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JPS5759366A - Epoxy resin composition for sealing semiconductor - Google Patents

Epoxy resin composition for sealing semiconductor

Info

Publication number
JPS5759366A
JPS5759366A JP55134570A JP13457080A JPS5759366A JP S5759366 A JPS5759366 A JP S5759366A JP 55134570 A JP55134570 A JP 55134570A JP 13457080 A JP13457080 A JP 13457080A JP S5759366 A JPS5759366 A JP S5759366A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
sealing
sealing semiconductor
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55134570A
Other languages
Japanese (ja)
Other versions
JPH02855B2 (en
Inventor
Toru Nishimura
Katsumi Shimada
Takashi Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP55134570A priority Critical patent/JPS5759366A/en
Publication of JPS5759366A publication Critical patent/JPS5759366A/en
Publication of JPH02855B2 publication Critical patent/JPH02855B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE:To improve hardening property sych as heat resisting charcteristics and light transmittance by adding 0.2-5pts.wt. gamma-mercaptopropyltrimethoxysilane with respect to 100pts.wt. of epoxy resin into the epoxy resin composition for sealing the semiconductor. CONSTITUTION:The epoxy resin composition for sealing the semiconductor includes the epoxy resin, a hardening agent, a hardening accelerator, and other additives. As the additive 0.2-5pts.wt. gamma-mercaptopropyltrimethoxysilane is added. In this constitution, the heat resisting characteristics are improved. Especially, transparency is improved in case the optical semiconductor element is sealed.
JP55134570A 1980-09-26 1980-09-26 Epoxy resin composition for sealing semiconductor Granted JPS5759366A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55134570A JPS5759366A (en) 1980-09-26 1980-09-26 Epoxy resin composition for sealing semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55134570A JPS5759366A (en) 1980-09-26 1980-09-26 Epoxy resin composition for sealing semiconductor

Publications (2)

Publication Number Publication Date
JPS5759366A true JPS5759366A (en) 1982-04-09
JPH02855B2 JPH02855B2 (en) 1990-01-09

Family

ID=15131424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55134570A Granted JPS5759366A (en) 1980-09-26 1980-09-26 Epoxy resin composition for sealing semiconductor

Country Status (1)

Country Link
JP (1) JPS5759366A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11510961A (en) * 1995-08-11 1999-09-21 カーストン・ケネス・ジェイ Encapsulants with flux properties and their use
KR100430195B1 (en) * 1998-12-31 2004-09-18 제일모직주식회사 Epoxy Resin Composition for Sealing Semiconductor Devices with Excellent Crack Resistance
JP2020070391A (en) * 2018-11-01 2020-05-07 株式会社ダイセル Curable epoxy resin composition
JP2020070390A (en) * 2018-11-01 2020-05-07 株式会社ダイセル Curable epoxy resin composition

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2090013A5 (en) * 1970-04-21 1972-01-07 Licentia Gmbh

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2090013A5 (en) * 1970-04-21 1972-01-07 Licentia Gmbh

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11510961A (en) * 1995-08-11 1999-09-21 カーストン・ケネス・ジェイ Encapsulants with flux properties and their use
EP0843894A4 (en) * 1995-08-11 2000-04-26 Kenneth J Kirsten Encapsulant with fluxing properties and method of use
KR100430195B1 (en) * 1998-12-31 2004-09-18 제일모직주식회사 Epoxy Resin Composition for Sealing Semiconductor Devices with Excellent Crack Resistance
JP2020070391A (en) * 2018-11-01 2020-05-07 株式会社ダイセル Curable epoxy resin composition
JP2020070390A (en) * 2018-11-01 2020-05-07 株式会社ダイセル Curable epoxy resin composition

Also Published As

Publication number Publication date
JPH02855B2 (en) 1990-01-09

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