JPH01136987A - Method for partially plating electrolytic aluminum - Google Patents
Method for partially plating electrolytic aluminumInfo
- Publication number
- JPH01136987A JPH01136987A JP29253987A JP29253987A JPH01136987A JP H01136987 A JPH01136987 A JP H01136987A JP 29253987 A JP29253987 A JP 29253987A JP 29253987 A JP29253987 A JP 29253987A JP H01136987 A JPH01136987 A JP H01136987A
- Authority
- JP
- Japan
- Prior art keywords
- opening
- plating
- nozzle
- mask plate
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 59
- 229910052782 aluminium Inorganic materials 0.000 title claims description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims description 15
- 238000000034 method Methods 0.000 title claims description 11
- 239000000463 material Substances 0.000 claims abstract description 25
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 claims abstract description 8
- 238000005868 electrolysis reaction Methods 0.000 claims abstract description 6
- 150000003839 salts Chemical class 0.000 claims abstract description 5
- 238000007599 discharging Methods 0.000 claims abstract description 4
- POKOASTYJWUQJG-UHFFFAOYSA-M 1-butylpyridin-1-ium;chloride Chemical compound [Cl-].CCCC[N+]1=CC=CC=C1 POKOASTYJWUQJG-UHFFFAOYSA-M 0.000 claims abstract description 3
- 239000003960 organic solvent Substances 0.000 claims description 2
- 239000002904 solvent Substances 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 12
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000010963 304 stainless steel Substances 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、めっき前に予め被めっき材をマスキングする
ことなく部分めっきを施すことができる電気アルミニウ
ムめっきの部分めっき方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a partial plating method for electrolytic aluminum plating, which allows partial plating to be performed without masking the material to be plated before plating.
（従来技術）
近年、ＩＣリードフレーム材にステンレス鋼板や４２％
ニッケル合金鋼板などが使用されているが、これらの鋼
板は、ボンディング性が良好でないので、表面に金、金
合金、銅、アルミニウムなどのめっきを施しで、ボンデ
ィング性を改善することが行なわれている。このめっき
の作業は、鋼板全面に施すのが容易であるが、実用上め
っきの必要な部分は、ＩＣリードフレームに打ち抜いた
後ボンディングする部分だけである。また、めっきは、
電気めっきや蒸着めっきによっているが、めっき金属が
高いので、使用しないｎ分までめっきを施すと、その分
だけ高価になってしまう。(Prior technology) In recent years, stainless steel plates and 42%
Nickel alloy steel plates are used, but these steel plates do not have good bonding properties, so the surface is plated with gold, gold alloy, copper, aluminum, etc. to improve bonding properties. There is. Although it is easy to perform this plating operation on the entire surface of the steel plate, the only part that actually requires plating is the part that is bonded to the IC lead frame after punching. In addition, plating is
Electroplating or vapor deposition plating is used, but since the plating metal is expensive, if plating is applied to the nth portion that is not used, the price will increase accordingly.
このため、 ＩＣリードフレームに打ち抜いた後ボンデ
ィングする部分だけにめっきを施すことが検討されてい
る。従来、この方法として行なわれている方法は、不要
な部分をめつ訃前にテープや樹脂で予めマスキングする
方法である。For this reason, it is being considered to plate only the parts that will be bonded after punching out the IC lead frame. Conventionally, this method has been carried out by masking unnecessary parts with tape or resin before the death.
（発明が解決しようとする問題点）
しかし、このマスキング材の貼付け、剥離に時間を要す
るため、生産性が劣り、２生産性を改善する必要があっ
た。(Problems to be Solved by the Invention) However, since it takes time to apply and peel off this masking material, productivity is poor, and it is necessary to improve productivity.
そこで、本発明は、アルミニウムめっきを電気めっきに
より部分的に施す際の生産性を改善するものである。Therefore, the present invention aims to improve the productivity when aluminum plating is partially applied by electroplating.
（問題点を解決するための手段）
本発明は、開口部を有するマスク板の開口部片側に被め
っき材を圧接するとともに、マスク板の開口部反対側に
Ａｌｇ１ノズルもしくは内部にＡｌ＃ｌを有するノズル
を離隔配置して、被めっき材を陰極に、Ａｌ９１ノズル
またはＡｌ＃ｌを陽極にして、ノズルからアルミニウム
めっき液をマスク板の開口部に吐出させながら電解する
ことにより能率よく部分めっきを施すことができるよう
にした。(Means for Solving the Problems) The present invention presses the material to be plated onto one side of the opening of a mask plate having an opening, and at the same time, an Alg1 nozzle is placed on the opposite side of the opening of the mask plate or Al#l is placed inside the mask plate. Partial plating can be efficiently performed by arranging the nozzles with the plating material at a distance, using the material to be plated as the cathode, and using the Al91 nozzle or Al#l as the anode, and electrolyzing while discharging the aluminum plating solution from the nozzle into the opening of the mask plate. I made it possible to do so.
このめっきの際使用するめっき液としては、アルミニウ
ムめっき液として、アルミニラムノ１０デン化物４０〜
８０モル％とフルキルピリノニウムハロゲン化物２０〜
６０モル％との溶融塩浴、待に塩化アルミニウム５０〜
７５モル％とブチルビソノニウムクロリド２５〜５０モ
ル％の溶融塩浴もしくはこれに有機溶媒を添加した浴が
作業的に安全で、めっき純度、外観が良好である。The plating solution used for this plating is aluminum plating solution, aluminum ramno-10 denide 40~
80 mol% and furkylpyrinonium halide 20~
Molten salt bath with 60 mol%, then aluminum chloride 50~
A molten salt bath containing 75 mol % and 25 to 50 mol % of butylbisononium chloride or a bath in which an organic solvent is added thereto is safe for operation and has good plating purity and appearance.
このめっき液による場合、めっき液は、腐食性が強いの
で、マスク板は、フッ素樹脂のような耐酸化性υ（開裂
のものにするか、その樹脂で被覆したものを使用する。When using this plating solution, the plating solution is highly corrosive, so the mask plate should be made of oxidation-resistant υ (cleavage) such as fluororesin, or coated with the resin.
電解は、めっき液温度を０〜１５０℃にして、電流密度
０．５〜１００＾／ｄ＋ａ２で直流もしくはパルス電流
で行えばよい。Electrolysis may be carried out using direct current or pulsed current at a plating solution temperature of 0 to 150° C. and a current density of 0.5 to 100^/d+a2.
なお、めっきは、大気中で行うと、イオンが酸化される
ので、不活性雰囲気中でめっきし、また、めっき液は、
導電性が低（、水溶液に比べて粘度も高いので、マスク
板にノズルを接近できるようにノズルを可変構造に支持
しておくのが好ましい。Note that if plating is performed in the air, the ions will be oxidized, so plating should be done in an inert atmosphere, and the plating solution should be
Since the conductivity is low (and the viscosity is high compared to an aqueous solution), it is preferable to support the nozzle in a variable structure so that the nozzle can approach the mask plate.
さらに、ＡｌＭは、電解により消耗するので、吐出口の
方に連続的に繰り出しできるようにする。ノズルよりの
吐出速度は、１〜１０００慟／閣ｉｎの範囲で行えばよ
い。Furthermore, since AlM is consumed by electrolysis, it should be possible to continuously feed it out toward the discharge port. The discharge speed from the nozzle may be in the range of 1 to 1000 cm/cm.
（作用）
上記のようにしてめっき液をマスク板の開口部に吐出さ
せると、めっき液を介して１製ノズルもしくはＡｌ製と
被めっき材との間に回路ができるので、電解すれば、被
めっき材の開口部より露出している部分だけをめっきす
ることができる。(Function) When the plating solution is discharged into the opening of the mask plate as described above, a circuit is created between the nozzle made of No. 1 or Al and the material to be plated via the plating solution. Only the parts of the plating material that are exposed through the opening can be plated.
めりきは、可溶性陽極のＡｌ製ノズルやＡｌ線が溶解す
ることによりなされる。従って、電解を継続してゆくと
、＾ｌ製ノズルやＡｌ線が消耗してゆくが、消耗した場
合、前者は交換し、後者は吐出口の方に繰り出すように
する。The plating is performed by melting the Al nozzle or Al wire of the soluble anode. Therefore, as electrolysis continues, the nozzle made of ^l and the Al wire will wear out, but when they wear out, the former should be replaced and the latter should be fed out toward the discharge port.
めっき方式は、被めっき材に対しで、めっき液を高速で
供給する方式になっているので、めっき速度が速（、め
っきは、ち密で均一になる。The plating method supplies the plating solution at high speed to the material to be plated, so the plating speed is fast (and the plating is dense and uniform).
広幅の銅帯を連続的に部分めっきする場合には、マスク
板に、開口部を複数設けておけば、同時に複数箇所の部
分めっｂを竹うことができる。When partially plating a wide copper strip continuously, if a plurality of openings are provided in the mask plate, partial plating can be carried out at a plurality of locations at the same time.
（実施例）
第１図は、本発明のめっき方法を示したもので、めっき
梢１の上部に、開口部２を有するマスク板３を配置して
密閉する。そして、開口部２の下側に吐出口が上を向い
たノズル４を配置して、このノズル４とめっき）ＩＬ５
とをポンプ６、バルブ７を有する絶縁性の循環管８で接
続する。マスク板３としては、第２図のように、開口部
２が方形になったものを使用し、ノズル４としては、ノ
ズル自体がＡｌ製のものか、第３図に示すように、内部
にＡｌ製９が収容されたものを用いる。この後者の場合
のノズル材質は、フッ素樹１層製などにする。(Example) FIG. 1 shows the plating method of the present invention, in which a mask plate 3 having an opening 2 is arranged above a plating tree 1 and sealed. Then, a nozzle 4 with a discharge port facing upward is arranged below the opening 2, and this nozzle 4 and plating) IL5
and are connected by an insulating circulation pipe 8 having a pump 6 and a valve 7. The mask plate 3 used has a rectangular opening 2 as shown in FIG. The one containing aluminum 9 is used. In the latter case, the nozzle material is made of a single layer of fluorine resin.
めっきは、開口部２に被めっき材１０を圧接して、めっ
きｇｓをポンプ６で開口部２に吐出させながら、被めっ
き材１０を陰極、Ａｌ製ノズル４またはノズル４内部の
Ａｌ＃ｉ９を陽極にしで電解すればよい、ノズル４より
のめっきａＳの吐出断続は、ポンプ６とバルブ７により
行う。For plating, the material to be plated 10 is pressed against the opening 2, and while the plating gs is discharged into the opening 2 by the pump 6, the material to be plated 10 is used as the cathode, and the Al nozzle 4 or the Al#i9 inside the nozzle 4 is used as the cathode. The discharge of plating aS from the nozzle 4, which can be electrolyzed at the anode, is controlled by a pump 6 and a valve 7.
この方法でめっきＷＩｌ内に塩化アルミニウムとブチル
ピリジニウムクロリドの溶融塩（混合モル比２：１）ま
たはこれにキシレンを添加したものを投入して、５ＵＳ
３０４ステンレス鋼板をめっき液温度４０℃、電流密度
５＾／ｄａ２で５分間電解したところ、Ａｌ９１ノズル
、Ａｌ＃ｌ収容ノズルを使用した場合とも、アルミニウ
ムを３μ曽めっきできた。In this method, a molten salt of aluminum chloride and butylpyridinium chloride (mixed molar ratio 2:1) or a mixture of xylene added thereto was introduced into the plating WIl, and 5US
When a 304 stainless steel plate was electrolyzed for 5 minutes at a plating solution temperature of 40° C. and a current density of 5^/da2, aluminum could be plated to a thickness of 3 μm both when using an Al91 nozzle and an Al#1 containing nozzle.
（発明の効果）
以上のように、本発明は、開口部を有するマスク板に被
めっき材を圧接して、被めっき材に陽極の３１ｇｌノズ
ルもしくは内部にＡｌ＃ｉを有する／Ｘ″ルでめっき液
を吐出させながら、被めっき材を陰極にして電解して部
分めっきを施す方法であるので、めっき萌に被めっき材
をマスキングする必要がなく、生産性が優れている。(Effects of the Invention) As described above, the present invention presses the material to be plated onto a mask plate having an opening, and attaches the material to the material to be plated using a 31gl nozzle of an anode or an /X'' hole having Al#i inside. This method performs partial plating by electrolyzing the material to be plated as a cathode while discharging the plating solution, so there is no need to mask the material to be plated during plating, and productivity is excellent.
第１図は、本発明によりアルミニウムの部分電気めっき
を行う場合の被めっき材、マスク板、ノズルの配置方法
を示すものであり、第２図は、マスク板の平面図を、第
３図は、内部にＡｌ線を有するノズルの断面図を示すも
のである。Fig. 1 shows a method of arranging the material to be plated, a mask plate, and a nozzle when performing partial electroplating of aluminum according to the present invention, Fig. 2 shows a plan view of the mask plate, and Fig. 3 shows a plan view of the mask plate. , which shows a cross-sectional view of a nozzle having an Al wire inside.
Claims (3)
材を圧接するとともに、マスク板の開口部反対側にＡｌ
製ノズルもしくは内部にＡｌ線を有するノズルを離隔配
置して、被めっき材を陰極に、Ａｌ製ノズルまたはＡｌ
線を陽極にして、ノズルからアルミニウムめっき液をマ
スク板の開口部に吐出させながら電解することを特徴と
する電気アルミニウムめっきの部分めっき方法。(1) Press the material to be plated on one side of the opening of a mask plate having an opening, and press the Al plated material on the opposite side of the opening of the mask plate.
A nozzle made of Al or a nozzle with an Al wire inside is arranged at a distance, and the material to be plated is used as a cathode.
A partial plating method for electrolytic aluminum plating characterized by using a wire as an anode and performing electrolysis while discharging aluminum plating solution from a nozzle into an opening in a mask plate.
５０〜７５モル％とブチルピリジニウムクロリド２５〜
５０モル％の溶融塩浴もしくはこれに有機溶媒を添加し
た浴を噴射することを特徴とする特許請求の範囲第１項
に記載の電気アルミニウムめっきの部分めっき方法。(2) As an aluminum plating solution, 50 to 75 mol% of aluminum chloride and 25 to 75 mol% of butylpyridinium chloride
The partial plating method for electrolytic aluminum plating according to claim 1, characterized in that a 50 mol % molten salt bath or a bath to which an organic solvent is added is injected.
することを特徴とする特許請求の範囲第１項に記載の電
気アルミニウムめっきの部分めっき方法。(3) The partial plating method for electrolytic aluminum plating according to claim 1, wherein the mask plate is made of or coated with a fluororesin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29253987A JPH01136987A (en) | 1987-11-19 | 1987-11-19 | Method for partially plating electrolytic aluminum |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29253987A JPH01136987A (en) | 1987-11-19 | 1987-11-19 | Method for partially plating electrolytic aluminum |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01136987A true JPH01136987A (en) | 1989-05-30 |
Family
ID=17783096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29253987A Pending JPH01136987A (en) | 1987-11-19 | 1987-11-19 | Method for partially plating electrolytic aluminum |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01136987A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6423389B1 (en) * | 1997-04-10 | 2002-07-23 | Occ Corporation | Metal tube armored linear body, metal tube armoring linear body, method and apparatus for manufacturing metal tube armored linear body |
-
1987
- 1987-11-19 JP JP29253987A patent/JPH01136987A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6423389B1 (en) * | 1997-04-10 | 2002-07-23 | Occ Corporation | Metal tube armored linear body, metal tube armoring linear body, method and apparatus for manufacturing metal tube armored linear body |
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