JPH01120899A - Method of mounting electronic component - Google Patents
Method of mounting electronic componentInfo
- Publication number
- JPH01120899A JPH01120899A JP62279610A JP27961087A JPH01120899A JP H01120899 A JPH01120899 A JP H01120899A JP 62279610 A JP62279610 A JP 62279610A JP 27961087 A JP27961087 A JP 27961087A JP H01120899 A JPH01120899 A JP H01120899A
- Authority
- JP
- Japan
- Prior art keywords
- circuit substrate
- electronic component
- chuck device
- mounting electronic
- static electricity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 4
- 230000003068 static effect Effects 0.000 claims abstract description 13
- 230000005611 electricity Effects 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 abstract description 5
- 230000006378 damage Effects 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 5
- 230000001464 adherent effect Effects 0.000 abstract 2
- 239000007767 bonding agent Substances 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
（イ）産業上の利用分野
本発明は、回路基板表面に電子部品を付着させる方法に
関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a method for attaching electronic components to the surface of a circuit board.
（ロ）従来の技術
回路基板への電子部品の実芸は、最近では殆ど自動装置
で行なわれるようになりた。装置例も特開昭６２−１１
４２９１号公報、同１４５８９９号公報に記載のもの等
、数多くのものを見ることができる。このような自動装
着装置はニアコンディショニングされた工場内に置かれ
ており、これによって取り扱う回路基板は、コンベアに
よる搬送、ＸＹテーブルによる位置決めともに、生産性
追求のため高速で動かされ、静電気の帯電しやすい条件
がととのっている。チップコンデンサやチップ抵抗のよ
うな部品ばかりならば多少の帯電は問題にならないが、
ＩＣ−？ＬＳＩまでもこのような高速型部品装着装置で
装着することが求められるようになってくると、静電気
をただ発生するにまかせておくことはでき々い。(b) Conventional Technology Recently, most of the actual mounting of electronic components onto circuit boards has been done using automated equipment. An example of the device is also from JP-A-62-11.
Many examples can be found, such as those described in Publication No. 4291 and No. 145899. This type of automatic mounting equipment is located in a near-conditioned factory, and the circuit boards it handles are moved at high speeds in pursuit of productivity, both by conveyor transport and XY table positioning, and are free from static electricity. There are favorable conditions. If there are only components such as chip capacitors and chip resistors, a slight charge will not be a problem, but
IC-? As it becomes necessary for even LSIs to be mounted using such high-speed component mounting equipment, it is no longer possible to simply allow static electricity to occur.
（ハ）発明が解決しようとする問題点
本発明は、静電破壊を懸念することなく回路基板にＩＣ
等を装着することのできる方法を提供しようとするもの
である。(c) Problems to be Solved by the Invention The present invention allows ICs to be mounted on circuit boards without worrying about electrostatic damage.
The purpose is to provide a method that allows the user to wear the following items.
に）問題点を解決するための手段
本発明では、静電気除去雰囲気中で電子部品装着を行な
うこととした。B) Means for Solving the Problems In the present invention, electronic components are mounted in an atmosphere free of static electricity.
（ホ）作 用
回路基板をコンベアで高速搬送し、またＸＹテーブルで
高速位置決めすることにより、回路基板に静電気が発生
したとしても、電子部品装着は常にその静電気を除去し
つつ進められ、従って、電子部品の静電破壊を気にする
必要がない。(e) Function By transporting the circuit board at high speed on a conveyor and positioning it at high speed on an XY table, even if static electricity is generated on the circuit board, electronic component mounting can proceed while always removing the static electricity. There is no need to worry about electrostatic damage to electronic components.
（へ）実権例
図において、ｉｌｌは′電子部品、（２）は回路基板で
ある。回路基板（２）の表面には接着剤、半田ペースト
等の粘着性物質が所定個所に塗布されている。(f) Actual example In the diagram, ill is an electronic component, and (2) is a circuit board. Adhesive substances such as adhesives and solder pastes are applied to predetermined locations on the surface of the circuit board (2).
＋ｔｔｎはチャック装置で、真空吸引力により電子部品
（１）をチャッキングし、回路基板１２）上の粘着性物
質に押しつけるものである。（地は回路基板（２）を支
持するＸＹテーブルで、回路基板１２）の所定個所をチ
ャック装置（■の真下に位置づける。１３１は静電気除
去装置で、イオン化した空気を放出して静電気を中和す
る。ＣＤは￥ｎｔ九除去装置（３１を囲むケーシングで
、下面は全面的に開口し、上面にはチャック装置１１１
Ｂの出入する窓Ｇ２が設けられており、回路基板Ｃ２）
上の電子部品＋１１に衝突しない高さに保持されている
。このケーシング（ｉｌｌの中にはイオン化された空気
が満ち、従って電子部品装着作業は、常に静″Ｉ気除去
雰囲気中で進められることになる。+ttn is a chuck device that chucks the electronic component (1) by vacuum suction force and presses it against the adhesive material on the circuit board 12). (The ground is an XY table that supports the circuit board (2), and a predetermined part of the circuit board 12 is positioned directly under the chuck device (■.) 131 is a static electricity eliminator that releases ionized air to neutralize static electricity The CD is a casing that surrounds the ¥nt9 removal device (31), the bottom surface is completely open, and the top surface has a chuck device 111.
A window G2 is provided for B to enter and exit, and the circuit board C2)
It is held at a height that does not collide with the electronic component +11 above. This casing (ill) is filled with ionized air, so the work of mounting electronic components is always carried out in a static, I-gas-free atmosphere.
（ト）発明の効果
回路基板は絶櫃物質あるいは絶橡処理された素材からな
り、本質的て静電気を帯びやすいものであるが、本発明
によれば帯電を意に介さず高速でハンドリングし、部品
偏着を進めることができる。(G) Effects of the Invention Circuit boards are made of extremely durable materials or materials that have been subjected to extreme processing, and are inherently susceptible to static electricity; however, according to the present invention, they can be handled at high speed without worrying about static electricity. It is possible to improve uneven placement of parts.
図は本発明を説明する概略図である。
（１）・・・電子部品、 １２）・・・回路基板、１１
■・・・チャック装置、 （？α・・・ＸＹテーブル、
■・・・静電気除去装置。The figure is a schematic diagram illustrating the present invention. (1)...Electronic component, 12)...Circuit board, 11
■...Chuck device, (?α...XY table,
■...Static electricity eliminator.
Claims (1)
で行なうことを特徴とする電子部品装着方法。1) An electronic component mounting method characterized by mounting electronic components onto a circuit board in an atmosphere that eliminates static electricity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62279610A JPH01120899A (en) | 1987-11-05 | 1987-11-05 | Method of mounting electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62279610A JPH01120899A (en) | 1987-11-05 | 1987-11-05 | Method of mounting electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01120899A true JPH01120899A (en) | 1989-05-12 |
Family
ID=17613382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62279610A Pending JPH01120899A (en) | 1987-11-05 | 1987-11-05 | Method of mounting electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01120899A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04117497U (en) * | 1991-03-30 | 1992-10-21 | 太陽誘電株式会社 | Chip-shaped circuit component mounting device |
| JPH04117495U (en) * | 1991-03-30 | 1992-10-21 | 太陽誘電株式会社 | Chip-shaped circuit component mounting device |
| JPH04121799U (en) * | 1991-04-20 | 1992-10-30 | 太陽誘電株式会社 | Chip-shaped circuit component mounting device |
| JPH0557900U (en) * | 1991-12-27 | 1993-07-30 | 太陽誘電株式会社 | Electronic component supply device |
| WO2001073842A1 (en) * | 2000-03-29 | 2001-10-04 | Infineon Technologies Ag | Housing for an electronic component |
| JP2002232189A (en) * | 2001-02-07 | 2002-08-16 | Pioneer Electronic Corp | Static electricity removal system for electronic circuit production line |
| JP2002232200A (en) * | 2001-02-07 | 2002-08-16 | Pioneer Electronic Corp | Electronic component mounter |
| WO2005072042A1 (en) * | 2004-01-26 | 2005-08-04 | Popman Corporation | Device for automatically mounting electronic part and part stock management device |
| JP2006294981A (en) * | 2005-04-13 | 2006-10-26 | Yamaha Motor Co Ltd | Substrate support apparatus and substrate support method |
| WO2007036991A1 (en) * | 2005-09-28 | 2007-04-05 | Tadahiro Ohmi | Atmosphere controlled joining device, joining method, and electronic device |
| JP2023153528A (en) * | 2022-04-05 | 2023-10-18 | ヤマハ発動機株式会社 | Substrate work device |
-
1987
- 1987-11-05 JP JP62279610A patent/JPH01120899A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04117497U (en) * | 1991-03-30 | 1992-10-21 | 太陽誘電株式会社 | Chip-shaped circuit component mounting device |
| JPH04117495U (en) * | 1991-03-30 | 1992-10-21 | 太陽誘電株式会社 | Chip-shaped circuit component mounting device |
| JPH04121799U (en) * | 1991-04-20 | 1992-10-30 | 太陽誘電株式会社 | Chip-shaped circuit component mounting device |
| JPH0557900U (en) * | 1991-12-27 | 1993-07-30 | 太陽誘電株式会社 | Electronic component supply device |
| WO2001073842A1 (en) * | 2000-03-29 | 2001-10-04 | Infineon Technologies Ag | Housing for an electronic component |
| JP2002232189A (en) * | 2001-02-07 | 2002-08-16 | Pioneer Electronic Corp | Static electricity removal system for electronic circuit production line |
| JP2002232200A (en) * | 2001-02-07 | 2002-08-16 | Pioneer Electronic Corp | Electronic component mounter |
| WO2005072042A1 (en) * | 2004-01-26 | 2005-08-04 | Popman Corporation | Device for automatically mounting electronic part and part stock management device |
| JP2006294981A (en) * | 2005-04-13 | 2006-10-26 | Yamaha Motor Co Ltd | Substrate support apparatus and substrate support method |
| WO2007036991A1 (en) * | 2005-09-28 | 2007-04-05 | Tadahiro Ohmi | Atmosphere controlled joining device, joining method, and electronic device |
| JP2023153528A (en) * | 2022-04-05 | 2023-10-18 | ヤマハ発動機株式会社 | Substrate work device |
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