JPS58222593A - Method of producing substrate for metal core-filled printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides gold M;i! Regarding the manufacturing method of a rare plate for eyelid plate with glint, its purpose is to have excellent insulation properties on the metal surface, easy to process circuits, and close contact with conductors by electroless M and plating. Provides a method for manufacturing a substrate for a metal-core type wiring board on which a dielectric insulation film is formed.
i-The number of printed wires with O gold M core is Kanahashi, 6. The metal base number table 1 is fully insulated, and the IJr pheasant circuit is formed with mechanical strength and heat dissipation VL% long metal. It is something that you have.

In order to insulate the surface of the Kinka 4 board, the power of the shield is used, and one of them is the tunkan 7121 edge painting method.

'A-layer insulation coating method has been widely used as a corrosion-resistant base coating for automobile bodies, and this technology is also used to insulate sheet metal PJ4 boards with holes, creating a new metal-core glint scarlet plate. Manufacturing technology was also proposed (Special Public Interest Publication in 1984).
-5.9076゜Special Publication Showa 55-24716, Japanese Patent Publication Publication Showa 54
-13968゜53-111471.53-11147
0, Japanese Patent Publication No. 5O-8494) oL However, since these technologies are based on the consideration of insulation of the gold wire part, other characteristics required for printed wiring board VC*,
? ! It has poor heat resistance, poor layering properties with the conductor and the 5-edge coating, and we recommend appropriate countermeasures against defects such as blistering. In order to provide a dense layer force between circuit conductors, in the prior art, after coating the T layer, '11. Therefore, this method reduces manufacturing costs and environmental issues associated with the shoulder coating process. Not only is this a disadvantage, but it is extremely difficult to paint the hole to prevent it from forming, so it is unavoidable to make the hole diameter as large as 2mmφ.

The present invention is based on one point of Vc, and the basic resin with M in the A9 molecule is entirely partially acidified with B.
11-J ↓ 9 Water dispersion performance is fully imparted to 2 Kanaon table formation JjqsB, Changan ゛C is a solid, and 11 lateral line fine powder is hardened by rainbow bath melting in heat. A metal object and an object were immersed in an aqueous dispersion of C4 rubber powder, and a metal holder was used as a cathode, and a direct photovoltaic ratio was applied to the counter electrode. On top of Kanasu board! IR 2 chamber material precipitate can be precipitated in t paper and 16 things. 0 There is a basic phoneme in the molecule, but J fat & ff, epoxy @ 廠also r town Ehokin 笈性 lateral line metal water oxidation group FC. Tanio's M machine amine compound proboscis 4 = J sword reversible epoxy lateral line with amino groups added, acrylic acid ester 2L methacrylic acid ester, vinylpyridine, vinyl imidazole, etc. Acrylic acid ester with 7 amino groups, obtained from 1.18 units of acrylic with 2 yen or unvinylized @proboscis and vinyl compound 9 with 1 free acid group, with amino group Vinylized @ common nails, and boria (tobacco, etc.) are used for convenience.

Acidic compounds that neutralize the bouquet are hydrochloric acid, phosphoric acid, formic acid, acetic acid, globionic acid, citric acid, malic acid,
Tartaric acid, acrylic acid, etc. are useful, but other non-imaging acids
v1. ．． Organic acids are also used and 0 salts,! S lateral side line amino group t, acidification adjunct k (
J, 2 to san to 3 to 1, preferably 0.5 to 1
．． 5 To J% I IM＞The L9 water dilution performance has been added to the cation base for sufficient mixing. Epoxy paper 200-2400 epoxy 11I! 1st month and 1st grade or 2nd grade amine Attachment 7J [+ material made water bath compatible with an acidic compound is used] It is a solid at room temperature and is melted and cured in a hot bath when heated as a side wire. Epoxy street fat, polyester flank, acrylic lateral line. The powder particle size is preferably 1 to 20 μm. As a synthetic lateral line fine powder that is solid at room temperature and hardens in a rainbow bath, a color vehicle consisting of an epoxy resin with an epoxy equivalent of 400 to 2,400 and a hardening agent is used in an amount of 50 to 20 m. A particle size of 6 to 15 μm is used. Fine powder to cationic lateral line ratio trJo, s to 20
:1 or preferred.

The rubber is styrene-butadiene rubber.

(SBR) Acrylonitrile loosetadiene rubber (NBR
) is used as the styrene-butadiene rubber.
Those containing 0 to 40 Jkjt% also include U as acrylonitrile-butadiene rubber, and acrylonitrile group t18
Preferably, the rubber contains ~41% of rubber, the total of cationic resin and bottom side line fine powder M
When the award is 100, it is preferable to add 0.5 to 50 mK. Preferably, when the cutting edge 1 is finished with 0 rubber in the 1~TOJF award section, the electric layer coating is chemically roughened at less than 0.5 Kyoto S, and if the fc is sufficiently roughened, the samurai n-js or , Rubber Elephant
Since the film thickness is extremely thin at 10 μm or less, adding Ill of 1 to 10 parts by weight is a harsh method for obtaining a coating thickness of around 100 μm.

Rubber, cationic resin, resin, resin imitation powder or us
It can also be added to the aqueous dispersion of 'cn et al. in the form of a latex in the form of a latex.Also, it can be kneaded into fine synthetic resin powder.

Powder powder has a solid content of 5 to 20 breaths i1 in water.
It is used in a dispersed manner so that it becomes %.

As for the metal M steel plate, it is possible to use a flat plate made of aluminum, etc. with many through holes depending on the required capital, or a flat plate made of aluminum or the like on both sides of the wire mesh flat plate, or a core layer of the wire mesh plate. Those with gold maple exposed only on the edge of the flat plate (the inner wall of the hole for sleeves that open the hole), and those with the above pre-shaped by
, s7'L 7j Insulated pigeon awns with copper foil or laminated on the outside are used. 11, CrOs/) 1 layer 50 on the insulation layer pre-formed on the plain board
It is preferable to use a dispersible treatment liquid such as No. 4 for chemical roughening.

11! The acceptable condition is L-I/C where the sliding voltage is 1 to 25V.
It is preferable to do so.

25V to 100VTfl The generation of hydrogen gas from the cathode (on the surface of the electrically conductive layer) increases, and there is a tendency for it to rise (peel off) from the electrical layer surface in the middle of the coating film or seed layer.

The printed wiring board substrate containing n7 gold oval core obtained in the present invention is cured at 120 to 180°C for 60 to 90 minutes.
B/IJ*SOa mixture, Na1Cr leakage Os/NaF/H
*After chemical roughening with SO4 mixture etc., no remission plating or no '
By using electroplating, the circuit power can be increased by +1.

Example 1 The following paints were used for testing purposes to form an insulating film on a gold M board. (Part is X) (Li Powder particle epoxy flank Ebiko) +007 (Shell Chemical) 400 parts Incyanate hardening agent EH-118-2 (Asahi Kamika) 660 Pigment expansion agent-1 Natan R-80 (Ishiharama) East) 210 parts l 2 Carbon MA-100 (Mitsubishi Kasei) 0.5% P was transferred to Shona's powder manufacturing force, bath melt kneaded using an extruder, and an average particle size of 12.5 μ was obtained using an impact crusher. Powder coating particles t-obtained〇(2) Water-dilutable cationic lateral line Epicoat 1001 488 parts Jetanolamine 1o, sJ + Isog 0e
yvA, Near - # 25 Q suppression 80
The mixture was reacted under reflux at ℃ for 3 hours to obtain a lateral line tray.

(NBR latex, 1562 (Nippon Zeon).

A 10M 1% aqueous latex solution was prepared by stirring and adding Total Emulgen 920 (Kao Sokiken, nonionic surfactant) to water containing 1M nitrile while stirring.

Add 11 parts of ice, 38 parts of acid, and 5,105 parts of deionized water to the cationic lateral line 5s, 7ffp, stir thoroughly with a disilver, then add 5,400 parts of the powder coating particles, and mix and disperse for 50 minutes with a high-speed rotation homogenizer.
After that, the powder was diluted with deionized water to give a solid content of 20% v1. A bath liquid for paint was prepared.

Furthermore, 6,000 volumes of the latex bath solution described in (6) above was added to the above paint bath solution, and all of the above paint was poured into a tank containing all of the FIL layer paint. Iron board (250x2
00XD, 8om+)? Z Ling & Shi, pt-'r i
The internet was completely gloomy, and the metal board was blown away for about 60 seconds.

Sweat bath liquid temperature 22℃ Miserable ratio θ/■=1/1 between poles
15cm cage Pressure: 20V Time: 60 seconds After electrocoating, washing with clean water was performed, and then baking was performed. The baking conditions were 80℃XIO minutes, then increasing the temperature from 80℃ to 200℃1 for 15 minutes, and then baking at 200''GX for 15 minutes. 0 Withstand voltage o 2.5 kV or more, 1ζ, Cr0s (+
00g), H-8()4 (300g) 50
After roughening with a chemical roughening solution at ℃ for 15 minutes, a good roughening radius was obtained.
μ, electric steel plating 35'4mL fc island conductor beer strong KU flat part Te 20 kg / crn or more Ah! 7.26
No blistering occurred after treatment for 60 seconds. Comparative Example 1 In Example 1V, the rubber latex component was added to the entire electric M paint, and the shield and paint film were dried and cured in the same manner as Example 1. 〇The axis, the quality of the coating film, and the quality of the creation were the same as in Example 1, but the surface of the chemically roughened surface was hardly roughened.
During ivy plating, four copper pieces peeled off. t,
The conductor beer strength of the fc-'V-plane portion that did not peel off during electrical steel plating was 1rxo, s~L 1.3 kg/Cm.

Example 2 (υ　Gumujin powder as follows f) Vc and rl.

Epoxy @ CA: Ebico) 1007 (Shell Chemical Co., Ltd.) 100μ electric part nitrile rubber: NBR1432J (Nippon Seon) 5 genus part CaCO5° io, *** was melt-kneaded in an extruder using an extruder using the usual powder manufacturing method. ,
Powder particles with an average particle size of 30 μm were crushed using a crusher.

This product is t' corresponding to 50% of the solid content of the water solution containing the water-dispersible cationic fallen fat and powder particles prepared in Example 1 with a solid content of 20%. t-Additionally, 邂*mkagae.

Using this K7i# obstetrics, an insulating film was formed on an iron substrate in 5 seconds and according to the same procedure as in Example 1. The coating thickness was approximately 1UOgr1, and the pressure resistance was 2.5kV or more, and the roughening was as good as Example 1. As the latex, styrene-butadiene rubber latex (SBR Ntex) (Nippon Zeon) 501'f- is used, and a is M? ! Similar to 11, the surface was roughened? ! An insulating coating similar to I1 was obtained.

In this process 9, the conventional 11L layer paint was coated with rubber that can be roughened, so the insulating coating film used by the samurai was made of CrOs/Hs.
The roughening iJ basket is used for roughening liquid such as SOa yarn.

The strength of the vB layer between the membrane and the silkworm can be met. Specifically, the following effects are achieved with the present invention.

(2) Since the rubber component, which is a roughening component, is all present in the paint, it is necessary to form a circuit with good density on the deposited film.

(2) Therefore, Anazuma! No problems with 7th grade, Flint 4
The hole diameter on the plate was reduced to about 1/2 of the conventional one (plate thickness 1.6+n+nV
For L, it feels small up to 0.6mmφ) (2 lines/2
．． It is now possible to manufacture a carp board with a high @ degree spiritual core of about 54 mrn.

(3) In addition, the manufacturing process (insulation process) has been simplified, and the manufacturing cost has been reduced by approximately 1υ%.

Procedural amendment (N generation) July 2, 1980 - Mr. Commissioner of the Japan Patent Office 1, Display figure of the case 57't'l Terakohara City ^ 29272 No. 2, Title of invention も Substrate for printed wiring board with metal core Manufacturing method 3, relationship with the case of the person making the amendment Patent applicant address 2-1-1 Nishi-Shinjuku, Shinjuku-ku, Tokyo Name (
445) Hitachi Chemical Co., Ltd. Illustrator Ryoji Yokoyama 4, (Kiri v5 ■160 Address: Hitachi Chemical Co., Ltd., 2-1-1 Nishi-Shinjuku, Shinjuku-ku, Tokyo (Il1m ELK346-3111 (Dai (J6, revised) column for the title of the invention in the subject specification.

7. Contents of correction

Claims (1)

[Scope of Claims] 1. A cationic compound with full water dilution performance imparted by partially neutralizing the acidic adduct -C containing a base element in the A0 molecule.汀慟B, Changgang is solid and has 9 power 0
Heat VC, J: Taisei Yasui imitation powder that is cured by bath melting. Dip the metal M Bongei and Ejsai in the water-absorbing solution of C0 rubber metal powder M'a Layer, apply direct current pressure with the metal tensioning machine as Yinmori and the opposite electrode as Yami. A method of spinning a substrate for a printed distribution board with a core. 2.% of powder-containing i** paints that are rubber or latex-like
A method for spinning a metal-core Kuglint fabric for willow lining according to Claim 1.nt. 6. When the column is cationic (on the cationic side) and @ 111' of Sosei Sento imitation powder, %0.
5 to 501 m tit ti15 T h Claims 1 or r, I 2nd Abandonment Metal Core Type V Printed Wiring Board -,! The manufacturing method of the board. 4. The substrate for a metal-core type lint wiring board according to claim 1, 2, or 3, wherein the DC voltage applied between the metal substrate and the counter electrode is 1 to 25 V'''C. (D
Manufacturing method.