JPS63187689A - printed circuit manufacturing equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to the production of printed circuits, and in particular to the production of printed circuits directly onto a substrate using electrical signals from a circuit drawing system using a computer. Regarding the device to be created.

[Conventional technology]

In the conventional technology, as described in JP30 to P37 of the electronic technology special edition, "All about printed wiring boards," a wiring circuit CAD system only required one circuit design.

[Problem that the invention seeks to solve]

With the conventional technology, after circuit design using a wiring circuit CAD system, many processes, equipment, and cost and time are required for photomask production, etching, screen printing, sintering rings, and wiring circuit production. I used to be.

The purpose of the present invention is to apply thermal transfer printing technology to wiring circuit CAD.
By combining the present invention with a system, the process and equipment required to produce a wiring circuit can be greatly simplified, the cost can be reduced by two hours, and the circuit can be easily modified.

[Means for solving problems]

The above purpose is to combine a printing unit that uses an ink film coated with a conductive material with a wiring circuit CAD system, output image data of the wiring pattern to the printing unit, and transfer the wiring material on the ink film onto the board by thermal transfer. This is achieved by

[Effect]

The wiring pattern obtained by the wiring CAD system is input to the printing unit as image data (No. 73 or vector signal).The printing unit thermally transfers the wiring material on the ink film to the board according to this output, and creates the wiring circuit. In this way, since a wiring circuit is directly formed in response to an electric signal, time and equipment are not required, and the circuit can be easily modified.

〔Example〕

FIG. 1 is a block diagram of the present invention, and FIG. 2 is a flowchart thereof.

The wiring 0ΔD system 1 includes a communication system 3 with a large computer 1, a cpτJ4, a RAM 5, and a display 6.
, keyboard 7, memory disk 8, data bus 72
Consisting of And circuit design 133, component arrangement 14, white! I! The wiring diagram obtained by performing the lit wiring 15 is converted into image data 16. This image data No. 943 9 is divided into a conductor printing signal 11, a low antibody printing signal 12, and an insulating material printing signal 13 by the printing control input/output section 10, which are respectively divided into a conductor printing section 14, a low antibody printing section 15, and an insulating material printing signal 13. The conductor print 21 and the resistor print 22 are supplied to the body printing unit 16, and the conductor print 21 and the resistor print 22 are supplied to the
, insulator printing 23 is performed, and a wiring circuit 24 is formed.

FIG. 3 is a flowchart of resistor formation by printing.

Wiring CA U) Resistance value determined by system 1 25.4
(The resistance device 26 is applied, and the relationship R=ρQ/a (R: resistance value, ρ: physical orientation of the ink film 'C
The width and length of the resistor printing section are determined from the ratio, Q=length, a: cross-sectional area) 27, which is converted into image data 28, and resistor printing is performed. As a result, various resistance values can be obtained even with one type of resistive ink film.

4 and 5 show the printing principle of the printing section.

FIG. 4 shows a thermal transfer method in which a switching circuit 30 is turned on by an image signal 9 synchronized with the feeding of a substrate 37.
, 0FFL, and the DC power supply 3 is applied to the resistance element 32 accordingly.
A current flows from 1, generating heat, and the heat is transmitted to the ink layer 34 (conductor, resistor, insulator) through the film base 33 of the ink film 35, and the ink 36 is transferred onto the substrate 37, forming a wiring circuit. Ru.

FIG. 5 shows an energization transfer method, in which the ink film 35 is composed of an energization heat generation layer 40, a conductive layer 41, and an ink layer 34.
0, a current flows to the conductive layer 41 and then to the return electrode 39.

Here, the return electrode 39 has a sufficiently larger contact area with the current-carrying heat generating layer 40 than the recording electrode 38, so the current density is low, and heat generation and transfer are performed only under the recording electrode. This film base 33 is suitably made of a heat-resistant resin such as polynystyl or polycarbonate. The energizing heat generating layer 40 is
Polyester, polycarbonate, or the like is added with carbon or metal powder to give a volume resistivity of 01 to 10 m, and the conductive layer 5 is made of an Afl thin film or the like.

The conductor, resistor, and insulator of the ink layer 34 are metal powder,
Formed by hardening carbon powder, metal oxide powder, etc. with a binder for thermal transfer.

FIG. 6 shows the configuration of the printing section.

Rubber roller 47 is rotated by motor 46 and feeds substrate 48 . The print head 5o has a resistor cable 32. Alternatively, a large number of recording electrodes 38 are lined up in a line, and the ink film 35 is pressed against the plate 37 at that part. Here, the image data signal 9 is input in synchronization with the feeding of the substrate 37. By turning on and off each of the four heat generating positions, the interconnect (conductor, resistor, insulator) is transferred to the substrate 48.

Get the wiring circuit.

The ink film 35 is wound around an unwinding roller 44, and is unwound in accordance with the feeding of the substrate 37. After printing is completed, it is wound around the winding roller 43. At this time, so that the ink film 49 does not slacken, torque motor 42
Add tension.

The current transfer method requires a return electrode 45, which is pressed against the ink film 49 by a capstan 52 and driven by a motor 46 via a belt 51 in accordance with its feeding.

FIG. 7 shows the overall configuration of the printing section.

On the feeding device 53, there are a conductor printing section 14 and a resistance printing section 15.
, the insulator printed parts 16 are lined up, and the board 37 passes through them, thereby forming a wiring circuit.

In addition, by forming the ink film 35 into a set of three surfaces of conductor ink, insulator ink, and resistor ink, and printing three times while reciprocating the board 48, a wiring circuit can be manufactured even with one printed part. . By repeating these processes, it is possible to create multiple layers of circuitry.

FIG. 8 shows a plotter-type printing section "t" which forms a wiring circuit using a vector data signal instead of an image data signal 9.
FIG. 9 shows details of the moving part.

Y-axis feed screw 54, Y-axis feed nut 55, Y-axis feed motor 57, X @ feed screw 59, X-axis feed nut 5
8. x-axis feed motor 56, X@guide 60, Y*11
1 guide, the moving unit (34) moves on the printing table 66 according to vector data from the wiring CAD. The head unit 71 consists of a head 70, an ink roller 69,
Motor 62. The belt 61 and the rotation 67 ensure that the feeding direction of the ink film 49 and the moving direction of the moving section 64 always match. Furthermore, when the direction of movement is changed, the actuator 63 and the lever 68 are used to lift the head part 71 once and then change the direction of the head part, so that the ink film 49 does not come off from the head 70.

This method is characterized in that the amount of ink film 49 used is small.

As described above, by combining a wiring CAD system with a printing device that thermally transfers wiring circuits directly onto a board using conductor ink film, insulator ink film, and resistor ink film, the process and equipment up to the production of wiring circuits can be improved. This greatly simplifies the process, saves 9 hours, and makes it easier to modify the circuit.

In the present invention, if a thick film paste is applied to the ink film 35 with a binder, it is easy to form a thick film circuit and print the first mask (on the substrate 48). I can do it.

〔Effect of the invention〕

According to the present invention, a circuit designed using a wiring CAD system can be immediately formed on a substrate, so that the process and equipment for forming a wiring circuit, as well as the time and cost associated therewith, can be significantly reduced.

[Brief explanation of the drawing]

FIG. 1 is a block diagram of a printed circuit manufacturing apparatus according to an embodiment of the present invention. FIG. 2 is a flowchart of FIG. 1. FIG. 3 is a flow chart for resistor printing. 4 and 5 are diagrams showing the printing principle of the printing section of this embodiment. FIG. 6 is a configuration diagram of the printing section of this embodiment. FIG. 7 is a complete diagram of the entire printing section. FIGS. 8 and 9 show one embodiment of the printing section.

Claims (1)

[Claims] 1. Thermal transfer of a conductive pattern onto a board using a wiring CAD system, a means for outputting the wiring pattern obtained by this system to a printing unit as image data, and a film coated with a conductive material. What is claimed is: 1. A printed circuit manufacturing apparatus comprising: a printing section; 2. A wiring CAD system, a means for obtaining wiring patterns for conductors, resistors, and insulators using this system and outputting the image data to the respective printing units, and an ink film coated with conductors, resistors, and insulators. and a printing device that thermally transfers them onto one substrate according to a wiring pattern. 3. A wiring CAD system, a means for inputting the wiring pattern obtained by this system as a vector data signal to the printing section, and a printing section that moves according to the data and thermally transfers the wiring pattern onto the board to form a circuit. A wiring circuit manufacturing device comprising: