KR100686605B1 - 연마포용 드레서 및 그 제조방법 - Google Patents
연마포용 드레서 및 그 제조방법 Download PDFInfo
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Abstract
Description
| 실시예1 | 실시예2 | 실시예3 | 비교예 | ||
| 연마포의 드레싱률 (㎛/h) | 평균 | 233 | 154 | 240 | 216 |
| 표준편차 | 3.25 | 3.41 | 2.85 | 9.86 | |
| 연마포의 면조도(Ra) (㎛) | 6.94 | 4.2 | 6.23 | 4.21 | |
| 표준편차 | 0.06 | 0.12 | 0.22 | 0.41 | |
| 연마포의 면조도(Rz) (㎛) | 27.42 | 17.84 | 24.12 | 29.55 | |
| 표준편차 | 2.30 | 1.85 | 1.62 | 2.75 | |
| 연마포의 드레싱시의 지립 탈락 개수 | 0 | 0 | 0 | 92 | |
Claims (15)
- 금속부재의 표면에 드레싱부가 형성되어 이루어지는 연마포용 드레서로서,상기 드레싱부는 다수개의 지립과 그것을 유지하는 평판형상의 유지재에 의해 형성되고,상기 유지재가, 주기율의 IVa, Va, VIa족 천이금속(Ti을 제외), 주기율의 IVa, Va, VIa족 천이금속의 산화물, 탄화물, 질화물, 붕소화물, 및 이들의 복합화합물의 1종 또는 2종이상의 고융점 고경도물질과, Fe, Co, Ni, Cu, Ti, Cr, Ag의 1종 또는 2종이상의 금속상으로 구성된 것의 (1) 초경합금, (2) 서멧, (3) 산화물, 탄화물, 질화물 및 붕소화물의 1종 또는 2종이상으로 이루어지는 세라믹스 중 어느 1종을 주성분으로 하는 것을 특징으로 하는 연마포용 드레서.
- 금속부재의 표면에 드레싱부가 형성되어 이루어지는 연마포용 드레서로서,상기 드레싱부는 다수개의 지립과 그것을 유지하는 평판형상의 유지재에 의해 형성되고,상기 유지재가, 주기율의 IVa, Va, VIa족 천이금속(Ti을 제외), 주기율의 IVa, Va, VIa족 천이금속의 산화물, 탄화물, 질화물, 붕소화물, 및 이들의 복합화합물의 1종 또는 2종이상 및 규소를 주성분으로 하고, 이것에 플럭스제로서의 이산화규소를 첨가하여 이루어지는 것을 특징으로 하는 연마포용 드레서.
- 제2항에 있어서, 상기 이산화규소의 첨가량은 상기 유지재 중량에 대해서 1~6%인 것을 특징으로 하는 연마포용 드레서.
- 제1항에 있어서, 상기 유지재는, 주기율의 IVa, Va, VIa족 천이금속(Ti을 제외), 주기율의 IVa, Va, VIa족 천이금속의 산화물, 탄화물, 질화물, 붕소화물, 및 이들의 복합화합물의 1종 또는 2종이상의 물질을 주성분으로 하는 것을 특징으로 하는 연마포용 드레서.
- 금속부재의 표면에 드레싱부가 형성되어 이루어지는 연마포용 드레서로서,상기 드레싱부는 다수개의 지립과 그것을 유지하는 평판형상의 유지재에 의해 형성되고,상기 유지재가, 주기율의 IVa, IVb, Va, VIa족 천이금속(Ti을 제외), 주기율의 IVa, IVb, Va, VIa족 천이금속의 산화물, 탄화물, 질화물, 붕소화물, 및 이들의 복합화합물의 1종 또는 2종이상의 고융점 고경도물질과, Fe, Co, Ni, Cu, Ti, Cr, Ag의 1종 또는 2종이상의 금속상으로 구성된 것의 초경합금, 서멧을 주성분으로 하는 것을 특징으로 하는 연마포용 드레서.
- 제1항 내지 제5항 중 어느 한 항에 있어서, 상기 지립은, 그 입경이 10~1000㎛인 다이아몬드 또는 입방정 질화 붕소이며, 또한 지립 표면을 코팅하지 않거나 또는 IVa, IVb, Va, VIa족 천이금속, 또는 Ni, Co, Ag 및 Cu 중 어느 하나로 코팅되어 있는 것을 특징으로 하는 연마포용 드레서.
- 제1항 내지 제5항 중 어느 한 항에 있어서, 상기 다수개의 지립 각각은, 유지재 표면에 2차원적인 규칙성을 가지고서 배열되고, 그 배열에 의해 형성되는 최소의 격자에 있어서의 인접하는 지립간의 거리가, 10~3000㎛의 범위이고, 각 지립이 실질적으로 균등분포를 이루어 배치되어 있는 것을 특징으로 하는 연마포용 드 레서.
- 제1항 내지 제5항 중 어느 한 항에 있어서, 상기 지립은, 1종 혹은 입도가 다른 2종이상으로 구성되어 있고, 각각의 지립종은 단독으로 상기 배열 형상을 이루는 것을 특징으로 하는 연마포용 드레서
- 제1항 내지 제5항 중 어느 한 항에 있어서, 상기 지립을 유지하는 평면상의 유지재와 금속부재 중, 적어도 상기 유지재의 노출면에 경질의 내산ㆍ내알칼리성 비금속피막을 형성하고 있는 것을 특징으로 하는 연마포용 드레서.
- 제9항에 있어서, 상기 내산ㆍ내알칼리성 비금속피막은 그 두께가 1~1O㎛인 것을 특징으로 하는 연마포용 드레서.
- 제9항에 있어서, 상기 내산ㆍ내알칼리성 비금속피막은, 할로겐 함유 다이아몬드 라이크 카본, 또는 다이아몬드 라이크 카본인 것을 특징으로 하는 연마포용 드레서.
- 제1항에 기재된 연마포용 드레서를 제조하는 방법으로서,유지재 표면에 다수개의 지립을 규칙성을 가지고서 유지시키기 위해 상기 유지재 표면 또는 그 위에 적재하는 시트에, 2차원적으로 규칙성을 가지고서 배열되 는 각 지립의 유지위치에 대응하여, 거의 지립 지름 사이즈의 점착부를 설치하고,그들 점착부에 각각의 단립자의 지립을 점착시키고,이어서, 상기 지립을 상기 유지재의 표면에 유지시켜 이 유지재를 소결함으로써 고정하는 것을 특징으로 하는 연마포용 드레서의 제조방법.
- 제2항에 기재된 연마포용 드레서를 제조하는 방법으로서,유지재 표면에 다수개의 지립을 규칙성을 가지고서 유지시키기 위해 상기 유지재 표면 또는 그 위에 적재하는 시트에, 2차원적으로 규칙성을 가지고서 배열되는 각 지립의 유지위치에 대응하여, 거의 지립 지름 사이즈의 점착부를 설치하고,그들 점착부에 각각의 단립자의 지립을 점착시키고,이어서, 상기 지립을 상기 유지재의 표면에 유지시켜 이 유지재를 소결함으로써 고정하는 것을 특징으로 하는 연마포용 드레서의 제조방법.
- 제12항 또는 제13항에 있어서, 상기 지립으로서, 표면에 IVa, IVb, Va, VIa족 천이금속, 또는 Ni, Co, Ag, Cu 및 그들의 화합물 중 어느 1종으로 코팅되어 있는 것을 이용하는 것을 특징으로 하는 연마포용 드레서의 제조방법.
- 제13항에 있어서, 거의 지립 지름 사이즈의 상기 점착부는, 점착제를 도포한 유지재 표면을 마스킹하는 시트에, 거의 지립 지름 사이즈의 구멍을 형성함으로써 비마스킹부를 형성하고, 그 비마스킹부에 점착부를 형성하는 것을 특징으로 하는 연마포용 드레서의 제조방법.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004068135 | 2004-03-10 | ||
| JPJP-P-2004-00068135 | 2004-03-10 |
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| Publication Number | Publication Date |
|---|---|
| KR20060043812A KR20060043812A (ko) | 2006-05-15 |
| KR100686605B1 true KR100686605B1 (ko) | 2007-02-26 |
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Country Status (5)
| Country | Link |
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| US (1) | US20050202762A1 (ko) |
| JP (1) | JP5295868B2 (ko) |
| KR (1) | KR100686605B1 (ko) |
| CN (1) | CN1666844A (ko) |
| TW (1) | TWI286963B (ko) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110275288A1 (en) * | 2010-05-10 | 2011-11-10 | Chien-Min Sung | Cmp pad dressers with hybridized conditioning and related methods |
| JP2008132573A (ja) * | 2006-11-29 | 2008-06-12 | Mitsubishi Materials Corp | Cmpコンディショナ |
| JP5644401B2 (ja) * | 2010-11-15 | 2014-12-24 | 株式会社Sumco | エピタキシャルウェーハの製造方法およびエピタキシャルウェーハ |
| CN102092009B (zh) * | 2010-12-10 | 2012-09-05 | 天津大学 | 陶瓷结合剂金刚石修整轮 |
| JP5853946B2 (ja) * | 2012-01-06 | 2016-02-09 | 信越化学工業株式会社 | 外周切断刃の製造方法 |
| TWI511841B (zh) * | 2013-03-15 | 2015-12-11 | Kinik Co | 貼合式化學機械硏磨修整器及其製法 |
| KR101506875B1 (ko) * | 2013-09-11 | 2015-03-31 | 주식회사 엘지실트론 | 드레싱 유닛 |
| CN104822491A (zh) * | 2013-10-02 | 2015-08-05 | 日本碍子株式会社 | 研磨物的制造方法 |
| JP2018032745A (ja) * | 2016-08-24 | 2018-03-01 | 東芝メモリ株式会社 | ドレッサー、ドレッサーの製造方法、及び半導体装置の製造方法 |
| CN106914826B (zh) * | 2017-03-21 | 2023-08-01 | 东旭集团有限公司 | 一种用于大尺寸陶瓷盘的修复装置 |
| CN108098590A (zh) * | 2017-12-21 | 2018-06-01 | 东莞华晶粉末冶金有限公司 | 一种研磨抛光垫的修整器及其修整方法 |
| US20190351527A1 (en) * | 2018-05-17 | 2019-11-21 | Entegris, Inc. | Conditioner for chemical-mechanical-planarization pad and related methods |
| JP6899404B2 (ja) * | 2019-01-08 | 2021-07-07 | 株式会社アライドマテリアル | 超砥粒ホイール |
| JP7068380B2 (ja) * | 2020-05-07 | 2022-05-16 | キオクシア株式会社 | ドレッサーの製造方法 |
| CN113118967B (zh) * | 2021-03-17 | 2022-12-23 | 广东纳诺格莱科技有限公司 | 一种适用于SiC晶片的磨粒定向的固相反应研磨盘及其制备方法和应用 |
| TWI769907B (zh) * | 2021-08-03 | 2022-07-01 | 中國砂輪企業股份有限公司 | 複合修整器 |
| CN113480974A (zh) * | 2021-08-04 | 2021-10-08 | 宁波江丰电子材料股份有限公司 | 一种研磨组合物及其应用 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4290809A (en) * | 1980-08-06 | 1981-09-22 | Mobay Chemical Corporation | Raw mix flux for continuous casting of steel |
| JP2679178B2 (ja) * | 1988-11-22 | 1997-11-19 | 三菱マテリアル株式会社 | 電着砥石 |
| JPH07297195A (ja) * | 1994-04-27 | 1995-11-10 | Speedfam Co Ltd | 半導体装置の平坦化方法及び平坦化装置 |
| US6299521B1 (en) * | 1995-12-26 | 2001-10-09 | Bridgestone Corporation | Polishing sheet |
| JPH09314457A (ja) * | 1996-05-29 | 1997-12-09 | Speedfam Co Ltd | ドレッサ付き片面研磨装置 |
| JP2000079551A (ja) * | 1998-07-06 | 2000-03-21 | Canon Inc | コンディショニング装置及びコンディショニング方法 |
| US6322427B1 (en) * | 1999-04-30 | 2001-11-27 | Applied Materials, Inc. | Conditioning fixed abrasive articles |
| US6755720B1 (en) * | 1999-07-15 | 2004-06-29 | Noritake Co., Limited | Vitrified bond tool and method of manufacturing the same |
| JP3657869B2 (ja) * | 1999-10-29 | 2005-06-08 | 株式会社巴川製紙所 | 低反射部材 |
| JP3527448B2 (ja) * | 1999-12-20 | 2004-05-17 | 株式会社リード | Cmp研磨布用ドレッサー及びその製造方法 |
| JP2001210613A (ja) * | 2000-01-27 | 2001-08-03 | Allied Material Corp | Cmp用パッドコンディショナー |
| JP3759399B2 (ja) * | 2000-10-26 | 2006-03-22 | 株式会社リード | 研磨布用ドレッサーおよびその製造方法 |
| US7037177B2 (en) * | 2001-08-30 | 2006-05-02 | Micron Technology, Inc. | Method and apparatus for conditioning a chemical-mechanical polishing pad |
| US6939413B2 (en) * | 2003-03-24 | 2005-09-06 | Lincoln Global, Inc. | Flux binder system |
| TWI221618B (en) * | 2003-08-12 | 2004-10-01 | Chilisin Electronics Corp | Ni-Zn ferrite low temperature sintered leadfree flux composition |
-
2005
- 2005-03-07 TW TW094106842A patent/TWI286963B/zh not_active IP Right Cessation
- 2005-03-08 US US11/073,619 patent/US20050202762A1/en not_active Abandoned
- 2005-03-10 KR KR1020050019924A patent/KR100686605B1/ko not_active Expired - Fee Related
- 2005-03-10 CN CNA200510053721XA patent/CN1666844A/zh active Pending
-
2009
- 2009-06-01 JP JP2009132037A patent/JP5295868B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US20050202762A1 (en) | 2005-09-15 |
| JP5295868B2 (ja) | 2013-09-18 |
| CN1666844A (zh) | 2005-09-14 |
| TWI286963B (en) | 2007-09-21 |
| JP2009190170A (ja) | 2009-08-27 |
| KR20060043812A (ko) | 2006-05-15 |
| TW200533467A (en) | 2005-10-16 |
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