[go: up one dir, main page]

JPS57143328A - Production of siloxane-modified polyimide precursor - Google Patents

Production of siloxane-modified polyimide precursor

Info

Publication number
JPS57143328A
JPS57143328A JP2924181A JP2924181A JPS57143328A JP S57143328 A JPS57143328 A JP S57143328A JP 2924181 A JP2924181 A JP 2924181A JP 2924181 A JP2924181 A JP 2924181A JP S57143328 A JPS57143328 A JP S57143328A
Authority
JP
Japan
Prior art keywords
precursor
siloxane
diaminosiloxane
effected
molecule
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2924181A
Other languages
Japanese (ja)
Other versions
JPS5813088B2 (en
Inventor
Kazumasa Igarashi
Katsuhiko Yamaguchi
Kazuo Iko
Kazuyuki Miki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP56029241A priority Critical patent/JPS5813088B2/en
Publication of JPS57143328A publication Critical patent/JPS57143328A/en
Publication of JPS5813088B2 publication Critical patent/JPS5813088B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Silicon Polymers (AREA)

Abstract

PURPOSE: The polymerization reaction between a specific diaminosiloxane, a diamine containing no silicon atoms in the molecule and an aromatic tetracarboxylic diahydride is effected to produce the titled precursor convertible into a polyimide with high adhesion and moisture resistance.
CONSTITUTION: The polymerization between (A) (i) a diaminosiloxane of the formula (R1 is divalent roganic group; R' is monovalent organic group; n is 1W 1,000), (ii) a diamine containing no silicon atoms in the molecule such as m- phenylenediamine and (B) an aromatic tetracarboxylic dianhydride, preferably 3,3',4,4'-biphenyltetracarboxylic dianhydride is effected in an inert solvent so that the content of component i becomes 1W4mol% based on the total diamine compounds to prepare a siloxane-modified polyimide precursor solution of less than 0.5wt% silicon content. The resultant solution is aged by heating at 40W 80°C to lower the intrinsic viscosity of the above precursor, thus giving the objective precursor.
COPYRIGHT: (C)1982,JPO&Japio
JP56029241A 1981-02-27 1981-02-27 Method for producing siloxane-modified polyimide precursor Expired JPS5813088B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56029241A JPS5813088B2 (en) 1981-02-27 1981-02-27 Method for producing siloxane-modified polyimide precursor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56029241A JPS5813088B2 (en) 1981-02-27 1981-02-27 Method for producing siloxane-modified polyimide precursor

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP22929483A Division JPS59113035A (en) 1983-12-05 1983-12-05 Method for forming polyimide layer having improved adhesive property on ground surface consisting of material containing silicon
JP58229292A Division JPS59107523A (en) 1983-12-05 1983-12-05 Method for formation of protective film on semiconductor element
JP58229293A Division JPS59107524A (en) 1983-12-05 1983-12-05 Method for formation of interlayer insulating film for semiconductor element

Publications (2)

Publication Number Publication Date
JPS57143328A true JPS57143328A (en) 1982-09-04
JPS5813088B2 JPS5813088B2 (en) 1983-03-11

Family

ID=12270743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56029241A Expired JPS5813088B2 (en) 1981-02-27 1981-02-27 Method for producing siloxane-modified polyimide precursor

Country Status (1)

Country Link
JP (1) JPS5813088B2 (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5978954A (en) * 1982-10-22 1984-05-08 Nitto Electric Ind Co Ltd Coating material for optical glass fiber
JPS59146985U (en) * 1983-03-22 1984-10-01 沖電気工業株式会社 Layer misalignment test coupon for multilayer printed wiring board
JPS60166325A (en) * 1984-02-09 1985-08-29 Sumitomo Bakelite Co Ltd Production of heat-resistant resin
JPS6164730A (en) * 1984-09-06 1986-04-03 Sumitomo Bakelite Co Ltd Production of heat-resistant resin
JPS6184025A (en) * 1984-09-29 1986-04-28 Nitto Electric Ind Co Ltd Formation of film on surface of semiconductor element
JPH03115433A (en) * 1989-07-28 1991-05-16 Consortium Elektrochem Ind Gmbh Preparation of poly(imide-siloxane) and preparation of coating film, film, covering, and gas separation film
JPH0578483A (en) * 1992-03-09 1993-03-30 Toray Ind Inc Polyimide copolymer
US5262505A (en) * 1991-07-30 1993-11-16 Dow Corning Toray Silicone Co. Ltd. Silicone modified polyimide resin and method for preparing same
JPH0680777A (en) * 1992-08-31 1994-03-22 Sumitomo Bakelite Co Ltd Soluble polyimide resin
JPH06157753A (en) * 1992-11-18 1994-06-07 Sumitomo Bakelite Co Ltd Partially imidated polyamic acid composition
US5473040A (en) * 1993-07-16 1995-12-05 Chisso Corporation Polyimidesiloxane film of low heat-conductivity
WO1996019012A1 (en) * 1994-12-16 1996-06-20 Occidental Chemical Corporation Forming polyimide coatings by screen printing
US5643986A (en) * 1995-03-17 1997-07-01 Ube Industries, Ltd. Polyimidosiloxane compositions
US5916688A (en) * 1997-02-18 1999-06-29 Nippon Steel Chemical Co., Ltd. Resin solution compositions for electronic materials and protective membranes prepared therefrom for circuits in printed wiring boards
KR20230104059A (en) 2021-12-31 2023-07-07 한국전자기술연구원 Whitening-suppressed transparent polyimide ink composition for display circuit board printing, transparent polyimide ink for display circuit board including the same composition, display circuit board therewith printed, display panel including the same circuit board and electronic device including the same panel

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5033295A (en) * 1973-06-07 1975-03-31
JPS5033294A (en) * 1973-06-07 1975-03-31
JPS5033296A (en) * 1973-06-07 1975-03-31

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5033295A (en) * 1973-06-07 1975-03-31
JPS5033294A (en) * 1973-06-07 1975-03-31
JPS5033296A (en) * 1973-06-07 1975-03-31

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5978954A (en) * 1982-10-22 1984-05-08 Nitto Electric Ind Co Ltd Coating material for optical glass fiber
JPS59146985U (en) * 1983-03-22 1984-10-01 沖電気工業株式会社 Layer misalignment test coupon for multilayer printed wiring board
JPS60166325A (en) * 1984-02-09 1985-08-29 Sumitomo Bakelite Co Ltd Production of heat-resistant resin
JPS6164730A (en) * 1984-09-06 1986-04-03 Sumitomo Bakelite Co Ltd Production of heat-resistant resin
JPS6184025A (en) * 1984-09-29 1986-04-28 Nitto Electric Ind Co Ltd Formation of film on surface of semiconductor element
JPH03115433A (en) * 1989-07-28 1991-05-16 Consortium Elektrochem Ind Gmbh Preparation of poly(imide-siloxane) and preparation of coating film, film, covering, and gas separation film
US5262505A (en) * 1991-07-30 1993-11-16 Dow Corning Toray Silicone Co. Ltd. Silicone modified polyimide resin and method for preparing same
JPH0578483A (en) * 1992-03-09 1993-03-30 Toray Ind Inc Polyimide copolymer
JPH0680777A (en) * 1992-08-31 1994-03-22 Sumitomo Bakelite Co Ltd Soluble polyimide resin
JPH06157753A (en) * 1992-11-18 1994-06-07 Sumitomo Bakelite Co Ltd Partially imidated polyamic acid composition
US5473040A (en) * 1993-07-16 1995-12-05 Chisso Corporation Polyimidesiloxane film of low heat-conductivity
WO1996019012A1 (en) * 1994-12-16 1996-06-20 Occidental Chemical Corporation Forming polyimide coatings by screen printing
CN1094655C (en) * 1994-12-16 2002-11-20 住友电木株式会社 Formation of polyimide coating by screen printing
US5643986A (en) * 1995-03-17 1997-07-01 Ube Industries, Ltd. Polyimidosiloxane compositions
US5916688A (en) * 1997-02-18 1999-06-29 Nippon Steel Chemical Co., Ltd. Resin solution compositions for electronic materials and protective membranes prepared therefrom for circuits in printed wiring boards
KR20230104059A (en) 2021-12-31 2023-07-07 한국전자기술연구원 Whitening-suppressed transparent polyimide ink composition for display circuit board printing, transparent polyimide ink for display circuit board including the same composition, display circuit board therewith printed, display panel including the same circuit board and electronic device including the same panel

Also Published As

Publication number Publication date
JPS5813088B2 (en) 1983-03-11

Similar Documents

Publication Publication Date Title
JPS57143327A (en) Production of siloxane-modified polyimide precursor
JPS57143328A (en) Production of siloxane-modified polyimide precursor
US4595548A (en) Process for preparing essentially colorless polyimide film containing phenoxy-linked diamines
EP1184403B1 (en) Polyimide silicone resin, process for its production, and polyimide silicone resin composition
TW358829B (en) A method of forming a polyimide coating, a polyimidesiloxane coating/pattern on the surface of a substrate
DE3803088A1 (en) POLYIMIDE SILOXANES, METHOD FOR THE PRODUCTION THEREOF AND THEIR USE
JPS624409B2 (en)
DE19804617A1 (en) Soluble siloxane-polyimide for heat-resistant adhesive
JPS5512131A (en) Preparation of polyamic acid for semiconductor treatment
DE69105319T2 (en) Polyimide copolymers containing 4-4'-bis (aminophenoxy) biphenyl and diaminosiloxane units.
US4954609A (en) Intermediate molecular weight fluorine containing polymide and method for preparation
US4952669A (en) Copolyimides prepared from 2-(3-aminophenyl)-2-(4-aminophenyl) Hexafluoro propane
DE3873844T2 (en) METHOD FOR PRODUCING A SILICONE-CONTAINING POLYIMIDE AND ITS PRE-STAGE.
KR830006387A (en) Intermediate Products, Interpolymers and Methods of Making the Same
KR870006158A (en) Adhesive Composition and Bonding Method Using Copper Adhesive
JPS6323928A (en) Production of modified polyimide
US4973651A (en) Polyimide polymers having 12-F fluorine-containing linking groups
JPS62135529A (en) Polyimide precursor
JPS6416834A (en) Polyamic acid copolymer, polyimide copolymer therefrom and production thereof
KR920007760B1 (en) Method for producing polyamic acid having siloxane bond and polyimide having siloxane bond and isoindolo quinazolindione ring
JPS6317092B2 (en)
JPH0288677A (en) Polyimidesiloxane compositions and membranes
JPS5565227A (en) Production of polyimide solution
JPS6422963A (en) Polyimide resin composition and production thereof
JP2621180B2 (en) Polyimide composition