KR101141371B1 - Cutting apparatus of ceramic sheets and fabrication method of multi layer ceramic electronics using the same - Google Patents

Abstract

The present invention relates to a ceramic sheet cutting device and a method of manufacturing a ceramic electronic component using the same, which can easily cut a ceramic sheet having no cutting mark formed on its side when manufacturing the ceramic electronic component.
The apparatus for cutting a ceramic sheet according to the present invention has a stage on which a ceramic sheet having a curved surface is seated, an illumination unit for irradiating light to the upper surface of the ceramic sheet, photographing an upper surface of the ceramic sheet, and recognizing a difference in contrast. And a cutting unit for cutting the ceramic sheet in accordance with the cutting position.

Description

Cutting apparatus of ceramic sheets and fabrication method of multi layer ceramic electronics using the same}

The present invention relates to a ceramic sheet cutting apparatus and a method for manufacturing a multilayer ceramic electronic component using the same, and more particularly, to a ceramic sheet cutting apparatus capable of easily cutting a ceramic sheet using an image camera, and ceramic electronics using the same. A method for manufacturing a part.

Generally, ceramic electronic components are mounted on printed circuit boards of various electronic products such as mobile communication terminals, laptops, computers, and personal portable terminals, and play an important role in charging or discharging electricity. For example, a capacitor in the form of a chip And may take various sizes and stacking forms depending on the intended use and capacity.

The ceramic electronic component first manufactures a ceramic sheet (or green sheet) formed by stacking a plurality of ceramic layers. Then, a final ceramic electronic component is obtained by performing a cutting process of separating the ceramic sheet into individual chips.

In the conventional ceramic sheet cutting process, a method of recognizing a cutting mark exposed to a side surface of a ceramic sheet is generally used, and cutting the ceramic sheet based on this.

Therefore, the conventional ceramic sheet cutting process cannot be utilized for the ceramic sheet having no cutting mark on the side. Accordingly, there is a demand for a cutting method capable of easily cutting a ceramic sheet without a cutting mark on its side.

Disclosure of Invention The present invention provides a ceramic sheet cutting apparatus capable of easily cutting a ceramic sheet having no cutting mark formed on its side when manufacturing a ceramic electronic component, and a method of manufacturing a ceramic electronic component using the same.

Ceramic sheet cutting device according to the present invention is a stage on which the ceramic sheet is formed on the upper surface is seated, the lighting unit for irradiating light to the upper surface of the ceramic sheet, the upper surface of the ceramic sheet is photographed, and the difference between the contrast and the ceramic sheet And a cutting unit for cutting the ceramic sheet according to the cutting position.

In an embodiment of the present invention, the lighting unit may irradiate light so that the contrast is identified according to the curvature of the ceramic sheet.

In an embodiment of the present invention, the lighting unit may irradiate light obliquely to the upper surface of the stage.

In an embodiment of the present disclosure, the image recognition unit may recognize cut positions disposed at both ends of the ceramic sheet, and calculate another cut position based on the recognized cut positions.

In an embodiment of the present invention, it may further include a moving unit for moving the stage so that the cutting position is disposed below the cutting portion.

In addition, the method for manufacturing a ceramic sheet according to an embodiment of the present invention comprises the steps of seating a ceramic sheet with a curved upper surface on the stage, irradiating light to the upper surface of the ceramic sheet, the upper surface of the ceramic sheet irradiated with light The method may include photographing, recognizing the difference in contrast, and identifying a cutting position of the ceramic sheet, and cutting the ceramic sheet according to the cutting position.

In an embodiment of the present invention, irradiating light may be irradiating light so that contrast is identified according to the curvature of the ceramic sheet.

In an embodiment of the present invention, irradiating light may be irradiating light obliquely to an upper surface of the stage.

In an embodiment of the present invention, the step of identifying the cutting position recognizes two cutting positions P1 and P2 disposed on the ceramic sheet, and based on the recognized two cutting positions P1 and P2, Calculating the cutting position.

In the embodiment of the present invention, the step of identifying the cutting position is based on the two cutting positions (P1, P2), calculating the cutting pitch (P) which is the interval between two adjacent cutting positions to calculate another cutting position It may be a step.

The ceramic sheet manufacturing method according to the embodiment of the present invention may satisfy the following Conditional Expression 1 with respect to the cutting pitch P. FIG.

(Condition 1) P = L / (C1-1)

Where P is the distance of the cutting pitch.

       L is the distance between cutting positions P1 and P2.

       C1 is the total number of cutting positions.

In the method of manufacturing a ceramic sheet according to an embodiment of the present invention, the following Conditional Expression 2 may be satisfied with respect to the total number C2 of cutting positions.

(Condition 2) C2 = L / P

Where C2 is the total number of cutting positions in real form.

       L is the measured distance between cutting positions P1 and P2.

The ceramic sheet manufacturing method according to the embodiment of the present invention may satisfy the following Conditional Expression 3 with respect to the correction value Cv of the cutting pitch P. FIG.

(Condition 3) Cv = (C2-C3) / C3

Where C3 is an integer removed from C2.

The ceramic sheet manufacturing method according to the embodiment of the present invention may satisfy the following Conditional Expression 4 with respect to the corrected cutting pitch P ′.

(Condition 4) P '= Cv + P

The apparatus for cutting a ceramic sheet according to the present invention and the method for manufacturing a ceramic electronic component using the same determine the cutting position based on the bend formed on the ceramic sheet, and thus it is possible to prevent cutting or breaking the electrode inside the ceramic sheet during cutting. .

In addition, the apparatus for cutting a ceramic sheet according to the present invention and a method for manufacturing a ceramic electronic component using the same identify a cutting position by using a bend formed in the ceramic sheet, and thus, a separate recognition mark on the ceramic sheet to identify the cutting position as in the prior art. Does not form. Therefore, the manufacturing process is simplified, thereby reducing the manufacturing cost.

1 is a plan view schematically showing a cutting device used in the ceramic sheet cutting process according to an embodiment of the present invention.
2 is a cross-sectional view taken along line AA ′ of FIG. 1;
3 is a view for explaining a cutting process according to an embodiment of the present invention.
4 is a flow chart schematically showing a cutting process according to an embodiment of the present invention.
5 is a perspective view schematically showing a green sheet according to an embodiment of the present invention.

Prior to the detailed description of the present invention, the terms or words used in the present specification and claims should not be construed as limited to ordinary or preliminary meaning, and the inventor may designate his own invention in the best way It should be construed in accordance with the technical idea of the present invention based on the principle that it can be appropriately defined as a concept of a term to describe it. Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention, and are not intended to represent all of the technical ideas of the present invention. Therefore, various equivalents It should be understood that water and variations may be present.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In this case, it should be noted that like elements are denoted by like reference numerals as much as possible. In addition, detailed descriptions of well-known functions and configurations that may blur the gist of the present invention will be omitted. For the same reason, some of the elements in the accompanying drawings are exaggerated, omitted, or schematically shown, and the size of each element does not entirely reflect the actual size.

1 is a plan view schematically showing a cutting apparatus used in a ceramic sheet cutting process according to an embodiment of the present invention, Figure 2 is a cross-sectional view taken along the line AA 'of FIG.

1 and 2, the cutting device 100 according to the present exemplary embodiment includes a stage 20, a transfer unit 25, an illumination unit 30, a cutting unit 40, and an image recognition unit 50. .

The stage 20 is where the ceramic sheet 10 to be cut is seated. Therefore, the ceramic sheet 10 is provided with a flat seating surface to be stably seated.

In addition, the stage 20 may include a plurality of suction ports 27 on the bottom surface to prevent the ceramic sheet 10 mounted on the seating surface from moving during the cutting process.

The suction port 27 may be connected to a vacuum pump (not shown) or the like. The ceramic sheet 10 seated on the stage 20 by suction of the vacuum pump is firmly adsorbed to the seating surface of the stage 20, whereby the ceramic sheet 10 is fixed in motion.

The transfer part 25 serves to move the stage 20 up, down, left, and right as needed, and may include a motor for this purpose. The stage 20 may be moved in various directions by the transfer unit 25, and may be rotated using a vertical axis as the rotation axis in the stage 20.

The lighting unit 30 irradiates light to the surface of the ceramic sheet 10 seated on the stage 20. At this time, the lighting unit 30 according to the present embodiment is characterized in that the light is irradiated on the surface of the ceramic sheet 10 so that the contrast is revealed along the curvature formed on the surface of the ceramic sheet 10.

To this end, the lighting unit 30 according to the present exemplary embodiment irradiates light to the stage 20 obliquely so as to be inclined at an angle with respect to the seating surface of the stage 20, not in a direction perpendicular to the stage 20.

In the present embodiment, the lighting unit 30 is an example in which four lights are configured to be arranged in all directions, but the present invention is not limited thereto. That is, if light can be irradiated to expose the contrast along the curvature formed on the surface of the ceramic sheet 10, various numbers of lights may be disposed at various positions.

The cutting unit 40 includes a cutting blade 42 and cuts the ceramic sheet 10 seated on the stage 20 by moving the cutting blade 42 up and down. To this end, the cutting unit 40 may include a driving unit (not shown) for driving the cutting blade 42 up and down.

The image recognition unit 50 is used to recognize the curvature of the ceramic sheet 10. To this end, the image recognition unit 50 may include a camera. If the camera is a camera capable of recognizing the contrast according to the bending formed on the ceramic sheet 10 may be used in a variety of types of camera.

Next, the ceramic sheet manufacturing method according to the present embodiment will be described.

First, a step of manufacturing the ceramic sheet 10 or green sheet is performed.

The ceramic sheet 10 is a molding process of continuously applying a slurry-type ceramic to a thin thickness of several tens of micrometers on a continuous PET (Polythylene terephthalate) film, a printing process of printing a conductive pattern on the surface of the applied ceramic, It is produced through a lamination step of laminating the sheets separated from the PET film in a predetermined number of layers, and a crimping step of pressing the laminated sheets at a predetermined pressure.

When the ceramic sheet 10 is manufactured through the above processes, a cutting process of cutting the ceramic sheet 10 along a predetermined direction and separating the ceramic sheet 10 into individual ceramic chips is performed. Through this cutting process, the ceramic sheet 10 takes the form of a final ceramic electronic component.

The present invention is related to the cutting process of the above-described process, it will be described in more detail as follows. On the other hand, the configuration of the above-described cutting device 100 will also be clearly described through the following description of the cutting method of the ceramic sheet.

3 is a view for explaining a cutting process according to an embodiment of the present invention, Figure 4 is a flow chart schematically showing a cutting process according to an embodiment of the present invention, Figure 5 is a ceramic sheet according to an embodiment of the present invention Is a perspective view schematically showing.

3 to 5 together, the cutting process according to the present embodiment, as shown in (a) of FIG. 3, first placing the ceramic sheet 10 on the seating surface of the stage 20 (S10). Is performed. At this time, as described above, the ceramic sheet 10 is firmly fixed to the seating surface of the stage 20 by the suction port 27 for sucking air.

As the ceramic sheet 10 mounted on the stage 20, a rod-shaped ceramic sheet 10 illustrated in FIG. 5 may be used. The rod-shaped ceramic sheet 10 may be formed by cutting the plate-shaped ceramic sheet 10 in a predetermined direction (horizontal or vertical direction). However, the ceramic sheet 10 according to the present invention is not limited to this rod shape.

Subsequently, in order to determine the cutting position as illustrated in FIG. 3B, the lighting unit 30 irradiates light onto the ceramic sheet 10 (S20).

As described above, the lighting unit 30 according to the present embodiment irradiates light on the ceramic sheet 10 at an oblique angle with respect to the surface (that is, the stage seating surface) of the ceramic sheet 10.

On the other hand, in the present embodiment, but the case in which the lighting unit 30 is configured to irradiate light after the ceramic sheet 10 is seated on the stage 20, but the present invention is not limited thereto. That is, regardless of whether the ceramic sheet 10 is seated or not, the lighting unit 30 may be configured to continuously radiate light toward the stage 20.

Next, when light is irradiated onto the ceramic sheet 10, the image recognition unit 50 subsequently photographs an image of the upper surface of the ceramic sheet 10 to identify a cutting position of the ceramic sheet 10 (S30). Is performed.

The image recognition unit 50 photographs the upper surface of the ceramic sheet 10 using a camera. Then, the contrast difference is calculated from the photographed image, and the curvature formed on the ceramic sheet 10 is identified based on this. This will be described in more detail as follows.

The ceramic sheet 10 is formed by stacking portions in which electrodes 12 are formed at the time of manufacture. Thus, as shown in FIG. 3B, the manufactured ceramic sheet 10 has a thickness D2 in which the electrode 12 is formed and is thicker than the portion D1 in which the electrode 12 is not formed.

Accordingly, the upper surface of the ceramic sheet 10 is formed in a recessed portion (hereinafter referred to as a recessed portion) in the portion D1 where the electrode 12 is not formed, compared to the portion D2 in which the electrode 12 is formed, As a result, the upper surface of the ceramic sheet 10 is curved.

Since the recess 14 is a portion where the electrode 12 is not formed during bending of the ceramic sheet 10, it becomes a cutting position of the ceramic sheet 10.

Because of the shape of the recess 14, the light irradiated from the lighting unit 30 is not evenly reflected, and as shown in FIG. 3B, the deepest bottom of the recess 14 is irradiated with light according to an incident angle. It may not be. As a result, the recess 14 reflects less light than other portions. In addition, due to the bending of the recess 14, light is diffusely reflected in various directions without being reflected in a constant direction.

For this reason, the image captured by the image recognizing unit 50 is dark in contrast to the periphery D2 of the portion corresponding to the recess 14. Therefore, the image recognition unit 50 according to the present embodiment recognizes the portion where the contrast is dark as the recess 14, that is, the cut position.

Subsequently, a step S40 of cutting the ceramic sheet 10 based on the identified cutting position is performed.

As shown in FIG. 3C, the transfer part 25 moves the stage 20 on which the ceramic sheet 10 is seated, thereby cutting the cutting position of the ceramic sheet 10 to the cutting edge 42 of the cut part 40. ) To the bottom. At this time, the transfer unit 25 aligns the stage 20 so that the cutting position of the ceramic sheet 10 is accurately disposed in the vertical movement path of the cutting blade 42.

When the cutting position and the cutting edge 42 are aligned in a straight line, the cutting portion 40 then moves the cutting edge 42 downward to cut the ceramic sheet 10 according to the cutting position.

When the cutting position of the ceramic sheet 10 is cut | disconnected, the cut part 40 moves the cutting blade 42 upward again. The transfer section 25 then moves the stage 20 again so that the next adjacent cutting position is placed below the cutting blade 42. As described above, the cut portion 40 cuts the ceramic sheet 10 along the second cut position.

The cutting process is repeatedly performed until all cutting positions of the ceramic sheet 10 are cut, and through such processes, the ceramic sheet 10 is separated into individual ceramic electronic components.

Meanwhile, in the above-described embodiment, after all the cutting positions are recognized by the image recognition unit 50, the ceramic sheet 10 is cut based on the example. However, the present invention is not limited thereto, and various methods may be additionally used as in the following embodiments.

In the method of manufacturing a ceramic electronic component according to the present embodiment, only a minimum cutting position is identified, and then other cutting positions are identified and cut based on the cutting position.

This will be described in more detail as follows.

In the case of this embodiment, only the step (S30) of identifying the cut position of the ceramic sheet 10 is different from the above-described embodiment. Therefore, the description of the process performed in the same manner as in the above-described embodiment will be omitted, and the step S30 of identifying the cutting position of the ceramic sheet 10 will be described in more detail.

In step S30 of identifying the cut position of the ceramic sheet 10, the image recognition unit 50 first recognizes two cut positions P1 and P2 disposed on the ceramic sheet 10. In this case, the two cut positions P1 and P2 recognized may be cut positions P1 and P2 disposed at both ends of the image recognition unit 50.

The image recognition unit 50 calculates the distance L between the two cutting positions P1 and P2, and then calculates the cutting pitch P through the following conditional expression (1).

(Condition 1) P = L / (C1-1)

Where L is the distance between cutting positions P1 and P2, and C1 is the total number of cutting positions.

That is, the distance between the two cutting positions P1 and P2 arranged at both ends of the ceramic sheet 10 is divided by the number of cutting positions C1-1 to determine the cutting pitch P, which is an interval between two adjacent cutting positions. You can get it.

The image recognition unit 50 applies the cutting pitch P calculated in this manner on the ceramic sheet 10 to identify the actual cutting position.

This embodiment can be easily applied when the total number C1 of the cutting positions provided in one ceramic sheet 10 is known.

On the other hand, when the total number C1 of the cutting positions is not known and only the cutting pitch P is known, the total number of the cutting positions can be obtained using the following Conditional Expression 2.

(Condition 2) C2 = L / P

Here, C2 is the total number of cutting positions in real form, and L is the distance (actual value) between cutting positions P1 and P2. In addition, the value of the cutting pitch P can be obtained through actual measurement.

If all the cutting pitches P in the ceramic sheet 10 are made identical, C2 is calculated as an integer. However, since the overall shape of the ceramic sheet 10 is partially deformed in the process of pressing the ceramic sheet 10 or the like, the measured value L is not maintained at the originally designed distance, and thus C2 is substantially non-integer, including a few. Is calculated in the form of a real number.

Therefore, the value represented by the decimal in C2 is the difference between the distance between the cut positions P1 and P2 by calculation and the distance between the cut positions P1 and P2 by measurement (ie, L) (that is, the deformed distance). Indicates.

In order to eliminate this difference, it is necessary to newly correct the cutting pitch. For this purpose, the following Conditional Equation 3 can be used.

(Condition 3) Cv = (C2-C3) / C3

Here, Cv is a correction value, and C3 is an integer obtained by removing a prime number from C2 (that is, the actual number of cutting positions).

In conditional expression 3, Cv means a value obtained by dividing the decimal value of C2 by the number of cutting positions (C3). That is, it means the distance which increases or decreases in one cutting pitch P. FIG.

Therefore, the corrected cutting pitch P 'can be obtained by adding the correction value Cv to the cutting pitch P as described in Conditional Expression 4.

(Condition 4) P '= Cv + P

As such, according to the present embodiment, when only the cutting pitch P is known, the distance L between the cutting positions P1 and P2 spaced apart from the ceramic sheet 10 by a predetermined distance is measured, and the cutting pitch P is measured. By correcting the difference between and the measurement distance (L) can be obtained a corrected cutting pitch (P ').

Thus, the image recognition unit 50 applies the corrected cutting pitch P ′ calculated in this manner on the ceramic sheet 10 to identify the actual cutting position.

The apparatus for cutting a ceramic sheet and the method for manufacturing a ceramic electronic component using the same according to the present embodiment described above determine the cutting position based on the bend formed on the ceramic sheet. It can prevent.

In addition, the ceramic sheet cutting apparatus and the ceramic electronic component manufacturing method using the same according to the present embodiment do not form a separate recognition mark on the ceramic sheet to identify the cutting position as in the prior art. Therefore, the manufacturing process is simplified, thereby reducing the manufacturing cost.

On the other hand, the ceramic sheet cutting apparatus according to the present invention described above and the ceramic electronic component manufacturing method using the same are not limited to the above-described embodiment, various applications are possible. For example, in the above-described embodiment, the case in which the rod-shaped green sheet is cut is described as an example, but the present invention is not limited thereto, and various types of ceramic green sheets may be applied.

In addition, this invention is not limited to the specific structure of embodiment or Example mentioned above. In particular, each component of the cutting device according to the present invention can be variously modified according to the shape and structure of the green sheet arrangement and driving direction.

For example, in the above-described embodiment, the motor is used for the vertical movement of the cutting blade and the movement of the stage. However, the present invention is not limited thereto, and various driving apparatuses such as a solenoid valve or a pump may be used.

In addition, in the above-described embodiment, the case in which the cutting unit is configured to be disposed adjacent to the image recognition unit is taken as an example.

In addition, in the above-described embodiment, the case in which the lighting unit is disposed to be inclined with the stage has been described as an example, but the present invention is not limited thereto, and the camera may recognize the contrast of the ceramic sheet such that the lighting unit is perpendicular to the stage. It can be arranged in various forms.

In addition, in the above-described embodiment, a case of cutting a ceramic sheet has been described as an example, but the present invention is not limited thereto, and the present invention may be easily applied to all cases of cutting a sheet having a curved surface at an upper surface thereof.

100: cutting device
10: ceramic sheet (green sheet)
12 electrode 14 recessed portion
20: stage 25: transfer section
27: inlet
30: lighting unit
40: cutting portion 42: cutting blade
50: image recognition unit

Claims (14)

A stage on which a ceramic sheet formed with a bend on the upper surface is seated;
An illumination unit for irradiating light to the upper surface of the ceramic sheet so that contrast is identified according to the curvature of the ceramic sheet;
An image recognition unit photographing an upper surface of the ceramic sheet and recognizing a difference in contrast to identify a cutting position of the ceramic sheet; And
A cutting unit for cutting the ceramic sheet according to the cutting position;
Ceramic sheet cutting device comprising a. delete The method of claim 1, wherein the lighting unit,
And irradiating light obliquely to the upper surface of the stage. A stage on which a ceramic sheet formed with a bend on the upper surface is seated;
An illumination unit for irradiating light to the upper surface of the ceramic sheet;
An image recognition unit photographing an upper surface of the ceramic sheet and recognizing a difference in contrast to identify a cutting position of the ceramic sheet; And
A cutting unit for cutting the ceramic sheet according to the cutting position;
Including;
The image recognition unit,
Recognizing a cutting position disposed on both ends of the ceramic sheet, and a different cutting position based on the recognized cutting position, characterized in that the ceramic sheet cutting device. The method of claim 1,
And a moving part for moving the stage such that the cutting position is disposed under the cutting part. Mounting a ceramic sheet having a curved surface on an upper surface thereof;
Irradiating light on the upper surface of the ceramic sheet so that contrast is identified according to the curvature of the ceramic sheet;
Photographing an upper surface of the ceramic sheet to which light is irradiated, and recognizing a difference in contrast to identify a cutting position of the ceramic sheet; And
Cutting the ceramic sheet according to the cutting position;
Ceramic sheet manufacturing method comprising a. delete The method of claim 6, wherein irradiating the light,
And irradiating light obliquely to the upper surface of the stage. Mounting a ceramic sheet having a curved surface on an upper surface thereof;
Irradiating light on the upper surface of the ceramic sheet;
Photographing an upper surface of the ceramic sheet to which light is irradiated, and recognizing a difference in contrast to identify a cutting position of the ceramic sheet; And
Cutting the ceramic sheet according to the cutting position;
Including;
Identifying the cutting position,
Recognizing two cutting positions (P1, P2) disposed on the ceramic sheet, and calculating a different cutting position based on the recognized two cutting positions (P1, P2) Manufacturing method. 10. The method of claim 9, wherein identifying the cut location comprises:
And calculating the other cutting positions by calculating a cutting pitch (P), which is an interval between two adjacent cutting positions, based on the two cutting positions (P1, P2). The method of claim 10,
A ceramic sheet manufacturing method characterized by satisfying the following Conditional Expression 1 with respect to the cutting pitch (P).
(Condition 1) P = L / (C1-1)
Where P is the distance of the cutting pitch.
L is the distance between cutting positions P1 and P2.
C1 is the total number of cutting positions. The method of claim 9,
A ceramic sheet manufacturing method characterized by satisfying the following Conditional Expression 2 with respect to the total number C2 of cutting positions.
(Condition 2) C2 = L / P
Where C2 is the total number of cutting positions in real form.
L is the measured distance between cutting positions P1 and P2.
P is the cutting pitch, which is the spacing between two adjacent cutting positions. The method of claim 12,
The following conditional expression 3 is satisfied with respect to the correction value Cv of the said cutting pitch P. The ceramic sheet manufacturing method characterized by the above-mentioned.
(Condition 3) Cv = (C2-C3) / C3
Where C3 is an integer removed from C2. The method of claim 13,
A ceramic sheet manufacturing method characterized by satisfying the following Conditional Expression 4 with respect to the corrected cutting pitch P '.
(Condition 4) P '= Cv + P

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