JPH0810798B2 - Rotary head electronic component mounting equipment - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a rotary head type electronic component mounting apparatus, and more specifically, to an electronic component such as a capacitor chip or a resistor chip that requires low mounting accuracy and a lead. Have
The present invention relates to a means for mounting electronic components such as QFP, which are required to have a high mounting accuracy, on a board together.

(Prior Art) There is known an electronic component mounting apparatus including a rotary head in which a large number of suction heads for electronic components are arranged side by side in the circumferential direction (for example, JP-A-60-171000). See figure). This kind of electronic component mounting device is designed to pick up electronic components equipped in the table moving device by the nozzle of the suction head by the index rotation of the rotary head, take up, and transfer and mount it on the substrate positioned on the XY table. Since it is possible to mount three or more electronic components on the substrate per second, it is now widely used as a high-speed mounter.

By the way, the electronic parts taken up by the nozzle are
Since there is a positional deviation in the XYθ directions, this positional deviation must be corrected when mounting on a substrate. As a positional deviation correcting means for this purpose, the conventional mounting device is provided with a CCD camera in the middle of the transfer path of the electronic component by the index rotation of the rotary head, detects the positional deviation of the electronic component in the XYθ direction, and detects the θ direction. The positional deviation in the (rotation direction) is corrected by rotating the nozzle in the θ direction, and the positional deviation in the XY direction is corrected by driving the XY table and moving the substrate in the XY direction.

(Problems to be Solved by the Invention) In recent years, many electronic components having leads such as QFP have been mounted on a substrate. Electronic components having such leads have the following (i) ~ (Ii
For the reason of i), it is difficult to mount on the substrate by the rotary head mounting device.

(I) In recent years, the number of leads tends to increase due to the demand for high density and high integration, and the number of leads reaches 300 or more. Therefore, the lead width and pitch are extremely small (for example, 0.
(3 mm or less), and the required mounting accuracy is becoming stricter, but the resolution of the CCD camera matches the electronic parts with low required mounting accuracy, so it is necessary to meet the required accuracy. It is extremely difficult to observe precisely.

(Ii) Electronic parts having leads are becoming large in size, and one large side has a side of 5 cm or more. In order to capture such a large electronic component in the field of view of the camera, it is necessary to reduce the magnification of the camera. However, if the magnification is reduced, the observation accuracy is inevitably lowered.

(Iii) Since the capacitor chip and the resistor chip are generally small in size, they are encapsulated in an electronic component encapsulating tape. Therefore, the capacitor chip and the resistor chip are mounted on the table of the table moving device as a tape unit, and are mounted on the nozzle of the rotary head. It can be automatically supplied. However, QFP
Electronic components with leads such as are generally large,
Moreover, when the mold body absorbs moisture in the air, at the time of reflow performed in a later step, this moisture vaporizes, and the vapor pressure easily causes cracks in the mold body,
It is stored in a tray, not enclosed in the above tape that easily absorbs moisture in the air. However, it is difficult to automatically supply the electronic components stored in the tray to the nozzles of the rotary head as they are.

For the above reasons, the capacitor chip and the resistor chip, which are required to have relatively low mounting accuracy, are mounted on the substrate at high speed by the rotary head mounting device, but the electronic component having the lead is mounted on the rotary head mounting device. However, it was not mounted on the substrate but was mounted separately at low speed by a single head type mounting device as shown in FIG. 3 of JP-A-60-171000.

In this way, electronic components with leads such as QFP have to be mounted on a substrate separately from the capacitor chip and the resistor chip, so that the work efficiency does not increase, and the rotary head type and the single head type are used. Since it was necessary to install a mounting device of each model and use both of them properly, the equipment cost soared, and the production management and maintenance management required labor.

Therefore, the present invention is applicable not only to electronic components such as capacitor chips and resistor chips with low required mounting accuracy but also to QF
An object of the present invention is to provide a rotary head type electronic component mounting apparatus capable of mounting an electronic component such as P having a required high mounting accuracy.

(Means for Solving the Problems) For this reason, the present invention is a rotary head type electronic component mounting apparatus in which fine leads for measuring leads of electronic components sucked by the nozzles of the suction head while moving in the XY directions. The measuring device is placed on the XY table on which the substrate is positioned, and the height of the lower end of the nozzle is adjusted according to the thickness of the electronic component in order to position the leads in the measuring area of this fine measuring device. The height adjusting means is provided.

Further, a table provided in the table moving device is provided with a mounting body for laterally mounting a plurality of electronic components having leads, and a supply device for electronic components is provided on the side of the table moving device. A parts supply device, a magazine in which trays in which electronic parts are stored are stacked and stored,
A temporary mounting stage disposed between the magazine and the table moving device, a sub-transfer head for transferring the electronic components of the tray to the stage, and an electronic component transferred to the stage It is composed of a transfer head that is transferred to the writing body.

(Operation) In the above configuration, the height adjusting means is driven to adjust the height of the nozzle according to the thickness of the electronic component having the leads, so that each lead is positioned in the measurement area of the fine measuring device. At the same time, the XY table is driven to move the fine measuring device in the horizontal direction to measure the positional deviation of the leads, and then the positional deviation is corrected and then mounted on the substrate.

Further, by providing a mounting body, a magazine accommodating trays in a stack, a temporary mounting stage, a sub-transfer head, a transfer head, etc., an electronic component having a lead does not have a lead such as a capacitor chip or a resistance chip. Like the electronic component, it is mounted on the substrate by a rotary head type electronic component mounting device.

Embodiments Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of a rotary head type electronic component mounting apparatus, in which 1 is a main body box, 2 is a rotary head rotatably mounted under the box 1, and 3 is an X table 5 and a Y table 4. It is an XY table. MX, M
Y is an X motor and a Y motor. Reference numeral 6 is a substrate set on the XY table 3 by a clamp member 10. On the lower surface of the rotary head 2, a large number of suction heads 7 are arranged in parallel along the circumferential direction thereof, and each suction head 7 is provided with a nozzle 8 projecting downward (also in FIG. 2). reference). The nozzle 8 sucks the electronic component C at its lower end by vacuum pressure.

FIG. 3 is a plan view of the electronic component mounting apparatus, where 100 is an X
The table moving device is arranged on the opposite side of the Y table 3, and its details will be described later. 13 is a table moving device 100
And a recognition device arranged between the XY table 3 and the CC
It is equipped with a D camera, and detects the positional deviation in the XYθ direction of the electronic component adsorbed to the lower end of the nozzle 8.

In FIG. 2, reference numeral 14 is a motor fast-adhered to the rotary head 2, and rotates the nozzle 8 in the θ direction (see FIG. 3) about its axis through the belt 15, the spline shaft 16 and the like. Then, the positional deviation of the electronic component C in the θ direction detected by the recognition device 13 is corrected. In addition, the electronic component C
For displacement in the XY direction, drive the XY table 3 and move the substrate 6
Correct by moving in the XY directions.

FIG. 5 shows a positioning means for the substrate 6 on the XY table 3, and 70 is a mounting table provided on the XY table 3, and a mounting plate 71 is disposed on the upper surface thereof. The clamp members 10 for clamping the substrate 6 from both sides are provided on both sides of the mounting plate 71. Further, the corners of the mounting plate 71 are horizontally rotatably pivoted on the mounting table 70 by hinges 72.

FIG. 6 shows a drive device 73 for horizontally rotating the mounting plate 71. Mθ is a motor, 75 is a feed screw, and 76 is a nut provided on the mounting table 70. At the tip of the feed screw 75, a hook-shaped pin 77 extends, and the tip of the pin 77 is
It engages with a long hole 78 formed in the mounting plate 71. Therefore, when the motor Mθ is driven, the feed screw 75 moves in the longitudinal direction.
Reciprocating to N2, the mounting plate 71 horizontally rotates around the hinge portion 72. FIG. 7 simply shows the situation.

In this device, θ of the electronic component attracted to the nozzle 8
The direction correcting means includes a means for driving the motor 14 to rotate the nozzle 8 and a means for driving the motor Mθ to rotate the substrate 6. Of these, in the former, the nozzle 8 is a recognition device.
It has the advantage that it can be performed while moving from 13 to the XY table 3 and can be rotated by a large amount such as 90 ° or 180 ° to change the direction of the electronic parts. Above all, for example, fine angle correction of 1 ° or less has a drawback that it is difficult. On the other hand, the latter correction means has an advantage of being able to make a fine angle correction of 1 ° or less, but has a drawback that a large angle correction cannot be made. Therefore, as will be described later, these two correction means are used properly according to the required mounting accuracy.

In FIG. 5, reference numeral 80 denotes a laser device provided on the XY table 3 as a fine measuring device, and has a light emitting portion 81 for emitting laser light and a light receiving portion 82. The laser device 80 scans in the XY direction integrally with the XY table 3 and leads L of the electronic component C attracted to the nozzle 8.
The lead L is precisely measured by sweeping and irradiating the laser light on the above and receiving the reflected light on the light receiving portion 82.

The recognition device 13 including a CCD camera has a small resolution,
Although it is not possible to precisely measure the positional deviation of electronic components, it has the advantage that images can be captured at high speed. On the other hand, the laser device 80 has the drawbacks that it can perform extremely precise measurement, but the measurement speed is slow, and that electronic components must be accurately positioned in the measurement area. Therefore, the recognition device 13 and the laser device 80 are selectively used as follows according to the required mounting accuracy.

That is, as shown in FIG. 8, the electronic components C have various sizes and shapes, and the electronic components Cn such as SOP having leads L in two directions, which are relatively small resistor chips C1 and C2 and capacitor chips C3, are relatively small. There is an electronic component Cn such as QFP having leads L in the -1,4 direction. Of these, the resistor chips C1 and C2, the capacitor chip C3, and the like generally require low mounting accuracy. Therefore, these electronic components perform the θ correction by observing the positional deviation by the recognition device 13 and driving the motor 14 to rotate the nozzle 8.

Further, in the electronic component Cn in which a large number of leads L are provided so as to project, each lead L must be accurately joined to the electrode formed on the upper surface of the substrate 6, so that the required mounting accuracy is extremely high. Therefore, such an electronic component Cn is used for the XY table 3
Is driven to move the laser device 80 in the XY directions, and the laser beam is swept and irradiated along the lead L to perform precise measurement, and the motor Mθ is driven to horizontally rotate the substrate 6, thereby Make a correction. In any case, the displacement in the XY direction drives the XY table 3 to move the substrate 6 to the XY position.
Correct by moving in the direction. Note that the SOP generally does not require so much mounting accuracy.

The present apparatus is an apparatus for mounting such various types of electronic components C1 to Cn on the substrate 6 at high speed while satisfying the mounting accuracy required for each. Next, the drive mechanism of the suction head 7 will be described with reference to FIGS. 1 and 2.

Reference numeral 20 is a drive unit box disposed directly above the rotary head 2, 21 is a drive unit of the drive unit box 20, and 22 is a support frame. The rotary head 2 is attached to the output shaft 23a of the drive unit box 20, and the rotary head 2 is index-rotated in the direction of arrow N by the drive of the drive unit 21. The drive unit 21 is an AC servomotor, and the power of the AC servomotor is transmitted to the suction head 7 through a power transmission path described below to raise and lower the suction head 7.

25a is a pulley attached to another output shaft 23b of the drive unit box 20, 25b is another pulley, 26 is a timing belt tuned to the pulleys 25a and 25b, 27 is a pulley 2
This is the rotation axis of 5b. At both ends of the rotary shaft 27, two cams 30, for moving up and down the suction head 7 when taking up electronic components of the table moving device 100 and mounting the electronic components on the substrate 6, 30 is installed. Since the mechanism for raising and lowering the suction head 7 is the same in the table moving device 100 and the XY table 3, the mechanism on the XY table 3 side will be described below with particular reference to FIG.

Reference numeral 31 denotes a cam follower that comes into contact with the circumferential surface of the cam 30, and is pivotally attached to a key-shaped lever 33. 34 is a cam follower 31
The cam follower 31 moves up and down following the rotation of the cam 30, and the lever 33 swings about the pin 32 in the direction of arrow a.

Reference numeral 40 denotes a tie rod, which is disposed horizontally, and rollers 41 and 42 are pivotally mounted on both ends thereof. One roller 41 fits into a groove 36 formed at the lower end of a lever 33, and the other roller 42 fits into a groove 44 of another lever 43. When the lever 33 swings, the tie rod 40 reciprocates in the horizontal direction b, and the lever 43 swings about the pin 45 in the direction of arrow c.

50 is a pulse motor arranged above the tie rod 40,
Reference numeral 51 is a support bracket thereof, 52 is a coupling, 53 is a screw rod, and the tie rod 40 is moved up and down in the vertical direction d by driving the pulse motor 50. This motor 50 is a computer
Automatically controlled by 59. 54 and 54 are guide members for guiding the vertical movement of the tie rod 40 (see FIG. 1), 56 are guide members for guiding horizontal reciprocating movement, and 57 is a guide member 5.
5,56 support members.

61 is a guide body standing on the bottom of the main body box 1, 62
Is a slider that moves up and down along the guide body 61. Grooves are formed on both sides of the slider 62,
The lorry 46 of the lever 43 is fitted in one groove, and the roll 64 mounted on the upper part of the lifting shaft 63 of the suction head 7 is fitted in the other groove. 65 is the shaft 63
The ring guide of the other roll 64 attached to the upper part of the, and 66 is the lifting guide of the shaft 63. Figure 4 shows
The transmission mechanism from the drive unit 21 to the suction head 7 described above is simply shown. Next, the operation will be described with reference to this drawing.

With the continuous rotation of the cam 30, the lever 33 swings in the direction of arrow a, and the tie rod 40 reciprocates in the horizontal direction b. Then, the other lever 43 swings in the direction of arrow c, the slider 62 moves up and down along the guide body 61, and therefore the suction head 7 connected to this slider 62 via the shaft 63 also moves up and down.

Here, as shown by the solid line in the figure, when the position of the tie rod 40 is high and the roll 41 has deeply entered the groove portion 36 of the lever 33, the tie rod 40 reciprocates slightly and its stroke in the horizontal direction b is increased. l is short and therefore the other lever 43
Is small, and the lifting stroke S1 of the suction head 7 is short. On the contrary, when the position of the tie rod 40 is low and the roll 41 is shallowly entering the groove 36 as shown by the chain line in the figure, the tie rod 40 reciprocates with a large stroke l, and therefore the mounting head 7 The lifting stroke S2 is also long.

In this way, the lifting stroke of the suction head 7 changes depending on the height of the tie rod 33. Therefore, the present apparatus can adjust the height of the lower end portion of the nozzle 8 by driving the motor 50 automatically controlled by the computer 59 and changing the height of the tie rod 40.

By the way, the laser device 80 cannot perform accurate measurement unless the lead L, which is the object to be measured, is in the measurement area. That is, if the electronic component is thin, the lead L is too far from the laser device 80, and if the electronic component is thick, the lead L is too close to the laser device 80, and in any case, the lead L cannot be accurately measured. Therefore, in FIG. 9 (a),
As shown in (b) and (c), electronic components Cn, Cn-1, Cn-
If the lift of the cam 30 and the amount of rotation of the motor 50 are programmed in advance and input to the computer 59 according to the magnitude of the thicknesses Dn, Dn-1, Dn-2 (which are known) of 2, The stop positions of 21 are determined, and each electronic component Cn, Cn-1, Cn-
The vertical movement stop position of the nozzle 8 can be set according to the variation in the thickness of 2 and the lead L and the laser device 80 can be separated by a constant distance l.
The lead L can be positioned in the measurement area of the laser device 80. Therefore, the mechanism shown in FIG. 4 adjusts the height of the lower end portion of the nozzle 8 so that the leads L of various electronic components sucked by the nozzle 8 are positioned in the measurement area of the laser device 80. Are configured. Next, the table moving device 100 will be described in detail.

In FIG. 3, two tables 101A and 101B are mounted on the table moving device 100. One table one
In 01A, a plurality of tape units 102 are arranged in parallel.
103 is a feed screw, to which a nut 104 provided on the lower surface of the table 101A is screwed. 105 is a motor for rotating the nut 104. Therefore, when the motor 105 is driven, the table 101A reciprocates laterally along the feed screw 103 to stop the desired tape unit 102 at the take-up position by the nozzle 8. Although not shown, the nut 104 is similarly attached to the other table 101B.
And a motor 105 are provided, and this table 101B also
It reciprocates laterally along the feed screw 103.

The table 101B is provided with a tape unit 102 and a mount 111 for electronic components. A relatively small and mass-consuming electronic component such as a capacitor chip or a resistor chip is generally encapsulated in an electronic component encapsulating tape and mounted on the tape unit 102. On the other hand, relatively large and small consumption electronic components such as QFP are generally stored in a tray without being enclosed in an electronic component encapsulating tape. Therefore, as will be described later in detail, an electronic component supply device 200 provided on the side of the table moving device 100 transfers an electronic component such as a QFP stored in the tray 203 to the mounting body 111.

In FIGS. 10 to 12, 201 is a box-shaped magazine in which a plurality of trays 203 mounted on a base material 202 are stacked and stored. 210 and 211 are a lower frame and an upper frame, and the magazine 201 is arranged in the frames 210 and 211. M1 is a motor mounted on the upper frame 211, and 213 is a timing belt driven by the motor M1 to rotate along the timing pulley 214. Two timing pulleys 214 are provided on both sides of the upper frame 211, and the feed screws 217 and 218 driven by the timing pulleys
It is erected along the both side walls of 11. This lead screw 21
A feed nut 219 is screwed onto the 7,218, and a bracket 221 is integrally provided on the feed nut 219.

Two shafts 223 and 224 are laterally provided on the upper surface of the magazine 201, and both side portions thereof are supported by the bracket 221. Therefore, when the motor M1 rotates in the forward and reverse directions, the feed screws 217 and 218 rotate, and the feed nut 219 causes the feed screw 217 and 218 to rotate.
By moving up and down along 218, the magazine 201 moves up and down. That is, the motor M1, the feed screws 217 and 218, the nut 219, and the like form a lifting device for the magazine 201.

Reference numerals 230 and 231 denote arm portions extending to the front of the magazine 201, and the base member 202 on which the tray 203 is mounted is pulled out on a plate-shaped support member 207 provided between the arm portions 230 and 231 by a drawer device described later. .

232 is a cover plate laid over the arms 230 and 231; 233
Is a sub-transfer head. The base end of the sub transfer head 233 is attached to the slider 234.
Is mounted on a rail 235 installed inside the cover plate 232 so as to be slidable in the X direction.

FIG. 13 shows a drive system of the sub-transfer head 233 provided below the arms 230 and 231. Reference numerals 237 and 238 are sliders attached to both ends of the rail 235. The children 237, 238 are mounted slidably in the Y direction along the guide rods 239, 240 arranged inside the arms 230, 231. MX is an X-direction drive motor, 242
Is an X-axis winding drum, MY is a Y-direction driving motor, and 243 is a Y-axis winding drum. An X-direction wire 244 and a Y-direction wire 245 are wound around the drums 242 and 243, respectively.

The X-direction wire 244 is connected to the slider 234 and the sliders 237 and 23.
The slider 234 on which the sub-transfer head 233 is mounted slides in the X-direction along the rail 235, as the motor MX rotates in the forward and reverse directions. In addition, the Y-direction wire 245 is banded on a bearer ring 249 provided at the corners of the frames 247, 248,
When the motor MY rotates forward / reversely, the sliders 237 and 238 move to the rod 23.
It moves in the Y direction along 9,240, and the sub transfer head 233 connected to the sliders 237 and 238 also moves in the same direction. That is, motors MX, MY, slider 234, rail 235, slider 23
7,238, Rod 239,240, Drum 242,243, Wire 244,24
5, the bearings 246, 249 and the like constitute an XY direction moving device for the sub transfer head 233.

In FIGS. 10 and 12, 250 is the front wall 20 of the base member 202.
It is a child who engages and disengages in 2a. This breaker 250 has a pin 251
An extension element 253, which is rotatably supported by and is extended downwardly from this, is attached to a rod 254a of a cylinder 254. In addition, the engagement / disengagement 250 uses the spring material 255, and
It is urged in the direction to separate from (counterclockwise in FIG. 12). When the cylinder 254 operates and the rod 254a projects, the engagement / disengagement member 250 rotates clockwise against the spring force of the spring member 255 and engages with the front wall 202a. When the cylinder 254 stops operating, the engagement / disengagement member 250 rotates upward due to the spring force of the spring member 255 and separates from the front wall 202a. That is,
The cylinder 254, the spring material 255 and the like constitute an engagement / disengagement device.

In FIG. 10, 256 is below the supporting member 207,
Belt tuned to pulley 257, M2 is drive motor, 258
Is a mover attached to the belt 256. The cylinder 254 is attached to the mover 258, and the motor
By driving M2, the engagement / disengagement member 250 pulls the base member 202 on which the tray 203 is mounted, and moves in the Y direction. That is, the belt 256, pulley 257, mover 258, motor M2, etc.
Tray 203 stored in magazine 201
It constitutes a loading and unloading device that pulls out from and stores in magazine 201.

Reference numeral 140 denotes a transfer head, and the rodless cylinder 141 allows the electronic component temporary mounting stage 130 and the mounting body 1 described above.
Reciprocate between 11 and mount the electronic components on the stage 130
Transferred to 11 pockets 112. Pockets 129 are also provided side by side on the stage 130. A sensor 142 such as a photoelectric element and a light source 143 are provided above and below the pocket 112. Further, a light transmitting portion 124 is formed in the pocket 112. Therefore, when the table 101B moves in the lateral direction, the presence or absence of the electronic component in the pocket 112 is detected by the sensor 142.

As shown in FIG. 11, a plurality of pockets 112 and 129 are formed in the lateral direction (10 in the present embodiment), and the same number of transfer heads 140 are provided. 145 is a support bracket for the transfer head 140, and 146 is the table 111 for the mounting body 111.
It is a clamp member that is fixed to B. Therefore, the transfer head 140 can simultaneously transfer the ten electronic components placed in the pocket 129 to the pocket 112. By arranging a plurality of pockets 112 and 129 side by side in this manner, it is possible to mount a large number of various types of electronic components on the table 101B. Further, by providing a temporary mounting stage 130 between the magazine 201 and the mounting body 111, the table 101
While B is reciprocating along the feed screw 103 and supplying the electronic component to the nozzle 8, the electronic component of the tray 203 is previously replenished to the stage 130 by the sub transfer head 233, When the electronic parts of the mounting body 111 are out of stock, the transfer head 140 can immediately replenish them in good order. Therefore, the replenishment of electronic components does not cause a loss time, and the mounting speed can be increased accordingly.

This rotary head type electronic component mounting apparatus has the above-mentioned configuration, and the overall operation will be described below.

The tape unit 102 is equipped with electronic components such as a capacitor chip and a resistor chip that require low mounting accuracy. Therefore, first, a method of mounting such an electronic component will be described. In FIG. 3, the table 101A reciprocates laterally to stop the predetermined tape unit 102 at the take-up position. Then, the nozzle 8 takes up the electronic component and transfers it to the substrate 6 on the XY table 3 by index rotation of the rotary head 2. In the middle of the process, the XYθ of the electronic component adsorbed by the nozzle 8
The positional deviation in the direction is observed by the recognition device 13. Among these, the positional deviation in the θ direction is corrected by rotating the nozzle 8, and the positional deviation in the XY direction is corrected by moving the substrate 6 in the XY direction.

Next, when mounting an electronic component having a lead such as QFP housed in the tray 203, the table 101A is withdrawn laterally (see the chain line in FIG. 3), and the table 101B is moved to the central portion of the table moving device 100. Move to. So table 101
B is reciprocally moved in the lateral direction to stop a predetermined electronic component on the mounting body 111 at the take-up position. Next, the electronic component is taken up by the nozzle 8 and transferred to the substrate 6. During this transfer, the motor 21 is stopped, and at the same time, the motor 50 is driven by a predetermined amount, the suction head 7 is moved up and down, and the lead L is moved to the measurement area of the laser device 80 as described with reference to FIG. Located in.

The laser device 80 stands by immediately below the suction head 7, and when the electronic component arrives directly above the laser device 80, the laser device 80 irradiates the lead L with laser light while moving in the XY directions. The reflected light is received, and the positional deviation, floating, bending, etc. of the lead L are measured. Of the positional deviations in the XYθ directions, the positional deviations in the θ direction are corrected by driving the motor Mθ to horizontally rotate the substrate 6, and the positional deviations in the XY direction are corrected by moving the substrate 6 in the XY directions. To do. If the lead L is lifted or bent more than the allowable amount, it is not mounted on the substrate 6. When the electronic components on the mounting body 111 are out of stock, the electronic components in the pocket 129 of the stage 130 are mounted on the mounting body by the transfer head 140.
Supply to pocket 112 of 111. The above sensor 142
Due to a mistake in take-up of the nozzle 8
The remaining electronic components are detected, and an error in replenishment of the electronic components to the pocket 112 by the transfer head 140 is detected.

The present invention is not limited to the above embodiment, and various design changes are possible. For example, in FIG. 3, the electronic component supply device 200 such as the magazine 201 is disposed on the rotary head 2 side. Good. This way, the worker
It is easy to manage both the XY table 3 and the supply device 200. Further, although the tape unit 102 and the mounting body 111 are mounted on the table 101B, only the mounting body 111 may be mounted. Of course, how many tables 101 are mounted on the table moving device 100. You may. A linear image sensor can also be used as a fine measuring device.

(Effects of the Invention) As described above, according to the present invention, the height adjusting means is driven to move the nozzle up and down in accordance with the thickness of the electronic component adsorbed to the nozzle. Since the lead can be precisely measured while being positioned in the measurement area of the fine measuring device and driving the XY table to scan this fine measuring device in the horizontal direction,
It is possible to accurately mount an electronic component having a large number of leads as described above and having high required mounting accuracy on a substrate.

Also, by providing a mounting body, a magazine accommodating stacked trays, a temporary mounting stage, a sub-transfer head, a transfer head, etc., electronic components having leads can be provided with leads such as capacitor chips and resistance chips. Like the electronic components that are not mounted, the rotary head type electronic component mounting device enables highly accurate mounting on the substrate. Moreover, in this case, the electronic components of the tray of the magazine are preliminarily placed on the temporary placement stage by the sub-transfer head, so that when the electronic components of the placing body on the table are out of stock, they are transferred. Since the head allows you to quickly replenish the supply,
Mounting time can be improved by eliminating loss time for replenishing electronic components.

[Brief description of drawings]

FIG. 1 shows an embodiment of the present invention. FIG. 1 is a perspective view of a rotary head type electronic component mounting apparatus, FIG. 2 is a front view of a lifting mechanism of a suction head, FIG. 3 is a plan view, 4 is a simplified front view of the elevating mechanism, FIG. 5 is a perspective view of the positioning means for the substrate, FIG. 6 is the same sectional view, FIG. 7 is the same plan view, FIG. 8 is a plan view of the electronic component, 9 (a), (b),
(C) is a front view during measurement by a laser device, FIG. 10 is a side view of an electronic component supply device, FIG. 11 is the same plan view, FIG. 12 is the same perspective view, and FIG. 13 is a perspective view of a drive system. It is a figure. 2 …… Rotary head 3 …… XY table 6 …… Substrate 7 …… Suction head 8 …… Nozzle 80 …… Fine measurement device 101A, 101B …… Table 111 …… Mounting body 130 …… Temporary mounting stage 140 ...... Transfer head 200 …… Electronic component supply device 201 …… Magazine 203 …… Tray 233 …… Sub transfer head

Claims (2)

[Claims] 1. A table moving device for laterally reciprocating a table on which electronic components are mounted, an XY table for positioning a substrate, and a suction head equipped with a nozzle for sucking electronic components along a circumferential direction. A plurality of rotary heads arranged side by side, and while rotating the rotary heads in an index manner, the electronic parts on the table are sucked up by the nozzles and taken up, and the rotary heads are transferred and mounted on the substrate. In the electronic component mounting apparatus, a fine measuring device for measuring the lead of the electronic component sucked by the nozzle is arranged on the XY table while moving in the XY direction, and the lead is measured by the measuring area by the fine measuring device. To adjust the height of the lower end of the nozzle by moving the nozzle up and down according to the thickness of the electronic component. A rotary head type electronic component mounting apparatus, characterized in that the aligning means is provided on the rotary head side. 2. A table moving device for laterally reciprocating a table on which electronic components are mounted, an XY table for positioning a substrate, and a suction head provided with a nozzle for sucking electronic components along a circumferential direction. A plurality of rotary heads arranged side by side, and while rotating the rotary heads in an index manner, the electronic parts on the table are sucked up by the nozzles and taken up, and the rotary heads are transferred and mounted on the substrate. In the electronic electronic component mounting apparatus, a mounting body for mounting a plurality of electronic components having leads in a lateral direction is provided on the table, and an electronic component supply device is provided on a side of the table moving device. The parts supply device includes a magazine in which trays in which electronic parts are stored are stacked and housed, and a magazine in which the magazine and the table moving device are installed. Stage for temporary placement, a sub-transfer head for transferring the electronic components of the tray to this stage, and a transfer for transferring the electronic components transferred to this stage to the mounting body described above. A rotary head type electronic component mounting apparatus comprising a head and a head.