JPS6235844A - Manufacture of multilayer printed wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention is an improvement in a method for manufacturing a multilayer printed wiring board, particularly in a method for preventing misalignment between layers of a multilayer printed wiring board in the material layup stage before lamination pressing. It is related to.

[Conventional technology]

Fig. 5 is a plan view showing a conventional multilayer printed wiring board, Fig. 6 is a front view thereof, and Fig. 7 shows the conventional manufacturing process, (A) is a plan view, and (B) to (D) are its ■-■ It is a sectional view. In the figure, (1) is a multilayer printed wiring board, (2) and (3) are single-sided copper foil outer layer substrates placed on both sides of this multilayer printed wiring board, and (4) is a prepreg (glue) (5).

(6) is an inner layer substrate disposed inside, and (7) is an eyelet for fixing these in a stacked state.

In the conventional method for manufacturing a multilayer printed wiring board (1), as shown in FIG.
, (3) are correctly stacked on both sides of the inner layer substrate (4) via prepregs (5) and (6), and fixed with adhesive tape (8) to form a laminated substrate (9). Then, in step CB), the laminated board (9) is drilled to form a through hole (10).
is formed, and the eyelet (11) is inserted into the through hole (10) in step (C). Next, in step CD), the ends of the eyelets (11) (71) are caulked to integrate the entire laminated substrate (9), and the laminated substrate (9) is cured with a heat-sensitive press to produce a multilayer printed wiring board (1).

[Problem that the invention seeks to solve]

However, such a conventional manufacturing method requires hole drilling and an eyelet (11), and the head of the eyelet (11) after caulking is attached to the single-sided copper foil outer layer substrate (2), (3) Since it is more protruding, there is a problem that the partition rib plate may be damaged during the heat pressing operation in the next step.

This invention was made in order to solve the above-mentioned problems, and it is a multilayer printed wiring that does not require hole drilling or the use of eyelets, and thus prevents scratches during thermal press work. The purpose is to provide a method for manufacturing plates.

[Means for solving problems]

The method for producing a multilayer printed wiring board of the present invention involves cutting or burring a vL layer board in which a two-sided copper foil outer layer board, a prepreg, and an inner layer board are laminated in the lamination direction, and deforming the vL layer board in the lamination direction. The two are integrated to perform thermal pressing.

[For production]

In the method for manufacturing a multilayer printed wiring board of the present invention, a single-sided copper foil outer layer substrate, a prepreg, and an inner layer substrate are laminated to form a cutting or burring in the lamination direction of the laminated substrate,
When the laminated substrates are deformed in the lamination direction and integrated, the product vJ
The single-sided copper foil outer layer substrate, prepreg, and inner layer substrate forming the substrate terminate with each other to prevent movement between the five layers, and thermal pressing can be performed without the need for hole drilling or eyelets.

[Embodiments of the invention]

FIG. 1 is a plan view showing a laminated board according to an embodiment of the present invention, FIG. 2 is a side view thereof, FIG. 3 is a front view thereof, and FIG. 4 is a sectional view taken along IV-IV. The same reference numerals as those in the figures to FIG. 7 indicate the same or corresponding parts.

The manufacturing method for multilayer printed wiring boards is the same as the conventional method.

One-sided copper foil outer layer board (2), (3) is prepreg (5),
(6) are laminated on both sides of the inner layer substrate (4) to form a laminated substrate (9), and the corners of the laminated substrate (9) are cut and bent using a special mold. (12) is formed.

The cutting and bending part (12) has a shape that is deformed into an arc shape in the lamination direction between parallel cuts (13), and in this part, the single-sided copper foil outer layer board (2), (3), inner layer Group F2
(4) and the prepregs (5) and (6) are intertwined and integrated to prevent movement between the layers. In this state, thermal pressing is performed to harden the laminated substrate (9) to produce a multilayer printed wiring board (1).

In the above embodiment, the laminated substrate (9) is cut and bent (1).
2), but the same effect can be obtained even if the parts are deformed and integrated by burring.

〔Effect of the invention〕

According to this invention, since the laminated substrates are integrated by cutting and bending or burring, there is no need to drill holes.
Movement between the fi layer and the substrate can be prevented without using eyelets, workability is improved, and scratches do not occur during thermal pressing.

[Brief explanation of drawings]

Fig. 1 is a plan view showing a laminated board according to an embodiment of the present invention, Fig. 2 is a side view thereof, Fig. 3 is a front view, Fig. 4 is a cross-sectional view of the IV-TV, and Fig. 5 is a conventional multilayer substrate. A plan view showing a printed wiring board, FIG. 6 is a front view thereof, and FIG. 7 shows a conventional manufacturing process, (A) is a plan view, (B) to (D) are its ■-
■It is a sectional view. In each figure, the same reference numerals indicate the same or corresponding parts, (2)
, (3) is a single-sided copper foil outer layer board, (4) is an inner layer board, (5
), (6) huffrifref, (9)+*1uK! J board,
(12) is a cutting and bending part.

Claims (2)

[Claims] (1) Cutting or burring is formed in the lamination direction of a laminated board in which a single-sided copper foil outer layer board, prepreg, and inner layer board are laminated, and the laminated board is deformed in the lamination direction to be integrated and thermal pressing is performed. A method for manufacturing a multilayer printed wiring board. (2) The method for manufacturing a multilayer printed wiring board according to claim 1, wherein the cutting and bending portions are formed by deforming parallel cuts into an arc shape.