KR100900372B1 - 형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을이용한 발광 장치 - Google Patents
형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을이용한 발광 장치 Download PDFInfo
- Publication number
- KR100900372B1 KR100900372B1 KR1020087007102A KR20087007102A KR100900372B1 KR 100900372 B1 KR100900372 B1 KR 100900372B1 KR 1020087007102 A KR1020087007102 A KR 1020087007102A KR 20087007102 A KR20087007102 A KR 20087007102A KR 100900372 B1 KR100900372 B1 KR 100900372B1
- Authority
- KR
- South Korea
- Prior art keywords
- phosphor
- light
- light emitting
- emitting device
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/55—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing beryllium, magnesium, alkali metals or alkaline earth metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/581—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on aluminium nitride
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/584—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/62605—Treating the starting powders individually or as mixtures
- C04B35/62645—Thermal treatment of powders or mixtures thereof other than sintering
- C04B35/6265—Thermal treatment of powders or mixtures thereof other than sintering involving reduction or oxidation
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/62605—Treating the starting powders individually or as mixtures
- C04B35/62645—Thermal treatment of powders or mixtures thereof other than sintering
- C04B35/6268—Thermal treatment of powders or mixtures thereof other than sintering characterised by the applied pressure or type of atmosphere, e.g. in vacuum, hydrogen or a specific oxygen pressure
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/59—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing silicon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/65—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing carbon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7715—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing cerium
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7715—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing cerium
- C09K11/77218—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/7729—Chalcogenides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77342—Silicates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
- C04B2235/3213—Strontium oxides or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
- C04B2235/3229—Cerium oxides or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/38—Non-oxide ceramic constituents or additives
- C04B2235/3852—Nitrides, e.g. oxynitrides, carbonitrides, oxycarbonitrides, lithium nitride, magnesium nitride
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/38—Non-oxide ceramic constituents or additives
- C04B2235/3852—Nitrides, e.g. oxynitrides, carbonitrides, oxycarbonitrides, lithium nitride, magnesium nitride
- C04B2235/3865—Aluminium nitrides
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/38—Non-oxide ceramic constituents or additives
- C04B2235/3852—Nitrides, e.g. oxynitrides, carbonitrides, oxycarbonitrides, lithium nitride, magnesium nitride
- C04B2235/3873—Silicon nitrides, e.g. silicon carbonitride, silicon oxynitride
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
- H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
- H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/917—Electroluminescent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Luminescent Compositions (AREA)
Abstract
Description
Claims (9)
- 600nm 이상 660nm 미만의 파장 영역에 발광 피크를 갖는 적색 형광체와, 510㎚ 이상 550㎚ 이하의 파장 영역에 발광 피크를 갖는 녹색 형광체를 포함하는 형광체층과,440nm 이상 500nm 미만의 파장 영역에 발광 피크를 갖는 청색 광을 발하는 청색 발광 소자를 구비하고,상기 적색 형광체와 상기 녹색 형광체는, 상기 청색 광에 의해 여기되어 발광하고,형광체에 흡수되지 않은 상기 청색 광은, 상기 형광체층을 투과하여 출력되고,상기 적색 형광체가 발하는 발광 성분과, 상기 녹색 형광체가 발하는 발광 성분과, 상기 청색 발광 소자가 발하는 발광 성분을 출력 광에 포함하는 발광 장치로서,상기 형광체층은, Eu2 +으로 부활된 형광체 이외의 형광체, 및 질화물 형광체 또는 산질화물 형광체 이외의 형광체를 실질적으로 포함하지 않고,상기 형광체층에 포함되는 형광체 중에서, 상기 청색 발광 소자가 발하는 광 여기 하에서 가장 내부 양자 효율이 낮은 형광체는 내부 양자 효율이 80% 이상인 형광체이며,상기 적색 형광체는 니트리드알루미노실리케이트계의 형광체이며,상기 형광체층에 포함되는 상기 녹색 형광체의 여기 스펙트럼은, 상기 청색 발광 소자가 발하는 광의 피크 파장보다도 단파장 영역에 여기 피크를 가지는 것을 특징으로 하는 발광 장치.
- 청구항 1에 있어서, 상기 녹색 형광체의 여기 스펙트럼은 파장 440nm 이상 500nm 미만의 청색 영역보다도 단파장 영역에 여기 피크를 가지는 발광 장치.
- 청구항 1에 있어서, 상기 형광체층에 포함되는 형광체의 여기 스펙트럼은, 상기 청색 발광 소자가 발하는 광의 피크 파장보다도 단파장 영역에 여기 피크를 가지는 발광 장치.
- 청구항 1에 있어서, 상기 형광체층에 포함되는 형광체의 여기 스펙트럼은, 파장 440nm 이상 500nm 미만의 청색 영역보다도 단파장 영역에 여기 피크를 가지는 발광 장치.
- 청구항 1에 있어서, 상기 청색 발광 소자는 450nm 이상 480nm 이하의 파장 영역에 발광 피크를 가지는 발광 장치.
- 청구항 1에 있어서, 상기 적색 형광체는 조성식 (M1 - xEux)AlSiN3로 표시되는 형광체이고, 상기 M는 Mg, Ca, Sr, Ba 및 Zn에서 선택되는 적어도 1개의 원소이고, 상기 x는 식 0.005≤x≤0.3을 만족하는 수치인 발광 장치.
- 청구항 6에 있어서, 상기 적색 형광체는 상기 M의 50원자% 이상이 Sr인 발광 장치.
- 청구항 1에 있어서, 상기 녹색 형광체는 525nm 이상의 파장 영역에 발광 피크를 가지는 발광 장치.
- 청구항 1에 있어서, 상기 출력광의 상관색 온도는 2500K 이상 8000K 이하인 발광 장치.
Applications Claiming Priority (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004131770 | 2004-04-27 | ||
| JPJP-P-2004-00131770 | 2004-04-27 | ||
| JP2004182797 | 2004-06-21 | ||
| JPJP-P-2004-00182797 | 2004-06-21 | ||
| JPJP-P-2004-00194196 | 2004-06-30 | ||
| JP2004194196 | 2004-06-30 | ||
| JPJP-P-2004-00250739 | 2004-08-30 | ||
| JP2004250739A JP2005336450A (ja) | 2004-04-27 | 2004-08-30 | 蛍光体組成物とその製造方法、並びにその蛍光体組成物を用いた発光装置 |
| JPJP-P-2004-00363534 | 2004-12-15 | ||
| JP2004363534A JP4128564B2 (ja) | 2004-04-27 | 2004-12-15 | 発光装置 |
| PCT/JP2005/008395 WO2005103199A1 (en) | 2004-04-27 | 2005-04-26 | Phosphor composition and method for producing the same, and light-emitting device using the same |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020077015970A Division KR101041311B1 (ko) | 2004-04-27 | 2005-04-26 | 형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을 이용한 발광장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20080041714A KR20080041714A (ko) | 2008-05-13 |
| KR100900372B1 true KR100900372B1 (ko) | 2009-06-02 |
Family
ID=34968845
Family Applications (7)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020097010819A Expired - Lifetime KR101157313B1 (ko) | 2004-04-27 | 2005-04-26 | 형광체 조성물과 그 제조방법, 및 그 형광체 조성물을 이용한 발광 장치 |
| KR1020087007100A Expired - Lifetime KR100847957B1 (ko) | 2004-04-27 | 2005-04-26 | 형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을이용한 발광 장치 |
| KR1020087007101A Expired - Lifetime KR100865624B1 (ko) | 2004-04-27 | 2005-04-26 | 형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을이용한 발광 장치 |
| KR1020087014853A Expired - Lifetime KR100887489B1 (ko) | 2004-04-27 | 2005-04-26 | 형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을이용한 발광 장치 |
| KR1020067024124A Expired - Lifetime KR100777501B1 (ko) | 2004-04-27 | 2005-04-26 | 형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을이용한 발광 장치 |
| KR1020077015970A Expired - Lifetime KR101041311B1 (ko) | 2004-04-27 | 2005-04-26 | 형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을 이용한 발광장치 |
| KR1020087007102A Expired - Lifetime KR100900372B1 (ko) | 2004-04-27 | 2005-04-26 | 형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을이용한 발광 장치 |
Family Applications Before (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020097010819A Expired - Lifetime KR101157313B1 (ko) | 2004-04-27 | 2005-04-26 | 형광체 조성물과 그 제조방법, 및 그 형광체 조성물을 이용한 발광 장치 |
| KR1020087007100A Expired - Lifetime KR100847957B1 (ko) | 2004-04-27 | 2005-04-26 | 형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을이용한 발광 장치 |
| KR1020087007101A Expired - Lifetime KR100865624B1 (ko) | 2004-04-27 | 2005-04-26 | 형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을이용한 발광 장치 |
| KR1020087014853A Expired - Lifetime KR100887489B1 (ko) | 2004-04-27 | 2005-04-26 | 형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을이용한 발광 장치 |
| KR1020067024124A Expired - Lifetime KR100777501B1 (ko) | 2004-04-27 | 2005-04-26 | 형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을이용한 발광 장치 |
| KR1020077015970A Expired - Lifetime KR101041311B1 (ko) | 2004-04-27 | 2005-04-26 | 형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을 이용한 발광장치 |
Country Status (4)
| Country | Link |
|---|---|
| US (10) | US7391060B2 (ko) |
| EP (3) | EP2113549B1 (ko) |
| KR (7) | KR101157313B1 (ko) |
| WO (1) | WO2005103199A1 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013007610A (ja) * | 2011-06-23 | 2013-01-10 | Canon Inc | 測色器及び画像形成装置 |
Families Citing this family (284)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10036940A1 (de) * | 2000-07-28 | 2002-02-07 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Lumineszenz-Konversions-LED |
| US7915085B2 (en) | 2003-09-18 | 2011-03-29 | Cree, Inc. | Molded chip fabrication method |
| TWI359187B (en) * | 2003-11-19 | 2012-03-01 | Panasonic Corp | Method for preparing nitridosilicate-based compoun |
| JP3837588B2 (ja) | 2003-11-26 | 2006-10-25 | 独立行政法人物質・材料研究機構 | 蛍光体と蛍光体を用いた発光器具 |
| JP3931239B2 (ja) | 2004-02-18 | 2007-06-13 | 独立行政法人物質・材料研究機構 | 発光素子及び照明器具 |
| KR101010880B1 (ko) | 2004-04-26 | 2011-01-25 | 미쓰비시 가가꾸 가부시키가이샤 | 컬러 필터용 청색 조성물, 컬러 필터 및 컬러 화상 표시장치 |
| EP2113549B1 (en) * | 2004-04-27 | 2011-12-28 | Panasonic Corporation | Phosphor composition and light-emitting device using the same |
| JP4565141B2 (ja) * | 2004-06-30 | 2010-10-20 | 独立行政法人物質・材料研究機構 | 蛍光体と発光器具 |
| JP4511885B2 (ja) * | 2004-07-09 | 2010-07-28 | Dowaエレクトロニクス株式会社 | 蛍光体及びled並びに光源 |
| JP4422653B2 (ja) * | 2004-07-28 | 2010-02-24 | Dowaエレクトロニクス株式会社 | 蛍光体およびその製造方法、並びに光源 |
| US7476338B2 (en) | 2004-08-27 | 2009-01-13 | Dowa Electronics Materials Co., Ltd. | Phosphor and manufacturing method for the same, and light source |
| US20090261364A1 (en) * | 2004-08-31 | 2009-10-22 | Kyota Ueda | Fluorescent substance |
| US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
| WO2006095285A1 (en) | 2005-03-09 | 2006-09-14 | Philips Intellectual Property & Standards Gmbh | Illumination system comprising a radiation source and a fluorescent material |
| US8269410B2 (en) | 2005-03-18 | 2012-09-18 | Mitsubishi Chemical Corporation | Light-emitting device, white light-emitting device, illuminator, and image display |
| KR101142519B1 (ko) * | 2005-03-31 | 2012-05-08 | 서울반도체 주식회사 | 적색 형광체 및 녹색 형광체를 갖는 백색 발광다이오드를채택한 백라이트 패널 |
| CN103254894A (zh) | 2005-04-01 | 2013-08-21 | 三菱化学株式会社 | 无机功能材料原料用合金粉末及荧光体 |
| TWI475093B (zh) | 2005-05-24 | 2015-03-01 | 三菱化學股份有限公司 | 螢光體及其應用 |
| JP4896129B2 (ja) * | 2005-05-24 | 2012-03-14 | ソウル セミコンダクター カンパニー リミテッド | 発光素子及びそれのためのアルカリ土類金属硫化物系蛍光体 |
| JP2007049114A (ja) * | 2005-05-30 | 2007-02-22 | Sharp Corp | 発光装置とその製造方法 |
| US8215815B2 (en) | 2005-06-07 | 2012-07-10 | Oree, Inc. | Illumination apparatus and methods of forming the same |
| WO2006131924A2 (en) | 2005-06-07 | 2006-12-14 | Oree, Advanced Illumination Solutions Inc. | Illumination apparatus |
| US8272758B2 (en) | 2005-06-07 | 2012-09-25 | Oree, Inc. | Illumination apparatus and methods of forming the same |
| WO2007004492A1 (ja) * | 2005-07-01 | 2007-01-11 | National Institute For Materials Science | 蛍光体とその製造方法および照明器具 |
| CN101223824B (zh) | 2005-07-14 | 2011-05-18 | 皇家飞利浦电子股份有限公司 | 场致发光器件 |
| KR100691273B1 (ko) | 2005-08-23 | 2007-03-12 | 삼성전기주식회사 | 복합 형광체 분말, 이를 이용한 발광 장치 및 복합 형광체분말의 제조 방법 |
| US7262439B2 (en) * | 2005-11-22 | 2007-08-28 | Lumination Llc | Charge compensated nitride phosphors for use in lighting applications |
| US7859182B2 (en) | 2005-08-31 | 2010-12-28 | Lumination Llc | Warm white LED-based lamp incoporating divalent EU-activated silicate yellow emitting phosphor |
| US20070052342A1 (en) * | 2005-09-01 | 2007-03-08 | Sharp Kabushiki Kaisha | Light-emitting device |
| DE102006004397A1 (de) * | 2005-09-30 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
| KR100724591B1 (ko) | 2005-09-30 | 2007-06-04 | 서울반도체 주식회사 | 발광 소자 및 이를 포함한 led 백라이트 |
| JP4932248B2 (ja) * | 2005-12-21 | 2012-05-16 | Necライティング株式会社 | 黄色発光蛍光体、それを用いた白色発光素子、およびそれを用いた照明装置 |
| KR100764148B1 (ko) * | 2006-01-17 | 2007-10-05 | 루시미아 주식회사 | 시트상 형광체와 그 제조방법 및 이를 이용한 발광장치 |
| KR100990699B1 (ko) * | 2006-02-09 | 2010-10-29 | 우베 고산 가부시키가이샤 | 청색 발광 형광체의 제조 방법 |
| KR101184957B1 (ko) * | 2006-02-10 | 2012-10-02 | 미쓰비시 가가꾸 가부시키가이샤 | 형광체 및 그 제조 방법, 형광체 함유 조성물, 발광 장치, 그리고 화상 표시 장치 및 조명 장치 |
| EP1999232B1 (en) * | 2006-03-16 | 2017-06-14 | Seoul Semiconductor Co., Ltd | Fluorescent material and light emitting diode using the same |
| JP5032043B2 (ja) * | 2006-03-27 | 2012-09-26 | 豊田合成株式会社 | フェラスメタルアルカリ土類金属ケイ酸塩混合結晶蛍光体およびこれを用いた発光装置 |
| JP2007300069A (ja) * | 2006-04-04 | 2007-11-15 | Toyoda Gosei Co Ltd | 発光素子、この発光素子を用いた発光装置及びこの発光素子の製造方法 |
| US8451401B2 (en) | 2006-04-19 | 2013-05-28 | Mitsubishi Chemical Corporation | Color image display device |
| KR100731678B1 (ko) * | 2006-05-08 | 2007-06-22 | 서울반도체 주식회사 | 칩형 발광 다이오드 패키지 및 그것을 갖는 발광 장치 |
| EP2022834A4 (en) * | 2006-05-19 | 2011-11-23 | Mitsubishi Chem Corp | NITROGENIC ALLOY AND THEIR USE FOR THE PREPARATION OF PHOSPHORUS |
| EP2682446A3 (en) | 2006-06-27 | 2014-03-26 | Mitsubishi Chemical Corporation | Illuminating device |
| KR101258229B1 (ko) * | 2006-06-30 | 2013-04-25 | 서울반도체 주식회사 | 발광 소자 |
| JP4957110B2 (ja) * | 2006-08-03 | 2012-06-20 | 日亜化学工業株式会社 | 発光装置 |
| DE102006036577A1 (de) * | 2006-08-04 | 2008-02-07 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Rot emittierender Leuchtstoff und Lichtquelle mit derartigem Leuchtstoff |
| US8581108B1 (en) | 2006-08-23 | 2013-11-12 | Rockwell Collins, Inc. | Method for providing near-hermetically coated integrated circuit assemblies |
| US8617913B2 (en) | 2006-08-23 | 2013-12-31 | Rockwell Collins, Inc. | Alkali silicate glass based coating and method for applying |
| US8166645B2 (en) * | 2006-08-23 | 2012-05-01 | Rockwell Collins, Inc. | Method for providing near-hermetically coated, thermally protected integrated circuit assemblies |
| US8637980B1 (en) | 2007-12-18 | 2014-01-28 | Rockwell Collins, Inc. | Adhesive applications using alkali silicate glass for electronics |
| US8174830B2 (en) | 2008-05-06 | 2012-05-08 | Rockwell Collins, Inc. | System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling |
| US8084855B2 (en) * | 2006-08-23 | 2011-12-27 | Rockwell Collins, Inc. | Integrated circuit tampering protection and reverse engineering prevention coatings and methods |
| US8076185B1 (en) | 2006-08-23 | 2011-12-13 | Rockwell Collins, Inc. | Integrated circuit protection and ruggedization coatings and methods |
| US7915527B1 (en) | 2006-08-23 | 2011-03-29 | Rockwell Collins, Inc. | Hermetic seal and hermetic connector reinforcement and repair with low temperature glass coatings |
| JP2008050496A (ja) * | 2006-08-25 | 2008-03-06 | Sony Corp | 発光組成物、光源装置、及び表示装置 |
| TW200822403A (en) * | 2006-10-12 | 2008-05-16 | Matsushita Electric Industrial Co Ltd | Light-emitting device and method for manufacturing the same |
| JP5076446B2 (ja) * | 2006-10-30 | 2012-11-21 | ソニー株式会社 | 発光組成物、光源装置、表示装置、発光組成物の製造方法 |
| JP2008116849A (ja) | 2006-11-07 | 2008-05-22 | Sony Corp | 表示装置 |
| JP5367218B2 (ja) | 2006-11-24 | 2013-12-11 | シャープ株式会社 | 蛍光体の製造方法および発光装置の製造方法 |
| JP4228012B2 (ja) | 2006-12-20 | 2009-02-25 | Necライティング株式会社 | 赤色発光窒化物蛍光体およびそれを用いた白色発光素子 |
| US8232564B2 (en) * | 2007-01-22 | 2012-07-31 | Cree, Inc. | Wafer level phosphor coating technique for warm light emitting diodes |
| US9024349B2 (en) | 2007-01-22 | 2015-05-05 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
| US9159888B2 (en) | 2007-01-22 | 2015-10-13 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
| KR20090128408A (ko) * | 2007-02-06 | 2009-12-15 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 적색 방출 발광 재료 |
| US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
| JP5476128B2 (ja) * | 2007-02-22 | 2014-04-23 | クリー インコーポレイテッド | 照明装置、照明方法、光フィルタ、および光をフィルタリングする方法 |
| EP2122695A4 (en) * | 2007-03-08 | 2013-09-11 | 3M Innovative Properties Co | NETWORK OF LUMINESCENT ELEMENTS |
| DE102007015474A1 (de) * | 2007-03-30 | 2008-10-02 | Osram Opto Semiconductors Gmbh | Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
| DE102007018099A1 (de) | 2007-04-17 | 2008-10-23 | Osram Gesellschaft mit beschränkter Haftung | Rot emittierender Leuchtstoff und Lichtquelle mit derartigem Leuchtstoff |
| CN101663371B (zh) | 2007-04-20 | 2013-02-06 | 皇家飞利浦电子股份有限公司 | 具有改进的颜色稳定性的白色发光光源和发光材料 |
| US7781779B2 (en) * | 2007-05-08 | 2010-08-24 | Luminus Devices, Inc. | Light emitting devices including wavelength converting material |
| US9279079B2 (en) * | 2007-05-30 | 2016-03-08 | Sharp Kabushiki Kaisha | Method of manufacturing phosphor, light-emitting device, and image display apparatus |
| WO2009005035A1 (ja) * | 2007-06-29 | 2009-01-08 | Mitsubishi Chemical Corporation | 蛍光体、蛍光体の製造方法、蛍光体含有組成物、並びに発光装置 |
| EP2009078A1 (en) * | 2007-06-29 | 2008-12-31 | Leuchtstoffwerk Breitungen GmbH | Ce3+, Eu2+ -activated alkaline earth silicon nitride phosphors |
| WO2009003988A1 (en) * | 2007-06-29 | 2009-01-08 | Leuchtstoffwerk Breitungen Gmbh | Ce3+, eu2+ and mn2+ - activated alkaline earth silicon nitride phosphors and white-light emitting led |
| US8084942B2 (en) * | 2007-07-09 | 2011-12-27 | Sharp Kabushiki Kaisha | Phosphor particle group and light emitting apparatus using the same |
| WO2009011205A1 (ja) * | 2007-07-19 | 2009-01-22 | Sharp Kabushiki Kaisha | 発光装置 |
| JP2009046668A (ja) * | 2007-08-21 | 2009-03-05 | Samsung Sdi Co Ltd | 白色蛍光体、これを用いる発光装置、及び表示装置 |
| US8648523B2 (en) * | 2007-08-30 | 2014-02-11 | Nichia Corporation | Light emitting device including light emitting element and phosphor |
| JP5578597B2 (ja) | 2007-09-03 | 2014-08-27 | 独立行政法人物質・材料研究機構 | 蛍光体及びその製造方法、並びにそれを用いた発光装置 |
| CN101821357B (zh) | 2007-10-15 | 2016-08-10 | 皇家飞利浦电子股份有限公司 | 包括多相SiAlON基陶瓷材料的发光器件 |
| US8866169B2 (en) * | 2007-10-31 | 2014-10-21 | Cree, Inc. | LED package with increased feature sizes |
| EP2229426B1 (en) | 2007-12-03 | 2011-05-25 | Philips Intellectual Property & Standards GmbH | Light emitting device comprising a green emitting sialon-based material |
| US9041285B2 (en) | 2007-12-14 | 2015-05-26 | Cree, Inc. | Phosphor distribution in LED lamps using centrifugal force |
| US8363189B2 (en) * | 2007-12-18 | 2013-01-29 | Rockwell Collins, Inc. | Alkali silicate glass for displays |
| US20090161369A1 (en) | 2007-12-19 | 2009-06-25 | Keren Regev | Waveguide sheet and methods for manufacturing the same |
| US8172447B2 (en) | 2007-12-19 | 2012-05-08 | Oree, Inc. | Discrete lighting elements and planar assembly thereof |
| US8878219B2 (en) | 2008-01-11 | 2014-11-04 | Cree, Inc. | Flip-chip phosphor coating method and devices fabricated utilizing method |
| JP2009167338A (ja) * | 2008-01-18 | 2009-07-30 | Sharp Corp | 波長変換部材およびこれを備える発光装置、ならびに蛍光体 |
| US8436526B2 (en) * | 2008-02-11 | 2013-05-07 | Sensor Electronic Technology, Inc. | Multiwavelength solid-state lamps with an enhanced number of rendered colors |
| US8237348B2 (en) | 2008-03-03 | 2012-08-07 | Sharp Kabushiki Kaisha | Light-emitting device |
| US8231237B2 (en) * | 2008-03-05 | 2012-07-31 | Oree, Inc. | Sub-assembly and methods for forming the same |
| US7990045B2 (en) * | 2008-03-15 | 2011-08-02 | Sensor Electronic Technology, Inc. | Solid-state lamps with partial conversion in phosphors for rendering an enhanced number of colors |
| JP2009227701A (ja) * | 2008-03-19 | 2009-10-08 | Niigata Univ | 蛍光体およびその製造方法 |
| JP2011515536A (ja) * | 2008-03-21 | 2011-05-19 | ナノグラム・コーポレイション | 金属シリコン窒化物または金属シリコンオキシ窒化物のサブミクロン蛍光体粒子およびこれらの粒子を合成する方法 |
| US8598618B2 (en) * | 2008-04-17 | 2013-12-03 | Kabushiki Kaisha Toshiba | White light emitting device, backlight, liquid crystal display device, and illuminating device |
| US8205337B2 (en) * | 2008-09-12 | 2012-06-26 | Rockwell Collins, Inc. | Fabrication process for a flexible, thin thermal spreader |
| US8221089B2 (en) | 2008-09-12 | 2012-07-17 | Rockwell Collins, Inc. | Thin, solid-state mechanism for pumping electrically conductive liquids in a flexible thermal spreader |
| US8650886B2 (en) * | 2008-09-12 | 2014-02-18 | Rockwell Collins, Inc. | Thermal spreader assembly with flexible liquid cooling loop having rigid tubing sections and flexible tubing sections |
| US8616266B2 (en) * | 2008-09-12 | 2013-12-31 | Rockwell Collins, Inc. | Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid |
| US8274215B2 (en) * | 2008-12-15 | 2012-09-25 | Intematix Corporation | Nitride-based, red-emitting phosphors |
| US8242525B2 (en) * | 2008-05-20 | 2012-08-14 | Lightscape Materials, Inc. | Silicate-based phosphors and LED lighting devices using the same |
| CN102015961A (zh) * | 2008-06-02 | 2011-04-13 | 松下电器产业株式会社 | 半导体发光设备以及使用所述半导体发光设备的光源设备 |
| US8691113B2 (en) * | 2008-07-02 | 2014-04-08 | Dexerials Corporation | Red phosphor, method for producing red phosphor, white light source, illuminating device, and liquid crystal display device |
| US8301002B2 (en) | 2008-07-10 | 2012-10-30 | Oree, Inc. | Slim waveguide coupling apparatus and method |
| US8297786B2 (en) * | 2008-07-10 | 2012-10-30 | Oree, Inc. | Slim waveguide coupling apparatus and method |
| DE102008038249A1 (de) | 2008-08-18 | 2010-02-25 | Osram Gesellschaft mit beschränkter Haftung | alpha-Sialon-Leuchtstoff |
| US8415870B2 (en) | 2008-08-28 | 2013-04-09 | Panasonic Corporation | Semiconductor light emitting device and backlight source, backlight source system, display device and electronic device using the same |
| WO2010029872A1 (ja) | 2008-09-09 | 2010-03-18 | 昭和電工株式会社 | 発光装置、発光モジュール、表示装置 |
| US8119040B2 (en) | 2008-09-29 | 2012-02-21 | Rockwell Collins, Inc. | Glass thick film embedded passive material |
| JP2010090231A (ja) * | 2008-10-07 | 2010-04-22 | Canon Inc | 画像表示装置 |
| US20100098377A1 (en) * | 2008-10-16 | 2010-04-22 | Noam Meir | Light confinement using diffusers |
| US8008845B2 (en) * | 2008-10-24 | 2011-08-30 | Cree, Inc. | Lighting device which includes one or more solid state light emitting device |
| EP2357679B1 (en) * | 2008-11-14 | 2018-08-29 | Samsung Electronics Co., Ltd. | Vertical/horizontal light-emitting diode for semiconductor |
| US9428688B2 (en) | 2008-11-17 | 2016-08-30 | Cree, Inc. | Phosphor composition |
| TWI391471B (zh) * | 2008-11-21 | 2013-04-01 | Univ Nat Cheng Kung | Preparation method of nitride fluorescent powder |
| DE102008058621A1 (de) * | 2008-11-22 | 2010-05-27 | Merck Patent Gmbh | Co-dotierte 1-1-2-Nitride |
| US8360617B2 (en) * | 2008-11-25 | 2013-01-29 | Samsung Electronics Co., Ltd. | Lighting system including LED with glass-coated quantum-dots |
| JP5641384B2 (ja) | 2008-11-28 | 2014-12-17 | 独立行政法人物質・材料研究機構 | 表示装置用照明装置及び表示装置 |
| US8456082B2 (en) | 2008-12-01 | 2013-06-04 | Ifire Ip Corporation | Surface-emission light source with uniform illumination |
| US8368112B2 (en) | 2009-01-14 | 2013-02-05 | Cree Huizhou Opto Limited | Aligned multiple emitter package |
| US8624527B1 (en) | 2009-03-27 | 2014-01-07 | Oree, Inc. | Independently controllable illumination device |
| CN102803129B (zh) * | 2009-04-28 | 2016-08-03 | Qd视光有限公司 | 光学材料、光学部件和方法 |
| EP2386239A4 (en) * | 2009-05-12 | 2012-08-15 | Olympus Medical Systems Corp | IN VIVO IMAGING SYSTEM OF THE SUBJECT AND IN VIVO INTRODUCTION DEVICE IN THE FIELD |
| US8328406B2 (en) | 2009-05-13 | 2012-12-11 | Oree, Inc. | Low-profile illumination device |
| WO2010150202A2 (en) | 2009-06-24 | 2010-12-29 | Oree, Advanced Illumination Solutions Inc. | Illumination apparatus with high conversion efficiency and methods of forming the same |
| WO2011024818A1 (ja) * | 2009-08-26 | 2011-03-03 | 三菱化学株式会社 | 白色半導体発光装置 |
| WO2011024296A1 (ja) | 2009-08-28 | 2011-03-03 | 株式会社 東芝 | 蛍光体の製造方法およびそれにより製造された蛍光体 |
| CN107256915A (zh) * | 2009-09-18 | 2017-10-17 | 天空公司 | 发光二极管器件 |
| US9583678B2 (en) | 2009-09-18 | 2017-02-28 | Soraa, Inc. | High-performance LED fabrication |
| US8933644B2 (en) | 2009-09-18 | 2015-01-13 | Soraa, Inc. | LED lamps with improved quality of light |
| US9293644B2 (en) | 2009-09-18 | 2016-03-22 | Soraa, Inc. | Power light emitting diode and method with uniform current density operation |
| EP2479237B1 (en) * | 2009-09-18 | 2014-08-13 | Mitsui Mining & Smelting Co., Ltd | Phosphor |
| WO2011060180A1 (en) | 2009-11-11 | 2011-05-19 | Qd Vision, Inc. | Device including quantum dots |
| US20110127905A1 (en) * | 2009-12-02 | 2011-06-02 | General Electric Company | Alkaline earth borate phosphors |
| US10147850B1 (en) | 2010-02-03 | 2018-12-04 | Soraa, Inc. | System and method for providing color light sources in proximity to predetermined wavelength conversion structures |
| US8740413B1 (en) | 2010-02-03 | 2014-06-03 | Soraa, Inc. | System and method for providing color light sources in proximity to predetermined wavelength conversion structures |
| US8905588B2 (en) | 2010-02-03 | 2014-12-09 | Sorra, Inc. | System and method for providing color light sources in proximity to predetermined wavelength conversion structures |
| US8545721B2 (en) * | 2010-02-24 | 2013-10-01 | Hyun-seop Shim | UV coating composition for LED color conversion |
| WO2011108053A1 (ja) * | 2010-03-01 | 2011-09-09 | パナソニック株式会社 | Ledランプおよびled照明装置 |
| US8643038B2 (en) * | 2010-03-09 | 2014-02-04 | Cree, Inc. | Warm white LEDs having high color rendering index values and related luminophoric mediums |
| US8508127B2 (en) * | 2010-03-09 | 2013-08-13 | Cree, Inc. | High CRI lighting device with added long-wavelength blue color |
| US20110220920A1 (en) * | 2010-03-09 | 2011-09-15 | Brian Thomas Collins | Methods of forming warm white light emitting devices having high color rendering index values and related light emitting devices |
| WO2011111368A1 (ja) * | 2010-03-12 | 2011-09-15 | 株式会社 東芝 | 白色照明装置 |
| JP5749327B2 (ja) * | 2010-03-19 | 2015-07-15 | 日東電工株式会社 | 発光装置用ガーネット系蛍光体セラミックシート |
| MX2013005202A (es) * | 2010-03-30 | 2013-11-20 | Changchn Inst Of Applied Chemistry Chinese Academy Of Sciences | Dispositivo de corriente alterna de led blanco. |
| DE102010021341A1 (de) * | 2010-05-22 | 2011-11-24 | Merck Patent Gmbh | Leuchtstoffe |
| JP2012060097A (ja) | 2010-06-25 | 2012-03-22 | Mitsubishi Chemicals Corp | 白色半導体発光装置 |
| US10546846B2 (en) | 2010-07-23 | 2020-01-28 | Cree, Inc. | Light transmission control for masking appearance of solid state light sources |
| JP5910498B2 (ja) * | 2010-08-04 | 2016-05-11 | 宇部興産株式会社 | 珪窒化物蛍光体用窒化珪素粉末並びにそれを用いたCaAlSiN3系蛍光体、Sr2Si5N8系蛍光体、(Sr,Ca)AlSiN3系蛍光体及びLa3Si6N11系蛍光体、及びその製造方法 |
| CN102376860A (zh) | 2010-08-05 | 2012-03-14 | 夏普株式会社 | 发光装置及其制造方法 |
| US8733942B2 (en) * | 2010-08-09 | 2014-05-27 | Delta Electronics, Inc. | Illumination system and projector using the same |
| KR101243773B1 (ko) * | 2010-08-17 | 2013-03-14 | 순천대학교 산학협력단 | 발광장치 및 태양전지용 파장변환조성물, 이 조성물을 포함하는 발광장치와 태양전지 및 이 파장변환조성물의 제조방법 |
| CN101921592B (zh) * | 2010-09-09 | 2012-12-26 | 江苏博睿光电有限公司 | 一种白光led红色荧光粉及其制造方法 |
| TWI393764B (zh) * | 2010-10-15 | 2013-04-21 | 奇美實業股份有限公司 | A phosphor and a light emitting device |
| TWI393763B (zh) * | 2010-10-15 | 2013-04-21 | 奇美實業股份有限公司 | A phosphor and a light emitting device |
| JP2012099282A (ja) * | 2010-10-29 | 2012-05-24 | Sharp Corp | 照明装置及び車両用前照灯 |
| US8329484B2 (en) * | 2010-11-02 | 2012-12-11 | Tsmc Solid State Lighting Ltd. | Phosphor with Ce3+/Ce3+, Li+ doped luminescent materials |
| KR101235179B1 (ko) * | 2010-11-02 | 2013-02-20 | 주식회사 에클립스 | 백색 발광다이오드 소자용 시온계 산화질화물 형광체, 그의 제조방법 및 그를 이용한 백색 led 소자 |
| CN108456516A (zh) * | 2010-11-09 | 2018-08-28 | 奇美实业股份有限公司 | 荧光体的制造方法 |
| KR101087032B1 (ko) | 2010-11-12 | 2011-11-30 | 재단법인서울대학교산학협력재단 | Masn 형광체의 제조방법 |
| US8343785B2 (en) * | 2010-11-30 | 2013-01-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Nitridosilicate phosphor tunable light-emitting diodes by using UV and blue chips |
| WO2012073177A1 (en) * | 2010-12-01 | 2012-06-07 | Koninklijke Philips Electronics N.V. | Red emitting luminescent materials |
| US8828531B2 (en) | 2010-12-01 | 2014-09-09 | Nitto Denko Corporation | Emissive ceramic materials having a dopant concentration gradient and methods of making and using the same |
| TWI447207B (zh) * | 2010-12-08 | 2014-08-01 | 國立交通大學 | 螢光材料及使用其之發光裝置 |
| JP5864851B2 (ja) | 2010-12-09 | 2016-02-17 | シャープ株式会社 | 発光装置 |
| US9617469B2 (en) | 2011-01-06 | 2017-04-11 | Shin-Etsu Chemical Co., Ltd. | Phosphor particles, making method, and light-emitting diode |
| US9166126B2 (en) | 2011-01-31 | 2015-10-20 | Cree, Inc. | Conformally coated light emitting devices and methods for providing the same |
| FI122809B (fi) * | 2011-02-15 | 2012-07-13 | Marimils Oy | Valolähde ja valolähdenauha |
| KR101215300B1 (ko) * | 2011-03-29 | 2012-12-26 | 순천대학교 산학협력단 | 산질화물계 형광체 |
| US8716731B2 (en) * | 2011-04-11 | 2014-05-06 | Tsmc Solid State Lighting Ltd. | Tunable phosphor for luminescent |
| WO2013101280A2 (en) | 2011-04-11 | 2013-07-04 | Cree, Inc. | Solid state lighting device including green shifted red component |
| CN102185059A (zh) * | 2011-04-12 | 2011-09-14 | 天津理工大学 | 一种可双向电压驱动无机量子点电致发光器件及制备方法 |
| KR101781437B1 (ko) | 2011-04-29 | 2017-09-25 | 삼성전자주식회사 | 백색 발광 장치 및 이를 이용한 디스플레이 및 조명장치 |
| TWI505524B (zh) * | 2011-05-20 | 2015-10-21 | Au Optronics Corp | 有機電激發光光源 |
| JP2012246462A (ja) | 2011-05-31 | 2012-12-13 | Sharp Corp | 発光装置 |
| CN103608938B (zh) * | 2011-06-03 | 2017-03-08 | 西铁城电子株式会社 | 半导体发光装置、展示物照射用照明装置、肉照射用照明装置、蔬菜照射用照明装置、鲜鱼照射用照明装置、一般用照明装置和半导体发光系统 |
| US8814621B2 (en) | 2011-06-03 | 2014-08-26 | Cree, Inc. | Methods of determining and making red nitride compositions |
| US8906263B2 (en) * | 2011-06-03 | 2014-12-09 | Cree, Inc. | Red nitride phosphors |
| US8747697B2 (en) * | 2011-06-07 | 2014-06-10 | Cree, Inc. | Gallium-substituted yttrium aluminum garnet phosphor and light emitting devices including the same |
| CN102842679A (zh) * | 2011-06-21 | 2012-12-26 | 海洋王照明科技股份有限公司 | 有机电致发光器件及其制备方法 |
| DE102011078402A1 (de) * | 2011-06-30 | 2013-01-03 | Osram Ag | Konversionselement und Leuchtdiode mit einem solchen Konversionselement |
| US20130016528A1 (en) * | 2011-07-11 | 2013-01-17 | Kevin Joseph Hathaway | Enhanced color gamut led backlighting unit |
| KR20130014256A (ko) | 2011-07-29 | 2013-02-07 | 엘지이노텍 주식회사 | 발광 소자 패키지 및 이를 이용한 조명 시스템 |
| US20130062561A1 (en) * | 2011-09-09 | 2013-03-14 | Epistar Corporation | Phosphor and method of preparing the same |
| DE202011106052U1 (de) | 2011-09-23 | 2011-11-09 | Osram Ag | Lichtquelle mit Leuchtstoff und zugehörige Beleuchtungseinheit. |
| JP5872828B2 (ja) * | 2011-09-28 | 2016-03-01 | 株式会社小糸製作所 | 発光モジュールおよび蛍光体 |
| US9551467B2 (en) | 2011-10-24 | 2017-01-24 | Kabushiki Kaisha Toshiba | White light source and white light source system including the same |
| US8591072B2 (en) | 2011-11-16 | 2013-11-26 | Oree, Inc. | Illumination apparatus confining light by total internal reflection and methods of forming the same |
| JP5899470B2 (ja) * | 2011-12-16 | 2016-04-06 | パナソニックIpマネジメント株式会社 | 照明装置 |
| CN103184049B (zh) * | 2011-12-28 | 2015-01-14 | 湖南信多利新材料有限公司 | 一种氮化物荧光粉的制备方法及其设备 |
| CN104105660B (zh) | 2011-12-30 | 2016-08-24 | 英特美光电(苏州)有限公司 | 含有用于电荷平衡的间隙阳离子的氮化物磷光体 |
| US8663502B2 (en) | 2011-12-30 | 2014-03-04 | Intematix Corporation | Red-emitting nitride-based phosphors |
| JP5912580B2 (ja) * | 2012-01-27 | 2016-04-27 | デンカ株式会社 | 蛍光体、その製造方法及びその用途 |
| US9318669B2 (en) | 2012-01-30 | 2016-04-19 | Cree, Inc. | Methods of determining and making red nitride compositions |
| KR101650533B1 (ko) * | 2012-02-09 | 2016-08-23 | 덴카 주식회사 | 형광체 및 발광 장치 |
| CN104508082A (zh) | 2012-03-06 | 2015-04-08 | 日东电工株式会社 | 用于发光装置的陶瓷体 |
| CA2807615C (en) | 2012-03-08 | 2020-06-30 | Simplehuman, Llc | Vanity mirror |
| TWI547208B (zh) * | 2012-03-19 | 2016-08-21 | 友達光電股份有限公司 | 有機電致發光裝置 |
| US20130280520A1 (en) * | 2012-04-18 | 2013-10-24 | Nitto Denko Corporation | Phosphor ceramics and methods of making the same |
| US9441155B2 (en) * | 2012-06-06 | 2016-09-13 | Sharp Kabushiki Kaisha | Wavelength converting member, light-emitting device, illuminating device, vehicle headlight, and method for producing wavelength converting member |
| WO2014006501A1 (en) | 2012-07-03 | 2014-01-09 | Yosi Shani | Planar remote phosphor illumination apparatus |
| US8597545B1 (en) | 2012-07-18 | 2013-12-03 | Intematix Corporation | Red-emitting nitride-based calcium-stabilized phosphors |
| KR20150035742A (ko) * | 2012-07-20 | 2015-04-07 | 미쓰비시 가가꾸 가부시키가이샤 | 발광 장치, 파장 변환 부재, 형광체 조성물 및 형광체 혼합물 |
| DE102012106940A1 (de) * | 2012-07-30 | 2014-01-30 | Osram Gmbh | Verfahren zur Herstellung eines Leuchtstoffs, Leuchtstoff und optoelektronisches Bauelement |
| KR101476000B1 (ko) * | 2012-08-03 | 2014-12-24 | 에스앤비인더스트리 주식회사 | 원예용 led조명장치의 led칩 제조방법 |
| US9435915B1 (en) | 2012-09-28 | 2016-09-06 | Rockwell Collins, Inc. | Antiglare treatment for glass |
| JP6068914B2 (ja) | 2012-10-09 | 2017-01-25 | デンカ株式会社 | 蛍光体の製造方法 |
| US20140167601A1 (en) * | 2012-12-19 | 2014-06-19 | Cree, Inc. | Enhanced Luminous Flux Semiconductor Light Emitting Devices Including Red Phosphors that Exhibit Good Color Rendering Properties and Related Red Phosphors |
| CN102994079A (zh) * | 2012-12-21 | 2013-03-27 | 北京有色金属研究总院 | 氮氧化物橙-红色荧光物质,包括其的发光膜或发光片及发光器件 |
| US9761763B2 (en) | 2012-12-21 | 2017-09-12 | Soraa, Inc. | Dense-luminescent-materials-coated violet LEDs |
| US9219202B2 (en) | 2013-04-19 | 2015-12-22 | Cree, Inc. | Semiconductor light emitting devices including red phosphors that exhibit good color rendering properties and related red phosphors |
| KR102075989B1 (ko) | 2013-06-20 | 2020-02-11 | 삼성전자주식회사 | 적색 형광체, 백색 발광장치, 디스플레이 장치 및 조명장치 |
| JP6195760B2 (ja) * | 2013-08-16 | 2017-09-13 | シチズン電子株式会社 | Led発光装置 |
| JP2015041633A (ja) * | 2013-08-20 | 2015-03-02 | 船井電機株式会社 | 食品用照明装置および精肉用照明装置 |
| USD737060S1 (en) | 2013-08-22 | 2015-08-25 | Simplehuman, Llc | Vanity mirror |
| US9410664B2 (en) | 2013-08-29 | 2016-08-09 | Soraa, Inc. | Circadian friendly LED light source |
| US10074781B2 (en) | 2013-08-29 | 2018-09-11 | Cree, Inc. | Semiconductor light emitting devices including multiple red phosphors that exhibit good color rendering properties with increased brightness |
| US9240528B2 (en) | 2013-10-03 | 2016-01-19 | Cree, Inc. | Solid state lighting apparatus with high scotopic/photopic (S/P) ratio |
| US9356201B2 (en) * | 2013-10-04 | 2016-05-31 | Bridgelux, Inc. | Die emitting white light |
| JP2015082596A (ja) | 2013-10-23 | 2015-04-27 | 株式会社東芝 | 発光装置 |
| USD736001S1 (en) | 2014-01-27 | 2015-08-11 | Simplehuman, Llc | Vanity mirror |
| USD751829S1 (en) | 2014-03-13 | 2016-03-22 | Simplehuman, Llc | Vanity mirror |
| KR102213650B1 (ko) * | 2014-04-18 | 2021-02-08 | 대주전자재료 주식회사 | 산질화물계 형광체 및 이를 이용한 백색 발광 장치 |
| CN105431503B (zh) * | 2014-06-05 | 2018-05-04 | 上海富迪照明电器有限公司 | 大功率高温白光led封装及其制作方法 |
| US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
| WO2016021705A1 (ja) | 2014-08-07 | 2016-02-11 | 三菱化学株式会社 | 蛍光体、発光装置、画像表示装置及び照明装置 |
| TWI645579B (zh) * | 2014-08-11 | 2018-12-21 | 佰鴻工業股份有限公司 | Light-emitting diode module with reduced blue light energy |
| US9200198B1 (en) | 2014-08-28 | 2015-12-01 | Lightscape Materials, Inc. | Inorganic phosphor and light emitting devices comprising same |
| US9315725B2 (en) | 2014-08-28 | 2016-04-19 | Lightscape Materials, Inc. | Method of making EU2+ activated inorganic red phosphor |
| US9200199B1 (en) | 2014-08-28 | 2015-12-01 | Lightscape Materials, Inc. | Inorganic red phosphor and lighting devices comprising same |
| US10622522B2 (en) | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
| JP6782427B2 (ja) * | 2014-10-23 | 2020-11-11 | 三菱ケミカル株式会社 | 蛍光体、発光装置、照明装置及び画像表示装置 |
| US20160149096A1 (en) * | 2014-11-24 | 2016-05-26 | Ledst Co., Ltd. | Prox reaction apparatus for fuel cell |
| USD785345S1 (en) | 2015-03-06 | 2017-05-02 | Simplehuman, Llc | Mirror |
| US10076176B2 (en) | 2015-03-06 | 2018-09-18 | Simplehuman, Llc | Vanity mirror comprising light sources and methods of manufacture thereof |
| CN104698530A (zh) * | 2015-04-07 | 2015-06-10 | 京东方科技集团股份有限公司 | 一种导光板、前置光源模组、显示模组和显示装置 |
| JP6202154B2 (ja) * | 2015-08-28 | 2017-09-27 | 日亜化学工業株式会社 | 窒化物蛍光体及びその製造方法並びに発光装置 |
| EP3135746B1 (en) | 2015-08-28 | 2019-05-29 | Nichia Corporation | Method for producing nitride fluorescent material |
| JP6384468B2 (ja) * | 2015-12-22 | 2018-09-05 | 日亜化学工業株式会社 | 発光装置 |
| US9882107B2 (en) * | 2016-01-12 | 2018-01-30 | Citizen Electronics Co., Ltd. | LED package with covered bonding wire |
| DE212017000060U1 (de) * | 2016-02-03 | 2018-09-10 | Opple Lighting Co., Ltd. | Lichtquellenmodul und Beleuchtungsvorrichtung |
| US10256374B2 (en) | 2016-03-04 | 2019-04-09 | Nichia Corporation | Light emitting device |
| JP6447557B2 (ja) | 2016-03-24 | 2019-01-09 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| WO2018004006A1 (ja) * | 2016-06-30 | 2018-01-04 | 堺化学工業株式会社 | 酸化亜鉛蛍光体及びその製造方法 |
| JP6418208B2 (ja) * | 2016-08-24 | 2018-11-07 | 日亜化学工業株式会社 | 窒化物蛍光体及び発光装置 |
| CN106322148B (zh) * | 2016-10-21 | 2023-06-06 | 四川省桑瑞光辉标识系统股份有限公司 | 一种led灯板调光系统和方法 |
| JP2020012010A (ja) * | 2016-11-15 | 2020-01-23 | デンカ株式会社 | 赤色蛍光体及び発光装置 |
| US10290779B2 (en) * | 2016-12-15 | 2019-05-14 | Panasonic Intellectual Property Management Co., Ltd. | Light emitting element |
| KR102316099B1 (ko) * | 2017-03-03 | 2021-10-25 | 엘지전자 주식회사 | 디스플레이 디바이스 |
| USD816350S1 (en) | 2017-03-17 | 2018-05-01 | Simplehuman, Llc | Vanity mirror |
| US10869537B2 (en) | 2017-03-17 | 2020-12-22 | Simplehuman, Llc | Vanity mirror |
| US10340426B2 (en) * | 2017-07-06 | 2019-07-02 | Epistar Corporation | Phosphor and illumination device utilizing the same |
| TWI702362B (zh) * | 2017-07-13 | 2020-08-21 | 東貝光電科技股份有限公司 | Led發光裝置 |
| DE102017121889B3 (de) * | 2017-09-21 | 2018-11-22 | Heraeus Noblelight Gmbh | Breitbandige halbleiterbasierte UV-Lichtquelle für eine Spektralanalysevorrichtung |
| KR102620016B1 (ko) * | 2017-10-10 | 2024-01-03 | 덴카 주식회사 | 적색 형광체 및 발광 장치 |
| US11387390B2 (en) | 2017-11-27 | 2022-07-12 | Nichia Corporation | Method for producing wavelength converting member, and wavelength converting member |
| JP6923804B2 (ja) * | 2017-12-08 | 2021-08-25 | 日亜化学工業株式会社 | 波長変換部材及びその製造方法 |
| US10763414B2 (en) * | 2017-12-18 | 2020-09-01 | Rohm Co., Ltd. | Semiconductor light-emitting device |
| USD848158S1 (en) | 2017-12-28 | 2019-05-14 | Simplehuman, Llc | Vanity mirror |
| JP7527759B2 (ja) | 2018-02-14 | 2024-08-05 | シンプルヒューマン・エルエルシー | 小型ミラー |
| KR20190101787A (ko) * | 2018-02-23 | 2019-09-02 | 서울반도체 주식회사 | 개선된 연색성을 갖는 led 조명 장치 및 led 필라멘트 |
| USD846288S1 (en) | 2018-03-08 | 2019-04-23 | Simplehuman, Llc | Vanity mirror |
| CA3037704A1 (en) | 2018-03-22 | 2019-09-22 | Simplehuman, Llc | Voice-activated vanity mirror |
| CN110342939A (zh) | 2018-04-06 | 2019-10-18 | 日亚化学工业株式会社 | 陶瓷复合体的制造方法、陶瓷复合体和发光装置 |
| KR102530363B1 (ko) * | 2018-08-31 | 2023-05-09 | 루미레즈 엘엘씨 | 높은 컬러 품질을 갖는 인광체 변환 led |
| USD874161S1 (en) | 2018-09-07 | 2020-02-04 | Simplehuman, Llc | Vanity mirror |
| CA3113402A1 (en) | 2018-09-19 | 2020-03-26 | Simplehuman, Llc | Vanity mirror |
| US10935231B2 (en) | 2018-10-15 | 2021-03-02 | Aylo Llc | Systems and methods for a mirror mounted light with mobile device mounting |
| USD950118S1 (en) | 2018-10-15 | 2022-04-26 | Aylo, Llc | Light |
| JP7457657B2 (ja) | 2018-12-27 | 2024-03-28 | デンカ株式会社 | 発光基板及び照明装置 |
| WO2020137762A1 (ja) | 2018-12-27 | 2020-07-02 | デンカ株式会社 | 蛍光体基板、発光基板及び照明装置 |
| WO2020137761A1 (ja) | 2018-12-27 | 2020-07-02 | デンカ株式会社 | 蛍光体基板、発光基板及び照明装置 |
| EP3905345B1 (en) | 2018-12-27 | 2024-01-24 | Denka Company Limited | Light-emitting substrate, and lighting device |
| JP7491849B2 (ja) | 2018-12-27 | 2024-05-28 | デンカ株式会社 | 蛍光体基板、発光基板及び照明装置 |
| USD925928S1 (en) | 2019-03-01 | 2021-07-27 | Simplehuman, Llc | Vanity mirror |
| EP3931615A1 (en) | 2019-03-01 | 2022-01-05 | Simplehuman LLC | Vanity mirror |
| WO2020186002A1 (en) * | 2019-03-13 | 2020-09-17 | Current Lighting Solutions, Llc | Horticulture lighting devices |
| KR102676824B1 (ko) * | 2019-04-03 | 2024-06-19 | 코쿠리츠켄큐카이하츠호징 붓시쯔 자이료 켄큐키코 | 형광체, 그 제조 방법 및 발광 소자 |
| CN113711449B (zh) * | 2019-04-24 | 2025-02-18 | 松下知识产权经营株式会社 | 波长转换体以及使用了该波长转换体的发光装置、医疗系统、电子设备及检验方法 |
| USD927863S1 (en) | 2019-05-02 | 2021-08-17 | Simplehuman, Llc | Vanity mirror cover |
| USD899226S1 (en) | 2019-09-09 | 2020-10-20 | Aylo Llc | Suction cup mount |
| CN110635013A (zh) * | 2019-09-20 | 2019-12-31 | 深圳市长方集团股份有限公司 | 一种利用紫光激发的全光谱冷白led光源 |
| JP7332881B2 (ja) * | 2019-09-30 | 2023-08-24 | 日亜化学工業株式会社 | 発光装置 |
| US12396577B2 (en) | 2023-03-03 | 2025-08-26 | Simplehuman, Llc | Vanity mirror with hidden sensor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030007742A (ko) * | 2000-05-29 | 2003-01-23 | 파텐트-트로이한트-게젤샤프트 퓌어 엘렉트리쉐 글뤼람펜 엠베하 | Led계 백색광 발광 조명 유닛 |
| JP2003277746A (ja) * | 2002-03-22 | 2003-10-02 | Nichia Chem Ind Ltd | 窒化物蛍光体及びその製造方法 |
Family Cites Families (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW383508B (en) | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
| KR19980046311A (ko) | 1996-12-12 | 1998-09-15 | 손욱 | 형광막 프로젝터 |
| ES2299260T5 (es) | 1998-09-28 | 2011-12-20 | Koninklijke Philips Electronics N.V. | Sistema de iluminación. |
| US6429583B1 (en) | 1998-11-30 | 2002-08-06 | General Electric Company | Light emitting device with ba2mgsi2o7:eu2+, ba2sio4:eu2+, or (srxcay ba1-x-y)(a1zga1-z)2sr:eu2+phosphors |
| EP1104799A1 (en) | 1999-11-30 | 2001-06-06 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Red emitting luminescent material |
| EP1280860A2 (en) * | 2000-05-04 | 2003-02-05 | Kimberly-Clark Worldwide, Inc. | Salt-sensitive, water-dispersible polymer composition |
| KR100784573B1 (ko) | 2000-05-29 | 2007-12-10 | 파텐트-트로이한트-게젤샤프트 퓌어 엘렉트리쉐 글뤼람펜 엠베하 | 발광다이오드에 기반을 둔 백색광을 방출하는 조명 기구 |
| DE10036940A1 (de) * | 2000-07-28 | 2002-02-07 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Lumineszenz-Konversions-LED |
| JP2004505172A (ja) | 2000-07-28 | 2004-02-19 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 波長変換のためのルミネセンス変換ベースの発光ダイオード及び蛍光体 |
| JP4619509B2 (ja) | 2000-09-28 | 2011-01-26 | 株式会社東芝 | 発光装置 |
| US6524542B2 (en) * | 2001-04-12 | 2003-02-25 | Millennium Cell, Inc. | Processes for synthesizing borohydride compounds |
| AT410266B (de) | 2000-12-28 | 2003-03-25 | Tridonic Optoelectronics Gmbh | Lichtquelle mit einem lichtemittierenden element |
| DE10105800B4 (de) | 2001-02-07 | 2017-08-31 | Osram Gmbh | Hocheffizienter Leuchtstoff und dessen Verwendung |
| US6632379B2 (en) | 2001-06-07 | 2003-10-14 | National Institute For Materials Science | Oxynitride phosphor activated by a rare earth element, and sialon type phosphor |
| DE10133352A1 (de) | 2001-07-16 | 2003-02-06 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
| WO2003021691A1 (en) | 2001-09-03 | 2003-03-13 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light emitting device, light emitting apparatus and production method for semiconductor light emitting device |
| DE10146719A1 (de) | 2001-09-20 | 2003-04-17 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
| DE10147040A1 (de) | 2001-09-25 | 2003-04-24 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
| KR100894372B1 (ko) | 2001-10-01 | 2009-04-22 | 파나소닉 주식회사 | 반도체 발광소자와 이를 이용한 발광장치 |
| JP3985486B2 (ja) | 2001-10-01 | 2007-10-03 | 松下電器産業株式会社 | 半導体発光素子とこれを用いた発光装置 |
| SG185827A1 (en) | 2002-03-22 | 2012-12-28 | Nichia Corp | Nitride phosphor and production process thereof, and light emitting device |
| JP2003321675A (ja) | 2002-04-26 | 2003-11-14 | Nichia Chem Ind Ltd | 窒化物蛍光体及びその製造方法 |
| AU2003215785A1 (en) | 2002-03-25 | 2003-10-08 | Philips Intellectual Property And Standards Gmbh | Tri-color white light led lamp |
| US6809471B2 (en) | 2002-06-28 | 2004-10-26 | General Electric Company | Phosphors containing oxides of alkaline-earth and Group-IIIB metals and light sources incorporating the same |
| JP4407204B2 (ja) | 2002-08-30 | 2010-02-03 | 日亜化学工業株式会社 | 発光装置 |
| EP1413618A1 (en) * | 2002-09-24 | 2004-04-28 | Osram Opto Semiconductors GmbH | Luminescent material, especially for LED application |
| EP1413619A1 (en) | 2002-09-24 | 2004-04-28 | Osram Opto Semiconductors GmbH | Luminescent material, especially for LED application |
| US6717353B1 (en) | 2002-10-14 | 2004-04-06 | Lumileds Lighting U.S., Llc | Phosphor converted light emitting device |
| JP4442101B2 (ja) | 2003-03-14 | 2010-03-31 | 日亜化学工業株式会社 | 酸窒化物蛍光体及びそれを用いた発光装置 |
| MY149573A (en) | 2002-10-16 | 2013-09-13 | Nichia Corp | Oxynitride phosphor and production process thereof, and light-emitting device using oxynitride phosphor |
| EP1676076A2 (en) | 2003-08-29 | 2006-07-05 | Koninklijke Philips Electronics N.V. | Color-mixing lighting system |
| JP3837588B2 (ja) | 2003-11-26 | 2006-10-25 | 独立行政法人物質・材料研究機構 | 蛍光体と蛍光体を用いた発光器具 |
| JP3931239B2 (ja) | 2004-02-18 | 2007-06-13 | 独立行政法人物質・材料研究機構 | 発光素子及び照明器具 |
| US7250715B2 (en) | 2004-02-23 | 2007-07-31 | Philips Lumileds Lighting Company, Llc | Wavelength converted semiconductor light emitting devices |
| JP4511849B2 (ja) | 2004-02-27 | 2010-07-28 | Dowaエレクトロニクス株式会社 | 蛍光体およびその製造方法、光源、並びにled |
| JP3921545B2 (ja) | 2004-03-12 | 2007-05-30 | 独立行政法人物質・材料研究機構 | 蛍光体とその製造方法 |
| EP2113549B1 (en) | 2004-04-27 | 2011-12-28 | Panasonic Corporation | Phosphor composition and light-emitting device using the same |
| JP4128564B2 (ja) | 2004-04-27 | 2008-07-30 | 松下電器産業株式会社 | 発光装置 |
| JP4565141B2 (ja) | 2004-06-30 | 2010-10-20 | 独立行政法人物質・材料研究機構 | 蛍光体と発光器具 |
| JP5226929B2 (ja) | 2004-06-30 | 2013-07-03 | 三菱化学株式会社 | 発光素子並びにそれを用いた照明装置、画像表示装置 |
| US7138756B2 (en) | 2004-08-02 | 2006-11-21 | Dowa Mining Co., Ltd. | Phosphor for electron beam excitation and color display device using the same |
| JP4543250B2 (ja) * | 2004-08-27 | 2010-09-15 | Dowaエレクトロニクス株式会社 | 蛍光体混合物および発光装置 |
| JP4543253B2 (ja) * | 2004-10-28 | 2010-09-15 | Dowaエレクトロニクス株式会社 | 蛍光体混合物および発光装置 |
| US7671529B2 (en) | 2004-12-10 | 2010-03-02 | Philips Lumileds Lighting Company, Llc | Phosphor converted light emitting device |
| CN101460880B (zh) * | 2006-05-05 | 2012-05-23 | Prysm公司 | 用于显示系统和装置的磷光体组合物和其它荧光材料 |
| JP4285580B1 (ja) | 2008-02-22 | 2009-06-24 | 三菱自動車工業株式会社 | 自動変速機の変速操作装置 |
-
2005
- 2005-04-26 EP EP09007211A patent/EP2113549B1/en not_active Expired - Lifetime
- 2005-04-26 US US11/568,149 patent/US7391060B2/en not_active Expired - Lifetime
- 2005-04-26 WO PCT/JP2005/008395 patent/WO2005103199A1/en not_active Ceased
- 2005-04-26 KR KR1020097010819A patent/KR101157313B1/ko not_active Expired - Lifetime
- 2005-04-26 KR KR1020087007100A patent/KR100847957B1/ko not_active Expired - Lifetime
- 2005-04-26 KR KR1020087007101A patent/KR100865624B1/ko not_active Expired - Lifetime
- 2005-04-26 KR KR1020087014853A patent/KR100887489B1/ko not_active Expired - Lifetime
- 2005-04-26 KR KR1020067024124A patent/KR100777501B1/ko not_active Expired - Lifetime
- 2005-04-26 EP EP05736612.2A patent/EP1749074B1/en not_active Expired - Lifetime
- 2005-04-26 KR KR1020077015970A patent/KR101041311B1/ko not_active Expired - Lifetime
- 2005-04-26 KR KR1020087007102A patent/KR100900372B1/ko not_active Expired - Lifetime
- 2005-04-26 EP EP08010928A patent/EP1980605B1/en not_active Expired - Lifetime
-
2007
- 2007-08-10 US US11/891,386 patent/US7507354B2/en not_active Expired - Lifetime
-
2008
- 2008-04-08 US US12/099,555 patent/US7615797B2/en not_active Expired - Lifetime
- 2008-04-08 US US12/099,511 patent/US8221649B2/en active Active
- 2008-04-08 US US12/099,584 patent/US7651634B2/en not_active Expired - Lifetime
- 2008-06-18 US US12/141,616 patent/US7811472B2/en active Active
-
2009
- 2009-06-16 US US12/485,627 patent/US7892453B2/en not_active Expired - Lifetime
- 2009-08-04 US US12/535,442 patent/US8226853B2/en not_active Expired - Lifetime
-
2012
- 2012-05-16 US US13/473,195 patent/US8419975B2/en not_active Expired - Lifetime
-
2013
- 2013-03-18 US US13/845,976 patent/US8551362B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030007742A (ko) * | 2000-05-29 | 2003-01-23 | 파텐트-트로이한트-게젤샤프트 퓌어 엘렉트리쉐 글뤼람펜 엠베하 | Led계 백색광 발광 조명 유닛 |
| JP2003277746A (ja) * | 2002-03-22 | 2003-10-02 | Nichia Chem Ind Ltd | 窒化物蛍光体及びその製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013007610A (ja) * | 2011-06-23 | 2013-01-10 | Canon Inc | 測色器及び画像形成装置 |
Also Published As
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100900372B1 (ko) | 형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을이용한 발광 장치 | |
| TWI394815B (zh) | 螢光體組成物及其製造方法、使用該螢光體組成物之發光裝置 | |
| CN101171884B (zh) | 包括发射源和荧光材料的照明系统 | |
| JP2005336450A (ja) | 蛍光体組成物とその製造方法、並びにその蛍光体組成物を用いた発光装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A107 | Divisional application of patent | ||
| A201 | Request for examination | ||
| PA0104 | Divisional application for international application |
St.27 status event code: A-0-1-A10-A18-div-PA0104 St.27 status event code: A-0-1-A10-A16-div-PA0104 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| FPAY | Annual fee payment |
Payment date: 20130430 Year of fee payment: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| FPAY | Annual fee payment |
Payment date: 20140507 Year of fee payment: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| FPAY | Annual fee payment |
Payment date: 20150430 Year of fee payment: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| FPAY | Annual fee payment |
Payment date: 20160418 Year of fee payment: 8 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| FPAY | Annual fee payment |
Payment date: 20170421 Year of fee payment: 9 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| FPAY | Annual fee payment |
Payment date: 20180418 Year of fee payment: 10 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 10 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 11 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 12 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 13 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 14 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 15 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R14-asn-PN2301 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 16 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| PC1801 | Expiration of term |
St.27 status event code: N-4-6-H10-H14-oth-PC1801 Not in force date: 20250427 Ip right cessation event data comment text: Termination Category : EXPIRATION_OF_DURATION |