KR100532335B1 - 냉각 및 발전 장치 및 이를 채용한 휴대 단말기 및 그동작 방법 - Google Patents
냉각 및 발전 장치 및 이를 채용한 휴대 단말기 및 그동작 방법 Download PDFInfo
- Publication number
- KR100532335B1 KR100532335B1 KR10-2003-0088705A KR20030088705A KR100532335B1 KR 100532335 B1 KR100532335 B1 KR 100532335B1 KR 20030088705 A KR20030088705 A KR 20030088705A KR 100532335 B1 KR100532335 B1 KR 100532335B1
- Authority
- KR
- South Korea
- Prior art keywords
- cooling
- power generation
- heat
- operation mode
- thermoelectric semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (3)
- 냉각 및 발전을 위한 장치에 있어서,열전반도체로 구성되어, 미리 설정된 부분에 설치되어 해당 부분에서 발생하는 열을 제거하는 냉각모듈과,흡열판 및 방열판을 구비하는 열전반도체로 구성되며, 상기 냉각모듈의 열전반도체의 발열 부위에 상기 흡열판이 설치되어 상기 흡열판과 방열판 사이의 온도 차이에 의한 기전력을 발생하는 발전모듈을 포함함을 특징으로 하는 냉각 및 발전 장치.
- 냉각 및 발전을 위한 장치를 채용한 휴대 단말기에 있어서,열전반도체로 구성되며 상기 휴대 단말기의 내부의 미리 설정된 부분에 설치되어 해당 부분에서 발생하는 열을 제거하는 냉각모듈과, 흡열판 및 방열판을 구비하는 열전반도체로 구성되며 상기 냉각모듈의 열전반도체의 발열 부위에 상기 흡열판이 설치되어 상기 흡열판과 방열판 사이의 온도 차이에 의한 기전력을 발생하는 발전모듈을 가지는 냉각/발전부와,상기 냉각/발전부의 발전모듈에서 발생된 기전력을 이용하여 내부 전원의 보조 전원으로 사용하는 전원부를 포함함을 특징으로 하는 휴대 단말기.
- 열전반도체로 구성되어 해당 부분에서 발생하는 열을 제거하는 냉각모듈과, 열전반도체로 구성되어 냉각모듈의 열전반도체의 발열 부위의 온도를 이용한 기전력을 발생하는 발전모듈로 구성되는 냉각 및 발전 장치를 채용한 휴대 단말기의 동작에 있어서,자체 동작 모드를 확인하여 현재 동작 모드가 미리 설정된 동작 모드일 경우에 상기 냉각 및 발전 장치를 구동하는 과정과,자체 동작 모드를 확인하여 현재 동작 모드가 상기 미리 설정된 동작 모드가 아닐 경우에 상기 냉각 및 발전 장치의 구동을 종료하는 과정을 수행함을 특징으로 하는 휴대 단말기의 동작 방법.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2003-0088705A KR100532335B1 (ko) | 2003-12-08 | 2003-12-08 | 냉각 및 발전 장치 및 이를 채용한 휴대 단말기 및 그동작 방법 |
| US10/912,798 US20050121064A1 (en) | 2003-12-08 | 2004-08-06 | Cooling and electricity generation apparatus, a portable terminal adopting the same, and a method of operating the portable terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2003-0088705A KR100532335B1 (ko) | 2003-12-08 | 2003-12-08 | 냉각 및 발전 장치 및 이를 채용한 휴대 단말기 및 그동작 방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20050055485A KR20050055485A (ko) | 2005-06-13 |
| KR100532335B1 true KR100532335B1 (ko) | 2005-11-29 |
Family
ID=34632138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2003-0088705A Expired - Fee Related KR100532335B1 (ko) | 2003-12-08 | 2003-12-08 | 냉각 및 발전 장치 및 이를 채용한 휴대 단말기 및 그동작 방법 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20050121064A1 (ko) |
| KR (1) | KR100532335B1 (ko) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8546680B2 (en) * | 2005-07-08 | 2013-10-01 | Ying Wen Hsu | Energy efficient micro combustion system for power generation and fuel processing |
| KR101370338B1 (ko) * | 2007-02-23 | 2014-03-05 | 삼성전자 주식회사 | 컴퓨터 및 그 전원공급방법 |
| DE102008049726B4 (de) * | 2008-09-30 | 2012-02-09 | Advanced Micro Devices, Inc. | Gestapelte Chipkonfiguration mit stromgespeistem Wärmeübertragungssystem und Verfahren zum Steuern der Temperatur in einem Halbleiterbauelement |
| CN102396146B (zh) * | 2009-04-15 | 2014-08-13 | 惠普开发有限公司 | 生成并使用从电气设备的废热获得的电力 |
| TWI395355B (zh) * | 2010-05-25 | 2013-05-01 | Ruei Jen Chen | 熱電轉換模組 |
| FR2982080B1 (fr) * | 2011-10-26 | 2013-11-22 | St Microelectronics Rousset | Procede de communication sans fil entre deux dispositifs, notamment au sein d'un meme circuit integre, et systeme correspondant |
| JP6031802B2 (ja) * | 2012-04-03 | 2016-11-24 | アイシン精機株式会社 | 温度制御装置 |
| EP2844518B1 (en) * | 2012-04-30 | 2018-11-28 | Thermo King Corporation | Transport refrigeration system controller to engine control unit interface |
| US10247452B2 (en) * | 2012-12-17 | 2019-04-02 | Yi-Ming Tseng | Device and method for supporting a person |
| US20150075186A1 (en) * | 2013-09-18 | 2015-03-19 | Qualcomm Incorporated | Method of and an apparatus for maintaining constant phone skin temperature with a thermoelectric cooler and increasing allowable power/performance limit for die in a mobile segment |
| CA2981740C (en) * | 2015-04-06 | 2021-08-03 | Siemens Industry, Inc. | Rail cooling system and method for reducing thermal expansion |
| CN107131441A (zh) * | 2017-05-09 | 2017-09-05 | 华南理工大学 | 一种温差发电手电筒及其方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980026930A (ko) * | 1996-10-12 | 1998-07-15 | 정장호 | 이동통신 단말기의 송신용 전력 증폭부구조 |
| JPH11242085A (ja) * | 1997-12-25 | 1999-09-07 | Seiko Instruments Inc | 熱発電ユニット並びに該ユニットを用いた携帯用電子機器 |
| KR20000008835A (ko) * | 1998-07-16 | 2000-02-15 | 윤종용 | 이동통신단말기의 냉각팬 구동회로 |
| KR20040084549A (ko) * | 2003-03-28 | 2004-10-06 | 엘지전자 주식회사 | 이동 통신 단말기에서 전력 증폭 모듈의 발열 억제 장치및 방법 |
| KR20040093316A (ko) * | 2003-04-29 | 2004-11-05 | 주식회사 팬택앤큐리텔 | 이동통신 단말기에서의 공랭식 발열 억제 장치 및 그 방법 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4467611A (en) * | 1982-12-13 | 1984-08-28 | Marlow Industries, Inc. | Thermoelectric power generating device |
| US5824947A (en) * | 1995-10-16 | 1998-10-20 | Macris; Chris | Thermoelectric device |
| US6164076A (en) * | 1999-08-05 | 2000-12-26 | International Business Machines Corporation | Thermoelectric cooling assembly with thermal space transformer interposed between cascaded thermoelectric stages for improved thermal performance |
| US6271459B1 (en) * | 2000-04-26 | 2001-08-07 | Wafermasters, Inc. | Heat management in wafer processing equipment using thermoelectric device |
-
2003
- 2003-12-08 KR KR10-2003-0088705A patent/KR100532335B1/ko not_active Expired - Fee Related
-
2004
- 2004-08-06 US US10/912,798 patent/US20050121064A1/en not_active Abandoned
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980026930A (ko) * | 1996-10-12 | 1998-07-15 | 정장호 | 이동통신 단말기의 송신용 전력 증폭부구조 |
| JPH11242085A (ja) * | 1997-12-25 | 1999-09-07 | Seiko Instruments Inc | 熱発電ユニット並びに該ユニットを用いた携帯用電子機器 |
| KR20000008835A (ko) * | 1998-07-16 | 2000-02-15 | 윤종용 | 이동통신단말기의 냉각팬 구동회로 |
| KR20040084549A (ko) * | 2003-03-28 | 2004-10-06 | 엘지전자 주식회사 | 이동 통신 단말기에서 전력 증폭 모듈의 발열 억제 장치및 방법 |
| KR20040093316A (ko) * | 2003-04-29 | 2004-11-05 | 주식회사 팬택앤큐리텔 | 이동통신 단말기에서의 공랭식 발열 억제 장치 및 그 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20050055485A (ko) | 2005-06-13 |
| US20050121064A1 (en) | 2005-06-09 |
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