JPS61155410A - Crosslinked fluorocarbon resin molding - Google Patents
Crosslinked fluorocarbon resin moldingInfo
- Publication number
- JPS61155410A JPS61155410A JP28089084A JP28089084A JPS61155410A JP S61155410 A JPS61155410 A JP S61155410A JP 28089084 A JP28089084 A JP 28089084A JP 28089084 A JP28089084 A JP 28089084A JP S61155410 A JPS61155410 A JP S61155410A
- Authority
- JP
- Japan
- Prior art keywords
- trimethyl
- cyanurate
- fluororesin
- isocyanurate
- crosslinking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title description 3
- 229920005989 resin Polymers 0.000 title description 3
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 title 1
- 238000000465 moulding Methods 0.000 title 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 15
- 238000004132 cross linking Methods 0.000 claims description 14
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 10
- 125000005395 methacrylic acid group Chemical group 0.000 claims description 6
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 5
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 claims description 5
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 230000005865 ionizing radiation Effects 0.000 claims 1
- 238000010894 electron beam technology Methods 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 10
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 238000007654 immersion Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 150000001451 organic peroxides Chemical class 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 210000003298 dental enamel Anatomy 0.000 description 2
- -1 polytetrafluoroethylene Polymers 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- JFZBUNLOTDDXNY-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)propoxy]propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)OCC(C)OC(=O)C(C)=C JFZBUNLOTDDXNY-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229920006355 Tefzel Polymers 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- SWHLOXLFJPTYTL-UHFFFAOYSA-N [2-methyl-3-(2-methylprop-2-enoyloxy)-2-(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(COC(=O)C(C)=C)COC(=O)C(C)=C SWHLOXLFJPTYTL-UHFFFAOYSA-N 0.000 description 1
- HSZUHSXXAOWGQY-UHFFFAOYSA-N [2-methyl-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(C)(COC(=O)C=C)COC(=O)C=C HSZUHSXXAOWGQY-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- QHSJIZLJUFMIFP-UHFFFAOYSA-N ethene;1,1,2,2-tetrafluoroethene Chemical compound C=C.FC(F)=C(F)F QHSJIZLJUFMIFP-UHFFFAOYSA-N 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000010454 slate Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野〕
本発明は、電子h!l器部品として使用できる架橋フッ
素附脂成型物に関する。[Detailed Description of the Invention] [Technical Field] The present invention provides an electronic h! This invention relates to a cross-linked fluorine-coated molded product that can be used as a container part.
近年、各種電子機器の発達に伴い、リレー、スイチツン
グ、レギレーター等の電子部品に対してより高速化、高
性能化が要求される様になった。In recent years, with the development of various electronic devices, higher speed and higher performance have been required for electronic components such as relays, switches, and regulators.
この為、低誘電率、高抵抗の材料が必要となり、この点
で、四フッ化エチレン樹脂(PTFE)は低誘電率、高
抵抗の電気特性をもち、しかも耐薬品性、耐熱性に優れ
ており理想的な素材といえる。しかしPTFEは、加工
が非常に雅しく、mpttt的強度tで欠けるといった
問題があり、部品材料として使用しにくいものである。For this reason, a material with a low dielectric constant and high resistance is required, and in this respect, polytetrafluoroethylene resin (PTFE) has electrical properties of low dielectric constant and high resistance, and has excellent chemical resistance and heat resistance. It can be said to be an ideal material. However, PTFE is difficult to use as a component material because it is difficult to process and lacks mpttt strength t.
一方、加工性に優れたフッ素樹脂として、エチレン−テ
トラエチレン共重合体(ETFE)、テトラフルオロエ
チレン−へキサフルオロプロピレン共重合体(FEP
)等がある。これらのフッ素樹脂は、電気的には低誘電
率、高抵抗で耐熱性、耐薬品性シでも優れている。しか
し、明確な融点全もつ為、例えば300″Cといった融
点以上の半田浴に浸漬するといった場合tζ、成型物が
変形するといった問屋が生じ、これも電子部品用材料と
して使用できない。On the other hand, fluororesins with excellent processability include ethylene-tetraethylene copolymer (ETFE) and tetrafluoroethylene-hexafluoropropylene copolymer (FEP).
) etc. These fluororesins have low electrical permittivity, high resistance, and are excellent in heat resistance and chemical resistance. However, since it has a clear melting point, if it is immersed in a solder bath with a temperature higher than the melting point, such as 300''C, the molded product will be deformed, so it cannot be used as a material for electronic parts.
本発明は、ETFE 、FEPといった加工性の良いフ
ッ素樹脂全周い、しかも300°Cの半田浴浸漬といっ
た融点以上の加熱に対しても、形状を保持させるべく検
討したものである。The present invention is based on studies aimed at retaining the shape of a fluororesin such as ETFE or FEP, which has good processability, even when heated above its melting point, such as by immersion in a solder bath at 300°C.
一般にポリマーの架橋方法として蚤よ、(1)有機過酸
化物による架橋、(2)放射線架橋、(3)有機シラン
架橋などが知られている。フッ素樹脂の架橋では、該樹
脂の融点が260〜270”Cと高く、加工温度(30
0〜400°C)でも分解せずに分解温度が400°C
以上というような有機過酸化物は一般゛には存在しない
ので(1)の有機過酸化物による架橋は出来ない。Generally known methods for crosslinking polymers include (1) crosslinking with organic peroxides, (2) radiation crosslinking, and (3) organic silane crosslinking. In the crosslinking of fluororesin, the melting point of the resin is as high as 260 to 270"C, and the processing temperature (30
The decomposition temperature is 400°C without decomposing even at 0 to 400°C.
Since organic peroxides such as those mentioned above generally do not exist, crosslinking using organic peroxides in (1) cannot be performed.
また(3)の有機シランによる架橋では、アルコキシシ
ラン全ポリアミド樹脂にグラフト化させる必↓
要があるが、300°C近くではアルキシシランが揮散
してしまうため、この方法も不可能である。In addition, in (3) crosslinking with organic silane, it is necessary to graft the alkoxysilane onto the all-polyamide resin, but this method is also impossible because the alkoxysilane will volatilize at temperatures near 300°C.
そこでフッ素樹脂に対して放射線照射による架FR?険
肘した。放射線としては、電子線、r線などがあるが、
工業的には電子線音用いるのが効率よく有利であること
から、電子線照射による方法と検討した。So, is it possible to create a frame FR by irradiating the fluororesin with radiation? I had a hard time. Radiation includes electron beams, r-rays, etc.
Industrially, it is efficient and advantageous to use electron beam sound, so we considered a method using electron beam irradiation.
まず、フッ素樹脂単独で電子線照射全行なったが、殆ん
ど効果なく、350″Cの半田浴に15秒間浸漬した所
、完全に溶融してしまった。First, electron beam irradiation was performed on the fluororesin alone, but there was almost no effect, and when it was immersed in a solder bath at 350''C for 15 seconds, it completely melted.
そこで架橋助剤?フッ素樹脂に配合することの検討全行
なった。架橋助剤としては、よく知られている多官能性
モノマーに使用した。即ち、ジエチレングリコールジア
クリレートのようなジアクリレート系、エチレングリコ
ールジメタクリレート、ジプロピレングリコールジメタ
クリレートなどのジメタクリレート系、トリメチロール
エタントリアクリレート、トリメチロールプロパントリ
アクリレートなどのトリアクリレート系、トリメチロー
ルエタントリメタクリレート、トリメチロールプロパン
トリメタクリレートなどのトリアクリレート系、トリア
リルシアスレート、トリアリルイソシアヌレート、ジア
リルスレート、ジアク
リルフ;レート、トリメチルメタクリルシアスレート、
トリメチルメタクリルイソシアヌレート、トリメチルア
クリルシアヌレート、トリメチルアクリルイソシアスレ
ートなどである。Is that a crosslinking aid? We have thoroughly investigated the possibility of incorporating it into fluororesin. A well-known polyfunctional monomer was used as the crosslinking aid. Namely, diacrylates such as diethylene glycol diacrylate, dimethacrylates such as ethylene glycol dimethacrylate and dipropylene glycol dimethacrylate, triacrylates such as trimethylolethane triacrylate and trimethylolpropane triacrylate, and trimethylolethane trimethacrylate. , triacrylates such as trimethylolpropane trimethacrylate, triallyl ciaslate, triallyl isocyanurate, diallyl slate, diacrylphate, trimethyl methacrylic ciaslate,
These include trimethyl methacrylic isocyanurate, trimethyl acrylic cyanurate, and trimethyl acrylic isocyanurate.
これらの架橋助剤全フッ素樹脂に添加した後、ボビンに
成形し、電子線照射を行なった。その後、350°Cの
半田浴に15秒間浸漬した。その結果、fi 橋助剤と
して、トリメチルメタクリルシアヌレート、トリメチル
メタクリルイソシアヌレート、トリメチルアクリルシア
スレート、トリメチルアクリルイソシアスレート、トリ
アリルシアヌレートおよびトリアリルイソシアスレート
全用いた成型品は上記半田浴に浸漬しても形状11i−
保持していたが、これ以外の架橋助剤音用いた成型品は
形状保持性に劣っていた。After adding these crosslinking aids to the fully fluororesin, it was molded into a bobbin and irradiated with an electron beam. Thereafter, it was immersed in a solder bath at 350°C for 15 seconds. As a result, molded products using all of trimethyl methacrylic cyanurate, trimethyl methacryli isocyanurate, trimethyl acrylic cyanurate, trimethyl acrylic isocyanurate, triallyl cyanurate, and triallyl isocyanurate as fi linking agents were immersed in the above solder bath. Even shape 11i-
However, molded products using other crosslinking aids had poor shape retention.
さらに、トリメチルメタクリルシアスレート、トリメチ
ルメタクリルイソシアヌレート、トリメチルアクリルシ
アスレート、トリメチルアクリルイソシアヌレート、ト
リアリルシアヌレートあるいはトリアリルイソシアスレ
ートを架橋助剤としたフッ素樹脂組成物からなる電子線
照射した成型品では、350°Cの半田浸漬でも形状?
保持していた。In addition, electron beam irradiated molded products made of fluororesin compositions using trimethyl methacrylic cyanurate, trimethyl methacrylisocyanurate, trimethyl acrylic cyanurate, trimethyl acrylic isocyanurate, triallyl cyanurate, or triallyl isocyanurate as a crosslinking agent. , Is the shape even after solder immersion at 350°C?
was holding it.
又、電子線照射に変えて、”Coのr線照射?行なった
所、電子線照射と同様に、350 ’C半田浴に15秒
間浸漬しても溶解しないことが認められた。Furthermore, when Co was subjected to r-ray irradiation instead of electron beam irradiation, it was found that it did not dissolve even when immersed in a 350'C solder bath for 15 seconds, similar to electron beam irradiation.
以上のように本発明の架橋フッ素樹脂成型物はフッ素樹
脂にトリメチルメタクリルシアスレート、トリメチルメ
タクリルイソシアヌレート、トリメチルアクリルシアヌ
レート、トリメチルアクリルイソシアヌレート、トリア
リルシアヌレートアルいはトリアリルイソシアヌレート
などの架)二助削をカロえ放射線架橋全行なうためフッ
素樹脂の融点以上に加熱しても、溶融変形することなく
形状?保持することができるのである。As described above, the cross-linked fluororesin molded product of the present invention has a cross-linked fluororesin with trimethyl methacrylic ciaslate, trimethyl methacrylylisocyanurate, trimethyl acrylic cyanurate, trimethyl acrylic isocyanurate, triallyl cyanurate, or triallyl isocyanurate. ) Since the second cutting is carried out and radiation cross-linking is carried out, the shape does not melt and deform even when heated above the melting point of the fluororesin. It is possible to retain it.
次に本発明に実施例により詳細に説明する。Next, the present invention will be explained in detail using examples.
第1表の架橋助剤と加えた樹脂組成物k、型1f?圧カ
フ0(の射出成型幾全用い、第1図に示した形状のトラ
ンス用ボビン?成形した。第1図においてはビン立て部
、(2)はボビン本体、(3)はツバ部である。その後
、これら成型物音2 MeVの電子線加j!! 器’l
”用い電子線t 3 、1.0 、25 、35Mra
d照射した。Resin composition k, type 1f added with the crosslinking aid shown in Table 1? Using the injection molding geometry of pressure cuff 0, a bobbin for a transformer with the shape shown in Fig. 1 was molded. In Fig. 1, the bottle stand part, (2) is the bobbin body, and (3) is the collar part. .After that, these molded objects were subjected to electron beam application of 2 MeV!!
"Used electron beam t3, 1.0, 25, 35 Mra
d irradiated.
次いでこのボビンにエナメル線全巻線し、ビン立て2行
ない、電源トランスと成し、350°Cの半田浴に15
沙間浸漬し、ピン及びエナメル巻線全半田漬けし、ボビ
ンの形状変化音しらべ、第1表の結果を得た。その結果
、本発明の照射量の範囲で照射した成型物は半田浸漬し
てもすべて形状保持していた。Next, this bobbin was fully wound with enamelled wire, two rows of bottle stands were made, and a power transformer was formed.
The pins and enamel windings were all soldered, and the bobbin shape change noise was investigated, and the results shown in Table 1 were obtained. As a result, all of the molded products irradiated within the dose range of the present invention retained their shape even when immersed in solder.
比・咬例
第1表に示すフッ素樹脂組成物を使用しで、実権例と同
じ形状のトランス用ボビン?射出成型した。該成型物を
実施例と同様に2 MeVの電子線加mat用い、3.
1O125,35Mradの電子線全照射シた。次いで
このボビンにエナメル電線全巻線し、ピン立で全行ない
電源トランスと成し、実施例と同じく半田浸漬全行なっ
た。その結果、未照射、照射全問わず、比較例配合の組
成物よりなる成型物は、すべて半田浴浸漬により、ビン
の位置ずれが発生し、実用に洪さないことが認められた
。A bobbin for a transformer that uses the fluororesin composition shown in Table 1 and has the same shape as the actual example? Injection molded. 3. The molded product was subjected to 2 MeV electron beam heating in the same manner as in the example.
The entire sample was irradiated with an electron beam of 1O125.35 Mrad. Next, the enamel electric wire was completely wound around this bobbin, and the wire was completely wound with a pin stand to form a power transformer, and the entire wire was dipped in solder in the same manner as in the example. As a result, it was found that all of the molded products made of the composition of the comparative example, regardless of whether they were unirradiated or fully irradiated, suffered misalignment of the bottle due to immersion in the solder bath, and it was recognized that this would not affect practical use.
第 1 表
1)F E P :テトラフルオロエチレンーヘキサフ
ルオロプロピレン共重合体
(テフayFEP:Dupont陸商品名2)ETFE
:エチレンーテトラフルオロエチレン共重合体
(テフゼル: Du pon’を仕向品名)3)350
”C−15秒浸漬
○:変形なし △:変形あり ×:溶融Table 1 1) FEP: Tetrafluoroethylene-hexafluoropropylene copolymer (TEFEP: DuPont brand name 2) ETFE
: Ethylene-tetrafluoroethylene copolymer (Tefzel: product name supplied by Du pon') 3) 350
"C-15 seconds immersion ○: No deformation △: Deformation ×: Melting
第1図は本発明実施例の成形物(トランス用ボビン)全
示す。
(1)はピン立て部、)2)はボビン本体、(3)はツ
バ部である。
第1図FIG. 1 shows the entire molded article (bobbin for a transformer) according to an embodiment of the present invention. (1) is the pin stand part, )2) is the bobbin body, and (3) is the collar part. Figure 1
Claims (1)
レン共重合体又はエチレン−テトラフルオロエチレン共
重合体に、トリアリルシアヌレート、トリアリルイソシ
アヌレート、トリメチルメタクリルシアヌレート、トリ
メチルメタクリルイソシアヌレート、トリメチルアクリ
ルシアヌレート、トリメチルアクリルイソシアヌレート
から成る詳より選ばれた架橋助剤を配合して成るフッ素
樹脂組成物の成型物であつて、電離放射線照射により架
橋されて成ることを特徴とする架橋フッ素樹脂成型物。(1) Tetrafluoroethylene-hexafluoropropylene copolymer or ethylene-tetrafluoroethylene copolymer, triallyl cyanurate, triallyl isocyanurate, trimethyl methacrylic cyanurate, trimethyl methacrylisocyanurate, trimethyl acrylic cyanurate, trimethyl 1. A crosslinked fluororesin molded article, which is a molded article of a fluororesin composition containing a crosslinking aid selected from acrylic isocyanurate, which is crosslinked by irradiation with ionizing radiation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28089084A JPS61155410A (en) | 1984-12-27 | 1984-12-27 | Crosslinked fluorocarbon resin molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28089084A JPS61155410A (en) | 1984-12-27 | 1984-12-27 | Crosslinked fluorocarbon resin molding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61155410A true JPS61155410A (en) | 1986-07-15 |
Family
ID=17631366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28089084A Pending JPS61155410A (en) | 1984-12-27 | 1984-12-27 | Crosslinked fluorocarbon resin molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61155410A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0376703U (en) * | 1989-11-29 | 1991-07-31 | ||
| US9044541B2 (en) | 2005-12-02 | 2015-06-02 | C. R. Bard, Inc. | Pressure activated proximal valves |
| JP2017224766A (en) * | 2016-06-16 | 2017-12-21 | 富士電機株式会社 | High-voltage, high-frequency insulating transformer |
-
1984
- 1984-12-27 JP JP28089084A patent/JPS61155410A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0376703U (en) * | 1989-11-29 | 1991-07-31 | ||
| US9044541B2 (en) | 2005-12-02 | 2015-06-02 | C. R. Bard, Inc. | Pressure activated proximal valves |
| US9943678B2 (en) | 2005-12-02 | 2018-04-17 | C. R. Bard, Inc. | Pressure activated proximal valves |
| US11305102B2 (en) | 2005-12-02 | 2022-04-19 | C. R. Bard, Inc. | Pressure activated proximal valves |
| JP2017224766A (en) * | 2016-06-16 | 2017-12-21 | 富士電機株式会社 | High-voltage, high-frequency insulating transformer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4407846A (en) | Method of producing a hydrophilic membrane from a polyethylene base film | |
| EP0351982B1 (en) | Electrical terminal | |
| US4373554A (en) | Self-sealing article and process | |
| ES468279A1 (en) | Method for preparing silicone graft copolymers | |
| JPS5912936A (en) | Crosslinked polyamide resin composition | |
| JPS61155410A (en) | Crosslinked fluorocarbon resin molding | |
| JPS5912935A (en) | Crosslinked polyamide resin formed product | |
| JP2019050214A (en) | cable | |
| JPS61179010A (en) | Low voltage electric cable | |
| JPS63305151A (en) | Crosslinked fluororesin molding | |
| JPH05314960A (en) | Method for manufacturing battery separator | |
| JPS5917935B2 (en) | heat shrink tube | |
| JPS631683B2 (en) | ||
| JPS5912946A (en) | Crosslinked polybutylene terephthalate resin molded product | |
| JPH01115934A (en) | Crosslinking of molded resin article | |
| JPH028606B2 (en) | ||
| JPS6125822A (en) | heat shrink tube | |
| JPS57212024A (en) | Heat-shrinkable tube | |
| JPH06275129A (en) | Electrical insulation composition and electric wire / cable | |
| JPS6063227A (en) | Method for producing irradiation crosslinked molded product | |
| JPH0422134B2 (en) | ||
| JPS6116940A (en) | Heat-resistant transparent polyolefin resin composition | |
| JPS5968334A (en) | Manufacturing method for polyamide resin molded products | |
| JPS581728A (en) | Crosslinking method for resin composition | |
| Du Plessis | Accelerators in radiation processing |