JPH01206505A - fluorescent lamp device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Objective of the Invention] (Industrial Field of Application) The present invention provides a cap at one end of a synthetic resin cover, a fluorescent lamp at the other end, and a lamp inside the cover. The present invention relates to a fluorescent lamp device containing lighting circuit components.

(Prior Art) Recently, a screw-type cap for an incandescent light bulb is attached to one end of a cover, and a lighting circuit component such as a ballast or a high-frequency lighting circuit is housed within this cover, and at the other end of this cover, For example, fluorescent lamp devices equipped with bent fluorescent lamps such as U-shaped, W-shaped, and saddle-shaped fluorescent lamps have been developed, and these fluorescent lamp devices have become popular as energy-saving light sources because they are compatible with incandescent light bulbs. It's coming.

By the way, the above-mentioned cover of this type of fluorescent lamp device is
It is made of synthetic resin to maintain electrical insulation with the lighting circuit components housed inside, and is made of organic polymer solid materials with particularly good processability, such as PBT (polybutylene terephthalate) and PET (polyethylene terephthalate). It is formed.

(Problem to be solved by the invention) However, organic polymer solid materials such as PBT and PET have poor thermal conductivity, and therefore the heat generated from the lighting circuit components housed inside the cover is not released to the outside. Easy to hide inside. As a result, the temperature inside the cover rises and the temperature of the lighting circuit components rises abnormally, causing problems such as thermal damage and premature end of life.

The present invention aims to provide a fluorescent lamp device that facilitates the release of heat within the cover to the outside, prevents thermal damage to lighting circuit components housed in the cover, and has a long life.

[Structure of the Invention] (Means for Solving the Problems) The present invention provides a cover formed of a synthetic resin made of a solid organic polymeric material with a screw-type cap attached to one end and a fluorescent lamp attached to the other end. A fluorescent lamp device in which a lighting circuit component is housed inside the cover is characterized in that a metallic thin film is formed on the outer surface of the cover.

(Function) According to the present invention, heat within the cover is effectively released to the outside of the cover due to the high thermal conductivity of the metallic thin film formed on the outer surface of the cover. Therefore, the temperature rise inside the cover is suppressed, and the adverse thermal effect on the lighting circuit components is reduced.

(Example) The present invention will be described below based on an example shown in FIGS. 1 and 2.

In the figure, l is a cover, and this cover 1 is made of synthetic resin, for example, an organic polymer solid material such as PBT.

A base chassis portion 2 is integrally formed at one end of the cover 1, and a screw type base 3, such as an E26 type base, is attached to the base chassis portion 2.

A closing member 4 made of a heat insulating material such as synthetic resin is attached to the other end of the cover 1, and the opening at the other end of the cover 1 is closed with this closing member 4.

This closing member 4 is composed of a pair of disc-shaped partition boards 5 and 6 that are spaced apart in the axial direction, and these partition boards 5 and 6 are separated by a predetermined distance by a connecting rib 7 interposed between them. They are still facing each other.

Therefore, a heat insulating air layer 8 is formed between these partition boards 5 and 6 which are spaced apart and facing each other, and this heat insulating air layer 8 is communicated with the outside over the entire circumference.

By closing the opening of the cover 1 with the closing member 4 in this manner, a room 9 is formed inside the cover 1, which is separated from the outside.

In this room 9, a circuit board 10 is arranged inside the cover 1 rather than the one disc-shaped partition panel 5, and this circuit board 10 has its peripheral edge fixed to the cover 1, for example. ing.

Lighting circuit components are attached to this circuit board IO.

This lighting circuit component is, for example, a high frequency lighting circuit component, and is an electrolytic capacitor 11. These include a choke ballast 12, an oscillation coil 13, a transistor, and the like. Note that since the electrolytic capacitor 11 is the tallest, it is installed approximately at the center of the circuit board IO.

A globe 15 made of a diffused light-transmitting material is attached to the other disc-shaped partition panel 6 of the closing member 4. The interior of the globe 15 forms a lamp chamber in which a bent fluorescent lamp 20 is housed.

The bent fluorescent lamp 20 may be U-shaped, W-shaped, etc., but in this embodiment, a fluorescent lamp having a saddle-shaped discharge path is used.

This fluorescent lamp 20 is connected to the other disk-shaped partition board 6.
It is attached to a lamp support plate 21 fixed to. That is, both ends of the fluorescent lamp 20 are joined to the lamp support plate 21 via an adhesive (not shown), and the bent portion is engaged with a hook 22 formed on the lamp support plate 21. There is.

A thin film 25 made of a metal with excellent thermal conductivity, such as aluminum, is formed on the outer surface of the cover 1. This metallic thin film 25 has a thickness of 0.311
m or less, and is constructed by, for example, steaming aluminum or gluing aluminum foil. Note that when bonding aluminum foil, an adhesive with excellent thermal conductivity such as silicone or polyamide adhesive is used.

Further, on the outer surface of the metallic thin film 25, a heat emitting coating film 26 having excellent heat reflection and heat emitting properties, for example, white paint, is formed. This white paint eliminates the glossiness of the metallic thin film 25, and thereby the metallic thin film 25
This increases the heat radiation of the material.

The operation of the fluorescent lamp device of the embodiment having such a configuration will be explained.

The fluorescent lamp device having the above structure is lit by screwing the base 3 into a socket on the power supply side (not shown).
．． 13 etc. generate heat, and the fluorescent lamp 20 also generates heat.

The heat emitted from the high-frequency lighting circuit component 11S12.13 is contained within the cover 1 by a closing member 4, and the cover 1 is made of an organic polymer solid material such as PBT which has poor heat conductivity. So, I shut myself up in room 9 and try to raise the temperature of this room 9.

However, since a metal thin film 25 made of aluminum or the like having excellent thermal conductivity is formed on the outer surface of the cover 1, the heat of the cover 1 is released to the outside by the heat dissipation effect of the metal thin film 25.

In this case, since a heat emitting coating film 26 such as white paint is formed on the outer surface of the metallic thin film 25, this heat emitting coating film 26 eliminates the glossiness of the metallic thin film 25,
The heat radiation property of the metallic thin film 25 is further improved.

Therefore, since the heat of the cover 1 is effectively released to the outside, the temperature of the cover 1 itself is lowered, and even if the cover 1 has inherently poor thermal conductivity, it can effectively conduct the internal heat to the outside. Therefore, the temperature rise in the room 9 is suppressed.

As a result, the temperature rise of the high frequency lighting circuit components is reduced.

Note that if the thickness of the metal thin film 25 exceeds 0.31 fi11, the heat dissipation effect will be significantly reduced. That is, the film thickness is 0.
If it exceeds 3 aug, the adhesion of the metallic thin film 25 to the cover 1 will deteriorate, resulting in poor thermal conductivity, and the heat capacity of the metallic thin film 25 itself will increase, causing the metallic thin film 25 to
The amount of heat taken into the metallic thin film 25 increases rather than the heat dissipated from the cover 5, and the temperature of the metallic thin film 25 itself rises, which reduces the ability to release heat inside the cover 1 to the outside, and the metallic thin film 25 is provided. The initial objective will no longer be achieved. Further, as the thickness of the metal thin film 25 increases, the weight increases, causing problems such as an increase in the weight of the entire device.

On the other hand, the heat emitted from the lamp 20 increases the temperature of the lamp chamber within the globe 15, but this heat is mainly radiated to the outside air through the globe 15.

Then, the heat inside the globe 15 attempts to conduct heat through the closing member 4 and transfer to the high frequency lighting circuit component side, but the closing member 4
Since an insulating air layer 8 is formed in the insulating air layer 8, the heat is prevented from being transmitted to the cover 1 side by the heat blocking effect of this insulating air layer 8, and therefore, the high frequency lighting circuit components are not thermally damaged by the heat of the fluorescent lamp 20. There's nothing wrong with that.

FIG. 2 shows the results of temperature measurements for the above configuration.

In Figure 2, the temperature was investigated at each location: the inside of the cover, the inner surface of the cover, the outer surface of the cover, the surface of the partition panel 5 on the inside of the cover, that is, the top surface, and the surface of the partition panel 6 on the inside of the glove, that is, the bottom surface. , B has a cover made only of PBT, and a thin aluminum film is formed on the outer surface of the ASPBT cover.

and C, in which a thin aluminum film is formed on the PBT cover surface and white paint is applied to the outer surface of the cover.
The results of each measurement using a 16W fluorescent lamp device are shown.

This example type C has a thin aluminum film formed on the PBT cover surface and white paint applied to the outer surface of the cover.
The temperature inside the cover has been lowered, and the effect of reducing the temperature rise of the lighting components housed therein has been recognized.

The present inventors have considered forming a metallic thin film on the inner surface of the cover 1, but in such a case, electrical insulation between the metallic thin film and lighting circuit components must be considered. If an attempt is made to ensure a sufficient electrically insulating distance between these metallic thin films and lighting circuit components, a problem arises in that the device becomes larger. Therefore, it is not preferable to form a metallic thin film on the inner surface of the cover 1.

Further, the present invention is not limited to the above embodiments.

That is, FIG. 3 shows another embodiment of the present invention.

The difference between this embodiment and the case shown in FIG. 1 is that the metallic thin film 25
Both the heat emitting coating film 26 and the heat emitting coating film 26 are formed only on the upper surface of the cover 1, and support protrusions 30 are integrally provided on the inner surface of the cover 1, and these support protrusions 30
. . . are closely fitted with parts of high-frequency lighting circuit components, such as the choke ballast 12 and the oscillation coil 13.

According to such a configuration, the metal thin film 25 and the heat emitting coating film 2B release the heat inside the cover 1 to the outside, and the heat generated in the choke ballast 12 and the oscillation coil 13 is transferred to the support protrusion 30... Since the heat is conducted to the cover 1 and released to the cover 1 side, the choke ballast 12 and the oscillation coil 13 are prevented from being excessively heated.

Note that the choke ballast 12 and oscillation coil 13, which are part of the high-frequency lighting circuit components, are mechanically supported by the cover 1 via the support protrusions 30, so they will not come off even if vibration or impact is applied. There's no need to worry about it.

In addition, since both the metallic thin film 25 and the heat emitting coating film 26 are formed only on the upper surface of the cover 1, the heat released from the globe 15 during lighting rises due to convection and heats the outer peripheral surface of the cover 1. Even if an attempt is made to do so, the cover 1 will not be heated by the convection heat since there is no metallic thin film 25 on this outer circumferential surface.

Furthermore, the present invention is not limited to the formation of the heat-releasing coating film 2B, and even a type B without the heat-releasing coating film 26 shown in FIG. 2 is more effective than the conventional one. Since this is recognized, the heat-releasing coating film 2B may be omitted.

Further, in the above embodiment, a structure in which the bent fluorescent lamp 20 is covered with a transparent or semi-transparent globe 15 has been described, but it is also possible to use a type in which the fluorescent lamp 20 is used as it is exposed. It is.

Further, the heat insulating air layer 8 is not necessarily formed, and it is also possible to use a choke coil type ballast as the lighting circuit component in addition to the high frequency lighting circuit component.

Further, when the cover 1 is provided with heat radiation holes, the heat inside the cover is released to the outside through the heat radiation holes, and it is even more effective if this is also used in combination with the provision of the metal thin film 25.

Furthermore, the fluorescent lamp may be constructed by connecting three U-shaped bulbs, or may be a straight tube type fluorescent lamp.

[Effects of the Invention] As explained above, according to the present invention, on the outer surface of the cover,
Since the formed metallic thin film has high thermal conductivity, the heat within the cover is effectively released to the outside of the cover. Therefore, the temperature rise inside the cover is suppressed, the adverse thermal effect on the lighting circuit components is reduced, and the lighting circuit components are prevented from being thermally damaged and their lifespan is extended.

[Brief explanation of the drawing]

1 and 2 show one embodiment of the present invention, FIG. 1 is a sectional view of a fluorescent lamp device, FIG. 2 is a characteristic diagram showing measured temperature results, and FIG. 3 is a diagram showing an embodiment of the present invention. FIG. 2 is a sectional view of a fluorescent lamp device showing an embodiment of the present invention. 1 cover, 3... cap, 4... closing member, 5.6.
...Partition plate, 8...Insulating air layer, IO...Circuit board, 11゜12.13...High frequency lighting circuit component, 15
... Globe, 20 ... Bent fluorescent lamp, 25
...Metallic thin film, 26... Heat-releasing coating film. Applicant's agent Patent attorney Takehiko Suzue

Claims (1)

[Scope of Claims] A fluorescent lamp device in which a screw-type cap is provided at one end of a cover made of synthetic resin, a fluorescent lamp is attached to the other end of this cover, and lighting circuit components are housed inside this cover, A fluorescent lamp device characterized in that a metallic thin film is formed on the outer surface of the cover.