KR100735395B1 - 집적 회로를 이용한 인쇄회로기판의 라우팅 방법 - Google Patents
집적 회로를 이용한 인쇄회로기판의 라우팅 방법 Download PDFInfo
- Publication number
- KR100735395B1 KR100735395B1 KR1020050038864A KR20050038864A KR100735395B1 KR 100735395 B1 KR100735395 B1 KR 100735395B1 KR 1020050038864 A KR1020050038864 A KR 1020050038864A KR 20050038864 A KR20050038864 A KR 20050038864A KR 100735395 B1 KR100735395 B1 KR 100735395B1
- Authority
- KR
- South Korea
- Prior art keywords
- integrated circuit
- routing
- signal processing
- integrated circuits
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10522—Adjacent components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
Description
상기 신호 처리용 집적회로들의 중심부의 이웃한 위치에 라우팅용 센터 집적회로를 배치하여 상기 신호 처리용 집적회로들과 여러 방향으로 라우팅시킴으로써, 상기 신호 처리용 집적회로들을 서로 전기적으로 연결하는 것을 특징으로 한다.
Claims (6)
- 전자기기의 인쇄회로기판에 구비되는 다수개의 신호 처리용 집적회로(IC)를 장착하고,상기 신호 처리용 집적회로들의 중심부의 이웃한 위치에 라우팅용 센터 집적회로를 배치하여 상기 신호 처리용 집적회로들과 여러 방향으로 라우팅시킴으로써, 상기 신호 처리용 집적회로들을 서로 전기적으로 연결하는 것을 특징으로 하는 집적회로를 이용한 인쇄회로기판의 라우팅 방법.
- 제 1 항에 있어서, 상기 라우팅용 센터 집적회로에는 상기 각각의 신호 처리용 집적회로들과 라우팅되도록 다수의 라우팅 핀이 구비됨을 특징으로 하는 집적회로를 이용한 인쇄회로기판의 라우팅 방법.
- 제 1 항에 있어서, 상기 신호 처리용 집적 회로는 상기 라우팅용 센터 집적회로를 중심으로 장착 위치가 변경되는 것을 특징으로 하는 집적회로를 이용한 인쇄회로기판의 라우팅 방법.
- 제 1 항에 있어서, 상기 라우팅용 센터 집적 회로는 길이방향으로 연장되게 제공되고, 상기 라우팅용 센터 집적 회로의 상,하, 좌, 우측에 장착된 신호 처리용 집적회도들을 상기 라우팅용 센터 집적회로를 통해 상호 연결시킴을 특징으로 하는 집적회로를 이용한 인쇄회로기판의 라우팅 방법.
- 제 1 항에 있어서, 상기 라우팅용 센터 집적 회로의 이웃한 위치에는 적어도 하나 이상의 전원/기준 클럭이 배치되어 상기 신호 처리용 집적 회로들이 상기 라우팅용 센터 집적회로를 통해 전원/기준 클럭을 공급받는 것을 특징으로 하는 집적회로를 이용한 인쇄회로기판의 라우팅 방법.
- 제 1 항에 있어서, 상기 라우팅용 센터 집적 회로는 신호, 전원 및 클럭 공급을 위한 라인만으로 구성된 것을 특징으로 하는 집적회로를 이용한 인쇄회로기판의 라우팅 방법.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050038864A KR100735395B1 (ko) | 2005-05-10 | 2005-05-10 | 집적 회로를 이용한 인쇄회로기판의 라우팅 방법 |
| US11/391,590 US7480748B2 (en) | 2005-05-10 | 2006-03-28 | Printed circuit board (PCB) having a plurality of integrated circuits (ICS) interconnected through routing pins in one central integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050038864A KR100735395B1 (ko) | 2005-05-10 | 2005-05-10 | 집적 회로를 이용한 인쇄회로기판의 라우팅 방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20060116459A KR20060116459A (ko) | 2006-11-15 |
| KR100735395B1 true KR100735395B1 (ko) | 2007-07-04 |
Family
ID=37591137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020050038864A Expired - Fee Related KR100735395B1 (ko) | 2005-05-10 | 2005-05-10 | 집적 회로를 이용한 인쇄회로기판의 라우팅 방법 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7480748B2 (ko) |
| KR (1) | KR100735395B1 (ko) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11042211B2 (en) | 2009-08-07 | 2021-06-22 | Advanced Processor Architectures, Llc | Serially connected computing nodes in a distributed computing system |
| US8381031B2 (en) | 2009-08-07 | 2013-02-19 | Advanced Processor Architectures, Llc | Distributed computing |
| US9645603B1 (en) | 2013-09-12 | 2017-05-09 | Advanced Processor Architectures, Llc | System clock distribution in a distributed computing environment |
| US9429983B1 (en) | 2013-09-12 | 2016-08-30 | Advanced Processor Architectures, Llc | System clock distribution in a distributed computing environment |
| US8402406B2 (en) | 2010-12-28 | 2013-03-19 | International Business Machines Corporation | Controlling plating stub reflections in a chip package |
| US8653377B2 (en) * | 2011-04-05 | 2014-02-18 | Raytheon Company | Microelectronic assemblies |
| US20180076349A1 (en) | 2016-09-14 | 2018-03-15 | The Boeing Company | Power routing module for a solar cell array |
| US11437533B2 (en) | 2016-09-14 | 2022-09-06 | The Boeing Company | Solar cells for a solar cell array |
| EP3907766A1 (en) * | 2016-09-14 | 2021-11-10 | The Boeing Company | Solar cell array connections using corner conductors |
| US12490523B2 (en) | 2017-06-12 | 2025-12-02 | The Boeing Company | Solar cell array with changeable string length |
| US11967923B2 (en) | 2018-03-28 | 2024-04-23 | The Boeing Company | Single sheet foldout solar array |
| US12244265B2 (en) | 2018-03-28 | 2025-03-04 | The Boeing Company | Wiring for a rigid panel solar array |
| CN110740569A (zh) * | 2018-07-19 | 2020-01-31 | 鸿富锦精密工业(武汉)有限公司 | 印刷电路板 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08153937A (ja) * | 1994-11-29 | 1996-06-11 | Murata Mfg Co Ltd | 高周波プリント回路基板 |
| KR20000052705A (ko) * | 1996-10-21 | 2000-08-25 | 알파인 마이크로시스템즈, 인코포레이티드 | 집적회로를 실장하기 위한 시스템 및 방법 |
| KR20040030265A (ko) * | 2002-08-26 | 2004-04-09 | 하이맥스 테크놀로지스, 인코포레이티드 | 칩 패키지 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5491651A (en) * | 1992-05-15 | 1996-02-13 | Key, Idea Development | Flexible wearable computer |
| US5416730A (en) * | 1993-11-19 | 1995-05-16 | Appcon Technologies, Inc. | Arm mounted computer |
| US6545875B1 (en) * | 2000-05-10 | 2003-04-08 | Rambus, Inc. | Multiple channel modules and bus systems using same |
| US6900533B2 (en) * | 2002-01-30 | 2005-05-31 | Agilent Technologies, Inc. | Apparatus for routing electrical signals |
| US20060065958A1 (en) * | 2004-09-29 | 2006-03-30 | Pei-Haw Tsao | Three dimensional package and packaging method for integrated circuits |
-
2005
- 2005-05-10 KR KR1020050038864A patent/KR100735395B1/ko not_active Expired - Fee Related
-
2006
- 2006-03-28 US US11/391,590 patent/US7480748B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08153937A (ja) * | 1994-11-29 | 1996-06-11 | Murata Mfg Co Ltd | 高周波プリント回路基板 |
| KR20000052705A (ko) * | 1996-10-21 | 2000-08-25 | 알파인 마이크로시스템즈, 인코포레이티드 | 집적회로를 실장하기 위한 시스템 및 방법 |
| KR20040030265A (ko) * | 2002-08-26 | 2004-04-09 | 하이맥스 테크놀로지스, 인코포레이티드 | 칩 패키지 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060116459A (ko) | 2006-11-15 |
| US20070005843A1 (en) | 2007-01-04 |
| US7480748B2 (en) | 2009-01-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101218011B1 (ko) | 플립 칩 인터커넥션 패드 레이아웃 반도체 패키지 및 그 생산 방법 | |
| KR100735395B1 (ko) | 집적 회로를 이용한 인쇄회로기판의 라우팅 방법 | |
| US5903050A (en) | Semiconductor package having capacitive extension spokes and method for making the same | |
| CN100390969C (zh) | 半导体器件 | |
| JP5945243B2 (ja) | プリント回路基板、プリント回路基板の形成方法、及び、最終製品のメインボード | |
| JP5265948B2 (ja) | プリント回路基板、及び、最終製品のメインボード | |
| CA2422677C (en) | Technique for reducing the number of layers in a multilayer circuit board | |
| CN1842248B (zh) | 球栅阵列偏栅去耦的设备及方法 | |
| JP2003007750A (ja) | 半導体装置 | |
| KR20060045338A (ko) | 전기 회로 장치, 전기 시스템, 및 전기 회로 장치 동작방법 | |
| US7791896B1 (en) | Providing an embedded capacitor in a circuit board | |
| US7161812B1 (en) | System for arraying surface mount grid array contact pads to optimize trace escape routing for a printed circuit board | |
| US6040985A (en) | Circuit board having general purpose region and programmable region | |
| KR20070064288A (ko) | 1 이상의 인쇄 회로 기판을 포함하고 동일한 형태의 복수의반도체 구성요소들을 포함하는 전자 디바이스 및 그 제조방법 | |
| CN113747658B (zh) | 使用两个布线层的集成电路的印刷电路板连接 | |
| EP1629534B1 (en) | Foldable substrate with ground plane having a particular shape and corresponding manufacturing method | |
| JP2001015643A (ja) | 有機ランド・グリッド・アレイ(olga)パッケージとolgaを含む集積回路パッケージ | |
| US20070035005A1 (en) | Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid | |
| EP1714530B1 (en) | Method for increasing a routing density for a circuit board and such a circuit board | |
| JP2009117409A (ja) | 回路基板 | |
| TWI444115B (zh) | 印刷電路板和晶片系統 | |
| CN111797053A (zh) | 多芯片运算装置、虚拟货币挖矿机及计算机服务器 | |
| CN222126516U (zh) | 一种芯片封装结构、封装模组和电子设备 | |
| CN118158890B (zh) | 基板、基板的制作方法、芯片封装体和电子器件 | |
| KR100632733B1 (ko) | 인쇄회로기판 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
| D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| FPAY | Annual fee payment |
Payment date: 20130530 Year of fee payment: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| FPAY | Annual fee payment |
Payment date: 20140529 Year of fee payment: 8 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| FPAY | Annual fee payment |
Payment date: 20150528 Year of fee payment: 9 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| FPAY | Annual fee payment |
Payment date: 20160530 Year of fee payment: 10 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 10 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20170628 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20170628 |