KR100984359B1 - 박막 트랜지스터 표시판 - Google Patents
박막 트랜지스터 표시판 Download PDFInfo
- Publication number
- KR100984359B1 KR100984359B1 KR1020030082565A KR20030082565A KR100984359B1 KR 100984359 B1 KR100984359 B1 KR 100984359B1 KR 1020030082565 A KR1020030082565 A KR 1020030082565A KR 20030082565 A KR20030082565 A KR 20030082565A KR 100984359 B1 KR100984359 B1 KR 100984359B1
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- South Korea
- Prior art keywords
- electrode
- thin film
- film transistor
- gate
- layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
Abstract
Description
게이트선(121)은 물리적 성질이 다른 두 개의 막, 즉 하부막(121p)과 그 위의 상부막(121q)을 포함한다. 상부막(121q)은 게이트 신호의 지연이나 전압 강하를 줄일 수 있도록 낮은 비저항(resistivity)의 금속, 예를 들면 알루미늄(Al)이나 알루미늄 합금 등 알루미늄 계열의 금속으로 이루어진다. 이와는 달리, 하부막(121p)은 다른 물질, 특히 IZO(indium zinc oxide) 또는 ITO(indium tin oxide)와의 물리적, 화학적, 전기적 접촉 특성이 우수한 물질, 이를테면 몰리브덴(Mo), 몰리브덴 합금[보기: 몰리브덴-텅스텐(MoW) 합금], 크롬(Cr) 등으로 이루어진다. 하부막(121p)과 상부막(121q)의 조합의 예로는 크롬/알루미늄-네오디뮴 (Nd) 합금을 들 수 있다. 도 1에서 게이트 전극(124)의 하부막과 상부막은 각각 도면 부호 124p, 124q로, 확장부(127)의 하부막과 상부막은 각각 도면 부호 127p, 127q로 표시되어 있다.
Claims (6)
- 절연 기판의 상부에 형성되어 있으며, 채널부 및 상기 채널부의 양쪽에 위치하는 소스부 및 드레인부를 가지는 반도체층,상기 채널부와 중첩하는 게이트 전극,상기 반도체층과 상기 게이트 전극 사이에 형성되어 있는 게이트 절연막,상기 채널부를 중심으로 서로 마주하는 변을 가지며, 상기 소스부과 상기 드레인부에 각각 연결되어 있는 소스 전극 및 드레인 전극을 포함하며,상기 채널부와 중첩하는 상기 게이트 절연막의 표면은 요철을 포함하고,상기 반도체층은 상기 요철을 따라 형성되어 있는 박막 트랜지스터 표시판.
- 제1항에서,상기 게이트 전극은 하부막, 상기 하부막 위에 위치하며 상기 채널부의 폭 방향으로 배열된 슬릿 모양의 상부막을 포함하고,상기 게이트 절연막의 요철은 상기 상부막에 의해서 형성되는 박막 트랜지스터 표시판.
- 제1항에서,상기 반도체층은 비정질 규소 또는 다결정 규소로 이루어진 박막 트랜지스터 표시판.
- 제1항에서,상기 게이트 전극과 연결되어 있는 게이트선,상기 소스 전극과 연결되어 있으며 상기 게이트선과 교차하는 데이터선,상기 드레인 전극과 연결되어 있는 화소 전극을 더 포함하는 박막 트랜지스터 표시판.
- 제4항에서,상기 박막 트랜지스터 표시판은 액정 표시 장치의 한 기판으로 사용하는 박막 트랜지스터 표시판.
- 제4항에서,상기 박막 트랜지스터 표시판은 유기 발광 표시 장치의 한 기판으로 사용하는 박막 트랜지스터 표시판.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020030082565A KR100984359B1 (ko) | 2003-11-20 | 2003-11-20 | 박막 트랜지스터 표시판 |
| US10/996,303 US7646044B2 (en) | 2003-11-20 | 2004-11-22 | Thin film transistor and thin film transistor array panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020030082565A KR100984359B1 (ko) | 2003-11-20 | 2003-11-20 | 박막 트랜지스터 표시판 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20050048835A KR20050048835A (ko) | 2005-05-25 |
| KR100984359B1 true KR100984359B1 (ko) | 2010-09-30 |
Family
ID=34651265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020030082565A Expired - Fee Related KR100984359B1 (ko) | 2003-11-20 | 2003-11-20 | 박막 트랜지스터 표시판 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7646044B2 (ko) |
| KR (1) | KR100984359B1 (ko) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100699990B1 (ko) * | 2004-06-30 | 2007-03-26 | 삼성에스디아이 주식회사 | 능동 구동 유기 전계 발광 소자 및 그 제조 방법 |
| JP4167651B2 (ja) * | 2004-12-15 | 2008-10-15 | 東芝松下ディスプレイテクノロジー株式会社 | 表示装置 |
| KR20060070345A (ko) * | 2004-12-20 | 2006-06-23 | 삼성전자주식회사 | 박막 트랜지스터 표시판 |
| KR101112549B1 (ko) * | 2005-01-31 | 2012-06-12 | 삼성전자주식회사 | 박막 트랜지스터 표시판 |
| KR101097167B1 (ko) * | 2005-06-07 | 2011-12-22 | 엘지디스플레이 주식회사 | 유기전계발광표시소자 및 그 제조방법 |
| KR101235135B1 (ko) * | 2005-12-19 | 2013-02-20 | 삼성디스플레이 주식회사 | 금속 배선, 이의 제조 방법, 이를 구비한 표시 기판 및표시 기판의 제조 방법 |
| KR101282403B1 (ko) * | 2006-09-19 | 2013-07-04 | 삼성디스플레이 주식회사 | 액정표시장치 |
| KR100907255B1 (ko) * | 2007-09-18 | 2009-07-10 | 한국전자통신연구원 | 유기 박막 트랜지스터를 구비하는 표시 장치 |
| US8766367B2 (en) * | 2011-06-30 | 2014-07-01 | Palo Alto Research Center Incorporated | Textured gate for high current thin film transistors |
| TWI595621B (zh) * | 2012-07-03 | 2017-08-11 | 元太科技工業股份有限公司 | 畫素結構及其製造方法 |
| TWI499849B (zh) | 2013-03-12 | 2015-09-11 | E Ink Holdings Inc | 畫素結構 |
| KR102083432B1 (ko) | 2013-05-30 | 2020-03-03 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| CN104409510A (zh) * | 2014-10-28 | 2015-03-11 | 京东方科技集团股份有限公司 | 薄膜晶体管及制备方法、阵列基板及制备方法、显示装置 |
| CN104795400B (zh) * | 2015-02-12 | 2018-10-30 | 合肥鑫晟光电科技有限公司 | 阵列基板制造方法、阵列基板和显示装置 |
| CN104952884B (zh) * | 2015-05-13 | 2019-11-26 | 深圳市华星光电技术有限公司 | Amoled背板结构及其制作方法 |
| KR102608419B1 (ko) | 2016-07-12 | 2023-12-01 | 삼성디스플레이 주식회사 | 표시장치 및 표시장치의 제조방법 |
| CN109390351B (zh) * | 2017-08-02 | 2021-01-22 | 京东方科技集团股份有限公司 | 布线结构及其制备方法、oled阵列基板、显示装置 |
| KR102553881B1 (ko) * | 2018-06-01 | 2023-07-07 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조 방법과 이를 포함하는 박막 트랜지스터 표시판 및 전자 장치 |
| CN110246884B (zh) * | 2019-06-25 | 2021-08-06 | 京东方科技集团股份有限公司 | 一种阵列基板的制备方法及阵列基板、显示面板 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH09260675A (ja) * | 1996-03-26 | 1997-10-03 | Sharp Corp | 薄膜トランジスタおよび薄膜トランジスタ基板 |
| KR20010082714A (ko) * | 2000-02-18 | 2001-08-30 | 마찌다 가쯔히꼬 | 박막트랜지스터 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6294796B1 (en) * | 1982-04-13 | 2001-09-25 | Seiko Epson Corporation | Thin film transistors and active matrices including same |
| KR950007358B1 (ko) * | 1992-07-01 | 1995-07-10 | 현대전자산업주식회사 | 박막트랜지스터의 제조방법 |
| US6066860A (en) * | 1997-12-25 | 2000-05-23 | Seiko Epson Corporation | Substrate for electro-optical apparatus, electro-optical apparatus, method for driving electro-optical apparatus, electronic device and projection display device |
| JP2000299473A (ja) * | 1999-04-02 | 2000-10-24 | Sharp Corp | 選択型シリサイド薄膜トランジスタおよびその製造方法 |
| GB9923261D0 (en) * | 1999-10-02 | 1999-12-08 | Koninkl Philips Electronics Nv | Active matrix electroluminescent display device |
| JP3736461B2 (ja) * | 2000-04-21 | 2006-01-18 | セイコーエプソン株式会社 | 電気光学装置、投射型表示装置及び電気光学装置の製造方法 |
| US6781646B2 (en) * | 2000-07-28 | 2004-08-24 | Hitachi, Ltd. | Liquid crystal display device having gate electrode with two conducting layers, one used for self-aligned formation of the TFT semiconductor regions |
| JP4236848B2 (ja) * | 2001-03-28 | 2009-03-11 | セイコーインスツル株式会社 | 半導体集積回路装置の製造方法 |
| JP4869497B2 (ja) * | 2001-05-30 | 2012-02-08 | 株式会社半導体エネルギー研究所 | 表示装置 |
| JP2003167551A (ja) * | 2001-11-28 | 2003-06-13 | Internatl Business Mach Corp <Ibm> | 画素回路の駆動方法、画素回路及びこれを用いたel表示装置並びに駆動制御装置 |
| US6716681B2 (en) * | 2002-03-27 | 2004-04-06 | Chi Mei Optoelectronics Corp. | Method for manufacturing thin film transistor panel |
| US7170118B2 (en) * | 2003-08-01 | 2007-01-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Field effect transistor (FET) device having corrugated structure and method for fabrication thereof |
-
2003
- 2003-11-20 KR KR1020030082565A patent/KR100984359B1/ko not_active Expired - Fee Related
-
2004
- 2004-11-22 US US10/996,303 patent/US7646044B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09260675A (ja) * | 1996-03-26 | 1997-10-03 | Sharp Corp | 薄膜トランジスタおよび薄膜トランジスタ基板 |
| KR20010082714A (ko) * | 2000-02-18 | 2001-08-30 | 마찌다 가쯔히꼬 | 박막트랜지스터 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20050127367A1 (en) | 2005-06-16 |
| KR20050048835A (ko) | 2005-05-25 |
| US7646044B2 (en) | 2010-01-12 |
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