KR100799839B1 - 파장변환용 형광체 혼합물과 이를 이용한 백색 발광장치 - Google Patents
파장변환용 형광체 혼합물과 이를 이용한 백색 발광장치 Download PDFInfo
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- KR100799839B1 KR100799839B1 KR1020050026708A KR20050026708A KR100799839B1 KR 100799839 B1 KR100799839 B1 KR 100799839B1 KR 1020050026708 A KR1020050026708 A KR 1020050026708A KR 20050026708 A KR20050026708 A KR 20050026708A KR 100799839 B1 KR100799839 B1 KR 100799839B1
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- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
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- C09K11/7737—Phosphates
- C09K11/7738—Phosphates with alkaline earth metals
- C09K11/7739—Phosphates with alkaline earth metals with halogens
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- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/7729—Chalcogenides
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- C09K11/77342—Silicates
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
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- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
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- H10H20/851—Wavelength conversion means
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- H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
Description
| x | y | |
| (Sr,Ca)5(PO4)3Cl:Eu2+ | 0.15 | 0.03 |
| (Ba,Sr)2SiO4:Eu | 0.19 | 0.63 |
| (Sr,Ca)S:Eu | 0.62 | 0.37 |
| 구분 | (Sr,Ca)5(PO4)3Cl:Eu2+ (wt%) | (Ba,Sr)2SiO4:Eu (wt%) | (Sr,Ca)S:Eu (wt%) |
| 발명예1 | 70.59 | 23.04 | 6.37 |
| 발명예2 | 65.98 | 30.44 | 3.58 |
| 발명예3 | 64.45 | 29.73 | 5.82 |
| 발명예4 | 80.08 | 15.60 | 4.32 |
| 발명예5 | 76.47 | 21.06 | 2.47 |
| 발명예6 | 78.32 | 18.30 | 3.38 |
| 비교예1 | 90.94 | 7.42 | 1.64 |
| 구분 | x | y | 연색지수(CRI) |
| 발명예1 | 0.418 | 0.396 | 93.84 |
| 발명예2 | 0.337 | 0.419 | 80.59 |
| 발명예3 | 0.414 | 0.428 | 89.70 |
| 발명예4 | 0.357 | 0.341 | 94.43 |
| 발명예5 | 0.307 | 0.363 | 86.98 |
| 발명예6 | 0.320 | 0.331 | 95.00 |
| 비교예1 | 0.254 | 0.232 | 78.62 |
| 비교예2 | 0.282 | 0.264 | 72.51 |
| 비교예3 | 0.302 | 0.295 | 76.44 |
| 비교예4 | 0.333 | 0.327 | 77.82 |
Claims (16)
- 삭제
- 삭제
- 근자외선 파장광을 CIE 색도좌표가 0.25≤x≤0.45와 0.25≤y≤0.43을 만족하는 색좌표 (x, y)에 위치하며, 연색지수(CRI)가 80이상인 출력광으로 변환시키는 배합비로, A5(PO4)3Cl:Eu2+, D2SiO4:Eu 및 MS:Eu인 3종의 형광체물질이 혼합되어 이루어지며, 상기 배합비는 전체 중량을 기준으로 A5(PO4)3Cl:Eu2+가 70∼83wt%이고, D2SiO4:Eu는 13∼27wt%이며, MS:Eu는 3∼7wt%이며, 여기서, A는 Sr, Ca, Ba 및 Mg 중 적어도 하나의 원소이며, D는 Ba, Sr 및 Ca 중 적어도 하나의 원소이며, M은 Sr 및 Ca 중 적어도 하나의 원소인 백색 형광체 혼합물.
- 삭제
- 삭제
- 제3항에 있어서,상기 백색 형광체 혼합물은 근자외선광에 대한 출력광의 연색지수가 90이상인 것을 특징으로 하는 백색 형광체 혼합물.
- 삭제
- 삭제
- 삭제
- 근자외선 발광다이오드; 및,상기 발광다이오드의 광방출방향에 형성되고, CIE 색도좌표가 0.3≤x≤0.45와 0.3≤y≤0.43을 만족하는 색좌표 (x, y)에 위치하며, 연색지수(CRI)가 80이상인 출력광으로 변환시키는 배합비로, A5(PO4)3Cl:Eu2+, D2SiO4:Eu 및 MS:Eu인 3종의 형광체물질이 혼합되어 이루어지며, 상기 배합비는 전체 중량을 기준으로 A5(PO4)3Cl:Eu2+가 70∼83wt%이고, D2SiO4:Eu는 13∼27wt%이며, MS:Eu는 3∼7wt%이며, 여기서, A는 Sr, Ca, Ba 및 Mg 중 적어도 하나의 원소이며, D는 Ba, Sr 및 Ca 중 적어도 하나의 원소이며, M은 Sr 및 Ca 중 적어도 하나의 원소인 백색 형광체 혼합물과 경화성 수지로 이루어진 파장변환부를 포함하는 백색 발광장치.
- 제10항에 있어서,상기 근자외선 발광다이오드의 광파장은 300∼450 ㎚인 것을 특징으로 하는 백색 발광장치.
- 제10항에 있어서,상기 경화성 수지는 실리콘 또는 에폭시 수지를 추가적으로 포함하는 것을 특징으로 하는 백색 발광장치.
- 삭제
- 삭제
- 제10항에 있어서,상기 백색 발광장치의 출력광은 90이상의 연색지수를 갖는 것을 특징으로 하 는 백색 발광장치.
- 삭제
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050026708A KR100799839B1 (ko) | 2005-03-30 | 2005-03-30 | 파장변환용 형광체 혼합물과 이를 이용한 백색 발광장치 |
| US11/320,137 US7911127B2 (en) | 2005-03-30 | 2005-12-28 | Phosphor blend for wavelength conversion and white light emitting device using the same |
| DE102006001399A DE102006001399B4 (de) | 2005-03-30 | 2006-01-11 | Phosphormischung für Wellenlängenumwandlung und weisse Leuchtdiode, für die diese verwendet wird |
| CNB2006100019018A CN100516168C (zh) | 2005-03-30 | 2006-01-19 | 用于波长转换的磷光体混合物及白光发射装置 |
| JP2006013071A JP4310315B2 (ja) | 2005-03-30 | 2006-01-20 | 波長変換用の蛍光体混合物及びこれを利用した白色発光装置 |
| TW095103413A TWI324174B (en) | 2005-03-30 | 2006-01-27 | Phosphor blend for wavelength conversion and white light emitting device using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050026708A KR100799839B1 (ko) | 2005-03-30 | 2005-03-30 | 파장변환용 형광체 혼합물과 이를 이용한 백색 발광장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20060104492A KR20060104492A (ko) | 2006-10-09 |
| KR100799839B1 true KR100799839B1 (ko) | 2008-01-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR1020050026708A Expired - Fee Related KR100799839B1 (ko) | 2005-03-30 | 2005-03-30 | 파장변환용 형광체 혼합물과 이를 이용한 백색 발광장치 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7911127B2 (ko) |
| JP (1) | JP4310315B2 (ko) |
| KR (1) | KR100799839B1 (ko) |
| CN (1) | CN100516168C (ko) |
| DE (1) | DE102006001399B4 (ko) |
| TW (1) | TWI324174B (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101607400B1 (ko) | 2014-10-29 | 2016-03-29 | 엘지전자 주식회사 | 발광 장치 |
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| US9084328B2 (en) | 2006-12-01 | 2015-07-14 | Cree, Inc. | Lighting device and lighting method |
| US8513875B2 (en) | 2006-04-18 | 2013-08-20 | Cree, Inc. | Lighting device and lighting method |
| US9441793B2 (en) | 2006-12-01 | 2016-09-13 | Cree, Inc. | High efficiency lighting device including one or more solid state light emitters, and method of lighting |
| KR100946015B1 (ko) * | 2007-01-02 | 2010-03-09 | 삼성전기주식회사 | 백색 발광장치 및 이를 이용한 lcd 백라이트용 광원모듈 |
| KR100862446B1 (ko) * | 2007-01-26 | 2008-10-08 | 삼성전기주식회사 | 백색 led 광원 모듈 |
| US7568815B2 (en) * | 2007-03-26 | 2009-08-04 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light source having a plurality of white LEDs with different output spectra |
| JP2010527157A (ja) * | 2007-05-08 | 2010-08-05 | クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド | 照明デバイスおよび照明方法 |
| TWI422785B (zh) * | 2007-05-08 | 2014-01-11 | 克里公司 | 照明裝置及照明方法 |
| EP2015614B1 (en) * | 2007-07-12 | 2010-12-15 | Koito Manufacturing Co., Ltd. | Light emitting device |
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| US7229573B2 (en) * | 2004-04-20 | 2007-06-12 | Gelcore, Llc | Ce3+ and Eu2+ doped phosphors for light generation |
| JPWO2005124878A1 (ja) * | 2004-06-22 | 2008-04-17 | コニカミノルタホールディングス株式会社 | 白色発光ダイオード及びその製造方法 |
| US7443094B2 (en) * | 2005-03-31 | 2008-10-28 | Dowa Electronics Materials Co., Ltd. | Phosphor and manufacturing method of the same, and light emitting device using the phosphor |
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2005
- 2005-03-30 KR KR1020050026708A patent/KR100799839B1/ko not_active Expired - Fee Related
- 2005-12-28 US US11/320,137 patent/US7911127B2/en active Active
-
2006
- 2006-01-11 DE DE102006001399A patent/DE102006001399B4/de active Active
- 2006-01-19 CN CNB2006100019018A patent/CN100516168C/zh active Active
- 2006-01-20 JP JP2006013071A patent/JP4310315B2/ja active Active
- 2006-01-27 TW TW095103413A patent/TWI324174B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200360280Y1 (ko) * | 2004-06-04 | 2004-08-25 | 안재현 | 완강기 |
| KR200369010Y1 (ko) * | 2004-07-07 | 2004-12-03 | 최병수 | 음식물 구이용 황토 패드 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101607400B1 (ko) | 2014-10-29 | 2016-03-29 | 엘지전자 주식회사 | 발광 장치 |
| US9518719B2 (en) | 2014-10-29 | 2016-12-13 | Lg Electronics Inc. | Light emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102006001399B4 (de) | 2013-03-14 |
| US20060221635A1 (en) | 2006-10-05 |
| TW200634130A (en) | 2006-10-01 |
| JP4310315B2 (ja) | 2009-08-05 |
| TWI324174B (en) | 2010-05-01 |
| CN1840611A (zh) | 2006-10-04 |
| US7911127B2 (en) | 2011-03-22 |
| KR20060104492A (ko) | 2006-10-09 |
| DE102006001399A1 (de) | 2006-10-05 |
| CN100516168C (zh) | 2009-07-22 |
| JP2006282994A (ja) | 2006-10-19 |
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