JPS6163405A - Processing method of unfired ceramic using energy beam - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a method for processing green ceramic sheets using an energy beam such as a laser or an electron beam, and in particular, a method for processing green ceramic sheets with high processing position accuracy. The present invention relates to a method of processing unfired ceramic using an energy beam, which is suitable for the following.

[Background of the invention]

In recent years, in the field of combinator technology, multilayer ceramic modules have been used as ceramic substrates on which integrated circuits and the like are mounted. The manufacturing process of this multilayer ceramic module will be briefly described as follows. First, alumina.

Ceramic particles are manufactured by finely pulverizing ceramics such as zircon. Organic binder,
By mixing a solvent and a plasticizer and extruding the mixture on a support tape such as Mycy, a so-called unfired ceramic 7-t (hereinafter referred to as green 7-t) can be obtained.

This green 7-sheet is drilled to form through holes when the board is completed, and after a circuit pattern is formed, the required number of sheets are laminated and heat-pressed to complete a multilayer ceramic module. It is something.

Multilayer ceramic modules must be molded with high positional accuracy because they are used to mount integrated circuits and the like. In particular, Guia holes are formed to establish continuity between each layer wiring via a conductor filled in a hole drilled in each green sheet, so in such a case, green mate hole drilling is required. This must be done with extremely high positional accuracy.

Conventionally, holes in green sheets have been made by drilling or press punching. Among these, trilling is only applied to drilling holes with hole diameters of approximately 0°3Hφ or more and small quantities due to drill wear and cutting. On the other hand, press punching is better than drilling in terms of tool wear and can achieve high processing speeds, so it is suitable for drilling holes in green sheets.

However, with the miniaturization of the hole pitch, "sag" occurs in the green sheet due to the accumulation of plastic deformation around the hole during processing, making subsequent lamination difficult and making it difficult to reduce the diameter of the hole. was there.

A processing method using an energy beam such as a laser or an electron beam is known as a non-contact processing method that does not cause a green 7-t to sag.

The green sheet processing method using this energy beam is
Processing progresses by irradiating the processing point with an energy beam to raise the temperature of the irradiated part, vaporizing the binder or solvent with a low vaporization temperature, and blowing off the ceramic particles with the evaporation pressure. It can be applied not only to hole machining but also to groove machining.

However, in the green sheet processing method using an energy beam, there is a problem in that material shrinkage occurs in the green sheet due to thermal history during processing, reducing processing position accuracy. The shrinkage mechanism is not necessarily clear, but it is thought that shrinkage occurs when the solvent contained in the green sheet evaporates due to heat during processing.

As already mentioned, high positional accuracy is required when machining holes in green sheets, and therefore, when machining green sheets using an energy beam, it is necessary to take measures to prevent the deterioration of machining position accuracy due to material shrinkage.

As a countermeasure against material shrinkage of green sheets, there is a method disclosed in Japanese Patent Publication No. 58-48497.

This method stabilizes the solution by placing the green sheet in a solvent vapor, a solvent solution, or a solvent solution spray, thereby suppressing material shrinkage and achieving dimensional stability. However, although this method has the effect of suppressing dimensional changes after processing, it does not provide a countermeasure against the reduction in processing position accuracy due to dimensional changes caused by material shrinkage that occurs during processing of green sheets with energy beams. . Under such circumstances, the conventional green sheet processing method using an energy beam does not take measures against material shrinkage, and it is difficult to process the green sheet with high processing position accuracy.

[Purpose of the invention]

An object of the present invention is to provide a method for processing unfired ceramic using an aluminum beam, which can improve the problems of the prior art described above and easily achieve high processing position accuracy. .

[Summary of the invention]

The structure of the method for processing green ceramic using an energy beam according to the present invention is to irradiate sequentially positioned processing points on a green ceramic sheet placed on an XY table with an energy beam to sequentially process the processing points. In the green ceramic processing method using an energy beam, the processing point is positioned while correcting dimensional changes caused by material shrinkage of the green ceramic sheet.

More specifically, in processing a green sheet using an energy beam, a positioning command for a processing point is corrected in response to dimensional changes due to material shrinkage.

[Embodiments of the Invention] Hereinafter, the present invention will be described in detail.
Implementation f11 in which a hole is machined in will be explained with reference to the drawings.

FIG. 1 is a schematic diagram showing a processing device used to carry out a processing method for green ceramics using an energy beam according to an embodiment of the present invention, and FIG. 2 shows holes in the alumina green sheet in FIG. 1. FIG. 3 is a plan view showing a state in which the machining area is divided into a plurality of cutting blocks each having a size L.
FIG. 3 is an enlarged plan view showing the beam deflection locus of the single niblock shown in the figure.

In FIG. 1, 1 is a cathode, 2 is a grid, and 3 is an anode, which constitute an electron gun 9. 8 is an electron beam emitted from the electron gun 9; 4 is an electromagnetic lens for focusing the electron beam 8; and 5 is a beam deflection command device that deflects the electron beam 8 to a predetermined position. The deflection coil 6, which can irradiate the area, has an alumina green sheet 7 placed thereon, and is moved by an XY table movement command value according to a command from an XY table movement device to bring the alumina green sheet 7 to a predetermined position. It is an XY table that can be positioned.

Using the processing device configured in this way, holes with a diameter of 150 μm are formed on the alumina green sheet 7 at a pitch of p=0.5.
mm (both X direction pitch and Y direction pitch 0.5 tra
A case in which 40,000 pieces are processed using the method (m) will be explained using FIGS. 2 and 3.

When processing this alumina green sheet 7,
The hole machining area is 8 columns x 8 rows, and a total of 64 holes are machined in one block 17 (block size L = 3.5 rtas). The machining point is determined by beam deflection of the electron beam 8 in the range of one block 17, and when moving to the next block 17', the dimensional change due to material contraction of the alumina green sheet 7 is determined. Processing is performed using the electron beam 8 while positioning is performed by a combination of beam deflection and XY table movement, such as moving the XY table 6 by the corrected XY table movement command value. The amount of correction in the XY table movement command value described above is determined in advance through experiments.

When the processing device is turned on, the XY table 6 is moved to a predetermined position by the XY table drive device, and the electron beam 8 is
is positioned at the beam initial position 10, which is the center point of the first crab block 17.

A command is given from the beam deflection command device to the deflection coil 5, and the electron beam 8 is deflected as shown in the trajectory 12 and positioned at the processing point 11, and the beam pulse (beam NR2m
A, hole processing is performed by irradiating 5 beam pulses with a pulse width of 50 μs. Next, in the same manner, the electron beam 8 is deflected along the trajectory 14 and positioned at the processing point 13 to perform hole processing. The above operations are repeated to sequentially drill holes, and 6
After reaching the fourth machining point 15 and drilling the hole, the trajectory 16
The electron beam 8 is deflected and returns to the beam initial position 10 as shown in FIG. This completes the machining of 64 holes in the single-machined apron 17. When the machining of the first cutting block 17 is completed, the XY
The table 6 is moved in the vertical direction (
Or, in the lateral direction), move the XY table movement command value Lfp + ΔL = 4.001 m corrected by the correction amount ΔL caused by material contraction of the alumina green sheet 7, and move to the beam initial position 10' of the next bending block 17'. The above-mentioned process is repeated again, and all the machining blocks are machined, completing the machining of 40,000 holes.

In this embodiment, the influence of the XY table movement command value on the machining position accuracy will be explained using FIG. 4.

FIG. 4 is a position deviation diagram showing an example of the influence of the XY table movement command value on the machining position accuracy. In FIG. 4, the horizontal axis represents the positional deviation of each machining point from the desired position when the starting point of alumina drilling is used as a reference.

In this figure, 18 indicates that the XY table movement command value is 4.
．． 000mm, that is, the positional deviation without correction, 19 is 4.001, and 20 is 4.00:3.
These are the positional deviations when corrections are made by 1 μm and 3 μm for +on and 4 throats, respectively. When the XY table movement command value is not corrected (positional deviation 18), the hole pitch becomes smaller due to the influence of material contraction, and the hole position shifts to the negative side. On the other hand, when the XY table movement command value is corrected by 1/1 m (in the case of a positional deviation of 19, in the case of this implementation column), the positive hole lIj is appropriate, and the positional deviation of the hole is reduced by 10 μm. It can be made as small as below. Further, when a correction of 3 μm is performed (positional deviation is 20), the position of the hole shifts to the plus side.

According to the embodiment described above, when processing the alumina green sheet 7 with the pentagonal beam 8 after sequential positioning by combining beam deflection and XY table movement, the XY table movement command value is Since appropriate correction is applied, there is an effect that a high machining position accuracy of 10 μm or less can be easily obtained.

Furthermore, even if the amount of material shrinkage changes by changing the hole diameter or hole pinch, high machining position accuracy can be easily achieved by simply changing the accuracy of the table movement command value slightly accordingly.

In this example, the case where positioning is performed by combining beam deflection and XY table movement has been described, but the method of the present invention can also be applied to positioning and processing using only table movement or beam deflection. When applied, similar effects can be achieved.

Further, in this embodiment, the case where hole machining is performed has been described, but the method of the present invention can also be applied to the case where groove machining is performed, and similar effects can be obtained.

Furthermore, although this embodiment describes the case where the alumina green sheet 7 is processed by the electron beam 8, the method of the present invention uses a laser instead of the electron beam 8 when processing other types of green notes. It can also be applied to processing using the same method, and the same effect can be obtained.

〔Effect of the invention〕

As described above in detail, according to the present invention, high machining position accuracy can be easily achieved. A method of processing green ceramic using an energy beam can be provided.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram showing a processing device used to carry out a processing method for green ceramics using an energy beam according to an embodiment of the present invention, and FIG. 2 shows holes in the alumina green sheet in FIG. 1. FIG. 3 is a plan view showing a state in which the machining area is divided into a plurality of cutting blocks each having a size L.
FIG. 4 is an enlarged plan view showing the beam deflection locus of one machining block in the figure, and FIG. 4 is a position deviation diagram showing an example of the influence of the XY table movement command value on the machining position accuracy. 6...XY table, 7...Alumina green sheet, 8...Electron beam, 11,13. L5: Machining point, ΔL: Correction amount. Figure 1 * 2 mouths

Claims (1)

[Claims] 1. In a method of machining green ceramic using an energy beam, the machining points are successively positioned by irradiating the energy beam onto sequentially positioned machining points on a green ceramic sheet placed on an XY table. A method for processing green ceramic using an energy beam, characterized in that point positioning is performed while correcting dimensional changes caused by material shrinkage of the green ceramic sheet.