JPS59136466A - Continuous melt plating method - Google Patents

Abstract

PURPOSE:To apply continuous thick plating with good appearance by quenching a material to be plated without generating an oxide film, by a method wherein a draining apparatus comprising a double pipe is immersed in a plating bath and a cooling medium is sprayed to the periphery of the material to be plated from many directions while forming an eddy current to said cooling medium. CONSTITUTION:A draining apparatus 4 is formed of an inner and an outer double tubular members 5, 6 and the lower part thereof is immersed in a plating bath 2. A cooling medium 10 comprising non-oxidative low temp. gas, liquid or a mixture thereof sent into an eddy current chamber between the tubular members 5, 6 from an introducing port 9 receives rotation in the peripheral direction of a material 1 to be plated to form an eddy current apparatus. A cooling medium 10 to which rotary motion is imparted is sprayed to the periphery of the material 1 to be plated in an almost uniform flow amount from outflow ports 8 in two directions or more and discharged from the upper part. The material 1 to be plated is uniformly quenched from the periphery thereof by the eddy current of the cooling medium and, at the same time, the drawing-up part of the plating bath 2 is prevented from oxidation because held under a non- oxidative atmosphere.

Description

DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a method of continuously applying hot-dip plating of a metal or alloy around a long material.

(Background technology) For example, melting into wires, plates, etc. &1. ) Conventionally, the drawing method shown in FIG. 1 has been adopted. In the figure, 1
is plated material such as wire, plate, etc., 2 bad), plated material 1
The carbon powder deposited on the plating bath 2 is drawn vertically through the Fura Nox etc. 3.

In hot-dip plating, the oxidizing power of the plating bath x p+tc
In order to prevent the oxide film from being rolled up and oxidized, the above-mentioned carbon powder, flux, etc. 3 was used to tighten the plating part by its weight and also to prevent oxidation. However, with this method, it is impossible to prevent the formation of an oxide film due to the generation of gap forces in the narrowed area during high-speed plating. It had the disadvantage that it could not be plated so thickly that it could not be coated.

In addition, K, which is thickly plated, requires electroplating, which is uneconomical because the equipment cost is high and plating takes a long time.

(Disclosure of the Invention) The present invention has been made to solve the above-mentioned problems. Even during high-speed plating, plating paulownia is uniformly rapidly cooled without generating an oxide film, resulting in a uniform and good appearance. The present invention aims to provide a continuous hot-dip plating method that can produce thick plating.

The present invention is a method for continuously melting and applying a coating to a long material, in which a non-oxidizing low-temperature gas, liquid, or a mixture thereof is sprayed in two or more directions toward the plating material in the pulling section. of the plating bath using a throttling device equipped with an outlet and a vortex device that imparts rotation of the gas, liquid or mixture thereof in the circumferential direction of the wall plating material at the pre-stage liquid reaching the outlet. This is a continuous hot-dip plating method characterized by oxidation prevention and rapid cooling of the plating material.

In the present invention, a long material is a long material such as a wire, a strip, a tape, a plate, etc., such as Cu, Al? , Fe, Ni or alloys thereof, metals such as Nb-Ti or alloys thereof, or composites thereof.

Also, the metal that is hot-dipped around them is an example. In particular, the present invention is suitable for AJ plating, which has conventionally been prone to non-plating.
It is extremely effective for Zn-A1 alloy plating, Sn plating, 5n-Pb alloy plating, etc.

Hereinafter, the present invention will be explained by examples using the drawings. FIG. 2 is a diagram showing an example of a squeezing device used in an embodiment of the method of the present invention, (a) the diagram is a longitudinal sectional view, and (b) 2 of the solid member 6.
The lower part of each layer is immersed in plating bath 2.1. I:, the lid 7 is fixed between them. Outflow ports 8 in a plurality of directions (four directions in the figure) are provided around the inner tubular member 5 at equal intervals. Outer tubular member 6
1 is provided with an inlet 9 through which a refrigerant 10 such as a non-oxidizing low-temperature gas, liquid, or a mixture thereof is introduced into the plating material 10 in the circumferential direction (in the direction of the arrow).

Between the two tubular members 5 and 6 from the fathom 9 (vortex fA, chamber)
The refrigerant 10 introduced into the refrigerant 10 is rotated in the circumferential direction of the plating material 1 as shown by the arrow, and the vortex device is blown.

The rotated refrigerant 1o is blown around the plated paulownia i with a substantially uniform flow rate from the four-direction outlet 8, and is discharged from above. The eddy flow of the coolant 1o equalizes the pressure balance of the gas around the plating paulownia 10, and uniformly quenches the plating material 1 from the surroundings. At the same time, the pulling up portion of the plating bath 2 becomes a non-oxidizing atmosphere, and oxidation is prevented.

Non-oxidizing low temperature gases, liquids or mixtures thereof may be present as low temperature liquids, vaporized gases thereof or mixtures thereof, such as N2. He.

Although LPG gas and the like are suitable, the present invention is not limited thereto, and only low-temperature gas may be used. Among these, N2 is most suitable because the liquid is available at low cost and is easy to handle.

The vortex device that gives rotation to the refrigerant is made of paulownia plated on the refrigerant.
Any structure may be used as long as it provides rotation in the -1 circumferential direction, and other examples are shown in FIGS. 3 and 4, for example. In the figure, the same reference numerals as in FIG. 2 indicate the same parts.

In FIG. 3, the diaphragm device 11 consists of an inner tubular member 5 and an outer tubular member 6' similar to that in FIG. The difference from FIG. 2 is that there are two inlets 91.9 in the tubular member 6'.
1, and in this case also tubular members 5 and 6'
The refrigerant 10 introduced into the space (vortex chamber) is similarly given rotation in the circumferential direction of the plating material 1 and is blown around the plating material 1 from the outlet ports 8 in four directions. In this case, since there are two inlets 9', the pressure balance around the plating material 10 can be made even more uniform.

In FIG. 4, the diaphragm device 12 consists of an outer tubular member 6 similar to that in FIG. 2, and a plurality of spiral blades 13. . The refrigerant 10 is introduced from the inlet 9 and the plating material l is drawn as shown by the arrow.
6 between the 6 blades 13.13-
It is sprayed around the plating material 1 from the direction.

The apparatus shown in FIGS. 3 and 4 also rotates the refrigerant in the circumferential direction of the plating material before the refrigerant reaches the outlet, and sprays the refrigerant from two directions around the plating material.
It is clear that the present invention has the same effect of preventing oxidation of the plating bath and rapidly cooling the plating material as the effect shown in FIG. 2 above.

(Example 1) The structure and dimensions shown in Fig. 2 and Fig. 5, the drawing device, and the surface of the plating bath were made using Azonyl (Currently Chemical ■, product name).
Hot-dip tin plating was applied to an annealed copper wire of 0.6 mmΦ using the method of the present invention, a comparative example, and a conventional example.

In FIG. 5, the expansion device 14 consists of a pipe 15 provided with an inlet 16 through which the refrigerant 10 is introduced.

As the refrigerant 10, vaporized low-temperature gas of liquid nitrogen was used. After degreasing and pickling the annealed copper wire and fluxing it with azonyl,
It was immersed in a tin plating solution at 280°C and pulled up through the squeezing device described in -1-.

Table 1 shows the results of examining the minimum plating thickness and appearance of tin-plated annealed copper wires obtained by plating at the line speeds shown in Table 1.

Table 1 Note) X mark, ×: Severe unevenness. ○: Can be used in practice, but needs improvement. @: Smooth.

From Table 1, 11!15 to interval 7 according to the present invention are the conventional example,
It can be seen that, compared to the comparative example, a product with good appearance and thick plating can be obtained even with high-speed plating.

(Example 2) Using the structure, dimensions, and carbon powder squeezing device shown in FIGS. 2 and 5, a 4.2 mmΦ steel wire was hot-dip galvanized by the method of the present invention, comparative example, and conventional example. did.

The same gas as in Example 1 was used as the refrigerant 10.

Pre-treatments include degreasing with a normal lead bath, pickling with hydrochloric acid,
Z n C1! ,, Flux treatment with a -NH4C1 mixture was performed.

Table 2 shows the results of examining the uniformity of the plating and the appearance of the galvanized steel wires obtained by immersing them in a galvanizing bath at 465° C. and at the wire speeds shown in Table 2. The uniformity test was conducted according to JISHO401.

Table 2 Note) Mark y, same as Table 1.

From Table 2, 'No, 12 to l'414 according to the present invention
It can be seen that, compared to the conventional example and the comparative example, the appearance is good even in high-speed plating, and the uniformity is good.

(Effects of the Invention) The continuous method 1 corroding method of the present invention configured as described above has the following effects.

(a) Two outlet ports in two directions that spray non-oxidizing low-temperature gas, liquid, or a mixture of these (refrigerant) toward the plating material in the pulling section, and at a stage before reaching the outlet ports,
Since the throttle device is equipped with a vortex device that gives the refrigerant rotation in the circumferential direction of the plating material, the introduced refrigerant is rotated and sprayed from two or more directions around the plating material.
Since the gas pressure around the plating material is equalized, uniform plating can be obtained.

(b) Since low-temperature refrigerant is sprayed around the plating paulownia, even in tube-speed plating, the pulling up part of the plating bath is made into a non-oxidizing atmosphere to prevent the occurrence of oxidation on the bath surface, resulting in plating with a good appearance. At the same time, since it is rapidly and effectively cooled with low-temperature gas and cooled in the pulling section, a large amount of deposited plating layer "sag" is prevented, resulting in high-speed plating performance and thick plating. I can do it.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional view showing an example of a conventional diaphragm device. Figures 2(a), 3(b), 3, and 4 are diagrams showing the aperture device used in the embodiment of the method of the present invention, respectively.
Figure (a) is a longitudinal cross-sectional view, and Figures 2 (b), 3, and 4 are cross-sectional views. Figure 5 is a vertical dyi plane view showing the aperture device used in the comparative example. 1- Plating material, 2- Plating bath, 3- Carbon powder, flux, etc., 4.11.12.14- Squeezing device, 5, 6
．． 6-tubular member, 7-lid, 8-outlet, 9°9', 1
Stone - inlet, 10' - refrigerant, 13 - swirl vane, 15 -
---Pipe.

Claims (2)

[Claims] (1) Long material ◎ In a continuous hot-dip plating method, an outlet in two or more directions that blows non-oxidizing low-temperature gas, liquid, or a mixture thereof toward the plated material at the bottom of the drawer. Then, before reaching the outlet, a throttling device equipped with a vortex device that rotates the gas, liquid, or a mixture thereof in the circumferential direction of the plating material is used to prevent oxidation of the plating bath and to remove the plating material. A continuous hot-dip plating method characterized by rapid cooling. (2) The continuous hot-dip plating method according to claim 1, wherein the non-oxidizing low-temperature gas, liquid, or a mixture thereof is produced from liquid nitrogen.