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JPWO2020196156A1 - - Google Patents

Info

Publication number
JPWO2020196156A1
JPWO2020196156A1 JP2021509254A JP2021509254A JPWO2020196156A1 JP WO2020196156 A1 JPWO2020196156 A1 JP WO2020196156A1 JP 2021509254 A JP2021509254 A JP 2021509254A JP 2021509254 A JP2021509254 A JP 2021509254A JP WO2020196156 A1 JPWO2020196156 A1 JP WO2020196156A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021509254A
Other languages
Japanese (ja)
Other versions
JP7413356B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020196156A1 publication Critical patent/JPWO2020196156A1/ja
Application granted granted Critical
Publication of JP7413356B2 publication Critical patent/JP7413356B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
JP2021509254A 2019-03-22 2020-03-18 Film adhesives and sheets for semiconductor processing Active JP7413356B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019054995 2019-03-22
JP2019054995 2019-03-22
PCT/JP2020/011975 WO2020196156A1 (en) 2019-03-22 2020-03-18 Film adhesive and sheet for semiconductor processing

Publications (2)

Publication Number Publication Date
JPWO2020196156A1 true JPWO2020196156A1 (en) 2020-10-01
JP7413356B2 JP7413356B2 (en) 2024-01-15

Family

ID=72610160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021509254A Active JP7413356B2 (en) 2019-03-22 2020-03-18 Film adhesives and sheets for semiconductor processing

Country Status (5)

Country Link
JP (1) JP7413356B2 (en)
KR (1) KR102759594B1 (en)
CN (1) CN112930380B (en)
TW (1) TWI845643B (en)
WO (1) WO2020196156A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7387400B2 (en) * 2019-11-15 2023-11-28 ヘンケルジャパン株式会社 UV thermosetting adhesive composition
JP7746715B2 (en) * 2021-07-26 2025-10-01 三菱ケミカル株式会社 Organic semiconductor ink, photoelectric conversion layer, and organic photoelectric conversion element

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004327623A (en) * 2003-04-23 2004-11-18 Three M Innovative Properties Co Sealing film adhesive, sealing film laminate, and sealing method
JP2008231366A (en) * 2007-03-23 2008-10-02 Lintec Corp Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet, and method for manufacturing semiconductor device
JP2012167174A (en) * 2011-02-14 2012-09-06 Lintec Corp Adhesive composition, adhesive sheet, and method of manufacturing semiconductor device
WO2015037631A1 (en) * 2013-09-11 2015-03-19 デクセリアルズ株式会社 Underfill, and method for manufacturing semiconductor device using underfill
WO2016121488A1 (en) * 2015-01-30 2016-08-04 リンテック株式会社 Adhesive sheet for semiconductor processing
JP2016216562A (en) * 2015-05-18 2016-12-22 日東電工株式会社 Adhesive film, dicing tape-integrated adhesive film, double-layer film, method for producing semiconductor device, and semiconductor device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3617417B2 (en) 1999-06-18 2005-02-02 日立化成工業株式会社 Adhesive, adhesive member, wiring board for semiconductor mounting provided with adhesive member, and semiconductor device using the same
JP4174366B2 (en) * 2003-04-23 2008-10-29 京セラ株式会社 Light emitting element storage package and light emitting device
JP2012222002A (en) 2011-04-04 2012-11-12 Nitto Denko Corp Dicing die-bonding film and semiconductor device manufacturing method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004327623A (en) * 2003-04-23 2004-11-18 Three M Innovative Properties Co Sealing film adhesive, sealing film laminate, and sealing method
JP2008231366A (en) * 2007-03-23 2008-10-02 Lintec Corp Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet, and method for manufacturing semiconductor device
JP2012167174A (en) * 2011-02-14 2012-09-06 Lintec Corp Adhesive composition, adhesive sheet, and method of manufacturing semiconductor device
WO2015037631A1 (en) * 2013-09-11 2015-03-19 デクセリアルズ株式会社 Underfill, and method for manufacturing semiconductor device using underfill
WO2016121488A1 (en) * 2015-01-30 2016-08-04 リンテック株式会社 Adhesive sheet for semiconductor processing
JP2016216562A (en) * 2015-05-18 2016-12-22 日東電工株式会社 Adhesive film, dicing tape-integrated adhesive film, double-layer film, method for producing semiconductor device, and semiconductor device

Also Published As

Publication number Publication date
KR20210143155A (en) 2021-11-26
CN112930380B (en) 2022-10-28
TWI845643B (en) 2024-06-21
WO2020196156A1 (en) 2020-10-01
JP7413356B2 (en) 2024-01-15
CN112930380A (en) 2021-06-08
KR102759594B1 (en) 2025-01-23
TW202100694A (en) 2021-01-01

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