KR101128015B1 - 단일 나노 채널 형성 방법 - Google Patents
단일 나노 채널 형성 방법 Download PDFInfo
- Publication number
- KR101128015B1 KR101128015B1 KR1020100129668A KR20100129668A KR101128015B1 KR 101128015 B1 KR101128015 B1 KR 101128015B1 KR 1020100129668 A KR1020100129668 A KR 1020100129668A KR 20100129668 A KR20100129668 A KR 20100129668A KR 101128015 B1 KR101128015 B1 KR 101128015B1
- Authority
- KR
- South Korea
- Prior art keywords
- nano
- electrodes
- electrode
- captured
- capture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
- H10D84/0128—Manufacturing their channels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
- H10D62/118—Nanostructure semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
도 2는 형성된 탄소나노튜브 단일선 트랜지스터의 측면도.
도 3은 부도체 박막 위에 형성된 전극을 도시한 평면도.
도 4는 1차 전기영동 후의 도 3의 평면도.
도 5는 2차 전기영동 후의 도 4의 평면도.
도 6은 탄소나노튜브 단일선이 완성된 평면도.
도 7은 소스와 드레인 금속전극에 의한 전기력 분포도.
도 8은 탄소나노튜브 전극에 의한 전기력 분포도.
도 9는 완성된 탄소나노튜브 단일선의 사진.
20: 소스 금속전극
21: 드레인 금속전극
22: 게이트 금속전극
30: 반도체 또는 휘어지는 기판
31: 부도체 박막
40: 탄소나노튜브 용액
Claims (5)
- 마주보는 두 전극 사이에 미리 설정된 나노 크기 물질을 위치시키는 단계;
상기 두 전극 사이에 미리 설정된 전극 포획 전압을 인가하여 상기 두 전극에 각각 상기 나노 크기 물질을 포획하는 전극 포획 단계; 및
상기 두 전극 사이에 미리 설정된 나노 크기 물질 포획 전압을 인가하여, 상기 포획된 나노 크기 물질에 전극마다 각각 하나의 상기 나노 크기 물질을 포획하는 연속 포획 단계를 포함하는 단일 나노 채널 형성 방법으로서,
상기 연속 포획 단계는 상기 두 전극에서 각각 포획된 상기 나노 크기 물질이 서로 연결될 때까지 반복되는 것을 특징으로 하는 단일 나노 채널 형성 방법. - 제 1항에 있어서,
상기 나노 크기 물질은 나노선 형태의 물질인 것을 특징으로 하는 단일 나노 채널 형성 방법. - 제 2항에 있어서,
상기 나노선 형태의 물질은 탄소 나노 튜브인 것을 특징으로 하는 단일 나노채널 형성 방법. - 제 1항에 있어서,
상기 두 전극은 각각 트랜지스터 구조에서의 소스 전극과 드레인 전극인 것을 특징으로 하는 단일 나노 채널 형성 방법. - 마주보는 두 전극 사이에 미리 설정된 나노 크기 물질을 위치시키는 단계;
상기 두 전극 사이에 미리 설정된 전극 포획 전압을 인가하여 상기 두 전극에 각각 상기 나노 크기 물질을 포획하는 단계; 및
상기 두 전극 사이에 미리 설정된 나노 크기 물질 포획 전압을 인가하여, 상기 포획된 나노 크기 물질에 전극마다 각각 하나의 상기 나노 크기 물질을 포획하는 단계를 포함하는 단일 나노 채널 형성 방법으로서,
상기 포획된 하나의 나노 크기 물질들 사이에 미리 설정된 결합 물질 분자를 위치시키는 단계를 더 포함하는 것을 특징으로 하는 단일 나노 채널 형성 방법.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100129668A KR101128015B1 (ko) | 2010-12-17 | 2010-12-17 | 단일 나노 채널 형성 방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100129668A KR101128015B1 (ko) | 2010-12-17 | 2010-12-17 | 단일 나노 채널 형성 방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR101128015B1 true KR101128015B1 (ko) | 2012-03-29 |
Family
ID=46142446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020100129668A Expired - Fee Related KR101128015B1 (ko) | 2010-12-17 | 2010-12-17 | 단일 나노 채널 형성 방법 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR101128015B1 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11912900B2 (en) * | 2020-04-06 | 2024-02-27 | The Regents Of The University Of California | Step-wise fabrication of conductive carbon nanotube bridges via dielectrophoresis |
-
2010
- 2010-12-17 KR KR1020100129668A patent/KR101128015B1/ko not_active Expired - Fee Related
Non-Patent Citations (1)
| Title |
|---|
| Synthesis of Small Diameter Silicon Nano-wires On SiO2 and Si3N4 Surfaces, IEICE Trans. Eletron., Vol. E93-C No.5 May 2010* |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11912900B2 (en) * | 2020-04-06 | 2024-02-27 | The Regents Of The University Of California | Step-wise fabrication of conductive carbon nanotube bridges via dielectrophoresis |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Chen et al. | Ultrasonic nanowelding of carbon nanotubes to metal electrodes | |
| JP4039600B2 (ja) | ナノ構造デバイス及び装置 | |
| CN102272967B (zh) | 基于排列的高深宽比纳米粒子网络的电子设备的制造方法 | |
| Long et al. | Recent advances in large-scale assembly of semiconducting inorganic nanowires and nanofibers for electronics, sensors and photovoltaics | |
| Sarker et al. | Semiconducting enriched carbon nanotube aligned arrays of tunable density and their electrical transport properties | |
| CN100381616C (zh) | 使用ac电场选择性对准纳米大小成分 | |
| JP2003332266A (ja) | ナノチューブの配線方法及びナノチューブ配線用制御回路 | |
| TWI508228B (zh) | 薄膜電晶體 | |
| JP2015531816A5 (ko) | ||
| Opoku et al. | Solution processable multi-channel ZnO nanowire field-effect transistors with organic gate dielectric | |
| KR101197037B1 (ko) | 나노와이어 소자를 임의 형태로 프린팅하여 나노 소자를 제조하는 방법 및 상기 방법에 사용되는 중간체 빌딩 블록 | |
| CN103091370B (zh) | 一种用于气敏传感器制造的纳米线原位成形方法 | |
| Foradori et al. | Assembly and alignment of high packing density carbon nanotube arrays using lithographically defined microscopic water features | |
| KR101771327B1 (ko) | 직접 전사 프린팅 방법 및 상기 방법에 이용되는 전사 매체 | |
| US11322702B1 (en) | Electrical devices having radiofrequency field effect transistors and the manufacture thereof | |
| KR101128015B1 (ko) | 단일 나노 채널 형성 방법 | |
| US8362618B2 (en) | Three dimensional nanoscale circuit interconnect and method of assembly by dielectrophoresis | |
| KR100549227B1 (ko) | 유기분자 소자의 제작 방법 | |
| KR100822992B1 (ko) | 나노선 전계효과 트랜지스터 및 그 제조 방법 | |
| Vijayaraghavan | Bottom‐up assembly of nano‐carbon devices by dielectrophoresis | |
| CN102420244B (zh) | 一种一维金属/半导体纳米异质结晶体管及其制备方法 | |
| KR100877690B1 (ko) | 나노 와이어 배열 소자 제조방법 | |
| CN101293629A (zh) | 碳纳米管或纳米线分叉结构的制备方法 | |
| US7462864B2 (en) | Thin film transistor and manufacturing method thereof, and liquid crystal display device having thin film transistor and manufacturing method thereof | |
| Kareer et al. | Metallic CNT Tolerant Field Effect Transistor Using Dielectrophoresis |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
| D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| FPAY | Annual fee payment |
Payment date: 20150108 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| FPAY | Annual fee payment |
Payment date: 20170109 Year of fee payment: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20180313 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20180313 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |