JPH11346418A - Vehicle electronics - Google Patents

Abstract

(57) [Summary] [Problem] To enable downsizing while employing a printed circuit board made of a normal resin base material, to be excellent in earthquake resistance and waterproofness, and to be directly mounted in an engine room of a vehicle, particularly, an engine or a transmission. To obtain a small and lightweight vehicle electronic device that can be used in all cases. SOLUTION: An upper case 2 in which a connector 1 is integrally formed and a terminal 3 for the connector 1 is insert-molded.
A lower case 10 bonded and fixed to the upper case 2 to form a storage chamber 12 together with the upper case 2, and a printed board 4 bonded and fixed to the upper case 2 in the storage chamber 12. On the first surface 4a, a chip-exposed semiconductor component 5 and the like are mounted on a first surface 4a, other electronic components 6 and the like are mounted on a second surface 4b, and the first surface 4a side is bonded to the upper case 2. It is configured to be fixed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a vehicle electronic device,
In particular, the present invention relates to a vehicle electronic device that can be directly mounted on an engine room or an engine or a transmission in an engine room.

[0002]

2. Description of the Related Art Electronic devices for vehicles are required to be smaller and lighter. In particular, electronic devices mounted in an engine compartment are required to have waterproofness, earthquake resistance and heat cycle resistance. Is done. In addition, regarding miniaturization of equipment, mini-molding of electronic components and hybrid IC
In addition, chip-exposed type semiconductor parts, whose package has been abolished, have been adopted for semiconductor parts, and miniaturization has been promoted.However, the miniaturization of the connector part for external lead-out, which constitutes the input / output terminals, is insufficient. This is one of the factors that hinder overall miniaturization.

One example of such a miniaturization technique for the connector portion is disclosed in Japanese Utility Model Laid-Open No. 4-793, for example. In this technology, a connector having a lead wire is directly fixed to an outer surface of a container of an electronic device with a screw or a locking claw, and a pin terminal of the connector, that is, a terminal is penetrated through a hole of the container, and a connection provided on a printed circuit board is provided. The connector on the electronic device side is abolished by being inserted into the hole member and electrically connected.

[0004]

Although the conventional electronic device constructed as described above achieves a certain degree of reduction in size and weight, a certain effective screw length is required to secure strength by screwing the connector. Therefore, it is necessary to secure the thickness of the threaded portion of the container and to select a material (for example, use of a metal material), which limits the reduction in size and weight. Also,
The mounting of the connector with the engaging claw is inferior in earthquake resistance and waterproofness in combination with the configuration in which the terminal is inserted into the connection hole member of the printed circuit board, and cannot be mounted in the engine room. Further, in order to reduce the size of the electronic circuit portion, a hybrid IC using a ceramic substrate for the electronic circuit as described above is used.
When C is adopted, it takes a considerable number of days from development to commercialization, and it may be difficult to adopt electronic devices for vehicles that require commercialization in a short period of time.

The present invention has been made to solve these problems, and it is possible to reduce the size even if a printed board made of a usual resin is used. It is an object of the present invention to provide a small and lightweight electronic device for a vehicle that is excellent and can be directly mounted on an engine room of a vehicle, especially an engine or a transmission.

[0006]

An electronic device for a vehicle according to the present invention has an upper case in which a connector is integrally formed and a terminal for the connector is insert-molded, and a lower portion adhesively fixed to the upper case. A storage room having a case, a printed circuit board housed in the storage room and adhered and fixed to the upper case, and a chip-exposed semiconductor component or the like is mounted on the first surface of the printed circuit board; , Another electronic component or the like is mounted thereon, and the first surface side is adhesively fixed to the upper case.

Further, the space formed between the first surface of the printed circuit board and the upper case is configured to be shielded from light by adhesion between the printed circuit board and the upper case. Further, a connection terminal formed integrally with the terminal is arranged so as to protrude parallel to the inner surface of the upper case from the upper case at a predetermined interval around the printed circuit board in the storage chamber. The substrate and the substrate are joined by a bonding wire.
The upper case and the lower case are bonded and fixed so as to serve as a waterproof seal. Further, the printed circuit board is made of a resin-based material such as glass epoxy.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 1 to 5
1 shows a configuration of a vehicle electronic device according to a first embodiment of the present invention. FIG. 1 is an external view thereof, FIG. 2 is a cross-sectional view, and FIGS. 3 to 5 are explanatory views for explaining the configuration. . In the figure, reference numeral 1 denotes a connector integrally formed with an upper case 2, a connector having a terminal group 3 insert-molded in the upper case 2, and 4 a printed board formed of a resin such as glass epoxy and having printed conductors on both sides. Reference numeral 5 denotes a semiconductor component mounted on the first surface 4a of the printed circuit board 4 at high density, 6 denotes an electronic component mounted on the second surface 4b of the printed circuit board 4, and 7 denotes a connection between the printed circuit board 4 and the upper case 2. An adhesive for bonding and fixing the surface.

Reference numeral 3a denotes a connection terminal in which a terminal 3 insert-molded in the upper case 2 projects from the inner surface of the upper case 2 at the periphery of the printed circuit board 4. The connection terminal 3a is connected to the inner surface of the upper case 2. Are formed in parallel with each other, and a predetermined gap g is provided between the connection terminal 3a and the upper case 2. Reference numeral 9 denotes a bonding wire, and the bonding wire 9 electrically connects the connection terminal 3 a to an external connection terminal of the printed circuit board 4. Reference numeral 10 denotes a lower case, and the lower case 10 is bonded and fixed to the upper case 2 around the entire periphery thereof with an adhesive 11, and the adhesive 11 is formed as a sealing material between the upper case 2 and the lower case 10. 12 to prevent water from entering. 13 is a ventilation hole provided in the lower case 9 to give ventilation to the accommodation room 12,
A water-repellent filter 14 is provided in the ventilation hole 13.

In the vehicle electronic device of the present invention configured as described above, the printed circuit board 4 is made of a general resin material such as glass epoxy, which has a short commercialization period.
The semiconductor components mounted on the first surface 4a at a high density are mounted mainly on chip-exposed semiconductor components whose packages have been abolished for miniaturization, and other normal mini components are mounted on the second surface 4b. A molded electronic component or the like is mounted. As shown in FIG. 3, the printed circuit board 4 has the first surface 4a side mounted on the upper case 2, and the bonding surface between the printed circuit board 4 and the upper case 2 is fixed by an adhesive 7 over the entire area. Thus, the space 8 on the first surface 4a side of the printed circuit board 4 is configured to be completely shielded from light, to prevent a characteristic variation due to the photoelectric effect of the chip-exposed type semiconductor component, and to perform electrical check, adjustment and programming. Etc. are assembled in the state of FIG. 3, ie,
This is performed in a state where the space 8 is shielded from light.

The connection terminal 3a is formed integrally with the terminal 3, and a bonding wire 9 is ultrasonically bonded to the bent surface. A gap g is provided between the connection terminal 3a and the inner surface of the upper case 2. The gap g is set to a distance that allows a fixed head that directly sandwiches the connection terminal 3a to be inserted. 9 is joined in a state of being directly held by the fixed head. By configuring the connection terminal 3a in this way, welding failure due to resonance, which is likely to occur when there is an intervening object other than the object to be joined, is avoided, and reliable connection becomes possible. Also, lower case 1
The vent hole 13 provided at 0 is for preventing a pressure change in the storage chamber 12 due to a change in environmental temperature and protecting the components from mechanical stress. Prevent water intrusion.

[0012]

As described above, according to the vehicular electronic apparatus of the present invention, the first surface of the printed circuit board is configured to shield light, so that chip-exposed semiconductor components can be mounted on this surface. The connector is integrated with the upper case, and the mounting of the printed circuit board and the mounting of the upper and lower cases are made an adhesive structure to eliminate the space required for screwing and the like, thereby enabling the entire device to be reduced in size and weight. In addition, since the structure is resistant to changes in environmental temperature and waterproof due to the sealing performance by adhesion and the vent hole provided with a water-repellent filter, it can be mounted directly on the engine or transmission in the engine compartment of the vehicle. Can be obtained. Furthermore, the fact that the first surface of the printed circuit board is light-shielded to allow the use of chip-exposed semiconductor components enables the use of a ceramic printed circuit board while using a resin printed circuit board that is short in terms of commercialization. It is possible to make it as small as the hybrid IC used.
An excellent vehicle electronic device can be obtained.

[Brief description of the drawings]

FIG. 1 is an external view of a vehicle electronic device according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of the vehicle electronic device according to the first embodiment of the present invention.

FIG. 3 is an explanatory diagram of the vehicle electronic device according to the first embodiment of the present invention.

FIG. 4 is an explanatory diagram of the vehicle electronic device according to the first embodiment of the present invention.

FIG. 5 is an explanatory diagram of the vehicle electronic device according to the first embodiment of the present invention.

[Explanation of symbols]

1 connector, 2 upper case, 3 terminal, 3a
Connection terminal, 4 printed circuit board, 4a first surface, 4b
2nd surface, 5 semiconductor chip components, 6 electronic components,
7, 11 adhesive, 8 space, 9 bonding wire, 10 lower case, 12 accommodation room, 13 vent hole,
14 Water repellent filter.

Claims (5)

[Claims] A storage chamber having an upper case in which a connector is integrally formed and a terminal for the connector being insert-molded, and a lower case bonded and fixed to the upper case; A printed circuit board that is adhered and fixed to the upper case is provided.A chip-exposed semiconductor component or the like is mounted on the first surface of the printed circuit board, and another electronic component or the like is mounted on the second surface. An electronic device for a vehicle, wherein a first surface side is configured to be adhesively fixed to the upper case. 2. The printed circuit board according to claim 1, wherein a space formed between the first surface of the printed circuit board and the upper case is shielded from light by adhesion between the printed circuit board and the upper case. The electronic device for a vehicle according to the above. 3. A connection terminal integrally formed with the terminal is arranged so as to protrude parallel to the inner surface of the upper case from the upper case at a predetermined interval around the printed circuit board in the storage chamber. 3. The electronic device for a vehicle according to claim 1, wherein the portion and the printed circuit board are joined by a bonding wire. 4. The electronic device for a vehicle according to claim 1, wherein the upper case and the lower case are bonded and fixed to each other also as a waterproof seal. 5. The vehicle electronic device according to claim 1, wherein the printed circuit board is made of a resin such as glass epoxy.