JPH11135715A - Stacked mounting body - Google Patents

Abstract

(57) [Problem] To provide a new stacked mounting body having a function equivalent to that of a conventional stacked mounting body, and to dissipate heat generated in semiconductor elements in each layer to the stacked mounting body to the outside. To dissipate efficiently. SOLUTION: The film carrier element 1 (1a to 1c)
Form a film carrier that is connected via a bend in the direction in which each surface expands. A semiconductor element is mounted on a mounting contact portion provided on the mounting surface. After the mounting of the element, each film carrier element is superimposed on the base element by bending the bent portion, and the whole is formed into one laminate 9.
And At this time, the heat conductive heat absorbing plate 20 is sandwiched between at least one of the layers 11a and 11b of the laminate, and the heat conductive heat radiating plate 3 is placed on the uppermost surface of the laminate.
0, and the heat absorbing plate and the heat radiating plate
At 0, it is connected so as to be able to conduct heat to form a stacked mounting body having a heat dissipation structure.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a new stacked mounting body which functions as a semiconductor device mounted on a film carrier and stacked as a semiconductor device and wiring between layers is completed.

[0002]

2. Description of the Related Art In order to cope with higher performance, higher function, and smaller size of electronic equipment, semiconductor elements (particularly, bare IC chips individually cut out from wafers) are mounted on a film carrier, and the film carrier is mounted on the film carrier. Are laminated on an external substrate by a required number, and a terminal of a film carrier of each layer is connected to a terminal of the lowermost external substrate (see JP-A-2-290048).

[0003]

However, the above-mentioned stacked mounting body has many problems which increase the cost as follows. Even if the semiconductor elements are mounted on a film carrier, they are separated from each other until they are connected as one laminate, which is inconvenient in terms of carrying and storage. In order to connect the film carrier and the lowermost external circuit board by individually bending the leads for each layer, a sophisticated technique is required for the lead bending process. The film carrier of each layer and the outermost circuit board of the lowermost layer must be laminated with accurate positioning with respect to the electrodes. In order to connect the electrodes of the external circuit board and the leads, a special joining tool (jig) must be used. A film carrier such as a TAB tape is expensive, and when the semiconductor elements are individually TAB-mounted as in the above structure, the cost increases.

Further, such a stacked mounting body has not been provided with a structure capable of efficiently dissipating heat generated in the semiconductor elements of each layer to the outside.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems, to provide a new stacked package having the same function as a conventional stacked package, and to provide a semiconductor device of each layer with respect to the stacked package. To efficiently dissipate the heat generated to the outside.

[0006]

The laminated mounting body of the present invention has a film carrier of the following (A), and a semiconductor element is mounted on a mounting surface of a film carrier element included in the film carrier and bent. And each film carrier element other than the base element is overlapped on the base element so that the connection surface of the base element becomes the lowermost surface of the stack in a state where the semiconductor element is mounted, to form one laminate. A heat-conductive heat-absorbing plate is sandwiched between at least one of the layers of the laminate, and a heat-conductive heat-dissipating plate is provided on the uppermost surface of the laminate; The heat radiating plate and the heat radiating plate are connected to each other so as to be able to conduct heat.

The film carrier (A) referred to in the present invention is a novel film carrier unique to the present invention described below. (A); a plurality of film carrier elements of the following (B) are connected via a bent portion in a direction in which each surface expands, and one of the film carrier elements is used as a base element;
The film carrier element other than the base element can be overlaid on the base element by bending the bend, and the entirety of the film carrier element can be formed into a single laminate. And a connection surface, which is a back surface of the mounting surface of the base element, is provided with a contact portion for connecting an external substrate, and the contact portion is electrically connected to a conductive circuit.

[0008] The film carrier element (B) in the present invention is a kind of the following film carrier, and is a component of the film carrier (A). (B): a conductive circuit is provided inside the insulating substrate, at least one surface of the insulating substrate is a mounting surface for mounting a semiconductor element, and a mounting contact portion is provided on the mounting surface. A film carrier element in which the mounting contact portion is in conduction with the conductive circuit.

[0009]

First, since the laminated package of the present invention uses the film carrier (A) described above (hereinafter also referred to as "the present film carrier"), the semiconductor element is mounted on one film carrier. Complete with Therefore, it is not necessary to prepare a film carrier for each semiconductor element and change the setup as in the related art, and the mounted semiconductor elements do not fall apart. Furthermore, a plurality of semiconductor elements can be integrally laminated only by bending the bent portion,
Positioning of each semiconductor element can be easily performed. Therefore, the problem of the conventional stacked mounting body is solved.

[0010] The connection between the stacked mounting body of the present invention and the external circuit board need only be made by using the connection contacts of the base element. In other words, since there is no need to connect the external circuit board with leads for each semiconductor element, all the conventional problems such as advanced techniques and labor for lead bending, alignment between the leads and the external circuit board, and the need for special tools are all required. The connection with the external circuit board can be easily performed.

In the stacked mounting body of the present invention, the connection between the layers is completed when the film carrier on which the semiconductor element is mounted is folded. Moreover, there is only one contact for external connection.
It is concentrated on one surface (the surface for connecting the base element), and the function as a conventional stacked mounting body is realized. By mounting this on an external circuit board as in the prior art, a laminated mounting body having external terminals compatible with the related art can be obtained.

Further, in the stacked mounting body of the present invention, a structure for heat dissipation is provided in addition to the stacked structure of the semiconductor element using the present film carrier. This heat dissipation structure has a structure in which a heat-absorbing plate is sandwiched between desired layers (preferably all layers), a heat-dissipating plate is provided on the uppermost surface of the laminated structure, and the heat-absorbing plate and the heat-dissipating plate are connected in a heat conductive manner. It is. This heat dissipation structure can be easily formed simply by bending a single thermally conductive plate, and is a simple and effective heat dissipation structure. In addition, it is easy to incorporate a semiconductor element using the present film carrier into a laminated structure. With this heat dissipation structure, heat generated by the operation of the semiconductor element can be suitably conducted to the heat dissipation plate, and can be preferably dissipated from the uppermost surface to the outside.

The “U-shape” in the present invention is a so-called “groove”, and does not limit the direction of the U-shape.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First, the present film carrier will be described. Hereinafter, the film carrier element (B) will be simply referred to as a “film carrier element”. As shown in FIG. 1A, the present film carrier has a structure in which a plurality of film carrier elements 1 (1a, 1b, 1c) are connected via a bent portion 3 in a direction in which each surface expands. Things. FIG. 1 shows an example in which three film carrier elements are connected in a straight line via a bent portion.

The film carrier element is, for example, shown in FIG.
As in the film carrier element 1b in (b), the conductive circuit 4b is provided inside the insulating substrate 5 and at least one surface of the insulating substrate 5 (only one surface in the example of FIG. 1). ) Is a mounting surface 2 for mounting a semiconductor element. A mounting contact portion 6 for mounting a semiconductor element is provided on the mounting surface 2, and the mounting contact portion 6 is electrically connected to the conductive circuit 4b by a conductive path immediately below.

Connected film carrier elements 1a-1
Of c, one film carrier element 1a is the base element 1a. The base element 1a is similar to the other film carrier elements in that one surface of the insulating substrate 5 is a mounting surface 2 for mounting a semiconductor element, but the other surface of the insulating substrate 5 is It differs from other film carrier elements in that it is a surface for connection to an external circuit board. The connection surface of the base element is provided with a contact portion 7 for connection to an external circuit board, and the contact portion 7 is connected to the conductive circuit 4 just below the inside.
a.

The film carrier elements 1b and 1c other than the base element 1a are bent by bending the bent portion 3.
That is, by folding the entire film carrier so that the bent portion has a fold, the film carrier overlaps the base element 1a, and the entire film carrier can be formed as one laminate. These film carrier elements 1b,
The conductive circuits 4b and 4c inside 1c are each connected to the conductive circuit 4a inside the base element through the inside of the bent portion 3.

The shape of the film carrier element is not particularly limited, and examples thereof include a circle, a square, other polygons, and irregular shapes. However, since the shape of the semiconductor element is rectangular, the shape of the film carrier element is also preferably rectangular as shown in FIG. Also,
The shapes of the film carrier elements may be different from each other, but from the viewpoint of forming one laminated body, all are formed into a congruent shape, and are connected in a direction such that the outer shapes match when folded. Is preferred.

The number of film carrier elements to be connected is
What is necessary is just to determine according to the number of target laminations, and it is not specifically limited. Further, the pattern of the arrangement of the film carrier elements (the pattern of connection) is such that the film carrier elements other than the base element overlap on the base element,
Any pattern that can be a single layered body as a whole,
For example, in addition to the linear pattern as shown in FIG.

A film carrier element may be connected to the outer four sides of the base element in any manner, and another film carrier element may be connected to the connected film carrier element and freely extended. Further, the base element does not necessarily need to be located at the center of the arrangement of the film carrier elements, but may be located at the end.

The material of the insulating substrate forming the film carrier element is not particularly limited, and a resin material used for a conventional film carrier can be used. If the bent portion is formed of an insulating substrate common to the film carrier element, a polyimide resin is preferable from the viewpoint of excellent bending property and mechanical strength.

The conductive circuit provided in the film carrier element only needs to be provided inside the insulating substrate and at a position where it can conduct with the contact portion. As a method for forming the conductive circuit, a known circuit pattern forming method can be used. The conductive circuit inside the film carrier element other than the base element is
It is connected to the conductive circuit inside the base element through the inside of the bend.

The film carrier element has at least one surface, that is, one or both surfaces, as a mounting surface. However, only one side of the base element is the mounting side,
The other surface is a connection surface. When only one side of the film carrier element other than the base element is used as the mounting surface, whether the mounting surface is the same side as the mounting surface of the base element or the back side is determined for each film carrier element. It is optional and may be selected according to the method of folding the present film carrier or a special use. Normally, as shown in FIG. 1, it is preferable that all the mounting surfaces are aligned on the same side surface in mounting the semiconductor element. Further, a film carrier element having only one mounting surface and a film carrier element having both mounting surfaces may be used in combination.

The mounting contact portion of the film carrier element and the connecting contact portion of the base element may be any as long as they can make electrical contact with the semiconductor element and the external circuit board to be contacted. As a mode of these contact portions, a mode in which the contact material protrudes in a hemispherical or dome shape from the surface of the insulating substrate (such as a bump contact or a solder ball by plating) is representative, but not necessarily from the surface of the insulating substrate. There is no need to protrude, and a surface that is the same as the surface of the insulating substrate or a concave surface may be formed according to the shape of the connection target and the connection method. Further, an opening may be provided on the surface of the insulating substrate, a part of the conductive circuit may be exposed inside the opening, and the exposed conductive circuit may be used as a contact.

A known technique may be used for forming a bump contact or forming a contact in which a part of a conductive circuit is exposed inside an opening. The conductive circuit is designed to pass immediately below the position where the contact portion is to be formed or in the vicinity of the contact portion so as to be able to conduct with the contact portion.

The bent portion has a conductive circuit for electrically connecting the conductive circuit inside the base element and the conductive circuit inside the other film carrier element, and is configured to be bendable. Whatever is done is good.

The bent portion may be formed separately from a substrate using a material suitable for bending and connected to the film carrier element. However, as shown in the example of FIG. An embodiment in which the substrate is extended and integrally formed as one continuous insulating substrate is preferable. At this time, the conductive circuit inside the bent portion may be formed as an extension of the conductive circuit inside the film carrier element.

The position of the bent portion may be determined according to the above-described positional relationship of the film carrier elements. The length of the bent portion (the distance between the film carrier elements) depends on the size and number of the semiconductor elements to be mounted, the thickness of the film carrier element,
What is necessary is just to determine according to the number of laminations.

Next, a laminate formed by bending the present film carrier on which the semiconductor element is mounted will be described. FIG.
(A) shows a state before the present film carrier is bent. The film carrier of the embodiment shown in FIG. 1 is used for this film carrier. Each film carrier element 1
The semiconductor elements 8 are mounted on the mounting surfaces 2 of (1a to 1c). The semiconductor element 8 is conductively connected to the conductive circuits (4a to 4c) via the mounting contact 6 (bump contact). An adhesive 13 is applied to the gap between the semiconductor element and the mounting surface.
Are filled, and these are adhered.

FIG. 2B shows a state in which the film carrier of FIG. 2A is bent at a bent portion to form a laminate. Further, the heat radiation structure is not shown in FIG. In the example shown in the figure, the connection surface of the base element 1a is the lowermost surface of the stack, and the film carrier element 1b,
1c is sequentially folded on the base element 1a to form one laminated body. The film carrier elements 1b and 1c other than the base element 1a are mounted on the mounting surface 2 with the base element 1a.
They overlap towards the side. This laminated body is different from a conventional film carrier in which a semiconductor element is simply laminated, in that a contact portion for external connection is secured on a connection surface, and connection of the semiconductor element of each layer to the external connection contact part is secured. Completed.

How to fold the present film carrier with the semiconductor element mounted thereon depends on the configuration of the present film carrier. For example, in the case where the film carrier elements are connected in series, if all the mounting surfaces are on the same surface, a spiral folding method like a “6” (FIG. 2) (B)). When the mounting surfaces are different from each other, a zigzag-based folding method such as an S-shape is also possible. Further, in addition to the folding method in which these are combined, in consideration of the folding in which the film carrier elements are connected in a cross shape, and the folding in which the film carrier elements are further branched and connected from the cross shape, the pattern of the folding method is considered. Exist infinitely, but may be freely selected according to the application.

Next, the heat dissipation structure will be described. FIG. 3 is a perspective view showing an example of a heat dissipation structure provided in the stacked mounting body of the present invention. In the example shown in the figure, a laminate 9 obtained by mounting a semiconductor element on the present film carrier is the same as that in the embodiment of FIG. 2B, and the film carrier elements 1a, 1b, 1
c has three layers. All the semiconductor elements and the like mounted on the present film carrier are not shown. At least one of the layers 11a and 11b of each of the layers 1a, 1b and 1c (in the example of FIG.
1a), a heat conductive heat absorbing plate 20 is sandwiched. In addition, a heat conductive heat dissipation plate 30 is provided on the uppermost surface of the laminate. The heat-absorbing plate 20 and the heat-dissipating plate 30 are connected to each other by a heat-conductive connecting portion 40 so as to be thermally conductive with each other. With this heat dissipation structure, heat generated in the semiconductor elements mounted on the film carrier elements 1a and 1b is radiated from the heat absorption plate 20 to the outside via the heat radiation plate 30.

The heat absorbing plate and the heat radiating plate may be connected in any manner as long as they can conduct heat. Above all, the simplest structure is to use a thermally conductive plate and bend it into parts that will be heat absorbing plates, parts that will be heat dissipating plates, and connecting parts that connect them, and then incorporate them into a laminate. In addition, favorable heat dissipation is obtained. Hereinafter, various variations of the mode obtained by bending the thermally conductive plate material will be described.

FIG. 4 shows an example in which the laminated body shown in FIG. 2B is used.
Only the end face of the cross section is shown, and all the mounted semiconductor elements and internal conductive circuits are omitted. FIG.
(A) shows that the same number of heat-absorbing plates and heat-dissipating plates are provided.
It is a figure showing the mode made to correspond by one. In the example shown in the figure, a corresponding number of heat conductive plates (that is, the number of layers between the layers on which the heat absorbing plates are provided) are prepared and individually bent to form a connection structure between the heat absorbing plates and the heat radiating plates. Has formed. The plate material is a part 20a (or a 20
b) and a portion 30a (or 30b) to be a heat dissipation plate
And a connecting portion 40a (or 40
b). In this embodiment, heat generated in each layer is independently transmitted to the heat dissipation plate without affecting other layers. Further, it is easy to bend the heat conductive plate material and incorporate it into the laminate, which is the most preferable embodiment.

FIGS. 4B and 4C are views showing an embodiment in which one heat-dissipating plate is made to correspond to a plurality of heat-absorbing plates. FIG.
In the example of (b), one heat conductive plate material is bent in a spiral shape, and the portions 20a and 20b that become the heat absorbing plates are
Each is connected to the common heat dissipation plate 30 by two connection portions 40a and 40b. In the example of FIG.
The heat conductive plate members are bent in an S-shape, and the portions 20a and 20b serving as the heat absorbing plates are connected to a common heat radiating plate 30 by one path.

In the example of FIG. 4, the direction from the film carrier element of each layer to the bent portion adjacent to the film carrier element (referred to as “direction to the bent portion”) is a direction perpendicular to the paper surface.
Further, the direction from the portion that becomes the heat absorbing plate to the connection portion (referred to as “direction to the connection portion”) is a horizontal direction when viewing the paper surface. In other words, in the state of being incorporated in the laminate, the “direction to the bent portion” and the “direction to the connection portion” are orthogonal to each other, and the bent portion of the film carrier,
The connection portion of the heat dissipation structure is configured to connect the layers using different side surfaces of the stacked body without overlapping each other. Such a mode is a preferable mode because the connecting portion of the heat dissipation structure does not affect the bent portion with heat, and the connecting portion can radiate heat well.

The example of FIG. 5 has the same heat radiation structure as that of FIG. 4, but is different from the example of FIG. 4 in the direction of assembling into the laminate. The direction to the use portion "is the same as the above. In FIG.
The laminate is viewed from the same direction as in FIG. 2 (b), and the folding pattern of the present film carrier appears. FIG.
The example of (a) is a case where the folding pattern of the present film carrier is S-shaped. As in FIG. 4A, the heat dissipation structure is such that the heat absorption plate and the heat dissipation plate are in one-to-one correspondence, and the thermally conductive plate is bent in a U-shape for each correspondence. The example of FIG. 5B is a case where the folding pattern of the present film carrier is spiral. Figure 4 shows the heat dissipation structure.
As in (c), this is an embodiment in which one heat dissipation plate corresponds to a plurality of heat absorption plates, and one heat conductive plate material is S
This is a mode that is bent in a letter shape.

When a plurality of heat-dissipating plates are provided and superposed in a layer on the uppermost surface, the heat-dissipating plates are held at an interval from each other, and the gap is formed so that the outside air can flow therethrough. The properties are better. In order to secure the interval between the heat radiating plates, the length of the connecting portion when bending the heat conductive plate material may be changed, but in addition to this, the heat radiating plate surface becomes an appropriate spacer The protrusion may be processed.

The heat radiating plate is preferably subjected to various processes for improving heat radiating properties. For example, the surface area is provided by providing irregularities (including a combination of a flat surface and a concave portion or a combination of a flat surface and a convex portion), a mode in which a through hole is provided like a punching plate, and further providing a radiation fin separately. This is a mode of increasing the size. Examples of providing the unevenness include an embossed plate and an embodiment in which the heat dissipation plates 30a and 30b are corrugated plates as shown in FIG.

As the material of the plate material having thermal conductivity,
Materials such as copper and aluminum that are lightweight and have good thermal conductivity are preferred.

In forming the stacked mounting body of the present invention, it is preferable that the folded layers and the inserted heat absorbing plate are bonded to each other adjacent to each other.

Various kinds of sealing may be applied to the stacked mounting body of the present invention using a resin. For example, only the connection surface and the heat dissipation plate of the base element 1a are exposed, and the other parts are sealed with resin to form a package, or the semiconductor elements are individually sealed at the stage of being mounted on the film carrier. There is a mode of stopping.

Although the laminated mounting body of the present invention functions as a semiconductor device by itself, it is further connected to an external circuit board to provide a conventional laminated mounting structure in terms of an external connection terminal arrangement. A stacked mounting body compatible with the mounting body is obtained. The example of FIG. 6 is an example in which the multilayer mounting body of the embodiment shown in FIG. 4A is connected to an external circuit board, and the whole is a multilayer mounting body compatible with a conventional product. In the example shown in the drawing, the connection contact 7 of the base element is connected to the external circuit board 1.
0 is connected to the land portion 12 (the contact portion for connection) and is conductive.

[0044]

EXAMPLE A laminated package having three layers was actually manufactured as an example of the present invention, and changes in heat radiation properties depending on the form of the heat radiation plate and the presence or absence of resin sealing were examined. Example 1 In this example, a semiconductor element was mounted on the present film carrier shown in FIG. 1, a three-layer laminated body shown in FIG. 4 was manufactured, and further connected to an external circuit board. In this embodiment,
The semiconductor element was in a bare mode without resin sealing, and the heat dissipation plate was a flat plate. The present film carrier shown in FIG.
In a mode in which film carrier elements are connected in series,
When referring to the dimensions of the film surface, the dimension in the direction of connecting them in series is referred to as "length", and the dimension in the direction perpendicular thereto is referred to as "width".

[Preparation of the present film carrier] As shown in FIG. 1, the connection of the film carrier elements is a three-series connection, and the central film carrier element is the base element. The size of each film carrier element is 10 mm long.
10mm in width, the size of each of the two bends is 3mm in length x
The width is 10 mm, the length is 5 mm, and the width is 10 mm. As a whole, the size of the insulating substrate is 38 mm in length, 10 mm in width.
And The insulating substrate is made of a polyimide resin and has a thickness of 0.1 mm. A conductive circuit made of copper was provided on an insulating substrate, and a coating layer made of the same material as that of the insulating substrate was provided thereon, so that the conductive circuit was embedded in the insulating substrate.
Next, one surface of the insulating substrate was used as a mounting surface, and a bump contact was provided as a mounting contact portion in a region serving as a film carrier element. Further, a bump contact was provided as a connection contact portion on the connection surface of the base element with the external circuit board, to obtain the present film carrier.

[Mounting of Semiconductor Element] An IC bare chip having an outer diameter of 7 mm × 7 mm was mounted as a semiconductor element on the mounting surface of each film carrier element in the film carrier prepared above. A thermosetting adhesive was used for bonding between the mounting surface and the semiconductor element.

[Formation of a Heat Dissipating Structure Member] Electrolytic nickel plating was applied to the entire surface of a copper plate having a width (dimension in the direction of the “length” of the film carrier) of 8 mm and a thickness of 0.5 mm.
0 μm was applied to obtain a plate material for a heat dissipation structure. Each of the plate members is bent using two sheets to form a U-shaped heat dissipation structure member.
One formed. In both members, a portion serving as a heat-absorbing plate (outer size 8 mm × 8 mm) and a portion serving as a heat-dissipating plate (outer size 8 m
m × 8 mm) and a connecting portion for connecting them. The length of the connection portion is such that the distance between the uppermost surface of the laminated body and the interlayer is taken into consideration, and a distance of 0.5 mm between the uppermost surface and the heat radiation plate and a distance of 0.5 mm between the heat radiation plates can be secured. And

[Assembly of the stacked mounting body] The bent portion of the present film carrier on which the semiconductor element is mounted is shown in FIG.
To form a laminate. Between each layer, the portion of the heat absorbing plate of the U-shaped member is inserted, and each layer and the heat absorbing plate (that is, the upper surface of the semiconductor element and the heat absorbing plate or the back surface of the film carrier element and the heat absorbing plate) are inserted. FIG.
A laminated mounting body of the embodiment shown in (a) was obtained. The workability of assembling the stacked mounting body was such that the dimensional accuracy, connection reliability, and strength reliability of the finished product were high while the formation of the stacked body and the incorporation of the heat radiation structure were easy. Finally, the heat dissipation will be compared (the same applies to the following examples).

Example 2 This example is exactly the same as Example 1 except that the semiconductor element was mounted on the present film carrier, and the semiconductor element was individually resin-sealed to form a laminate. To
A stacked mounting body of the present invention was manufactured.

Example 3 In this example, a laminated package of the present invention was manufactured in exactly the same manner as in Example 1 except that the heat radiation plate was a corrugated plate.
The wave shape of the corrugated plate is a substantially sine curve having an amplitude of 0.5 mm × pitch (length of one cycle) of 1.0 mm.

Embodiment 4 In this embodiment, when a semiconductor element is mounted on the present film carrier, the semiconductor element is individually sealed with a resin and then a laminate is formed. Except for this, a laminated mount of the present invention was manufactured in exactly the same manner as in Example 1. The specifications of the corrugated sheet are the same as in the third embodiment.

Comparative Example 1 In this comparative example, a laminated mounting body was manufactured in exactly the same manner as in Example 1 except that the heat dissipation structure of the U-shaped plate according to the present invention was not provided.

Comparative Example 2 In this comparative example, when a semiconductor element was mounted on the present film carrier, each semiconductor element was individually resin-sealed to form a laminate, and a U-shaped plate according to the present invention was used. Example 1 except that the heat dissipation structure was not provided.
In the same manner as in the above, a stacked mounting body was manufactured.

The heat radiation performance of the stacked mounting bodies obtained in Examples 1 to 4 and Comparative Examples 1 and 2 was measured by a heat resistance wind tunnel test and compared. The measurement of the thermal resistance was carried out using SEMI (G38
-87). The measurement conditions of the thermal resistance wind tunnel experiment are as follows. (A) Temperature rise of air: ΔTa = 50 ° C. (a) Air flow rate conditions: 0, 1, 2, 3 m / s (c) The multilayer mounting body as a sample is mounted on a SEMI-compliant thermal resistance measurement board. Implemented and evaluated. The experimental results are shown in the graph of FIG. 7 as a diagram showing the relationship between the air flow rate [m / s] and the thermal resistance [° C./W].

[Regarding the Presence or Absence of Resin Sealing] In the graph of FIG. 7, the first and second embodiments, the third and fourth embodiments,
As is clear from the comparison in each set of Comparative Example 1 and Comparative Example 2, the thermal resistance Θja of the stacked mounting body is smaller in the bare mode without resin sealing than in the mode with resin sealing. This is improved by about 10 ° C./W in the windless state. Therefore, when thermal resistance becomes a problem, it is advantageous to form a stacked package in the form of a bare semiconductor element.

[Regarding the Presence or Absence of a Heat Dissipation Structure] In the graph of FIG. 7, in the comparison between Example 1 and Comparative Example 1, the thermal resistance Δja of the stacked mounting body was 60 ° C./W to 30 ° C. in a no-air condition.
/ W. In the comparison between Example 2 and Comparative Example 2, the temperature was improved from 50 ° C./W to 20 ° C./W in a windless state, and a significant improvement of about 30 ° C./W was obtained in each case.

[Regarding the Use of Corrugated Plate for Heat Dissipation] In the graph of FIG. 7, as is clear from the comparison within each set of the first and third embodiments and the second and fourth embodiments, The thermal resistance Δja of the stacked mounting body is always about 10 ° C. in the mode in which the heat radiating plate is a corrugated plate, compared to the mode in which the heat radiating plate is a flat plate.
/ W can be improved.

[0058]

According to the laminated carrier of the present invention, first, the characteristics of the present film carrier solve various problems in production technology, management, and component cost of the conventional laminated carrier. Further, by providing the heat dissipation structure, it is possible to efficiently dissipate the heat generated in the semiconductor elements of each layer to the outside.

[Brief description of the drawings]

FIG. 1 is a diagram showing an example of the present film carrier. FIG. 1A is a view (top view) of the surface on which the mounting surface of the base element is located, and FIG. 1B is a cross-sectional view of the film carrier of FIG. 1A in the longitudinal direction. It is sectional drawing in the case. In FIG. 1A, only the bent portion is hatched, and in FIG. 1B, only the conductive circuit is hatched.

FIG. 2 is a cross-sectional view illustrating a state where a semiconductor element is mounted on the present film carrier and a state where the semiconductor element is bent to form a laminate. Only the conductive circuit is hatched, and only the outer shape of the semiconductor element is shown.

FIG. 3 is a schematic view showing an example of a heat dissipation structure provided in the multilayer mounting body of the present invention.

FIG. 4 is a diagram showing a mode obtained by bending a thermally conductive plate as an example of a heat dissipation structure provided in the stacked mounting body of the present invention.

FIG. 5 is a diagram showing another example of a mode obtained by bending a thermally conductive plate as an example of a heat dissipation structure provided in the stacked mounting body of the present invention.

FIG. 6 is a diagram showing an example in which the stacked mounting body of the embodiment shown in FIG. 4A is further connected to an external circuit board.

FIG. 7 is a graph showing the heat radiation performance of the laminated mounting bodies manufactured in the example and the comparative example, based on the air flow rate [m / s] and the thermal resistance [° C. /
W].

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Film carrier element 2 Mounting surface 3 Bending part 4 Conductive circuit 5 Insulating board 6 Mounting contact part 7 Connection contact part 8 Semiconductor element 9 Stacked body 10 External circuit board 11a, 11b Interlayer 20 Heat absorption plate 30 Heat dissipation plate 40 Connection part

Claims (9)

[Claims] 1. A film carrier having the following (A):
The semiconductor element is mounted on the mounting surface of the film carrier element included in the film carrier and bent at the bent portion, and each of the film carrier elements other than the base element is connected to the connection surface of the base element in a state where the semiconductor element is mounted. Are stacked on the base element such that is the lowermost surface of the laminate to form one laminate, and a heat conductive heat absorbing plate is sandwiched between at least one of the layers of the laminate, A laminated mounting body having a structure in which a heat-conducting heat-dissipating plate is provided on the uppermost surface of a body, and the heat-absorbing plate and the heat-dissipating plate are connected to each other so as to be thermally conductive. (A) A plurality of film carrier elements of the following (B) are connected via a bent portion in a direction in which each surface expands, and one of the film carrier elements is used as a base element, and a film carrier element other than the base element is used. Can be folded over the base element by bending the bend so that the whole is in one laminate, the conductive circuit inside is connected to the conductive circuit inside the base element through the inside of the bend,
A film carrier having a contact portion for connection to an external substrate provided on a connection surface which is a back surface of a mounting surface of a base element, and the contact portion is electrically connected to a conductive circuit. (B) a conductive circuit is provided inside the insulating substrate,
At least one surface of the insulating substrate is a mounting surface for mounting a semiconductor element, and a mounting contact portion is provided on the mounting surface, and the mounting contact portion is electrically connected to the conductive circuit. 2. The film carrier element of (B) wherein only one side has a mounting surface, and the film carrier elements are connected such that their mounting surfaces are on the same side as each other, and 2. The laminated mount according to claim 1, wherein the film carrier is formed. 3. The stacked package according to claim 1, wherein the film carrier elements of (B) are connected in series to form the film carrier of (A). 4. The stacked package according to claim 1, wherein the mounted semiconductor elements are individually sealed with resin for each film carrier element. 5. A structure in which a heat-absorbing plate and a heat-dissipating plate are connected so as to be able to conduct heat, a heat-conducting plate material is used as a heat-absorbing plate portion, a heat-dissipating plate portion, and the connection member. The multilayer mounting body according to claim 1, wherein the multilayer mounting body has a structure obtained by bending so as to be a part. 6. An aspect in which the same number of heat-absorbing plates and heat-dissipating plates are provided so as to correspond one-to-one, and the heat-absorbing plate and the heat-dissipating plate are individually connected in a heat-conducting manner for each correspondence. And
The structure in which the heat-absorbing plate and the heat-dissipating plate are connected in a heat-conducting manner in each of the correspondences includes a heat-conducting plate, a heat-absorbing plate, and a heat-dissipating plate. "U-shaped" consisting of
6. A structure obtained by bending the plate into a plurality of parts.
The stacked mounting body as described in the above. 7. The lamination according to claim 6, wherein the heat-absorbing plates are provided between two or more layers, and the heat-dissipating plates corresponding to the heat-absorbing plates are superposed in layers at intervals. Type implementation. 8. The film carrier of (A), wherein the film carrier elements are connected in series to form the film carrier of the above (A).
6. The multilayer mounting body according to claim 5, wherein a direction from the film carrier element to the bent portion adjacent thereto and a direction from the heat absorbing plate to the connection portion are orthogonal to each other. 9. The multilayer mounting body according to claim 1, wherein the heat radiation plate is provided with irregularities for increasing a surface area.