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JPS5538865A - Improved polyamide resin composition - Google Patents

Improved polyamide resin composition

Info

Publication number
JPS5538865A
JPS5538865A JP11384578A JP11384578A JPS5538865A JP S5538865 A JPS5538865 A JP S5538865A JP 11384578 A JP11384578 A JP 11384578A JP 11384578 A JP11384578 A JP 11384578A JP S5538865 A JPS5538865 A JP S5538865A
Authority
JP
Japan
Prior art keywords
polyamide resin
resin composition
organic base
material composed
surface gloss
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11384578A
Other languages
Japanese (ja)
Other versions
JPS5835542B2 (en
Inventor
Takuji Okada
Hiroshi Fujii
Takuji Nanba
Yuzo Hata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unitika Ltd
Original Assignee
Unitika Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unitika Ltd filed Critical Unitika Ltd
Priority to JP11384578A priority Critical patent/JPS5835542B2/en
Publication of JPS5538865A publication Critical patent/JPS5538865A/en
Publication of JPS5835542B2 publication Critical patent/JPS5835542B2/en
Expired legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: To provide the title composition having high surface gloss and moldability, comprising a polyamide resin and a complex material composed of an organic base and a synthetic mica with swelling potential.
CONSTITUTION: The objective composition comprising a polyamide resin and 0.001W5 (pref. 0.05W1.5)wt%, based on the amount of the resin, of a complex material composed of an organic base and a synthetic mica with swelling potential. If the content of said complex is 0.001wt% or less, the inprovement will be unexpected, whereas, when >5wt%, the surface gloss may be impaired, leading to growth of the opacity of the molded product. Said polyamide resin is a homopolyamide or copolyamide, prepared by polymerization of a lactam or an aminocarboxylic acid or by polycondensation between a diamine and a discarboxylic acid, respectively, or a mixture thereof.
COPYRIGHT: (C)1980,JPO&Japio
JP11384578A 1978-09-13 1978-09-13 Improved polyamide resin composition Expired JPS5835542B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11384578A JPS5835542B2 (en) 1978-09-13 1978-09-13 Improved polyamide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11384578A JPS5835542B2 (en) 1978-09-13 1978-09-13 Improved polyamide resin composition

Publications (2)

Publication Number Publication Date
JPS5538865A true JPS5538865A (en) 1980-03-18
JPS5835542B2 JPS5835542B2 (en) 1983-08-03

Family

ID=14622490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11384578A Expired JPS5835542B2 (en) 1978-09-13 1978-09-13 Improved polyamide resin composition

Country Status (1)

Country Link
JP (1) JPS5835542B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5514734A (en) * 1993-08-23 1996-05-07 Alliedsignal Inc. Polymer nanocomposites comprising a polymer and an exfoliated particulate material derivatized with organo silanes, organo titanates, and organo zirconates dispersed therein and process of preparing same
US5747560A (en) * 1991-08-12 1998-05-05 Alliedsignal Inc. Melt process formation of polymer nanocomposite of exfoliated layered material
USRE37385E1 (en) 1985-09-30 2001-09-18 Kabushiki Kaisha Toyoto Chuo Kenkyusho Composite material and process for manufacturing same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04106264A (en) * 1990-08-27 1992-04-08 Asahi Utsudo Tec Kk Wooden decorated floor member and its work executing method
JPH04336160A (en) * 1991-05-13 1992-11-24 Eidai Co Ltd Floor construction method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE37385E1 (en) 1985-09-30 2001-09-18 Kabushiki Kaisha Toyoto Chuo Kenkyusho Composite material and process for manufacturing same
US5747560A (en) * 1991-08-12 1998-05-05 Alliedsignal Inc. Melt process formation of polymer nanocomposite of exfoliated layered material
US5514734A (en) * 1993-08-23 1996-05-07 Alliedsignal Inc. Polymer nanocomposites comprising a polymer and an exfoliated particulate material derivatized with organo silanes, organo titanates, and organo zirconates dispersed therein and process of preparing same

Also Published As

Publication number Publication date
JPS5835542B2 (en) 1983-08-03

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