JPH0876369A - Photopolymerizable photosensitive material - Google Patents
Photopolymerizable photosensitive materialInfo
- Publication number
- JPH0876369A JPH0876369A JP20863094A JP20863094A JPH0876369A JP H0876369 A JPH0876369 A JP H0876369A JP 20863094 A JP20863094 A JP 20863094A JP 20863094 A JP20863094 A JP 20863094A JP H0876369 A JPH0876369 A JP H0876369A
- Authority
- JP
- Japan
- Prior art keywords
- group
- photopolymerizable
- acid
- photosensitive material
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 19
- 229920000642 polymer Polymers 0.000 claims abstract description 11
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims abstract description 8
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims abstract description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 6
- 230000000379 polymerizing effect Effects 0.000 claims abstract description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract 2
- 239000000203 mixture Substances 0.000 claims description 18
- -1 polycyclic compound Chemical class 0.000 claims description 15
- 150000005331 phenylglycines Chemical class 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- 239000000178 monomer Substances 0.000 claims description 5
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims 3
- 125000006539 C12 alkyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical group C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims 1
- 125000002252 acyl group Chemical group 0.000 claims 1
- 125000003342 alkenyl group Chemical group 0.000 claims 1
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 125000004644 alkyl sulfinyl group Chemical group 0.000 claims 1
- 125000004390 alkyl sulfonyl group Chemical group 0.000 claims 1
- 125000004414 alkyl thio group Chemical group 0.000 claims 1
- 125000000304 alkynyl group Chemical group 0.000 claims 1
- 150000001408 amides Chemical class 0.000 claims 1
- 150000003863 ammonium salts Chemical class 0.000 claims 1
- 125000004093 cyano group Chemical group *C#N 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 150000002763 monocarboxylic acids Chemical class 0.000 claims 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 6
- ZGUNAGUHMKGQNY-ZETCQYMHSA-N L-alpha-phenylglycine zwitterion Chemical compound OC(=O)[C@@H](N)C1=CC=CC=C1 ZGUNAGUHMKGQNY-ZETCQYMHSA-N 0.000 abstract 1
- 239000003999 initiator Substances 0.000 abstract 1
- 238000004321 preservation Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 11
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 239000010408 film Substances 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 7
- 239000011241 protective layer Substances 0.000 description 7
- 239000000243 solution Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000004471 Glycine Substances 0.000 description 5
- DZBUGLKDJFMEHC-UHFFFAOYSA-N acridine Chemical compound C1=CC=CC2=CC3=CC=CC=C3N=C21 DZBUGLKDJFMEHC-UHFFFAOYSA-N 0.000 description 4
- 239000003112 inhibitor Substances 0.000 description 4
- 239000000123 paper Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 238000012719 thermal polymerization Methods 0.000 description 4
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229920002125 Sokalan® Polymers 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000004584 polyacrylic acid Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- NPKSPKHJBVJUKB-UHFFFAOYSA-N N-phenylglycine Chemical compound OC(=O)CNC1=CC=CC=C1 NPKSPKHJBVJUKB-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000011094 fiberboard Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920002689 polyvinyl acetate Polymers 0.000 description 2
- 239000011118 polyvinyl acetate Substances 0.000 description 2
- 235000019353 potassium silicate Nutrition 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- PGYOHIAQCFZQDK-IFXJQAMLSA-N (2r)-2-(4-carbamimidoylanilino)-2-[5-ethoxy-2-fluoro-3-[(3s)-oxolan-3-yl]oxyphenyl]acetic acid Chemical group FC=1C([C@@H](NC=2C=CC(=CC=2)C(N)=N)C(O)=O)=CC(OCC)=CC=1O[C@H]1CCOC1 PGYOHIAQCFZQDK-IFXJQAMLSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- VEPOHXYIFQMVHW-XOZOLZJESA-N 2,3-dihydroxybutanedioic acid (2S,3S)-3,4-dimethyl-2-phenylmorpholine Chemical compound OC(C(O)C(O)=O)C(O)=O.C[C@H]1[C@@H](OCCN1C)c1ccccc1 VEPOHXYIFQMVHW-XOZOLZJESA-N 0.000 description 1
- LTMPEYZFRFPAMX-UHFFFAOYSA-N 2-(2,4-dichloroanilino)acetic acid Chemical compound OC(=O)CNC1=CC=C(Cl)C=C1Cl LTMPEYZFRFPAMX-UHFFFAOYSA-N 0.000 description 1
- DRMOCHGNKTXIBF-UHFFFAOYSA-N 2-(2-methoxyanilino)acetic acid Chemical compound COC1=CC=CC=C1NCC(O)=O DRMOCHGNKTXIBF-UHFFFAOYSA-N 0.000 description 1
- DYPOHVRBXIPFIK-UHFFFAOYSA-N 2-(2-methylanilino)acetic acid Chemical compound CC1=CC=CC=C1NCC(O)=O DYPOHVRBXIPFIK-UHFFFAOYSA-N 0.000 description 1
- KZXFAYGKDCLTER-UHFFFAOYSA-N 2-(3-chloroanilino)acetic acid Chemical compound OC(=O)CNC1=CC=CC(Cl)=C1 KZXFAYGKDCLTER-UHFFFAOYSA-N 0.000 description 1
- AEXFITBEFOTRCS-UHFFFAOYSA-N 2-(4-acetylanilino)acetic acid Chemical compound CC(=O)C1=CC=C(NCC(O)=O)C=C1 AEXFITBEFOTRCS-UHFFFAOYSA-N 0.000 description 1
- VYFGVOMFCZSJPI-UHFFFAOYSA-N 2-(4-carbamoylanilino)acetic acid Chemical compound NC(=O)C1=CC=C(NCC(O)=O)C=C1 VYFGVOMFCZSJPI-UHFFFAOYSA-N 0.000 description 1
- FWALJUXKWWBNEO-UHFFFAOYSA-N 2-(4-chloroanilino)acetic acid Chemical compound OC(=O)CNC1=CC=C(Cl)C=C1 FWALJUXKWWBNEO-UHFFFAOYSA-N 0.000 description 1
- DVYVBENBIMEAJZ-UHFFFAOYSA-N 2-(n-methylanilino)acetic acid Chemical compound OC(=O)CN(C)C1=CC=CC=C1 DVYVBENBIMEAJZ-UHFFFAOYSA-N 0.000 description 1
- ZXEFJAWHZVPDKS-UHFFFAOYSA-N 2-[(3-cyanophenyl)azaniumyl]acetate Chemical compound OC(=O)CNC1=CC=CC(C#N)=C1 ZXEFJAWHZVPDKS-UHFFFAOYSA-N 0.000 description 1
- LTHJXDSHSVNJKG-UHFFFAOYSA-N 2-[2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOCCOC(=O)C(C)=C LTHJXDSHSVNJKG-UHFFFAOYSA-N 0.000 description 1
- BCHZICNRHXRCHY-UHFFFAOYSA-N 2h-oxazine Chemical compound N1OC=CC=C1 BCHZICNRHXRCHY-UHFFFAOYSA-N 0.000 description 1
- AGIJRRREJXSQJR-UHFFFAOYSA-N 2h-thiazine Chemical compound N1SC=CC=C1 AGIJRRREJXSQJR-UHFFFAOYSA-N 0.000 description 1
- AODAQIOEZVDQLS-UHFFFAOYSA-N 3,4-ditert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=C(O)C(O)=C1C(C)(C)C AODAQIOEZVDQLS-UHFFFAOYSA-N 0.000 description 1
- MWKAGZWJHCTVJY-UHFFFAOYSA-N 3-hydroxyoctadecan-2-one Chemical compound CCCCCCCCCCCCCCCC(O)C(C)=O MWKAGZWJHCTVJY-UHFFFAOYSA-N 0.000 description 1
- GJCOSYZMQJWQCA-UHFFFAOYSA-N 9H-xanthene Chemical compound C1=CC=C2CC3=CC=CC=C3OC2=C1 GJCOSYZMQJWQCA-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229920001634 Copolyester Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- PCNDJXKNXGMECE-UHFFFAOYSA-N Phenazine Natural products C1=CC=CC2=NC3=CC=CC=C3N=C21 PCNDJXKNXGMECE-UHFFFAOYSA-N 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 229920002319 Poly(methyl acrylate) Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- UIZLQMLDSWKZGC-UHFFFAOYSA-N cadmium helium Chemical compound [He].[Cd] UIZLQMLDSWKZGC-UHFFFAOYSA-N 0.000 description 1
- 239000000298 carbocyanine Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 229920003086 cellulose ether Polymers 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229960000956 coumarin Drugs 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- PESYEWKSBIWTAK-UHFFFAOYSA-N cyclopenta-1,3-diene;titanium(2+) Chemical compound [Ti+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 PESYEWKSBIWTAK-UHFFFAOYSA-N 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 125000005520 diaryliodonium group Chemical group 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- CPBQJMYROZQQJC-UHFFFAOYSA-N helium neon Chemical compound [He].[Ne] CPBQJMYROZQQJC-UHFFFAOYSA-N 0.000 description 1
- LNCPIMCVTKXXOY-UHFFFAOYSA-N hexyl 2-methylprop-2-enoate Chemical compound CCCCCCOC(=O)C(C)=C LNCPIMCVTKXXOY-UHFFFAOYSA-N 0.000 description 1
- 229920006158 high molecular weight polymer Polymers 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- QDLAGTHXVHQKRE-UHFFFAOYSA-N lichenxanthone Natural products COC1=CC(O)=C2C(=O)C3=C(C)C=C(OC)C=C3OC2=C1 QDLAGTHXVHQKRE-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- DZVCFNFOPIZQKX-LTHRDKTGSA-M merocyanine Chemical compound [Na+].O=C1N(CCCC)C(=O)N(CCCC)C(=O)C1=C\C=C\C=C/1N(CCCS([O-])(=O)=O)C2=CC=CC=C2O\1 DZVCFNFOPIZQKX-LTHRDKTGSA-M 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 1
- 229940117841 methacrylic acid copolymer Drugs 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- CJTYSXOOAFRHEC-UHFFFAOYSA-N n-hydroxy-n-phenylnitramide Chemical compound [O-][N+](=O)N(O)C1=CC=CC=C1 CJTYSXOOAFRHEC-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- QWYZFXLSWMXLDM-UHFFFAOYSA-M pinacyanol iodide Chemical compound [I-].C1=CC2=CC=CC=C2N(CC)C1=CC=CC1=CC=C(C=CC=C2)C2=[N+]1CC QWYZFXLSWMXLDM-UHFFFAOYSA-M 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001483 poly(ethyl methacrylate) polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000002491 polymer binding agent Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920001290 polyvinyl ester Polymers 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- WVIICGIFSIBFOG-UHFFFAOYSA-N pyrylium Chemical compound C1=CC=[O+]C=C1 WVIICGIFSIBFOG-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007127 saponification reaction Methods 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical compound [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 description 1
- YXFVVABEGXRONW-UHFFFAOYSA-N toluene Substances CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical class C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は光重合性層を有する感光
材料に関するものであり、特に貯蔵安定性に優れた、高
感度な光重合性材料に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photosensitive material having a photopolymerizable layer, and more particularly to a highly sensitive photopolymerizable material having excellent storage stability.
【0002】[0002]
【従来の技術】光重合性感光材料は、印刷版、レジスト
材料、ホログラム感材などとして広く使用されている。
しかし、貯蔵安定性は低い事が知られている。特に高温
又は高温多湿下での保存安定性に問題があった。その対
策として、重合禁止剤や金属キレート剤等の添加が知ら
れている。また、特公平4−21184に開示されてい
る、保護層への鉱酸又は低分子有機酸の添加、特開昭6
0−262153、特開平1−201652に開示され
ている光重合性層への酸の添加が知られている。2. Description of the Related Art Photopolymerizable photosensitive materials are widely used as printing plates, resist materials, hologram sensitive materials and the like.
However, it is known that the storage stability is low. In particular, there was a problem with storage stability at high temperatures or under high temperature and high humidity. As a countermeasure, addition of a polymerization inhibitor or a metal chelating agent is known. Further, addition of a mineral acid or a low molecular weight organic acid to the protective layer, which is disclosed in JP-B-4-21184, JP-A-Sho 6
No. 0-262153, the addition of an acid to the photopolymerizable layer disclosed in JP-A-1-201652 is known.
【0003】[0003]
【発明が解決しようとする課題】しかしながら前記の方
法ではフェニルグリシン誘導体を含有する光重合性組成
物では不十分であり貯蔵安定性に優れた特に高温、又高
温多湿下に長時間保存しても性能の劣化しない光重合性
感光材料が求められる。However, the photopolymerizable composition containing the phenylglycine derivative is not sufficient in the above-mentioned method and is excellent in storage stability, especially at high temperature or even when stored for a long time under high temperature and high humidity. A photopolymerizable photosensitive material that does not deteriorate in performance is required.
【0004】[0004]
【課題を解決するための手段】本発明は以上の課題を解
決すべく、つまりフェニルグリシン誘導体を含有する光
重合性感光材料の貯蔵安定性を向上させる目的で、鋭意
研究を重ねた結果、本発明を完成するに到った。すなわ
ち本発明は、支持体上に、少なくともアクリル酸およ
び、またはメタクリル酸を含む単量体を重合して得られ
る高分子重合体層を設け、さらに少なくとも(a)一種
の常温で非ガス状のエチレン性不飽和化合物(b)一般
式の化1で示されるフェニルグリシン誘導体(c)光開
始剤を含有する光重合性組成物からなる層を設けてなる
光重合性感光材料である。本発明で用いるアクリル酸お
よびまたは、メタクリル酸を重合して得られる高分子重
合体としては、分子量1,000 〜100,000 の範囲であれば
適当である。上記のアクリル酸およびまたは、メタクリ
ル酸を重合して得られる高分子重合体は単独、又は2以
上の組み合わせで使用することができる。In order to solve the above problems, that is, to improve the storage stability of a photopolymerizable photosensitive material containing a phenylglycine derivative, the present invention has been earnestly studied, and as a result, The invention was completed. That is, the present invention provides a high-molecular polymer layer obtained by polymerizing a monomer containing at least acrylic acid and / or methacrylic acid on a support, and further at least (a) one type of non-gaseous substance at room temperature. An ethylenically unsaturated compound (b) is a photopolymerizable photosensitive material provided with a layer of a photopolymerizable composition containing a phenylglycine derivative (c) photoinitiator represented by the general formula (1). As the high molecular weight polymer obtained by polymerizing acrylic acid and / or methacrylic acid used in the present invention, a molecular weight of 1,000 to 100,000 is suitable. The above polymer obtained by polymerizing acrylic acid and / or methacrylic acid can be used alone or in combination of two or more.
【0005】少なくともアクリル酸および、またはメタ
クリル酸を含む単量体を重合して得られる高分子重合体
層を設けるための支持体の処理方法としては、処理液濃
度0.01〜30重量%の範囲、液温10〜90℃の範
囲、処理時間5〜300秒の範囲で浸漬処理すれば適当
である。このようにして得られた支持体上に少なくとも
(a)一種の常温で非ガス状のエチレン性不飽和化合物
(b)一般式化1で示されるフェニルグリシン誘導体
(c)光開始剤を含有する光重合性組成物からなる層を
設けてなる光重合性感光材料を含有する光重合性組成物
が設けられる。本発明に用いられるエチレン性不飽和化
合物としては遊離ラジカルで開始される連鎖成長付加反
応に適した単量体であればどのようなものでも良い。As a method for treating a support for providing a polymer layer obtained by polymerizing a monomer containing at least acrylic acid and / or methacrylic acid, a treatment solution having a concentration of 0.01 to 30% by weight is used. It is suitable to carry out the immersion treatment within the range, the temperature range of 10 to 90 ° C. and the treatment time range of 5 to 300 seconds. On the support thus obtained, at least (a) one kind of non-gaseous ethylenically unsaturated compound at room temperature (b) phenylglycine derivative represented by the general formula 1 (c) photoinitiator is contained. There is provided a photopolymerizable composition containing a photopolymerizable photosensitive material provided with a layer composed of the photopolymerizable composition. The ethylenically unsaturated compound used in the present invention may be any monomer as long as it is a monomer suitable for the chain growth addition reaction initiated by free radicals.
【0006】好ましい例としては、ペンタエリスリトー
ルトリアクリレート、ポリエチレングリコールジアクリ
レート、トリエチレングリコールジアクリレート、トリ
メチロールプロパントリアクリレート、トリメチロール
プロパントリメタクリレートなどが挙げられる。Preferable examples include pentaerythritol triacrylate, polyethylene glycol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate and the like.
【0007】本発明で用いられるフェニルグリシン誘導
体の具体例としては、N−フェニルグリシン、N−(3
−クロロフェニル)グリシン、N−(2,4ジクロルフ
ェニル)グリシン、N−(2−ニトロフェニリル)グリ
シン、N−(4−アセチルフェニル)グリシン、N−
(4−ニトロフェニリル)グリシン、N−(4−シアノ
フェニリル)グリシン、N−(4−クロロフェニル)グ
リシン、N−(2−メチルフェニル)グリシン、N−
(2−メトキシフェニル)グリシン、N−(2,4−ジ
メトキシフェニル)グリシン、N−メチル−N−フェニ
ルグリシン、N−(3シアノフェニル)グリシン、N−
(4−カルバモイルフェニル)グリシン、N−(4−ス
ルファモイルフェニル)グリシン、などがあげられる。Specific examples of the phenylglycine derivative used in the present invention include N-phenylglycine and N- (3
-Chlorophenyl) glycine, N- (2,4 dichlorophenyl) glycine, N- (2-nitrophenylyl) glycine, N- (4-acetylphenyl) glycine, N-
(4-Nitrophenylyl) glycine, N- (4-cyanophenylyl) glycine, N- (4-chlorophenyl) glycine, N- (2-methylphenyl) glycine, N-
(2-Methoxyphenyl) glycine, N- (2,4-dimethoxyphenyl) glycine, N-methyl-N-phenylglycine, N- (3cyanophenyl) glycine, N-
(4-carbamoylphenyl) glycine, N- (4-sulfamoylphenyl) glycine, and the like.
【0008】本発明に用いられる光開始剤としては、特
に限定するのもではないが、α−カルボニル化合物、ア
シロインエーテル、芳香族アシロイン化合物、多核キノ
ン、ヘキサアリールビスイミダゾール、トリハロメチル
−S−トリアジン、アクリジン、フェナジン、また、ト
リフェニルスルホニウム塩やジアリールヨードニウム塩
などのオニウム塩、チタノセン、鉄アレン錯体などが含
まれる。The photoinitiator to be used in the present invention is not particularly limited, but α-carbonyl compound, acyloin ether, aromatic acyloin compound, polynuclear quinone, hexaarylbisimidazole, trihalomethyl-S- Also included are triazine, acridine, phenazine, onium salts such as triphenylsulfonium salts and diaryliodonium salts, titanocene, iron allene complexes and the like.
【0009】本発明に増感剤を配合することもできる。
特に限定するものではないが好ましくはシアニン、カル
ボシアニン、メロシアニン、芳香族カルボニル、スチリ
ル、アクリジン、チアジン、オキサジン、クマリン、多
環芳香族炭化水素、ポリアリールアミン、ピリリウム、
チアピリリウム、キサンテンよりなる群より選択される
少なくとも1種の色素でありる。A sensitizer may be added to the present invention.
Although not particularly limited, preferably cyanine, carbocyanine, merocyanine, aromatic carbonyl, styryl, acridine, thiazine, oxazine, coumarin, polycyclic aromatic hydrocarbon, polyarylamine, pyrylium,
It is at least one dye selected from the group consisting of thiapyrylium and xanthene.
【0010】本発明組成物中には好ましくは熱可塑性高
分子量有機重合体結合剤を存在させてもよい。重合体結
合剤のタイプとしては(1)テレフタル酸、イソフタル
酸、セバシン酸、アジピン酸およびヘキサヒドロテレフ
タル酸に基くコポリエステル、(2)ポリアミド、
(3)ビニリデンクロリド共重合体、(4)エチレン/
ビニルアセテート共重合体、(5)セルロースエーテ
ル、(6)ポリエチレン、(7)合成ゴム、(8)セル
ロースエステル、(9)ポリビニルアセテート/アクリ
レートおよびポリビニルアセテート/メタクリレート共
重合体を含むポリビニルエステル、(10)ポリアクリレ
ートおよびポリα−アルキルアクリレートエステル例え
ばポリメチルアクリレートおよびポリエチルメタクリレ
ート、(11)4,000 〜4,000,000 の重量平均分子量を有
する高分子量エチレンオキシド重合体(ポリエチレング
リコール)、(12)ポリ塩化ビニルおよびその共重合体、
(13)ポリビニルアセタール、(14)ポリホルムアルデヒ
ド、(15)ポリウレタン、(16)ポリカーボネートおよび
(17) ポリスチレンが挙げられる。A thermoplastic high molecular weight organic polymer binder may preferably be present in the composition of the present invention. Polymeric binder types include (1) terephthalic acid, isophthalic acid, sebacic acid, adipic acid and hexahydroterephthalic acid based copolyesters, (2) polyamides,
(3) vinylidene chloride copolymer, (4) ethylene /
Vinyl acetate copolymer, (5) cellulose ether, (6) polyethylene, (7) synthetic rubber, (8) cellulose ester, (9) polyvinyl ester including polyvinyl acetate / acrylate and polyvinyl acetate / methacrylate copolymer, ( 10) Polyacrylates and poly α-alkyl acrylate esters such as polymethyl acrylate and polyethyl methacrylate, (11) high molecular weight ethylene oxide polymers having a weight average molecular weight of 4,000 to 4,000,000 (polyethylene glycol), (12) polyvinyl chloride and its Copolymer,
(13) Polyvinyl acetal, (14) Polyformaldehyde, (15) Polyurethane, (16) Polycarbonate and
(17) Examples include polystyrene.
【0011】本発明組成物において、特に好ましい重合
体結合剤としては、未露光光重合性コーティングが例え
ばアルカリ性溶液である主として水性の溶液には可溶性
であるが、活性線放射の露光後は比較的それに不溶性と
なるような重合体結合剤が好ましい。典型的にはこれら
の要求を満足させる重合体はカルボキシル化重合体、例
えば遊離カルボン酸基含有ビニル付加重合体である。メ
タクリル酸共重合体、アクリル酸共重合体、クロトン酸
共重合体、マレイン酸共重合体、部分エステル化マレイ
ン酸共重合体などがある。また側鎖にカルボキシル基を
有するセルロースや、水酸基を側鎖に含有する重合体に
環状酸無水物を付加させた物などがある。In the compositions of the present invention, a particularly preferred polymeric binder is one in which the unexposed photopolymerizable coating is soluble in predominantly aqueous solutions, such as alkaline solutions, but relatively after exposure to actinic radiation. Polymeric binders that are insoluble in it are preferred. Polymers that typically meet these requirements are carboxylated polymers, such as vinyl addition polymers containing free carboxylic acid groups. There are methacrylic acid copolymer, acrylic acid copolymer, crotonic acid copolymer, maleic acid copolymer, partially esterified maleic acid copolymer and the like. In addition, there are cellulose having a carboxyl group in the side chain, a polymer having a hydroxyl group in the side chain and a cyclic acid anhydride added thereto, and the like.
【0012】更に、その他に光重合性組成物を製造中あ
るいは保存中において重合可能なエチレン性不飽和化合
物の不要な熱重合を阻止するために少量の熱重合禁止剤
を添加することが望ましい。適当な熱重合禁止剤として
は、ハイドロキノン、p−メトキシフェノール、ジ−t
−ブチル−p−クレゾール、ピロガロール、ジ−t−ブ
チルカテコール、ベンゾキノン、2−メルカプトベンズ
イミダゾール、N−ニトロフェニルヒドロキシアミン第
一セリウムなどが挙げられる。熱重合禁止剤の添加量
は、全組成物に対して、0.01〜5重量%が好ましい。ま
た必要に応じて、不活性添加物、例えば非重合性可塑
剤、染料、顔料および充填剤などは光重合性を著しく阻
害しない程度に配合してもよい。In addition, it is desirable to add a small amount of a thermal polymerization inhibitor in order to prevent unnecessary thermal polymerization of the polymerizable ethylenically unsaturated compound during the production or storage of the photopolymerizable composition. Suitable thermal polymerization inhibitors include hydroquinone, p-methoxyphenol and di-t.
-Butyl-p-cresol, pyrogallol, di-t-butylcatechol, benzoquinone, 2-mercaptobenzimidazole, N-nitrophenylhydroxyamine primary cerium and the like. The addition amount of the thermal polymerization inhibitor is preferably 0.01 to 5% by weight based on the total composition. Further, if necessary, an inert additive such as a non-polymerizable plasticizer, a dye, a pigment and a filler may be blended to such an extent that the photopolymerizability is not significantly impaired.
【0013】なお本発明光重合性組成物は広範囲な種類
の基材上にコーティングすることができる。ここで「基
材」とはすべての天然または合成支持体、好ましくは可
撓性または剛性のフィルムまたはシートの形で存在し得
るものを意味している。例えば素材は金属シートまたは
箔、合成有機樹脂のシートまたはフィルム、セルロース
紙、ファイバーボードその他またはこれらの物質の2種
またはそれ以上のものの複合体でありうる。特定の素材
としてはアルミナプラストアルミニウム、アノード処理
アルミニウム、アルミプラストポリエチレンテレフタレ
ートフィルム、ポリエチレンテレフタレートフィルム、
静電放電処理ポリエチレンテレフタレートフィルム、ポ
リビニルアルコールをコーティングした紙、交叉結合ポ
リエステルコーティング紙、ナイロン、ガラス、セルロ
ースアセテートフィルムその他が挙げられる。The photopolymerizable composition of the present invention can be coated on a wide variety of substrates. By "substrate" herein is meant any natural or synthetic support, preferably one that may be present in the form of a flexible or rigid film or sheet. For example, the material can be a metal sheet or foil, a synthetic organic resin sheet or film, cellulosic paper, fiberboard or the like or a composite of two or more of these materials. Specific materials include alumina plast aluminum, anodized aluminum, aluminum plast polyethylene terephthalate film, polyethylene terephthalate film,
Examples include electrostatic discharge treated polyethylene terephthalate film, polyvinyl alcohol coated paper, cross-linked polyester coated paper, nylon, glass, cellulose acetate film and the like.
【0014】特定の素材は一般に関連する適用目的によ
り決定される。例えば印刷回路が製造される場合には、
素材はファイバーボード上に銅をコーティングしたプレ
ートでありうる。平版印刷プレートの製造においては、
素材はアノード処理アルミニウムでありうる。The particular material is generally determined by the relevant application purpose. For example, if a printed circuit is manufactured,
The material can be a plate coated with copper on a fiberboard. In the manufacture of lithographic printing plates,
The material can be anodized aluminum.
【0015】本発明において、光重合性組成物の厚みは
0.1 〜250 μmであり、好ましくは0.5 〜50μmであ
る。望ましい厚みは用途により決められる。基板に設け
られた光重合性組成物の層の上には、空気中の酸素によ
る重合抑制作用を防止するために、ポリビニルアルコー
ルなどのような酸素遮断性に優れたポリマーよりなる保
護層を設けるか、ポリエチレンテレフタレートフィルム
などのカバーフィルムをラミメートしてもよい。In the present invention, the thickness of the photopolymerizable composition is
The thickness is 0.1 to 250 μm, preferably 0.5 to 50 μm. The desired thickness is determined by the application. On the layer of the photopolymerizable composition provided on the substrate, a protective layer made of a polymer having an excellent oxygen barrier property, such as polyvinyl alcohol, is provided in order to prevent a polymerization inhibitory action by oxygen in the air. Alternatively, a cover film such as a polyethylene terephthalate film may be laminated.
【0016】露光に使用される光源としてはカーボンア
ークランプ、高圧、中圧、低圧の各水銀燈、キセノンラ
ンプ、メタルハライトランプ、アルゴンイオンレーザ
ー、ヘリウムカドミウムレーザー、ヘリウムネオンレー
ザーなどのレーザー、蛍光灯、タンクステン灯、及び太
陽光などが使用できる。The light source used for the exposure is a carbon arc lamp, high pressure, medium pressure, low pressure mercury lamp, xenon lamp, metal halide lamp, argon ion laser, laser such as helium cadmium laser, helium neon laser, fluorescent lamp, Tank stain light and sunlight can be used.
【0017】[0017]
【実施例】以下実施例により本発明を具体的に説明する
が、ここに部および%は重量基準である。 実施例1 ブラシ研磨した厚さ0.24mmのアルミニウム板を5%水酸
化ナトリウムに30℃1分浸漬した後、水洗後硝酸で中和
洗浄し、水洗した。これを10%硫酸中で電流密度3A/
dm2で3g/m2の厚さになるように陽極酸化処理した。
その後、35℃0.1 %ポリアクリル酸水溶液に1分間浸漬
後、水洗い乾燥してアルミ基板を得た。次に下記組成の
感光層塗工液を塗布し、熱風乾燥機にて 100℃1分間乾
燥し、厚さ 2.0g/m2の塗膜を得た。 (感光層塗工液組成) ポリ(メタクリル酸メチル/メタクリル酸) 52部 85/15モル比 分子量 8万 テトラエチレングリコールジアクリレート 40部 2,2'-(O-クロロフェニル)-4,4',5,5'-テトラフェニルビスイミ ダゾール 5部 ミヒラーケトン 3部 N−フェニルグリシン 6部 メタノール 200部 酢酸エチル 80部 クロロホルム 120部EXAMPLES The present invention will be described in more detail with reference to the following examples, in which parts and% are based on weight. Example 1 A brush-polished aluminum plate having a thickness of 0.24 mm was immersed in 5% sodium hydroxide at 30 ° C. for 1 minute, washed with water, neutralized with nitric acid, and washed with water. Current density 3A / in 10% sulfuric acid
It was anodized to have a thickness of 3 g / m 2 in dm 2 .
After that, it was immersed in a 0.1% polyacrylic acid aqueous solution at 35 ° C. for 1 minute, washed with water and dried to obtain an aluminum substrate. Next, a photosensitive layer coating solution having the following composition was applied and dried at 100 ° C. for 1 minute with a hot air dryer to obtain a coating film having a thickness of 2.0 g / m 2 . (Composition of photosensitive layer coating liquid) Poly (methyl methacrylate / methacrylic acid) 52 parts 85/15 molar ratio Molecular weight 80,000 Tetraethylene glycol diacrylate 40 parts 2,2 '-(O-chlorophenyl) -4,4', 5,5'-Tetraphenylbisimidazole 5 parts Michler's ketone 3 parts N-phenylglycine 6 parts Methanol 200 parts Ethyl acetate 80 parts Chloroform 120 parts
【0018】次に下記組成の保護層塗工液を塗布し、熱
風乾燥機にて 100℃1分間乾燥し、1g/m2の厚さの保
護層を設けて試験片を得た。 (保護層塗工液組成) ポリビニルアルコール 100部 (完全ケン化、重合度 500) ノニオン系界面活性剤 1部 (ノイゲンEA150 第一工業製薬) 水 900部 試験片は、40℃80%RHの条件に、10日間放置した後、
超高圧水銀灯(オーク社製明室プリンター) で画像露光
し、ネガ型PS版用現像液(富士写真フィルム、DN-3C
)1:1希釈液(30℃)に20秒間浸漬し、水洗して未
硬化部分を除去した後、風乾して平版印刷版を得た。こ
うして得られた平版印刷版をリョウビ製印刷機3200MCD
を用い、市販黒インキで上質紙に1万部印刷したところ
で地汚れを評価した。印刷版は次の3段階で評価した。 ○:良好 △:一部地汚れ発生 ×:地汚れ発生Next, a protective layer coating solution having the following composition was applied and dried at 100 ° C. for 1 minute with a hot air drier to provide a protective layer having a thickness of 1 g / m 2 to obtain a test piece. (Composition of coating liquid for protective layer) Polyvinyl alcohol 100 parts (Complete saponification, degree of polymerization 500) Nonionic surfactant 1 part (Neugen EA150 Daiichi Kogyo Seiyaku) Water 900 parts After leaving for 10 days,
Imagewise exposed with an ultra-high pressure mercury lamp (Oak's bright room printer), and a negative PS plate developer (Fuji Photo Film, DN-3C).
) It was immersed in a 1: 1 diluted solution (30 ° C.) for 20 seconds, washed with water to remove the uncured portion, and air-dried to obtain a lithographic printing plate. The lithographic printing plate obtained in this way was applied to the Ryobi printing machine 3200MCD.
The background stain was evaluated when 10,000 copies were printed on a high-quality paper using a commercially available black ink. The printing plate was evaluated in the following three stages. ○: Good △: Partial background stain occurred ×: Background stain occurred
【0019】実施例2 実施例1においてポリアクリル酸のかわりにポリメタク
リル酸を用い、以下実施例1と同じ操作を繰り返して印
刷版の地汚れを評価した。Example 2 Polymethacrylic acid was used instead of polyacrylic acid in Example 1, and the same operation as in Example 1 was repeated to evaluate the background stain of the printing plate.
【0020】比較例1 実施例1において35℃0.1 %ポリビニル水溶液の代わり
に70℃2 %3号水ガラスを用い、以下実施例1と同じ操
作を繰り返して印刷の地汚れを評価した。実施例1,2
比較例1の結果を表1に示す。COMPARATIVE EXAMPLE 1 The same operation as in Example 1 was repeated and the background smear of printing was evaluated by using 70 ° C. 2% water glass No. 3 in place of the 35 ° C. 0.1% polyvinyl aqueous solution in Example 1. Examples 1 and 2
The results of Comparative Example 1 are shown in Table 1.
【0021】[0021]
【表1】 [Table 1]
【0022】実施例5〜9 実施例1に記載したアルミ基板の上に下記組成の感光層
塗工液を塗布し、熱風乾燥して、厚さ1.8 g/m2の塗膜
を得た。 (感光層塗工液組成物) ポリ(メタクリル酸メチル/ メタクリル酸/メタクリル酸n-ヘキシル) 52部 モル比 65/15/20 テトラエチレングリコールジメタクリレート 40部 (η5-シクロ ペンタジエニル) ( η6-トルエン) 鉄 (II) ヘキサフルオロホスフェート 5部 7-ジエチルアミノ-3-(2-ベンゾイミダゾリル-クマリン 3部 フェニルグリシン誘導体 6部 メチルエチルケトン 150部 ジメチルホルムアミド 150部 次に実施例1と同じ保護層塗工液を塗布し、熱風乾燥機
にて 100℃1分間乾燥し、 1.2g/m2の厚さの保護層を
設けて試験片を得た。得られた試験片を40℃80%RHの条
件下に10日間放置した後、アルゴンイオンレーザー
(50mW、ビーム径25μ)で画像状に走査露光した。そ
して実施例1に用いた現像液で30℃にて23秒浸漬し、水
洗して未硬化部分を除去をして風乾し、平版印刷版を得
た。そして実施例1と同様に印刷試験を行ったところ地
汚れがなく良好に印刷することができた。Examples 5 to 9 A coating solution for the photosensitive layer having the following composition was applied on the aluminum substrate described in Example 1 and dried with hot air to obtain a coating film having a thickness of 1.8 g / m 2 . (Photosensitive layer coating liquid composition) Poly (methyl methacrylate / methacrylic acid / n-hexyl methacrylate) 52 parts Molar ratio 65/15/20 Tetraethylene glycol dimethacrylate 40 parts (η 5 -Cyclopentadienyl) (η 6 -Toluene) iron (II) hexafluorophosphate 5 parts 7-diethylamino-3- (2-benzimidazolyl-coumarin 3 parts phenylglycine derivative 6 parts methyl ethyl ketone 150 parts dimethylformamide 150 parts Next, the same protective layer coating solution as in Example 1 Was applied and dried in a hot air drier for 1 minute at 100 ° C., and a protective layer having a thickness of 1.2 g / m 2 was provided to obtain a test piece. After leaving it for 10 days, it was imagewise scanned and exposed with an argon ion laser (50 mW, beam diameter 25 μ), and immersed in the developer used in Example 1 at 30 ° C. for 23 seconds and washed with water to obtain an uncured portion. Remove Dried to obtain a lithographic printing plate. And scumming was carried out printing tests as in Example 1 was able to satisfactorily print without.
【0023】比較例2〜4 実施例3、5、6におけるポリアクリル酸の代わりに70
℃2%3号水ガラスを用い、以下同じ操作を繰り返して
印刷の地汚れを評価した。以上の結果を表2に示す。Comparative Examples 2 to 4 70 instead of polyacrylic acid in Examples 3, 5 and 6
Using the No. 3 water glass at 2 ° C., the same operation was repeated, and the background stain of the printing was evaluated. The above results are shown in Table 2.
【0024】[0024]
【表2】 [Table 2]
【0025】[0025]
【発明の効果】本発明の光重合性感光材料は、貯蔵安定
性にすぐれ長期的保存した後も、現像性が低下せず、平
版印刷版の場合には非画像部に汚れが発生せず良好な印
刷物を得ることができる。The photopolymerizable light-sensitive material of the present invention has excellent storage stability and does not deteriorate in developability even after long-term storage. In the case of a lithographic printing plate, stains do not occur on non-image areas. Good printed matter can be obtained.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 H05K 3/06 H ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display H05K 3/06 H
Claims (1)
び、またはメタクリル酸を含む単量体を重合して得られ
る高分子重合体層を設け、さらに少なくとも(a)一種
の常温で非ガス状のエチレン性不飽和化合物(b)下記
一般式化1で示されるフェニルグリシン誘導体(c)光
開始剤を含有する光重合性組成物からなる層を設けてな
る光重合性感光材料。 【化1】 式中R1 はC1 〜C12のアルキル基、C2 〜C12のアル
ケニル基、C2 〜C12のアルキニル基、C1 〜C8 のア
ルコキシ基、シアノ基、アルキルチオ基、フェノキシ
基、C2 〜C6 のモノカルボン酸およびエステルおよび
アミド、フェニル基、C2 〜C5 のアルカノイル基、ア
ンモニウム塩、ピリジニウム基、ニトロ基、アルキルス
ルフィニル基、アルキルスルフォニル基、スルファモノ
ル基より選ばれ、ベンゼン環と縮合多環化合物を形成し
てもよいnは0または1でありR2,R3 は同じかまたは
異なる基であり、水素または、C1 〜C12のアルキル基
から選ばれるものである。1. A high-molecular polymer layer obtained by polymerizing a monomer containing at least acrylic acid and / or methacrylic acid is provided on a support, and at least (a) one kind of non-gaseous at room temperature. A photopolymerizable photosensitive material comprising an ethylenically unsaturated compound (b), a phenylglycine derivative represented by the following general formula (1), and a layer comprising a photopolymerizable composition containing a photoinitiator (c). Embedded image In the formula, R 1 is a C 1 to C 12 alkyl group, a C 2 to C 12 alkenyl group, a C 2 to C 12 alkynyl group, a C 1 to C 8 alkoxy group, a cyano group, an alkylthio group, a phenoxy group, monocarboxylic acids and esters and amides of C 2 -C 6, phenyl group, an alkanoyl group of C 2 -C 5, an ammonium salt, a pyridinium group, a nitro group, an alkylsulfinyl group, alkylsulfonyl group, selected from Surufamonoru group, benzene N, which may form a condensed polycyclic compound with a ring, is 0 or 1, R 2 and R 3 are the same or different groups, and are selected from hydrogen or a C 1 to C 12 alkyl group. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20863094A JPH0876369A (en) | 1994-09-01 | 1994-09-01 | Photopolymerizable photosensitive material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20863094A JPH0876369A (en) | 1994-09-01 | 1994-09-01 | Photopolymerizable photosensitive material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0876369A true JPH0876369A (en) | 1996-03-22 |
Family
ID=16559414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20863094A Pending JPH0876369A (en) | 1994-09-01 | 1994-09-01 | Photopolymerizable photosensitive material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0876369A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001071428A1 (en) * | 2000-03-21 | 2001-09-27 | Hitachi Chemical Co., Ltd. | Photosensitive resin composition, photosensitive element comprising the same, method for producing resist pattern, and method for producing printed wiring board |
| JP2005309442A (en) * | 2000-03-21 | 2005-11-04 | Hitachi Chem Co Ltd | Photosensitive resin composition, photosensitive element using same, method for manufacturing resist pattern, and method for manufacturing printed-wiring board |
-
1994
- 1994-09-01 JP JP20863094A patent/JPH0876369A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001071428A1 (en) * | 2000-03-21 | 2001-09-27 | Hitachi Chemical Co., Ltd. | Photosensitive resin composition, photosensitive element comprising the same, method for producing resist pattern, and method for producing printed wiring board |
| JP2005309442A (en) * | 2000-03-21 | 2005-11-04 | Hitachi Chem Co Ltd | Photosensitive resin composition, photosensitive element using same, method for manufacturing resist pattern, and method for manufacturing printed-wiring board |
| US7220533B2 (en) | 2000-03-21 | 2007-05-22 | Hitachi Chemical Co., Ltd. | Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, and method for producing printed wiring board |
| US7232647B2 (en) * | 2000-03-21 | 2007-06-19 | Hitachi Chemical Co., Ltd. | Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board |
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