KR100293590B1 - Carrier module for semiconductor device inspection device - Google Patents

Abstract

A contactor and a semiconductor element support spring are provided for evenly pressing and holding the lead and the body of the semiconductor element to be tested so that the lead of the semiconductor element is not deformed during the test and the entire surface of the lead is in uniform contact with the socket of the tester. A carrier module for a semiconductor device inspection apparatus having improved stability and reliability is disclosed. The carrier module according to the present invention has a shape suitable for accommodating a predetermined semiconductor element to be tested, and includes a receiving portion including a sheet which is open to receive the semiconductor element, and a detachable portion and the semiconductor element is detachably mounted. And a cover to securely hold the semiconductor element by closing the received sheet. The receiving portion and the cover are integrated by a locking plate attached between the locking ring formed by protruding upward from one side of the sheet and the turning portion of the cover. The carrier module according to the present invention can easily accommodate a Chip Size Package-type semiconductor device such as a Thin Small Outline Package-type, a Thin Quad Flat Package-type, or a Micro Ball Grid Array.

Description

Carrier module for semiconductor device inspection device

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier module for a semiconductor device inspection device, and in particular, by providing a contactor and a semiconductor device support spring for evenly pressing and fixing a lead and a body of the semiconductor device to be tested, thereby preventing the lead of the semiconductor device from being deformed during testing. The present invention relates to a carrier module for semiconductor device inspection apparatus, which enables the entire surface of the lead to be in uniform contact with the socket of the tester and has improved stability and reliability.

In the recent electronics industry, while the output and function of electronic devices such as integrated circuits and semiconductor chips are rapidly increasing, various efforts have been made to reduce their size and unit manufacturing cost. One such method is to increase the test speed of electronic devices by simultaneously testing a plurality of electronic devices in an inspection process for inspecting the characteristics and performance of manufactured electronic devices.

To this end, a new type of automatic inspection device has been developed that increases the test speed of a plurality of electronic devices. In a new type of inspection device, a plurality of electronic devices to be tested are placed on a test tray so that they can be combined with a test head plate having a plurality of test contactors. At this time, since each electronic device, for example one semiconductor element, is made small and delicately, it is housed in a carrier module provided with a semiconductor element sheet to prevent the risk of breakage in handling and to maintain the position for the characteristic test accurately. Many carrier modules protect semiconductor devices that undergo multiple positional movements for inspection within the inspection apparatus. These carrier modules are arranged in a test tray in the longitudinal and transverse directions.

Korean Utility Model Publication No. 96-35614, filed on April 13, 1995, filed by Mirae Industry Co., Ltd., filed on April 13, 1995, discloses a thin small outline package-type (hereinafter referred to as TSOP) for inspection devices for semiconductor devices. The carrier module for testing a semiconductor device has been disclosed in which a structure has been improved to accommodate a semiconductor device and transfer it between test processes.

FIG. 7A is an exploded perspective view of a carrier module for testing a semiconductor device, and FIG. 7B is a cross-sectional view taken along the line VII-VII of FIG. 7A.

7A and 7B, the carrier module 10 according to the prior art mainly comprises a body 12 and an elastic leaf spring 18 inserted into the body 12. In the lower part of the main body 12, a cavity 14 for receiving the TSOP-type semiconductor element 11 is formed. On both sides of the cavity 14 are formed through holes 16 in which the leaf springs 18 are arranged. The leaf spring 18 is fixed to the main body 12 by fastening screws 15 in a state arranged in the through hole 16. That is, the leaf spring 18 is fixed to the body 12 by a fastening screw 15 inserted through the through hole 19 formed at one side of the leaf spring 18 into the fastening hole 13 of the body 12. do. At one end of the leaf spring 18, a locking piece 18a and a guide piece 18b are formed.

In the conventional carrier module 10 configured as described above, when the semiconductor element 11 is accommodated in the cavity 14 of the main body 12, the semiconductor element 11 is formed by the engaging piece 18a of the leaf spring 18. It is elastically fixed and supported. In addition, when the carrier module 10 containing the semiconductor element 11 is brought into contact with a socket (not shown) of the inspection apparatus, the lower surface of the main body 12 around the cavity 14 is the body of the semiconductor element 11. And the lead (11a) is pressed to make uniform contact with the socket of the inspection apparatus.

However, in the carrier module 10, when the elastic force of the leaf spring 18 is weakened, the semiconductor element 11 may be separated from the cavity 14 of the carrier module 10. In addition, when the carrier module 10 containing the semiconductor element 11 is brought into contact with the socket of the inspection apparatus, the lower surface of the main body 12 around the cavity 14 serving as a contactor rather reacts with the semiconductor element 11. The semiconductor element 11 may be damaged by the addition.

In addition, Korean Utility Model Publication No. 97-64197, filed on May 31, 1996, filed by Mirae Industries Co., Ltd. on May 31, 1996, discloses a test process in which a TSOP-type semiconductor device is suspended on a test tray. A carrier module of a test tray for a semiconductor device inspection device having an improved structure to be transported to the liver is disclosed.

FIG. 8A is an exploded perspective view of a carrier module for a semiconductor device inspection device, and FIG. 8B is a cross-sectional view taken along the line VIII-VIII of FIG. 8A.

Referring to FIGS. 8A and 8B, the carrier module 20 according to the prior art includes an integral body 22 and a latch 26 and a button 28 inserted into the body 22. In the lower part of the main body 22, a cavity 24 for receiving the TSOP-type semiconductor element 21 is formed. Both sides of the cavity 24 are formed with a button insertion hole 25 into which a portion of the latch 26, the button 28, and the coil spring 23 that elastically supports the button 28 are inserted. Within the button 28 is formed a recess 27 for receiving a portion of the latch 26.

The latch 26 has a locking piece 26a formed at one end thereof, and a through hole 26b is formed at an upper end of the latch 26. The latch 26 is positioned in the button insertion hole 25 of the main body 22 with the latch piece 26a and the through hole 26b being exposed in the recess 27 of the button 28. At this time, the latch 26 is rotatably disposed in the main body 22 by a connecting pin 29 fitted into the through hole 26b through the pin hole 29a formed in the main body 22.

In the carrier module 20 configured as described above, when the button 28 is pressed in order to accommodate the semiconductor element 21 into the cavity 24 of the main body 22, the latch 26 rotates about the connecting pin 29. As a result, a space for inserting the semiconductor element 21 into the cavity 24 is ensured. Then, when the semiconductor element 21 is accommodated in the cavity 24, the semiconductor element 21 is fixedly supported by the latching piece 26a of the latch 26. At this time, the latching piece 26a of the latch 26 supports both sides of the semiconductor element 21 so that the semiconductor element 21 is not separated from the cavity 24 unless an external force is applied to the button 28. . In addition, the carrier module 20 in which the semiconductor element 21 is accommodated makes the bottom surface of the cavity 24 uniformly contact the socket (not shown) of the tester by pressing the lead and the body of the semiconductor element 21.

By the way, in such a carrier module 20, when the force of the coil spring 23, which gives a force to the locking piece 26a through the button 28, is weakened, the semiconductor element 21 is connected to the carrier module 20. It may be released from the cavity 24. In addition, when the carrier module 20 containing the semiconductor element 21 is in contact with the socket of the tester, the cavity 24 serving as a contactor may react with the semiconductor element 21 to damage the semiconductor element 21. It may be. In addition, since the carrier module 20 described above adopts a method of suspending the semiconductor element 21 in the cavity 24, the detachment and detachment of the semiconductor element 21 in the cavity 24 is essential. As difficult as

Meanwhile, U.S. Patent No. 5,290,134, issued to Minoru Baba on March 1, 1994, discloses a carrier module for transferring TSOP-type semiconductor devices in inspection equipment for electronic devices such as integrated circuits or semiconductor chips. There is a bar.

9A is a perspective view of such a carrier module, and FIG. 9B is a partial cross-sectional view showing a state of use of the carrier module shown in FIG. 9A.

9A and 9B, the carrier module 30 has an integral body 32. In the center of the body 32 is formed a sheet 34 for receiving the semiconductor element 40 to be tested. The upper guide hole 36 and the lower guide hole 38 communicating with each other are formed at both sides of the sheet 34. A plurality of slits 35 are formed on the floor of the sheet 34 in the sheet 34. The slit 35 has a shape corresponding to the lead 42 of the semiconductor element 40. As a result, the socket terminal 52 of the tester socket 50 can enter the slit 35 to be in contact with the lead 42 of the semiconductor element 40.

When the characteristics of the semiconductor device 40 are tested using the conventional carrier module 30 configured as described above, the socket terminal 52 is inserted into the slit 35 of the carrier module 30. At this time, in order to ensure electrical contact between the lead terminal 42 and the socket terminal 52 inserted into the sheet 34 through the slit 35, the lead tightening mechanism 60 is lowered and accordingly the lead tightening mechanism ( The insulating lead push member 62 of 60 presses the lead 42 downward. That is, the lead push member 62 made of non-metallic minerals such as sapphire or quartz material that can be insulated makes the lead 42 of the semiconductor element 40 press the lead to uniformly contact the socket terminal 52 of the tester socket 50. Let's do it.

However, in the carrier module 30, since the carrier module 30 and the lead push member 62 made of a nonmetallic mineral are separated from each other, the lead 42 of the semiconductor element 40 is connected to the tester socket 50. When contacting the socket terminal 52 of the precision is difficult to maintain the accuracy is difficult to contact. In addition, the lead push member 62 made of a non-metallic mineral may be broken or detached from the lead tightening mechanism 60 when it contacts the socket terminal 52 of the tester socket 50, in which case maintenance is difficult. In addition, it is difficult to adequately cope with the semiconductor element 40 having various shapes with the current lead push member 62.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to provide a contactor and a semiconductor element support spring for evenly pressing and fixing the lead and the body of the semiconductor element to be tested, thereby providing An object of the present invention is to provide a carrier module for a semiconductor device inspection apparatus, which prevents the lead from being deformed, allows the entire surface of the lead to be in uniform contact with the socket of the tester, and has improved stability and reliability.

1 is a perspective view of a carrier module for a semiconductor device inspection device according to a first embodiment of the present invention;

FIG. 2 is an exploded perspective view of the carrier module shown in FIG. 1;

3 is a perspective view of a carrier module for a semiconductor device inspection apparatus according to a second embodiment of the present invention;

4 is an exploded perspective view of the carrier module shown in FIG.

5 is a perspective view of a carrier module for a semiconductor device inspection apparatus according to a third embodiment of the present invention;

6 is an exploded perspective view of the carrier module shown in FIG.

7A is an exploded perspective view of an embodiment of a carrier module for a semiconductor device inspection apparatus according to the prior art;

FIG. 7B is a cross-sectional view taken along the line VIII-VIII in FIG. 7A;

8A is an exploded perspective view of another embodiment of a carrier module for a semiconductor device inspection apparatus according to the prior art;

FIG. 8B is a cross-sectional view taken along the line VIII-VIII in FIG. 8A;

9A is a perspective view of another embodiment of a carrier module for a semiconductor device inspection apparatus according to the prior art, and

FIG. 9B is a partial cross-sectional view illustrating a state of use of the carrier module illustrated in FIG. 9A.

<Explanation of symbols for main parts of drawing>

10,20,30,100A, 100B, 100C: Carrier Module

11,21,40,160A, 160B, 160C: semiconductor device

11a, 21a, 42,162A, 162B, 162C: lead

12,22,32 Body 14,24,34 Cavity

18: leaf spring 18a, 26a, 149: locking piece

23: coil spring 26: latch

28: button 35: slit

50 tester socket 52 socket terminal

60: lead tightening mechanism 62: lead push member

101A, 101B, 10C: Receiving part main body 102: First through hole

104: first connecting pin 106: second through hole

108,108C: Second detection sensor hole 110A, 110B, 110C: Receiving part

112A, 112B, 112C: Sheet 118: Locking Ring

119 hinge opening 120 first torsion coil spring

140,140C: Cover 141,141C: Cover Body

142: hinge 143: contactor

144: turning part 145: third through hole

146: locking plate 148: second connecting pin

150: second torsion coil spring 170: support spring

In order to achieve the above object, the present invention,

An accommodating portion having a shape suitable for accommodating a predetermined semiconductor element to be tested and including a sheet open to receive the semiconductor element, the accommodating portion for accommodating and holding the semiconductor element; And

It is detachably mounted to the accommodating part, and provides a carrier module for a semiconductor device inspection apparatus including a cover for closing the sheet containing the semiconductor device to securely hold the semiconductor device.

The receiving portion,

Rectangular shaped body;

First locking means protruding upward from the main body at one side of the sheet to fix the cover on the receiving part when the receiving part and the cover are coupled;

Inserted into the first bush guide hole and the second bush guide hole vertically formed in the main body on both sides of the sheet, and accommodates the socket guide of the tester when the carrier module containing the semiconductor element contacts the socket of the tester. A first guide bush and a second guide bush for fastening;

When inserted into the first through-hole formed through the side of the main body near the hinge receiving opening vertically formed in the main body on one side of the sheet opposite the first locking means, and engaging the receiving portion and the cover First connecting means for rotatably connecting the cover to the receiving portion; And

When the first connecting means is inserted into the first through hole to engage the receiving portion and the cover, it is inserted in the middle of the first connecting means so that the cover is always upward with respect to the first connecting means. It further comprises a first elastic means for deflecting.

The cover,

A main body in which a second sensing sensor hole is formed to detect the presence or absence of the semiconductor element;

It is formed extending from one side of the main body in the downward direction, and is inserted into the hinge receiving opening when the receiving portion and the cover are coupled, the first connecting means is inserted when the receiving portion and the cover are coupled A hinge formed at a distal end of the second through hole having a size corresponding to the first through hole;

A contactor extending downward from the main body and configured to press the lead of the semiconductor element with a uniform force when the semiconductor element is located in the sheet;

A pair of turning portions formed extending in a lateral direction from one side of the main body to face the hinge, having a locking protrusion formed to protrude from the upper portion, and having a third through hole formed at an end thereof;

A second lock disposed between the turning portions, a fourth through hole formed at a center thereof, and jointly acting with the first locking means when the receiving portion and the cover are engaged to integrate the receiving portion and the cover; Way;

Second connecting means inserted into said third through hole and said fourth through hole, said second locking means pivotably connecting said second locking means to said pivoting portion when said second locking means is disposed between said pivoting portion; And

The second locking means is inserted in the middle of the second connecting means when the second connecting means is inserted into the third through hole and the fourth through hole to connect the second locking means to the pivot part. And second elastic means for always deflecting upward relative to the second connecting means.

The cover further includes third elastic means disposed on a lower surface of the cover to press downward the body of the semiconductor element accommodated in the sheet of the receiving portion.

Preferably, the receiving portion and the cover are manufactured by injection molding engineering plastics.

Preferably, the semiconductor device includes a chip size package-type semiconductor device such as a thin small outline package-type semiconductor device, a thin quad flat package-type semiconductor device, or a micro ball grid array.

As described above, according to the present invention, a cover provided with a contactor and a semiconductor element support spring for pressing and holding the leads and bodies of the different semiconductor elements to be tested evenly is integrated with the receiving portion of the semiconductor element, thereby providing The accommodated semiconductor element can be held in the accommodating part as a whole cover. Therefore, there is no fear that the semiconductor element is separated from the receiving portion. In addition, since the contactor integrally attached to the cover presses the lead of the semiconductor element with a uniform force when the semiconductor element contacts the socket of the tester, uniform contact between the semiconductor element and the socket is possible and the lead of the semiconductor element is deformed. Can be prevented.

In addition, the carrier module according to the present invention can be easily applied not only to various types of semiconductor devices currently manufactured, but also to future micro semiconductor devices.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In general, in order to select a semiconductor device based on the characteristics and performance results of the semiconductor device, it is required to remove the tested semiconductor device from the test tray and replace it with a new semiconductor device. For this reason, various types of IC packages have been developed, and the first embodiment of the present invention to be described below provides a carrier module 100A for accommodating the TSOP-type semiconductor device 160A.

1 is a perspective view of a carrier module for a semiconductor device inspection apparatus according to a first embodiment of the present invention, Figure 2 is an exploded perspective view of the carrier module shown in FIG.

1 and 2, the carrier module 100A for a semiconductor device inspection apparatus according to the first exemplary embodiment of the present invention includes a receiving portion 110A and a cover 140 formed of separate components. The receiving portion 110A and the cover 140 are manufactured by a plastic molding process, preferably by injection molding engineering plastics. Cover 140 is mounted detachably to the receiving portion (110A), can be replaced as needed.

The accommodating portion 110A accommodates the TSOP-type semiconductor element 160A to be tested using the semiconductor element inspection apparatus. The accommodation portion 110A includes a housing portion main body 101A having a rectangular shape. In the center of the receiving portion main body 101A, a sheet 112A for accommodating the flat shape TSOP-type semiconductor element 160A is formed. The sheet 112A is formed in a shape that conforms to the outer shape of the semiconductor element 160A to accommodate the TSOP-type semiconductor element 160A, and is open upward to allow the semiconductor element 160A to be charged from above. do.

In the sheet 112A, the first sensing sensor hole 111 penetrates through the bottom of the housing body 101A. When the first detection sensor hole 111 loads the semiconductor element 160A into the accommodation portion 110A on the work bench of the semiconductor inspection apparatus, the optical sensor (not shown) pre-installed on the work bench allows the accommodation portion 110A. ) Through the first sensor hole 111 to determine whether the semiconductor device 160A is inserted into the sheet 112A of the receiving portion 110A.

The first bush guide hole 113 and the second bush guide hole in which the cylindrical first guide bush 114 and the second guide bush 116 can be inserted into the receiving portion main body 101A on both sides of the sheet 112A. 115 is formed vertically. The first guide bush 114 and the second guide bush 116 accommodate the guide of the socket when the carrier module 100A containing the semiconductor element 160A contacts the socket of the tester (not shown). The socket and carrier module 100A can be aligned correctly.

In the vicinity of the first bush guide hole 113 and the second bush guide hole 115, carrier module fixing holes 117 are vertically formed in the accommodating part body 101A, respectively. The carrier module fixing hole 117 inserts a bolt of the test tray and fixes it with a nut when fixing the carrier module 100A containing the semiconductor device 160A on a test tray (not shown), thereby fixing the semiconductor device 160A. Can be correctly aligned on the test tray.

A locking ring 118 is installed between the first bush guide hole 113 and the sheet 112A. Locking ring 118 is formed to protrude upward from the receiving portion main body 101A on one side of the sheet (112A), to securely maintain their coupling when engaging the receiving portion (110A) and the cover 140 Play a role.

A hinge accommodating opening 119 for accommodating the hinge 142 of the cover 140 is vertically formed in the accommodating part body 101A between the sheet 112A and the second bush guide hole 115. Near the hinge accommodating opening portion 119, first through holes 102 are formed in both side surfaces of the accommodating portion main body 101A. The first connecting pin 104 is inserted into the first through hole 102. When the first connection pin 104 couples the receiving portion 110A and the cover 140, the first connection pin 104 may include the second through hole 106 formed in the hinge 142 of the first through hole 102 and the cover 140. It is inserted through. At this time, the first torsion coil spring 120 is fitted to the first connecting pin 104. That is, the first torsion coil spring 120 is fitted to the first connecting pin 104 between the hinges 142 of the cover 140 and always covers the cover 140 around the first connecting pin 104. Deflect upwards. As a result, the cover 140 is installed to be rotatable in the receiving portion 110A about the first connecting pin 104.

On the other hand, the cover 140 performs a function of safely holding the semiconductor device 160A by closing the sheet 112A when the semiconductor device 160A is inserted into the sheet 112A of the receiving portion 110A. In addition, the cover 140 uniformly presses the lead 162A of the semiconductor element 160A when the semiconductor element 160A contacts the socket of the tester (not shown) while the semiconductor element 160A is accommodated in the accommodation portion 110A. The master acts as a contactor. To this end, the cover 140 includes a cover body 141, a pair of hinges 142, a contactor 143, and a pair of pivoting portions 144 integrally formed.

In the center of the cover body 141 is formed a second detection sensor hole 108 of a rectangular shape. Like the first detection sensor hole 111, the second detection sensor hole 108, when the semiconductor element 160A is charged in the receiving portion 110A at the work table of the semiconductor inspection device, (Not shown) allows the semiconductor sensor 160A to be inserted into the sheet 112A of the receiving portion 110A through the second sensing sensor hole 108 above the cover 140.

The hinge 142 is formed to extend downward from one side of the cover body 141. A second through hole 106 having a size corresponding to the first through hole 102 of the receiving portion 110A is formed at the end of the hinge 142. As mentioned above, when the first connecting pin 104 couples the accommodation portion 110A and the cover 140, the first through hole 102 and the cover 140 of the accommodation portion 110A are formed. 2 is inserted through the through hole 106. The hinge 142 is inserted into the hinge receiving opening 119 of the receiving portion 110A when the receiving portion 110A and the cover 140 are coupled to each other.

The contactor 143 extends downward from the cover body 141. The contactor 143 presses the lead 162A of the semiconductor element 160A with a uniform force when the semiconductor element 160A is located in the sheet 112A of the receiving portion 110A. In addition, the contactor 143 may apply a uniform force to the lead 162A of the semiconductor element 160A even when the carrier 160A contacts the socket of the tester while the semiconductor element 160A is accommodated in the accommodation portion 110A. Press

The pair of turning portions 144 extends laterally from the other side of the cover body 141 opposite to the hinge 142. A locking protrusion 144a protrudes from the upper portion of the turning portion 144, and a third through hole 145 is formed at the end of the turning portion 144. The locking plate 146 is disposed between the turning portions 144. That is, the locking plate 146 is inserted between the turning parts 144 through the third through hole 145 of the turning part 144 and the fourth through hole 147 formed in the center of the locking plate 146. It is attached to the cover 140 by the second connecting pin 148. At this time, the second torsion coil spring 150 is fitted into the second connection pin 148. That is, the second torsion coil spring 150 is fitted to the second connecting pin 148 between the turning portions 144 of the cover 140, and the locking plate 146 around the second connecting pin 148. Always deflect upwards. As a result, the locking plate 146 is rotatably installed between the pivoting portions 144 of the cover 140 around the second connecting pin 148.

A locking groove 146a is formed on the upper outer surface of the locking plate 146. The locking groove 146a has a shape corresponding to that of the locking protrusion 144a formed in the swinging portion 144, and the swinging portion 146a is attached to the locking plate 146 between the swinging portions 144 of the cover 140. The locking projection 144a of the 144 is accommodated. As a result, the locking plate 146 is firmly attached to the cover 140.

The locking plate 146 acts jointly with the locking ring 118 of the receiving portion 110A to serve to integrate the receiving portion 110A and the cover 140. To this end, a locking piece 149 is formed below the locking plate 146. The locking piece 149 is engaged with the locking ring 118 of the receiving portion 110A when the cover 140 is closed while the locking plate 146 is attached between the turning portions 144 of the cover 140. do. As a result, the receiving portion 110A and the cover 140 are firmly coupled to each other.

A support spring 170 for supporting the semiconductor device 160A is disposed on the bottom surface of the cover 140 that is in contact with the top surface of the semiconductor device 160A. The support spring 170 is formed of a cylindrical coil spring, and serves to always press the body of the semiconductor element 160A received in the sheet 112A of the receiving portion 110A in the downward direction. As a result, the semiconductor element 160A is firmly located in the sheet 112A.

A process of positioning the TSOP-type semiconductor device 160A in the carrier module 100A according to the first embodiment of the present invention configured as described above will be briefly described.

First, the cover 140 installed to be rotatable in the receiving portion 110A around the first connecting pin 104 is opened. Under this condition, the TSOP-type semiconductor element 160A is positioned in the sheet 112A of the receiving portion 110A. Next, the cover 140 is rotated around the first connection pin 104 to couple the cover 140 and the receiving portion 110A. At this time, the locking plate 146 of the cover 140 is fixed to engage the locking ring 118 of the receiving portion (110A). Then, the receiving portion 110A and the cover 140 are firmly coupled.

Therefore, the semiconductor device 160A is completely trapped in the accommodating part 110A, and is separated from the sheet 112A of the accommodating part 110A before pressing the locking plate 146 of the cover 140 to open the cover 140. It doesn't work. In addition, since the support spring 170 attached to the lower portion of the cover 140 presses the upper portion of the resin body of the semiconductor element 160A downward while the cover 140 is closed, the sheet of the receiving portion 110A ( The semiconductor element 160A accommodated in 112A is not shaken during transfer for the characteristics and performance checks of the semiconductor element 160A.

On the other hand, when the carrier module 100A in which the semiconductor device 160A is housed is brought into contact with a socket (not shown) of the tester, the contactor 143 extending perpendicular to the bottom of the cover 140 is the semiconductor device 160A. The contactor 143 of the cover 140 is always in contact with the upper surface of the lid 162A, and when the carrier module 100A located upward is pressed downward while the socket of the tester is located below the carrier module 100A. ) Presses the upper surface of the lead 162A of the semiconductor element 160A and the lower surface of the lead 162A comes into contact with the socket. Thus, a balance of forces on the semiconductor device 160A and the lead 162A of the semiconductor device 160A is achieved to ensure accurate and safe contact between the semiconductor device 160A and the tester socket. As a result, deformation of the lead 162A is prevented.

3 is a perspective view of a carrier module for a semiconductor device inspecting apparatus according to a second exemplary embodiment of the present invention, and FIG. 4 is an exploded perspective view of the carrier module shown in FIG. 3.

3 and 4, the carrier module 100B for a semiconductor device inspection apparatus according to the second exemplary embodiment of the present invention is a preferred embodiment of the present invention, except for the sheet 112B formed in the accommodating part 110B. It has the same configuration as the carrier module 100A for semiconductor device inspection apparatus according to the embodiment. Therefore, the description of the same components and operations as those of the first embodiment of the present invention will be omitted, and the same reference numerals will be used for the same elements.

Unlike in the first embodiment of the present invention, which provides a carrier module 100A for accommodating the TSOP-type semiconductor device 160A, in the second preferred embodiment of the present invention, a thin quad flat package-type (hereinafter referred to as TQFP) A carrier module 100B for a semiconductor device inspection apparatus capable of accommodating a semiconductor device 160B is provided. The TQFP-type semiconductor device 160B has a multilayer structure and includes a lead 162B protruding outwardly on a peripheral portion. Sheet 112B formed in the center of carrier module 100B has a shape suitable for receiving TQFP-type semiconductor element 160B.

5 is a perspective view of a carrier module for a semiconductor device inspecting apparatus according to a third exemplary embodiment of the present invention, and FIG. 6 is an exploded perspective view of the carrier module shown in FIG. 5.

5 and 6, the carrier module 100C for a semiconductor device inspection apparatus according to a third exemplary embodiment of the present invention detects the second 112 formed in the sheet 112C and the cover 140C formed in the accommodating part 110C. Except for the sensor hole 108C, it has the same configuration as the carrier module 100A for semiconductor device inspection apparatus according to the first embodiment of the present invention. Therefore, the description of the same components and operations as those of the first embodiment of the present invention will be omitted, and the same reference numerals will be used for the same elements.

In a third preferred embodiment of the present invention, a carrier module 100C for a semiconductor device inspection apparatus capable of accommodating a chip size package-type (hereinafter referred to as a CSP-type) semiconductor device 160C, such as a micro ball grid array. To provide. The CSP-type semiconductor device 160C is formed of a middle layer structure of an upper layer and a lower layer, and has a ball-shaped lead 162C protruded and attached to the bottom surface of the lower layer. The sheet 112C formed at the center of the carrier module 100C has a shape suitable for accommodating the CSP-type semiconductor element 160C.

In addition, according to the third exemplary embodiment of the present invention, unlike the second sensing sensor hole 108 according to the first embodiment, a circular second sensing sensor hole 108C is formed in the center of the cover body 141C. . Similarly to the second detection sensor hole 108, the second detection sensor hole 108C is installed in the work table when the CSP-type semiconductor element 160C is charged into the receiving portion 110C in the work table of the semiconductor inspection apparatus. Allows an optical sensor (not shown) to check whether the semiconductor element 160C has been inserted into the sheet 112C of the receiving portion 110C through the second sensing sensor hole 108C above the cover 140C. do.

As mentioned above, according to the present invention, the sheet of the accommodating portion is integrated by integrating a cover provided with a semiconductor element support spring and a contactor for holding and pressing the leads and the body of the different semiconductor elements to be tested evenly. The semiconductor element housed therein can be held in the housing portion as a whole cover. Therefore, there is no fear that the semiconductor element is separated from the receiving portion. In addition, since the contactor integrally attached to the cover presses the lead and the body of the semiconductor element with a uniform force when the semiconductor element contacts the socket of the tester, uniform contact between the semiconductor element and the socket is possible and the lead of the semiconductor element is possible. Can be prevented from being deformed.

In addition, when the contactor of the cover is worn out, the cover can be removed from the accommodating part and replaced with a new one, so that the maintenance of the carrier module according to the present invention is easy. In addition, the carrier module according to the present invention can be easily applied not only to various types of semiconductor devices currently manufactured, but also to future micro semiconductor devices.

Although described above with reference to the preferred embodiments of the present invention, those skilled in the art various modifications and variations of the present invention without departing from the spirit and scope of the invention described in the claims below I can understand that you can.

Claims (11)

An accommodating portion having a shape suitable for accommodating a predetermined semiconductor element to be tested and including a sheet open to receive the semiconductor element, the accommodating portion for accommodating and holding the semiconductor element; And And a cover detachably mounted to the accommodation portion, the cover configured to close the sheet containing the semiconductor element to securely hold the semiconductor element. The method of claim 1, wherein the receiving portion, Rectangular shaped body; First locking means protruding upward from the main body at one side of the sheet to fix the cover on the receiving part when the receiving part and the cover are coupled; Inserted into the first bush guide hole and the second bush guide hole vertically formed in the main body on both sides of the sheet, and accommodates the socket guide of the tester when the carrier module containing the semiconductor element contacts the socket of the tester. A first guide bush and a second guide bush for fastening; When inserted into the first through-hole formed through the side of the main body near the hinge receiving opening vertically formed in the main body on one side of the sheet opposite the first locking means, and engaging the receiving portion and the cover First connecting means for rotatably connecting the cover to the receiving portion; And When the first connecting means is inserted into the first through hole to engage the receiving portion and the cover, it is inserted in the middle of the first connecting means so that the cover is always upward with respect to the first connecting means. Carrier module for a semiconductor device inspection device further comprising a first elastic means for deflecting. 3. The method of claim 2, wherein a first sensing sensor hole is formed through the bottom of the main body so as to detect the presence or absence of the semiconductor element in the sheet, and the first guide bushing hole and the second guide hole are formed at both sides of the sheet. And a carrier module fixing hole in which a bolt for aligning the carrier module containing the semiconductor element on the test tray is vertically formed at a position adjacent to the guide bush hole. The method of claim 2, wherein the cover, A main body in which a second sensing sensor hole is formed to detect the presence or absence of the semiconductor element; It is formed extending from one side of the main body in the downward direction, and is inserted into the hinge receiving opening when the receiving portion and the cover are coupled, the first connecting means is inserted when the receiving portion and the cover are coupled A hinge formed at a distal end of the second through hole having a size corresponding to the first through hole; A contactor extending downward from the main body and configured to press the lead of the semiconductor element with a uniform force when the semiconductor element is located in the sheet; A pair of turning portions formed extending in a lateral direction from one side of the main body to face the hinge, having a locking protrusion formed to protrude from the upper portion, and having a third through hole formed at an end thereof; A second lock disposed between the turning portions, a fourth through hole formed at a center thereof, and jointly acting with the first locking means when the receiving portion and the cover are engaged to integrate the receiving portion and the cover; Way; Second connecting means inserted into said third through hole and said fourth through hole, said second locking means pivotably connecting said second locking means to said pivoting portion when said second locking means is disposed between said pivoting portion; And The second locking means is inserted in the middle of the second connecting means when the second connecting means is inserted into the third through hole and the fourth through hole to connect the second locking means to the pivot part. And a second elastic means for always deflecting upward with respect to the second connecting means. 5. The semiconductor device according to claim 4, wherein the cover further comprises third elastic means disposed on a lower surface of the cover to press the body of the semiconductor element accommodated in the sheet of the housing downward. Carrier module for inspection device. The second locking means according to claim 4, wherein the second locking means engages with the first locking means to close the cover when the cover is closed while the second locking means is attached between the pivot portions. And a locking piece formed below the locking means, the upper outer surface of the second locking means having a shape corresponding to the locking protrusion to accommodate the locking protrusion when the second locking means is attached between the pivot portions. Carrier module for semiconductor device inspection device characterized in that the groove formed. The carrier module according to any one of claims 1 to 6, wherein the housing part is manufactured by injection molding an engineering plastic. The carrier module according to any one of claims 1 to 6, wherein the cover is manufactured by injection molding an engineering plastic. 2. The carrier module of claim 1, wherein the semiconductor device comprises a Thin Small Outline Package-type semiconductor device. The carrier module of claim 1, wherein the semiconductor device comprises a thin quad flat package-type semiconductor device. 2. The carrier module of claim 1, wherein the semiconductor device comprises a Micro Ball Grid Array-type semiconductor device.