JPH0720080A - Humidity sensor - Google Patents
Humidity sensorInfo
- Publication number
- JPH0720080A JPH0720080A JP16575393A JP16575393A JPH0720080A JP H0720080 A JPH0720080 A JP H0720080A JP 16575393 A JP16575393 A JP 16575393A JP 16575393 A JP16575393 A JP 16575393A JP H0720080 A JPH0720080 A JP H0720080A
- Authority
- JP
- Japan
- Prior art keywords
- humidity sensor
- electrode
- humidity
- substrate
- sensor according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 6
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 6
- 239000010703 silicon Substances 0.000 claims abstract description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 6
- 229910052731 fluorine Inorganic materials 0.000 claims description 6
- 239000011737 fluorine Substances 0.000 claims description 6
- 229920006254 polymer film Polymers 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 3
- 229910018487 Ni—Cr Inorganic materials 0.000 claims description 2
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 2
- 239000007772 electrode material Substances 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 5
- 238000005530 etching Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 23
- 239000011521 glass Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 3
- 239000005297 pyrex Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 229920002313 fluoropolymer Polymers 0.000 description 2
- 239000004811 fluoropolymer Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- -1 perfluoro Chemical group 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- 230000026041 response to humidity Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical class [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229940046892 lead acetate Drugs 0.000 description 1
- 229940071125 manganese acetate Drugs 0.000 description 1
- UOGMEBQRZBEZQT-UHFFFAOYSA-L manganese(2+);diacetate Chemical compound [Mn+2].CC([O-])=O.CC([O-])=O UOGMEBQRZBEZQT-UHFFFAOYSA-L 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000006903 response to temperature Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Abstract
(57)【要約】
【構成】 片面の一部をエッチングしたシリコン基板の
表面に酸化膜を形成し、エッチングしていない面の酸化
膜の上に櫛歯電極を形成し、その櫛歯電極部分を覆うよ
うに感湿膜を形成する。その裏面のエッチング面にヒー
ター電極を形成し、ヒーター電極の導通部分を残し、エ
ッチング面を陽極接合で密閉し、湿度センサとする。
【効果】 工程が単純で、大量生産に適したプロセスが
使えるため、量産性が良く、信頼性も高く、低電力のヒ
ーターをもった湿度センサが得られる。
(57) [Summary] [Structure] An oxide film is formed on the surface of a silicon substrate whose one side is partially etched, and a comb-teeth electrode is formed on the oxide film on the non-etched side. A moisture sensitive film is formed so as to cover the. A heater electrode is formed on the etching surface on the back surface, the conductive portion of the heater electrode is left, and the etching surface is sealed by anodic bonding to form a humidity sensor. [Effect] Since the process is simple and a process suitable for mass production can be used, mass productivity is good, reliability is high, and a humidity sensor having a low-power heater can be obtained.
Description
【０００１】[0001]
【産業上の利用分野】本発明は、湿度に対応して素子の
電気的特性が変化することにより湿度を検出する湿度セ
ンサに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a humidity sensor for detecting humidity by changing electric characteristics of an element in response to humidity.
【０００２】[0002]
【従来の技術】近年、湿度計測、湿度制御を必要とする
分野が増加し、湿度センサの重要性が認められるように
なった。2. Description of the Related Art In recent years, the number of fields requiring humidity measurement and humidity control has increased, and the importance of humidity sensors has come to be recognized.
【０００３】湿度に対応して素子の電気的特性が変化す
ることにより湿度を検出する湿度センサには、電解質
系、金属系、高分子系、セラミックス系等があり、それ
ぞれいろいろな系が研究されているが、現在実用化され
ているものは、高分子系およびセラミックス系の湿度セ
ンサである。いずれも、素子に対する水の吸脱着によ
り、素子の抵抗値または静電容量が変化する性質を利用
したものである。Humidity sensors that detect humidity by changing the electrical characteristics of the element in response to humidity include electrolyte-based, metal-based, polymer-based, and ceramic-based humidity sensors, and various systems have been studied. However, polymer and ceramic humidity sensors are currently in practical use. All of them utilize the property that the resistance value or capacitance of the element changes due to the adsorption and desorption of water with respect to the element.
【０００４】基板にはアルミナ、ガラス等の絶縁体が用
いられ、この基板上に櫛形電極、感湿膜を形成するか、
基板上に下部電極、感湿膜、上部電極を形成したサンド
ウィッチ形構造にするのが一般的である。An insulator such as alumina or glass is used for the substrate, and a comb-shaped electrode or a moisture sensitive film is formed on this substrate.
A sandwich type structure in which a lower electrode, a moisture sensitive film and an upper electrode are formed on a substrate is generally used.
【０００５】また、クリーニングを必要とする場合、ほ
とんどの湿度センサは湿度センサ全体をコイルで巻き、
そのコイルで加熱することにより行っている。When cleaning is required, most humidity sensors have a coil around the entire humidity sensor.
This is done by heating with the coil.
【０００６】[0006]
【発明が解決しようとする課題】従来の湿度センサは、
クリーニングを行う場合、湿度センサ全体にコイルを巻
き湿度センサ全体を加熱するため熱効率が悪く、消費電
力も大きくなるという問題があった。The conventional humidity sensor has the following problems.
When cleaning is performed, a coil is wound around the entire humidity sensor to heat the entire humidity sensor, resulting in poor thermal efficiency and high power consumption.
【０００７】また、湿度センサ全体を加熱する構造のた
め、湿度センサの構造が制限されるという問題があっ
た。Further, there is a problem that the structure of the humidity sensor is limited due to the structure for heating the entire humidity sensor.
【０００８】そこで本発明はこのような問題点を解決す
るものでその目的とするところは、量産性が良く、熱対
応が良く、信頼性の高く、構造が制限されない湿度セン
サを提供するところにある。Therefore, the present invention solves such a problem, and an object thereof is to provide a humidity sensor having good mass productivity, good heat resistance, high reliability, and unlimited structure. is there.
【０００９】[0009]
【課題を解決するための手段】本発明の湿度センサは、
最表面の絶縁を確保した基板上に一対の電極および電極
形状にあった感湿膜を形成し、電極および感湿膜を形成
した基板の裏面にヒーター電極が形成されていることを
特徴とする。The humidity sensor of the present invention comprises:
It is characterized in that a pair of electrodes and a moisture-sensitive film in the shape of an electrode are formed on a substrate with insulation on the outermost surface, and a heater electrode is formed on the back surface of the substrate on which the electrodes and the moisture-sensitive film are formed. .
【００１０】基板はガラス、アルミナ等の非導電性基板
でよい。基板に導電性金属板の表面に絶縁膜を形成した
ものを用いると熱伝導率もよく、効率的に湿度センサの
クリーニングが行えるという面から好ましい。さらに、
基板としてシリコンを用いると、大量生産に適したシリ
コンプロセスが使え、量産性、信頼性の両面から好まし
い。The substrate may be a non-conductive substrate such as glass or alumina. It is preferable to use a conductive metal plate having a surface on which an insulating film is formed as a substrate because the thermal conductivity is good and the humidity sensor can be efficiently cleaned. further,
When silicon is used as the substrate, a silicon process suitable for mass production can be used, which is preferable in terms of mass productivity and reliability.
【００１１】ヒーター電極部分を覆う方法として陽極接
合を用いることにより、通常の接合方法より高い接合強
度が得られるうえ、厚み方向の寸法精度が高く信頼性の
面から好ましい。さらに、ヒーター部分をエッチングす
ることにより、ヒーターで発生させた熱を効率よく感湿
部へ伝えることができるという点から好ましい。By using anodic bonding as a method of covering the heater electrode portion, a bonding strength higher than that of a normal bonding method can be obtained, and the dimensional accuracy in the thickness direction is high, which is preferable in terms of reliability. Further, by etching the heater portion, the heat generated by the heater can be efficiently transmitted to the moisture sensitive portion.
【００１２】一対の電極として櫛歯電極を用いることに
より、電極と感湿膜との接触面積を大きくでき、抵抗値
を小さくできるという点から好ましい。The use of comb-teeth electrodes as the pair of electrodes is preferable in that the contact area between the electrodes and the moisture sensitive film can be increased and the resistance value can be reduced.
【００１３】また、ヒーター電極としてニッケルクロム
を用いることにより、発熱量が高いため、効率良く湿度
センサのクリーニングが行えるという点から好ましい。Further, it is preferable to use nickel chromium for the heater electrode because the amount of heat generated is high and the humidity sensor can be efficiently cleaned.
【００１４】少なくとも感湿膜の部分をすべて覆うよう
に、含フッ素高分子膜を形成すると、より信頼性の高い
湿度センサを得ることができる。When the fluorine-containing polymer film is formed so as to cover at least the moisture sensitive film portion, a more reliable humidity sensor can be obtained.
【００１５】[0015]
（実施例１）水１００ｍｌに、エタノール１００ｍｌ、
酢酸マンガン８０ｇ、酢酸鉛２０ｇ、酢酸カリウム１０
ｇを加え、１時間撹拌し、感湿膜用コーティング液を作
成した。(Example 1) 100 ml of water, 100 ml of ethanol,
Manganese acetate 80 g, lead acetate 20 g, potassium acetate 10
g was added and the mixture was stirred for 1 hour to prepare a coating liquid for a moisture-sensitive film.
【００１６】シリコン基板の片面の一部をエッチング
し、絶縁の確保されたエッチング面にニッケルクロム合
金でヒーター電極を形成し、エッチング面裏面には金を
用いて櫛歯電極を形成した。このようにして作成した基
板の櫛歯電極上に感湿膜用コーティング液を櫛歯電極は
覆われるようにスクリーン印刷し、７００℃で１時間熱
処理し、感湿膜を形成した。このようにして作成した湿
度センサの断面図を図１、平面図を図２に示す。図１、
図２において、１は感湿膜、２は櫛歯電極、３は基板、
４は絶縁膜、５はヒーター電極である。A part of one side of the silicon substrate was etched, a heater electrode was formed of nickel-chrome alloy on the etched surface where insulation was secured, and a comb-teeth electrode was formed on the back surface of the etched surface using gold. A moisture-sensitive film coating liquid was screen-printed on the comb-teeth electrode of the substrate thus formed so that the comb-teeth electrode was covered and heat-treated at 700 ° C. for 1 hour to form a moisture-sensitive film. A cross-sectional view of the humidity sensor thus produced is shown in FIG. 1, and a plan view thereof is shown in FIG. Figure 1,
In FIG. 2, 1 is a moisture sensitive film, 2 is a comb electrode, 3 is a substrate,
Reference numeral 4 is an insulating film, and 5 is a heater electrode.
【００１７】本湿度センサの感湿特性を図３に示す。図
３より、本発明の湿度センサは、抵抗値が低く、抵抗値
の変化幅が適当であり、しかも温度によって特性が変化
しないので、使いやすいことがわかる。本湿度センサを
６０℃９０％の恒温恒湿槽中に１０００時間放置後、特
性を測定したところ、図３と測定誤差の範囲内で同様で
あった。したがって、本湿度センサは、耐久性、信頼性
が高いことがわかる。また、温度変化に対する応答は１
０秒以内、湿度変化に対する応答は５秒以内と十分速か
った。さらに、本湿度センサは、製造工程が単純である
ため、量産性がよく、安価に製造できることがわかる。FIG. 3 shows the humidity-sensitive characteristics of this humidity sensor. It can be seen from FIG. 3 that the humidity sensor of the present invention is easy to use because it has a low resistance value, an appropriate change range of the resistance value, and the characteristics do not change with temperature. The humidity sensor was left to stand in a constant temperature and humidity chamber at 60 ° C. and 90% for 1000 hours, and the characteristics were measured. The results were the same as those in FIG. 3 within the measurement error range. Therefore, it can be seen that this humidity sensor has high durability and reliability. Also, the response to temperature change is 1.
Within 0 seconds, the response to changes in humidity was sufficiently fast, within 5 seconds. Further, since the humidity sensor has a simple manufacturing process, it can be easily mass-produced and can be manufactured at low cost.
【００１８】（実施例２）実施例１で作成した湿度セン
サに、溶媒可溶性含フッ素高分子をパーフルオロ溶媒に
溶解した溶液（７重量％）を、少なくとも感湿膜上の電
極はすべて覆われるように、スクリーン印刷し、１８０
℃で１時間熱処理し、含フッ素高分子膜を形成した。こ
のようにして作成した湿度センサの断面図を図４に示
す。図４において、１は感湿膜、２は電極、３は基板、
４は絶縁膜、５はヒーター電極、６は含フッ素高分子膜
である。本湿度センサの特性は、実施例１で作成した湿
度センサと同様であった。本湿度センサを水に１００時
間浸漬後、特性を測定したところ、図３と測定誤差の範
囲内で同様であった。したがって、本湿度センサは、耐
久性、信頼性が高いことがわかる。Example 2 The humidity sensor prepared in Example 1 is covered with a solution (7% by weight) of a solvent-soluble fluorine-containing polymer dissolved in a perfluoro solvent, at least all electrodes on the moisture-sensitive film are covered. Screen-print, 180
It heat-processed at 1 degreeC for 1 hour, and formed the fluorine-containing polymer film. A cross-sectional view of the humidity sensor thus produced is shown in FIG. In FIG. 4, 1 is a moisture sensitive film, 2 is an electrode, 3 is a substrate,
Reference numeral 4 is an insulating film, 5 is a heater electrode, and 6 is a fluorine-containing polymer film. The characteristics of this humidity sensor were similar to those of the humidity sensor created in Example 1. After the humidity sensor was immersed in water for 100 hours, the characteristics were measured and found to be the same as in FIG. 3 within the measurement error range. Therefore, it can be seen that this humidity sensor has high durability and reliability.
【００１９】（実施例３）実施例１で作成したエッチン
グ面を覆うようにヒーター電極の導通部分を残してパイ
レックスガラスを陽極接合し、この湿度センサの少なく
とも感湿膜の全てを覆うように、溶媒可溶性含フッ素高
分子をパーフルオロ溶媒に溶解した溶液（７重量％）を
コーティングし、１８０℃で１時間熱処理し、含フッ素
高分子膜を形成した。このようにして作成した湿度セン
サの断面図を図５に示す。図５において、１は感湿膜、
２は電極、３は基板、４は絶縁膜、５はヒーター電極、
６は含フッ素高分子膜、７は陽極接合したパイレックス
ガラスである。本湿度センサの特性は、実施例１で作成
した湿度センサと同様であった。本湿度センサを６０℃
の飽和食塩水に１００時間浸漬後、特性を測定したとこ
ろ、図３と測定誤差の範囲内で同様であった。したがっ
て、本湿度センサは、極めて耐久性、信頼性が高いこと
がわかる。(Embodiment 3) Pyrex glass is anodically bonded so as to cover the etching surface prepared in Embodiment 1 while leaving the conductive portion of the heater electrode, and at least all of the humidity sensitive film of this humidity sensor is covered. A solution (7% by weight) of a solvent-soluble fluoropolymer dissolved in a perfluoro solvent was coated and heat-treated at 180 ° C. for 1 hour to form a fluoropolymer film. A cross-sectional view of the humidity sensor thus produced is shown in FIG. In FIG. 5, 1 is a moisture sensitive film,
2 is an electrode, 3 is a substrate, 4 is an insulating film, 5 is a heater electrode,
Reference numeral 6 is a fluorine-containing polymer film, and 7 is an anode-bonded Pyrex glass. The characteristics of this humidity sensor were similar to those of the humidity sensor created in Example 1. This humidity sensor is 60 ℃
When the characteristics were measured after being immersed in the saturated saline solution for 100 hours, the results were the same as those in FIG. 3 within the measurement error range. Therefore, it can be seen that this humidity sensor is extremely durable and highly reliable.
【００２０】なお、本実施例ではセラミックス系の感湿
膜を用いたが、他の成分のセラミックス系感湿膜、高分
子系の感湿膜でもよい。また、本実施例では湿度を抵抗
値で検出しているが、静電容量で検出してもよい。Although the ceramic moisture sensitive film is used in this embodiment, a ceramic moisture sensitive film of another component or a polymer moisture sensitive film may be used. Further, in this embodiment, the humidity is detected by the resistance value, but it may be detected by the capacitance.
【００２１】[0021]
【発明の効果】以上述べたように本発明の湿度センサ
は、薄膜の湿度センサ基板の裏面にヒーター電極を形成
することにより、低電力で効率よく湿度センサ表面をク
リーニングすることが可能となる。また、基板に熱効率
のよいシリコンを用いるとさらに低電力で湿度センサの
表面をクリーニングすることが可能となり、量産性、信
頼性の高い湿度センサが得られる。As described above, in the humidity sensor of the present invention, by forming the heater electrode on the back surface of the thin film humidity sensor substrate, the surface of the humidity sensor can be efficiently cleaned with low power. Further, if silicon having high thermal efficiency is used for the substrate, the surface of the humidity sensor can be cleaned with lower power, and a humidity sensor with high mass productivity and high reliability can be obtained.
【図１】本発明の湿度センサの断面図。FIG. 1 is a cross-sectional view of a humidity sensor of the present invention.
【図２】本発明の湿度センサの平面図。FIG. 2 is a plan view of the humidity sensor of the present invention.
【図３】本発明の湿度センサの感湿特性図。FIG. 3 is a humidity sensitive characteristic diagram of the humidity sensor of the present invention.
【図４】本発明の湿度センサの断面図。FIG. 4 is a sectional view of the humidity sensor of the present invention.
【図５】本発明の湿度センサの断面図。FIG. 5 is a sectional view of the humidity sensor of the present invention.
１ 感湿膜 ２ 電極 ３ 基板 ４ 絶縁膜 ５ ヒーター電極 ６ 含フッ素高分子膜 ７ 陽極接合したパイレックスガラス 1 Moisture Sensitive Film 2 Electrode 3 Substrate 4 Insulating Film 5 Heater Electrode 6 Fluorine-Containing Polymer Film 7 Anodically Bonded Pyrex Glass
Claims (9)
電極および電極形状にあった感湿膜を形成し、電極およ
び感湿膜を形成した基板の裏面にヒーター電極が形成さ
れていることを特徴とする湿度センサ。1. A pair of electrodes and a humidity sensitive film having an electrode shape are formed on a substrate having insulation on the outermost surface, and a heater electrode is formed on the back surface of the substrate on which the electrodes and the moisture sensitive film are formed. A humidity sensor characterized in that
極を形成することを特徴とする請求項１記載の湿度セン
サ。2. The humidity sensor according to claim 1, wherein a heater electrode is formed on the etched surface of the back surface.
る構造を持つことを特徴とする請求項１または２記載の
湿度センサ。3. The humidity sensor according to claim 1, which has a structure for sealing a heater electrode formed on the back surface.
とする請求項１乃至３記載の湿度センサ。4. The humidity sensor according to claim 1, wherein a comb-teeth electrode is used as the electrode.
とする請求項１乃至４記載の湿度センサ。5. The humidity sensor according to claim 1, wherein silicon is used as the substrate.
する請求項１乃至５記載の湿度センサ。6. The humidity sensor according to claim 1, wherein gold is used as the comb-teeth electrode.
ように、含フッ素高分子膜が形成されていることを特徴
とする請求項１乃至６記載の湿度センサ。7. The humidity sensor according to claim 1, wherein the fluorine-containing polymer film is formed so that at least the moisture-sensitive film portion is entirely covered.
接合を用いることを特徴とする請求項１乃至７記載の湿
度センサ。8. The humidity sensor according to claim 1, wherein anodic bonding is used as a method for sealing the heater electrode.
を用いることを特徴とする請求項１乃至８記載の湿度セ
ンサ。9. The humidity sensor according to claim 1, wherein nickel chromium is used as a heater electrode material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16575393A JPH0720080A (en) | 1993-07-05 | 1993-07-05 | Humidity sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16575393A JPH0720080A (en) | 1993-07-05 | 1993-07-05 | Humidity sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0720080A true JPH0720080A (en) | 1995-01-24 |
Family
ID=15818414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16575393A Pending JPH0720080A (en) | 1993-07-05 | 1993-07-05 | Humidity sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0720080A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6445565B1 (en) | 2001-02-15 | 2002-09-03 | Denso Corporation | Capacitive moisture sensor and fabrication method for capacitive moisture sensor |
| US6580600B2 (en) | 2001-02-20 | 2003-06-17 | Nippon Soken, Inc. | Capacitance type humidity sensor and manufacturing method of the same |
| US6628501B2 (en) | 2001-06-15 | 2003-09-30 | Denso Corporation | Capacitive moisture sensor |
| WO2013161559A1 (en) * | 2012-04-24 | 2013-10-31 | 株式会社村田製作所 | Humidity sensor element and method of fabricating same |
| JP2014038056A (en) * | 2012-08-20 | 2014-02-27 | Hitachi Automotive Systems Ltd | Humidity detector |
| US9239308B2 (en) | 2010-10-04 | 2016-01-19 | Alps Electric Co., Ltd. | Humidity detection sensor and a method for manufacturing the same |
-
1993
- 1993-07-05 JP JP16575393A patent/JPH0720080A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6445565B1 (en) | 2001-02-15 | 2002-09-03 | Denso Corporation | Capacitive moisture sensor and fabrication method for capacitive moisture sensor |
| US6580600B2 (en) | 2001-02-20 | 2003-06-17 | Nippon Soken, Inc. | Capacitance type humidity sensor and manufacturing method of the same |
| US6628501B2 (en) | 2001-06-15 | 2003-09-30 | Denso Corporation | Capacitive moisture sensor |
| US9239308B2 (en) | 2010-10-04 | 2016-01-19 | Alps Electric Co., Ltd. | Humidity detection sensor and a method for manufacturing the same |
| WO2013161559A1 (en) * | 2012-04-24 | 2013-10-31 | 株式会社村田製作所 | Humidity sensor element and method of fabricating same |
| JP2014038056A (en) * | 2012-08-20 | 2014-02-27 | Hitachi Automotive Systems Ltd | Humidity detector |
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