KR100881162B1 - 연마패드용 컨디셔닝 디스크의 제조방법 - Google Patents
연마패드용 컨디셔닝 디스크의 제조방법 Download PDFInfo
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- KR100881162B1 KR100881162B1 KR1020080029101A KR20080029101A KR100881162B1 KR 100881162 B1 KR100881162 B1 KR 100881162B1 KR 1020080029101 A KR1020080029101 A KR 1020080029101A KR 20080029101 A KR20080029101 A KR 20080029101A KR 100881162 B1 KR100881162 B1 KR 100881162B1
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- thermoplastic resin
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- resin binder
- conditioning disk
- manufacturing
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- 238000005498 polishing Methods 0.000 title claims abstract description 35
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- 239000011230 binding agent Substances 0.000 claims abstract description 50
- 239000000919 ceramic Substances 0.000 claims abstract description 39
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- 239000007924 injection Substances 0.000 claims abstract description 34
- 238000002156 mixing Methods 0.000 claims abstract description 33
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- 238000000034 method Methods 0.000 claims description 38
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- 238000000465 moulding Methods 0.000 claims description 6
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- IERHLVCPSMICTF-XVFCMESISA-N CMP group Chemical group P(=O)(O)(O)OC[C@@H]1[C@H]([C@H]([C@@H](O1)N1C(=O)N=C(N)C=C1)O)O IERHLVCPSMICTF-XVFCMESISA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 208000032765 Device extrusion Diseases 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
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- 210000003643 myeloid progenitor cell Anatomy 0.000 description 1
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Description
| 이송속도 | 본 발명 | 종래예 |
| 1,000mm/min | 입자 탈락 없음 | 미세한 입자 탈락 발생 |
| 800mm/min | 입자 탈락 없음 | 심한 입자 탈락 발생 |
| 500mm/min | 입자 탈락 없음 | 심한 입자 탈락 발생 |
| 300mm/min | 입자 탈락 발생 | 심한 입자 탈락 발생 |
Claims (12)
- 복수의 돌기가 일체로 형성된 컨디셔닝 디스크를 제조하는 방법으로,세라믹 분말과 열가소성수지 바인더을 믹싱한 후에 분쇄함으로써 세라믹분말과 열가소성수지 바인더가 균일하게 분산된 피드스탁(feed stock)을 형성하는 피드스탁 형성단계;상기 피드스탁을 가열연화시키면서 사출금형의 캐비티 내에 주입한 후에 고화시켜 사출성형체를 성형하는 사출성형단계;상기 사출성형체 내에서 열가소성수지 바인더를 제거하는 탈지단계; 및상기 탈지된 사출성형체를 소결시키는 소결단계를 포함하는 것을 특징으로 하는 연마패드용 컨디셔닝 디스크의 제조방법.
- 제1항에 있어서,상기 피드스탁의 세라믹 분말과 열가소성수지 바인더는 1 : 0.3~0.7의 부피비를 가지는 것을 특징으로 하는 연마패드용 컨디셔닝 디스크의 제조방법.
- 제1항에 있어서,상기 피드스탁 형성단계는, 상기 세라믹분말과 열가소성수지 바인더를 회전비틀림방식의 믹싱인 3차원 믹싱을 한 후에 분쇄함으로써 피드스탁을 형성하는 것을 특징으로 하는 연마패드용 컨디셔닝 디스크의 제조방법.
- 제3항에 있어서,상기 피드스탁 형성단계는,상기 세라믹분말과 열가소성수지 바인더의 혼합물을 진공분위기 하의 상온 상태에서 일정시간 동안 3차원 믹싱하는 제1믹싱단계;상기 열가소성수지 바인더에 유동성을 부여할 수 있는 제1설정치까지 온도를 올리면서 3차원 믹싱하는 제2믹싱단계;상기 제1설정치에서 일정시간 동안 유지시킨 후에 제2설정치까지 서냉시키면서 3차원 믹싱 및 응고시키는 제3믹싱단계; 및상기 응고된 혼합물을 분쇄하는 분쇄단계를 포함하고,상기 제2설정치는 상기 제1설정치 보다 낮은 온도인 것을 특징으로 하는 연마패드용 컨디셔닝 디스크의 제조방법.
- 제1항에 있어서,상기 사출성형단계 중 사출금형의 캐비티 내에 피드스탁을 주입하는 과정에서 상기 피드스탁의 주입압력을 균일하게 분배하는 것을 특징으로 하는 연마패드용 컨디셔닝 디스크의 제조방법.
- 제1항에 있어서,상기 사출금형은 그 내부에 캐비티를 가지고, 복수의 주입구를 가진 제1금형 및 음각패턴이 형성된 제2금형을 포함하며, 상기 사출금형의 캐비티 치수는 요구하 는 컨디셔닝 디스크의 사이즈 보다 크게 형성된 것을 특징으로 하는 연마패드용 컨디셔닝 디스크의 제조방법.
- 제1항에 있어서,상기 세라믹분말은 지르코니아분말인 것을 특징으로 하는 연마패드용 컨디셔닝 디스크의 제조방법.
- 제7항에 있어서,상기 세라믹분말은 부분안정화 지르코니아 분말인 것을 특징으로 하는 연마패드용 컨디셔닝 디스크의 제조방법.
- 제1항에 있어서,상기 열가소성수지 바인더는 결합제, 팽윤제, 가소제를 포함하는 것을 특징으로 하는 연마패드용 컨디셔닝 디스크의 제조방법.
- 제1항에 있어서,상기 피드스탁 형성단계에서, 유동성 보조제를 더 첨가하는 것을 특징으로 하는 연마패드용 컨디셔닝 디스크의 제조방법.
- 제10항에 있어서,상기 유동성 보조제는 우레탄인 것을 특징으로 하는 연마패드용 컨디셔닝 디스크의 제조방법.
- 제1항에 있어서,상기 세라믹분말의 입자들의 사이즈가 서로 다르고 또한 열가소성수지 바인더의 입자들의 사이즈가 서로 다르게 이루어지는 것을 특징으로 하는 연마패드용 컨디셔닝 디스크의 제조방법.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020080029101A KR100881162B1 (ko) | 2008-03-28 | 2008-03-28 | 연마패드용 컨디셔닝 디스크의 제조방법 |
| TW098110114A TW200940257A (en) | 2008-03-28 | 2009-03-27 | Method for manufacturing a conditioning disc for polishing pad |
| PCT/KR2009/001571 WO2009120036A1 (en) | 2008-03-28 | 2009-03-27 | Method for manufacturing a conditioning disc for polishing pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020080029101A KR100881162B1 (ko) | 2008-03-28 | 2008-03-28 | 연마패드용 컨디셔닝 디스크의 제조방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR100881162B1 true KR100881162B1 (ko) | 2009-02-03 |
Family
ID=40680931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020080029101A Active KR100881162B1 (ko) | 2008-03-28 | 2008-03-28 | 연마패드용 컨디셔닝 디스크의 제조방법 |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR100881162B1 (ko) |
| TW (1) | TW200940257A (ko) |
| WO (1) | WO2009120036A1 (ko) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101175565B1 (ko) | 2010-10-14 | 2012-08-21 | 국방과학연구소 | 포탄용 파편 및 그 제조방법 |
| CN111805442A (zh) * | 2020-07-22 | 2020-10-23 | 江苏赛扬精工科技有限责任公司 | 磨削航天航空钛合金用热压高强度陶瓷cbn砂轮及制备方法 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102248486B (zh) * | 2011-07-25 | 2013-01-30 | 清华大学 | 抛光垫修整方法 |
| AT515258B1 (de) * | 2013-12-18 | 2016-09-15 | Tyrolit - Schleifmittelwerke Swarovski K G | Verfahren zur Herstellung von Schleifkörpern |
| CN110216547B (zh) * | 2019-06-17 | 2021-03-12 | 广东启智精密科技股份有限公司 | 一种聚氯乙烯注塑抛光一体设备 |
| CN116851758A (zh) * | 2023-06-21 | 2023-10-10 | 深圳烯钻科技有限公司 | 一种高精度cmp修整盘制造方法及设备 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05253849A (ja) * | 1992-01-16 | 1993-10-05 | Ronald C Wiand | 研磨用品とその製造法 |
| KR20070012860A (ko) * | 2004-05-20 | 2007-01-29 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 사출 성형된 연마 제품의 제조 방법 |
| JP2007044824A (ja) | 2005-08-10 | 2007-02-22 | Soken:Kk | 半導体平坦化cmpプロセス(化学機械的研磨)におけるcmpパッドコンディショナー。 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2896657B2 (ja) * | 1996-06-28 | 1999-05-31 | 旭ダイヤモンド工業株式会社 | ドレッサ及びその製造方法 |
| JP3527448B2 (ja) * | 1999-12-20 | 2004-05-17 | 株式会社リード | Cmp研磨布用ドレッサー及びその製造方法 |
| US20070049164A1 (en) * | 2005-08-26 | 2007-03-01 | Thomson Clifford O | Polishing pad and method for manufacturing polishing pads |
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2008
- 2008-03-28 KR KR1020080029101A patent/KR100881162B1/ko active Active
-
2009
- 2009-03-27 TW TW098110114A patent/TW200940257A/zh unknown
- 2009-03-27 WO PCT/KR2009/001571 patent/WO2009120036A1/en not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05253849A (ja) * | 1992-01-16 | 1993-10-05 | Ronald C Wiand | 研磨用品とその製造法 |
| KR20070012860A (ko) * | 2004-05-20 | 2007-01-29 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 사출 성형된 연마 제품의 제조 방법 |
| JP2007044824A (ja) | 2005-08-10 | 2007-02-22 | Soken:Kk | 半導体平坦化cmpプロセス(化学機械的研磨)におけるcmpパッドコンディショナー。 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101175565B1 (ko) | 2010-10-14 | 2012-08-21 | 국방과학연구소 | 포탄용 파편 및 그 제조방법 |
| CN111805442A (zh) * | 2020-07-22 | 2020-10-23 | 江苏赛扬精工科技有限责任公司 | 磨削航天航空钛合金用热压高强度陶瓷cbn砂轮及制备方法 |
| CN111805442B (zh) * | 2020-07-22 | 2021-09-03 | 江苏赛扬精工科技有限责任公司 | 磨削航天航空钛合金用热压高强度陶瓷cbn砂轮及制备方法 |
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| WO2009120036A1 (en) | 2009-10-01 |
| TW200940257A (en) | 2009-10-01 |
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