KR100604813B1 - 정보기록방법 - Google Patents
정보기록방법 Download PDFInfo
- Publication number
- KR100604813B1 KR100604813B1 KR1020010026210A KR20010026210A KR100604813B1 KR 100604813 B1 KR100604813 B1 KR 100604813B1 KR 1020010026210 A KR1020010026210 A KR 1020010026210A KR 20010026210 A KR20010026210 A KR 20010026210A KR 100604813 B1 KR100604813 B1 KR 100604813B1
- Authority
- KR
- South Korea
- Prior art keywords
- metal film
- micro tip
- etching
- voltage
- information recording
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B9/00—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor
- G11B9/10—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using electron beam; Record carriers therefor
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B9/00—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor
- G11B9/12—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor
- G11B9/14—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor using microscopic probe means, i.e. recording or reproducing by means directly associated with the tip of a microscopic electrical probe as used in Scanning Tunneling Microscopy [STM] or Atomic Force Microscopy [AFM] for inducing physical or electrical perturbations in a recording medium; Record carriers or media specially adapted for such transducing of information
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B9/00—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor
- G11B9/12—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor
- G11B9/14—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor using microscopic probe means, i.e. recording or reproducing by means directly associated with the tip of a microscopic electrical probe as used in Scanning Tunneling Microscopy [STM] or Atomic Force Microscopy [AFM] for inducing physical or electrical perturbations in a recording medium; Record carriers or media specially adapted for such transducing of information
- G11B9/1463—Record carriers for recording or reproduction involving the use of microscopic probe means
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B9/00—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor
- G11B9/12—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor
- G11B9/14—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor using microscopic probe means, i.e. recording or reproducing by means directly associated with the tip of a microscopic electrical probe as used in Scanning Tunneling Microscopy [STM] or Atomic Force Microscopy [AFM] for inducing physical or electrical perturbations in a recording medium; Record carriers or media specially adapted for such transducing of information
- G11B9/1463—Record carriers for recording or reproduction involving the use of microscopic probe means
- G11B9/149—Record carriers for recording or reproduction involving the use of microscopic probe means characterised by the memorising material or structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/3174—Etching microareas
- H01J2237/31747—Etching microareas using STM
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Plasma & Fusion (AREA)
- Organic Chemistry (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Micromachines (AREA)
- ing And Chemical Polishing (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
Claims (6)
- 그 상면에 금속막이 형성되는 기판을 준비하는 단계;상기 금속막의 상방에 마이크로 팁을 위치시키는 단계;상기 금속막과 마이크로 팁에 소정의 전압을 인가하여 마이크로 팁으로 부터 전자빔을 발생시키는 단계;상기 전자빔을 이용하여 상기 금속막의 표면을 국부적으로 가열 또는 용해하여 상기 금속막의 표면을 소정 패턴으로 에칭하는 단계;를 포함하는 것을 특징으로 하는 정보기록방법.
- 제 1 항에 있어서,상기 금속막 에칭시 상기 금속막에 대해 상기 마이크로 팁이 상대적인 운동을 하는 것을 특징으로 하는 정보기록방법.
- 제 2 항에 있어서,상기 전압은 소정의 범위 내에서 가변되어 상기 금속막에 대한 에칭 정도를 조절하는 것을 특징으로 하는 정보기록방법.
- 제 1 항에 있어서,상기 기판은 그 표면에 실리콘 옥사이드가 형성되는 실리콘 기판이며, 상기 금속막은 금(Au)으로서 상기 실리콘 옥사이드의 상면에 형성되는 것을 특징으로 하는 정보기록방법.
- 제 1 항 또는 제 4 항에 있어서,상기 전압은 12 내지 25V 로서 상기 마이크로 팁은 네가티브 상태로 바이어스 되는 것을 특징으로 하는 정보기록방법.
- 제 1 항에 있어서,상기 마이크로 팁은 Si 로 형성되며 그 표면에 티타늄 박막이 형성되어 있는 것을 특징으로 하는 정보기록방법.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020010026210A KR100604813B1 (ko) | 2001-05-14 | 2001-05-14 | 정보기록방법 |
| JP2001351052A JP2002332580A (ja) | 2001-05-14 | 2001-11-16 | 金属膜のナノメートルスケールエッチング方法 |
| US10/029,814 US6664123B2 (en) | 2001-05-14 | 2001-12-28 | Method for etching metal layer on a scale of nanometers |
| JP2007204945A JP2008021407A (ja) | 2001-05-14 | 2007-08-07 | データ記憶方法及びデータ記憶装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020010026210A KR100604813B1 (ko) | 2001-05-14 | 2001-05-14 | 정보기록방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20020087574A KR20020087574A (ko) | 2002-11-23 |
| KR100604813B1 true KR100604813B1 (ko) | 2006-07-26 |
Family
ID=19709450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020010026210A Expired - Fee Related KR100604813B1 (ko) | 2001-05-14 | 2001-05-14 | 정보기록방법 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US6664123B2 (ko) |
| JP (2) | JP2002332580A (ko) |
| KR (1) | KR100604813B1 (ko) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2400908A (en) * | 2003-04-25 | 2004-10-27 | E2V Tech Uk Ltd | Molecular detector arrangement |
| TWI269699B (en) * | 2003-06-03 | 2007-01-01 | Hon Hai Prec Ind Co Ltd | A method for making a molding die and a light guide plate |
| KR100520631B1 (ko) * | 2003-07-23 | 2005-10-13 | 삼성전자주식회사 | 나노스케일 디지털 데이터 저장 장치 |
| US7215633B2 (en) * | 2003-08-13 | 2007-05-08 | Hewlett-Packard Development Company, L.P. | Storage device having a probe with a tip to form a groove in a storage medium |
| KR100585462B1 (ko) * | 2003-12-26 | 2006-06-07 | 한국전자통신연구원 | 정보 저장 및 독출 장치 |
| EP1848626B1 (de) * | 2005-02-18 | 2017-04-19 | Bayerische Motoren Werke Aktiengesellschaft | Vorrichtung zum verbringen eines kraftfahrzeugs in eine zielposition |
| US7749922B2 (en) * | 2005-05-05 | 2010-07-06 | The Board Of Trustees Of The University Of Illinois | Nanowire structures and electrical devices |
| CN102211754B (zh) * | 2010-04-02 | 2013-09-18 | 中国科学院沈阳自动化研究所 | 基于afm的纳米沟道加工方法 |
| KR101223977B1 (ko) * | 2010-05-26 | 2013-01-18 | 경상대학교산학협력단 | 독성을 억제하는 타이타늄 나노 구조 스텐트의 제작방법 |
| US20230189664A1 (en) * | 2021-12-15 | 2023-06-15 | International Business Machines Corporation | Qubit Capacitor Trimming for Frequency Tuning |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5021672A (en) * | 1989-12-22 | 1991-06-04 | E. I. Du Pont De Nemours And Company | Etching of nanoscale structures |
| US5219826A (en) * | 1990-08-20 | 1993-06-15 | Conductus, Inc. | Superconducting junctions and method of making same |
| JPH0737790A (ja) * | 1993-07-22 | 1995-02-07 | Res Dev Corp Of Japan | 微細加工用レジスト |
| KR0170472B1 (ko) * | 1995-12-21 | 1999-02-01 | 정선종 | 주사관통현미경의 저전압진공증착을 이용한 상온작동 단일전자트랜지스터의 제조방법 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4971851A (en) * | 1984-02-13 | 1990-11-20 | Hewlett-Packard Company | Silicon carbide film for X-ray masks and vacuum windows |
| JPH01312753A (ja) * | 1988-06-13 | 1989-12-18 | Canon Inc | 記録再生装置 |
| KR100322696B1 (ko) * | 1995-03-29 | 2002-06-20 | 김순택 | 전계효과전자방출용마이크로-팁및그제조방법 |
| US5892223A (en) * | 1997-06-30 | 1999-04-06 | Harris Corporation | Multilayer microtip probe and method |
| JP2000193672A (ja) * | 1998-12-25 | 2000-07-14 | Olympus Optical Co Ltd | 走査型プロ―ブ顕微鏡用カンチレバ―およびその作製方法 |
-
2001
- 2001-05-14 KR KR1020010026210A patent/KR100604813B1/ko not_active Expired - Fee Related
- 2001-11-16 JP JP2001351052A patent/JP2002332580A/ja active Pending
- 2001-12-28 US US10/029,814 patent/US6664123B2/en not_active Expired - Fee Related
-
2007
- 2007-08-07 JP JP2007204945A patent/JP2008021407A/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5021672A (en) * | 1989-12-22 | 1991-06-04 | E. I. Du Pont De Nemours And Company | Etching of nanoscale structures |
| US5219826A (en) * | 1990-08-20 | 1993-06-15 | Conductus, Inc. | Superconducting junctions and method of making same |
| JPH0737790A (ja) * | 1993-07-22 | 1995-02-07 | Res Dev Corp Of Japan | 微細加工用レジスト |
| KR0170472B1 (ko) * | 1995-12-21 | 1999-02-01 | 정선종 | 주사관통현미경의 저전압진공증착을 이용한 상온작동 단일전자트랜지스터의 제조방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008021407A (ja) | 2008-01-31 |
| US6664123B2 (en) | 2003-12-16 |
| JP2002332580A (ja) | 2002-11-22 |
| US20020168825A1 (en) | 2002-11-14 |
| KR20020087574A (ko) | 2002-11-23 |
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