren |
| CN103380227B (zh) * | 2011-03-15 | 2015-05-20 | 夏普株式会社 | 蒸镀颗粒射出装置和蒸镀装置 |
| WO2013005781A1 (ja) * | 2011-07-05 | 2013-01-10 | 東京エレクトロン株式会社 | 成膜装置 |
| JP5405549B2 (ja) * | 2011-10-20 | 2014-02-05 | 株式会社日本製鋼所 | 真空成膜方法および真空成膜装置 |
| JP6021377B2 (ja) * | 2012-03-28 | 2016-11-09 | 日立造船株式会社 | 真空蒸着装置および真空蒸着装置におけるるつぼ交換方法 |
| JP6222929B2 (ja) * | 2013-01-15 | 2017-11-01 | 日立造船株式会社 | 真空蒸着装置 |
| JP6430528B2 (ja) * | 2013-11-05 | 2018-11-28 | タタ、スティール、ネダーランド、テクノロジー、ベスローテン、フェンノートシャップTata Steel Nederland Technology Bv | 蒸発器デバイス内の液体金属の組成を制御するための方法および装置 |
| FR3018082B1 (fr) | 2014-03-03 | 2016-03-18 | Riber | Procede de rechargement d'une cellule d'evaporation |
| CN106062240B (zh) * | 2014-03-11 | 2018-09-28 | 株式会社日本有机雷特显示器 | 蒸镀装置以及使用了蒸镀装置的蒸镀方法、以及器件的制造方法 |
| FR3020381B1 (fr) * | 2014-04-24 | 2017-09-29 | Riber | Cellule d'evaporation |
| JP6302786B2 (ja) * | 2014-08-01 | 2018-03-28 | シャープ株式会社 | 蒸着装置、蒸着方法、及び有機el素子の製造方法 |
| JP6445959B2 (ja) * | 2015-12-16 | 2018-12-26 | 株式会社オプトラン | 成膜装置および成膜方法 |
| KR102561591B1 (ko) * | 2018-07-02 | 2023-08-02 | 삼성디스플레이 주식회사 | 증착 장치 및 이를 이용한 증착 방법 |
| CN109321884A (zh) * | 2018-10-17 | 2019-02-12 | 武汉华星光电半导体显示技术有限公司 | 蒸镀装置 |
| WO2021207904A1 (zh) | 2020-04-14 | 2021-10-21 | 眉山博雅新材料有限公司 | 一种晶体生长方法和装置 |
| KR102859881B1 (ko) * | 2020-11-18 | 2025-09-12 | 주식회사 엘지화학 | 유기발광다이오드의 증착장치 |
| CN112553691A (zh) * | 2020-12-02 | 2021-03-26 | 中电化合物半导体有限公司 | 碳化硅晶体生长方法及生长装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003129224A (ja) * | 2001-10-26 | 2003-05-08 | Matsushita Electric Works Ltd | 真空蒸着装置及び真空蒸着方法 |
| JP2004099942A (ja) * | 2002-09-05 | 2004-04-02 | Kiko Kenji Kagi Kofun Yugenkoshi | 成膜装置用蒸発源、成膜装置用蒸発源の加熱装置、及びそれらを用いた成膜材料加熱蒸発装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3773587B2 (ja) * | 1996-04-15 | 2006-05-10 | 株式会社アルバック | 有機化合物モノマーの精製方法 |
| JP3863988B2 (ja) * | 1998-02-06 | 2006-12-27 | 株式会社アルバック | 蒸着装置 |
| US6202591B1 (en) * | 1998-11-12 | 2001-03-20 | Flex Products, Inc. | Linear aperture deposition apparatus and coating process |
| JP2003155555A (ja) * | 2001-11-15 | 2003-05-30 | Eiko Engineering Co Ltd | 薄膜堆積用複合分子線源セル |
| CN2618925Y (zh) * | 2003-05-08 | 2004-06-02 | 深圳市创欧科技有限公司 | 用于制作有机电致发光显示器的蒸镀装置 |
-
2004
- 2004-06-28 JP JP2004189282A patent/JP4570403B2/ja not_active Expired - Fee Related
-
2005
- 2005-06-15 CN CNB2005800146515A patent/CN100558929C/zh not_active Expired - Fee Related
- 2005-06-15 WO PCT/JP2005/010948 patent/WO2006001205A1/ja not_active Ceased
- 2005-06-24 TW TW094121254A patent/TWI398535B/zh not_active IP Right Cessation
-
2006
- 2006-10-25 KR KR1020067022161A patent/KR101175165B1/ko not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003129224A (ja) * | 2001-10-26 | 2003-05-08 | Matsushita Electric Works Ltd | 真空蒸着装置及び真空蒸着方法 |
| JP2004099942A (ja) * | 2002-09-05 | 2004-04-02 | Kiko Kenji Kagi Kofun Yugenkoshi | 成膜装置用蒸発源、成膜装置用蒸発源の加熱装置、及びそれらを用いた成膜材料加熱蒸発装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2006001205A1 (ja) | 2006-01-05 |
| TWI398535B (zh) | 2013-06-11 |
| KR20070024519A (ko) | 2007-03-02 |
| JP2006009107A (ja) | 2006-01-12 |
| JP4570403B2 (ja) | 2010-10-27 |
| CN1950537A (zh) | 2007-04-18 |
| TW200613575A (en) | 2006-05-01 |
| CN100558929C (zh) | 2009-11-11 |
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