JPH07125739A - Sample container - Google Patents

Abstract

PURPOSE:To improve heat conduction with respect to an external temperature process and improve flexibility of an outer surface with a container holder by putting an inorganic material having high heat conductivity into resin constituting a sample container as a filler. CONSTITUTION:A sample container comprises a filler made of silicon carbide powder, a complex high heat conductive part I and an inner cylinder 2 only made of polypropylene resin wherein the filler is not in direct contact with a sample and is subjected to multilayered blow-molding. By applying gelation treatment to a part in contact with a sample holder of its outer surface, a gel silicone resin layer 3 with elastic starch dispersed has been formed. Formation of this part comprises steps for adding copper power into silicone resin before gelation as an inorganic filler into a container with a volume compounding ratio of 70% of the silicon carbide filler, stirring it, adjusting viscosity with solvent and applying it. Temperature process of heating or cooling from outside can be conducted rapidly and efficiently to the sample.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to the construction of a container for holding a sample requiring the application of thermal processes for the fields of medicine, chemistry and biotechnology.

[0002]

2. Description of the Related Art In a conventional sample container, it is composed of only a thick resin layer. Therefore, when the temperature process was applied from the outside, heat transfer was very poor, and heating / cooling could not be efficiently transferred to the sample in the container.
Further, the flexibility of the portion of the outer surface of the sample container that comes into contact with the sample container holder was not taken into consideration, and the close contact with the sample container holder was insufficient, resulting in poor heat transfer efficiency from the sample container holder to the sample container.

[0003]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks of the prior art and to efficiently transfer the heating and cooling from the outside to the sample that needs to be subjected to a temperature process. It is a thing.

[0004]

SUMMARY OF THE INVENTION The present invention, which was made to solve the above-mentioned problems, has a resin having a single thermal conductivity of 1%.
The technical means of improving the heat conduction by incorporating an inorganic material of 0 W / (mK) or more as a filler was adopted. That is, the defect of the resin having originally low thermal conductivity is complemented by the filler of the inorganic material having high thermal conductivity dispersed in the resin. If the volume content of the inorganic filler is low, there is no sufficient effect of improving the thermal conductivity, and the volume content of the inorganic filler is at least 30%. The higher the volume content of the inorganic filler, the better the thermal conductivity.
Increasing the volume content of the inorganic filler is especially 90%
It will be difficult if it exceeds. For example, the volume content of the filler can be up to 95% by using a method of using spherical inorganic filler particles. Therefore, the volume content of the inorganic filler may be freely selected from the range of 30% to 95% in consideration of strength, thermal conductivity, cost, shape and the like. Further, here, the shape of the inorganic material filler may be freely selected from particles, whiskers, fibers, foils and the like according to the purpose. If necessary, a plurality of shapes may be combined. Inorganic materials are boron nitride, aluminum oxide, silicon carbide,
Silicon nitride, calcium carbonate, magnesium oxide, silicon oxide, quartz glass, zirconium oxide, titanium nitride,
Beryllium oxide, carbon, diamond, gold, silver,
Copper, aluminum, tungsten, molybdenum, etc. are considered. A material may be freely selected from the above materials in consideration of strength, insulating properties, etc. according to the purpose, and a plurality of materials may be combined if necessary.

Due to the nature of the sample, the part in contact with the sample may have to be a resin so as to avoid contact with the inorganic filler. Therefore, for this portion, the type of resin may be selected according to the properties of the sample to form the portion of only resin. However, if the thickness of the part that is in contact with the sample and is composed only of resin is too thin, the sample may contact the inorganic filler due to damage of the resin-only layer, but depending on the resin material, at least 5 μm is necessary. On the other hand, if the thickness is more than a certain value, the thermal resistance of the resin-only part increases and the heat conduction to the sample deteriorates.
It is preferably 0 μm or less. That is, a technical means was adopted in which the portion in contact with the sample was composed only of the resin, and the remaining portion was composed of two portions composed of a composite of the resin and the inorganic filler.

By using a resin whose constituent resin on the outer surface of the sample container in contact with the sample container holder is softer than the main component resin of the sample container, the sample container holder and the outer surface of a sample container are brought into close contact with each other. It becomes possible. That is, when the flexible resin is deformed, the flexible resin is brought into close contact with the irregularities on the surface of the hole of the sample container holder into which the sample container is inserted, and heat is efficiently transferred from the sample container holder to the sample container. The flexible resin deformation mechanism may be plastic deformation or elastic deformation. In the case of plastic deformation, the tensile strength of the constituent resin of the portion of the outer surface of the sample container that contacts the sample container holder is preferably 32 MPa or less. In the case of elastic deformation, it is preferable that the longitudinal elastic modulus of the constituent resin of the portion of the outer surface of the sample container which is in contact with the sample container holder is 1.4 GPa or less. Alternatively, the soft resin may be a gel resin. As another method, when the temperature process applied to the sample is performed in the range of 50 ° C. or higher and 100 ° C. or lower, if the softening temperature of the component resin on the outer surface of the sample container that contacts the sample container holder is 50 ° C. Due to the temperature process of 50 ° C. or higher, the component resin in the portion in contact with the holder is easily deformed by heat and adheres closely. In the field of biotechnology, the range of applied temperature process is almost 100 ° C. or less. Therefore, the resin suitable for the purpose may be selected from the resins having a softening temperature of 100 ° C. or less of the constituent resin of the portion of the outer surface of the sample container that contacts the sample container holder. Even when this soft resin is used, the volume content of the inorganic filler is preferably in the range of 30% to 95%.

[0007]

[Operation] According to the sample container configured as described above, the sample can be efficiently heated and cooled from the outside by installing a composite part made of resin and an inorganic filler with good thermal conductivity. It is possible to communicate well to the sample. The inorganic filler does not directly contact the sample and does not damage the sample. Further, by using a resin that is softer than the main component resin of the sample container as the constituent resin of the portion of the outer surface of the sample container that contacts the sample container holder, the sample container holder and the sample container can be brought into close contact with each other.

[0008]

Embodiment 1 FIG. 1 shows the appearance of Embodiment 1 of the present invention.
FIG. 2 is a cross section taken along the line AA of FIG. As shown in the cross-sectional structure of FIG. 2, the sample container of Example 1 has a composite high thermal conductive part 1 made of a filler of silicon carbide powder and a polypropylene resin, and the filler is in direct contact with the sample. Made of 2 parts of polypropylene resin only so that there is no. The manufacturing method of this sample container was two-layer blow molding. That is, the volume blending ratio of the resin is 0, 20, respectively.
30, 50, 70, 80, 90% of 1 μm to 20 μm of silicon carbide powder was blended as a filler to form the composite high thermal conductive portion 1, and the portion 2 was made of polypropylene resin only and had a thickness of 30 μm. Attach a thermocouple inside each container, set each container in a constant temperature water bath at 80 ° C, and put the sample container in the same temperature water bath at 80 ° C, and measure the time when the temperature of the thermocouple changes from room temperature to 70 ° C. did. The results are shown in Fig. 3. As can be seen from the figure, the thermal conductivity of the composite high thermal conductivity part 1 is not sufficient when the volume ratio of the filler is less than 30%, which is outside the scope of the present invention. The higher the volume blending ratio of the filler, the better the result. However, the higher volume blending ratio of the filler causes problems such as strength deterioration. Therefore, the volume mixture ratio of the filler may be freely selected from 30% to 95% in consideration of the strength of the container, the usage state of the container, and the like. Here, particles of silicon carbide are used as the inorganic filler, but the present invention is not limited to this, and 10 W / (m
The shape may be freely selected from particles and whiskers, fibers, foils and the like from the above-mentioned inorganic fillers according to the purpose. Further, in this embodiment, only two layers are provided, but if necessary, three layers, that is, a relaxation layer may be provided between the one part and the two parts. By providing this layer, the shear stress of the first and second layers can be relaxed. In the present embodiment, the portion 2 that contacts the sample is the same polypropylene as the portion 1, but the present invention is not limited to this, and the portion 1 and the portion 2 may be selected depending on the purpose of the sample and the temperature process to be applied, the container strength, and the like. Any resin material may be selected. The manufacturing method of the part 2 contacting with the sample is not limited to the two-color blow molding, but after molding the container having only the high thermal conductivity part of the composite, the part 2 contacting with the sample inside is coated with the resin only. You may form.

[0009]

[Example 2] A gel-like silicone resin in which copper powder having elasticity is dispersed when a gelation treatment is performed on a portion of the outer surface of the container prepared in Example 1 in contact with the sample container holder as shown in FIG. Layers were formed. Here, the portion 3 in FIG. 4 is a gel silicon resin layer in which copper powder having elasticity is dispersed. FIG. 5 is a cross section taken along line AA of FIG. This part is formed by adding copper powder as an inorganic filler to the silicone resin before gelation in a container having a volume ratio of 70% of the silicon carbide filler prepared in Example 1 so as to be uniformly distributed. Add a surfactant, dispersant, etc. and stir it, and apply a solution whose viscosity has been adjusted using a solvent. Then, gelation treatment is performed on this portion. In this example, gelation treatment by heat was performed. Next, in order to test the performance of this container, as shown in FIG. 5, a container in which a flexible portion was installed and a container in which it was not installed were inserted into an aluminum block 4 of a dry thermostat and a comparative test was performed. The aluminum block was set to 80 ° C., each container was inserted into the container holding portion, and a weight was placed on the upper part of the sample container in order to enhance the adhesion between the container and the container holding portion. Then, as in Example 1, the time required to reach 70 ° C. was measured. As a result, the arrival time of the container having the flexible portion was shortened by 80% as compared with the container having no flexible portion. In this embodiment, the flexible portion is installed by coating, but the invention is not limited to this. For example, it may be performed at the same time when the container is molded. That is, three-color molding may be performed by a method such as injection. Of course, for the flexible portion, a material within the scope of the present invention may be selected. That is, the tensile strength of the component resin on the outer surface of the sample container in contact with the sample container holder is 32 MPa or less, the longitudinal elastic modulus is 1.4 GPa or less, or the softening temperature is 100 ° C.
You may select the resin according to the purpose from the following resins. A relaxation layer may be provided between one part of the high thermal conductivity composite part and three parts of the flexible part. By providing this layer, the shear stress of the second and third layers can be relaxed. The inorganic filler dispersed in the flexible portion 3 is not limited to copper powder.
The shape can be freely selected from particles and whiskers, fibers, foils and the like from the inorganic filler having a power of 10 W / (mK) or more.

[0010]

Third Embodiment FIG. 7 shows the appearance of the sample container of the third embodiment. FIG. 8 shows an AA cross section of FIG. 7. Here, 7 parts are boron nitride particles as an inorganic filler in a volume mixture ratio of 60%, 8 parts using epoxy as a resin are polypropylene,
Nine parts used soft PVC in which boron nitride particles were dispersed. The same test as in Example 2 was performed. That is, for comparison, as shown in FIG. 9, a sample container including a portion 10 containing only an epoxy resin containing no inorganic filler and a polypropylene portion 11 is prepared. As shown in FIG. 10, the sample containers 13 were set on the aluminum block 12, and each sample container 13 was pressed by the rod 14 from above. A test was conducted by attaching a thermocouple to the bottom part 15 of the sample holding part of the sample container. As a result, the temperature reached to 70 ° C. was 1/7 of that of the comparative example, which was a good result. Although the present invention has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and it goes without saying that various modifications can be made without departing from the scope of the invention.

[0011]

INDUSTRIAL APPLICABILITY As described above, the present invention is a sample container having high heat conduction and high heat transfer capable of rapidly and efficiently transmitting the temperature process of heating and cooling from the outside to the sample. Biotechnology and chemistry and medicine,
It is an invention for paving the way for new applications and applications in fields related to engineering.

[Brief description of drawings]

FIG. 1 Appearance of Example 1

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is an experimental result of Example 1.

FIG. 4 Appearance of Example 2

5 is a cross section taken along line AA of FIG.

6 is a test state of Example 2. FIG.

FIG. 7 Appearance of Example 3

8 is a cross section taken along line AA of FIG.

FIG. 9 is a cross section of a comparative example.

FIG. 10: Test state of Example 3

[Explanation of symbols]

 1 High Thermal Conduction Part 2 Sample Contact Part 3 Flexible Layer 4 Aluminum Block 5 Sample Container 6 Weight 7 High Thermal Conductivity Part 8, 11 Sample Contact Part 9 Flexible Layer 12 Aluminum Block 13 Sample Container 14 Rod

Claims (14)

[Claims] 1. A sample container having one or more sample holding parts, wherein the components of the sample container are composed of a resin and an inorganic filler. 2. The structure according to claim 1, wherein the portion in contact with the sample is composed only of resin, and the remaining portion is composed of at least two portions composed of a composite of resin and inorganic filler. Sample container. 3. The sample container according to claim 1, wherein the constituent resin of the portion of the outer surface of the sample container which is in contact with the sample container holder is softer than the main component resin of the sample container. . 4. The component resin of the portion of the sample container which is in contact with the sample and is composed only of the resin, the composite portion of the resin and the inorganic filler and the portion of the outer surface of the sample container which is in contact with the sample container holder are A structure in which a stress relaxation layer is provided by a method of polymer adhesion for the purpose of preventing breakage due to a difference in expansion coefficient in at least one layer part of the boundary layer of each part that is a resin that is more easily deformable than the main component. The sample container according to the second and third aspects. 5. The volume content of the inorganic filler is 30% to 9%.
It is 5%, The sample container of Claim 1 characterized by the above-mentioned. 6. The inorganic filler has a thermal conductivity of 10 W / (m
The sample container according to claim 1, wherein the sample container is made of at least one material selected from the group consisting of ceramics, metals, and carbon which is K) or more. 7. The sample container according to claim 1, wherein the inorganic filler has at least one shape selected from particles and whiskers, fibers and foils. 8. The inorganic filler is boron nitride, aluminum oxide, silicon carbide, silicon nitride, calcium carbonate, magnesium oxide, silicon oxide, quartz glass, zirconium oxide, titanium nitride, beryllium oxide, carbon, diamond, gold, silver, The sample container according to claim 1, characterized in that at least one material selected from copper, aluminum, tungsten, and molybdenum is a main component. 9. The sample container according to claim 2, wherein the thickness of the portion which is in contact with the sample and is composed only of the resin is 5 μm to 200 μm. 10. The thickness of the portion of the outer surface of the sample container, which is softer than the main component resin of the sample container, of the component resin of the part in contact with the sample container holder has a thickness of 5 μm.
The sample container according to claim 3, wherein the sample container has a thickness of 300 μm. 11. The tensile strength of the constituent resin at the portion of the outer surface of the sample container which is in contact with the sample container holder is 32 MPa or less.
Item sample container. 12. The longitudinal elastic modulus of the constituent resin of the portion of the outer surface of the sample container which is in contact with the sample container holder is 1.
It is 4 GPa or less, The sample container of Claim 3 characterized by the above-mentioned. 13. The sample container according to claim 3, wherein the component resin of the portion of the outer surface of the sample container which is in contact with the sample container holder is gel. 14. The softening temperature of the constituent resin of the portion of the outer surface of the sample container which is in contact with the sample container holder is 10.
The sample container according to claim 3, wherein the sample container has a temperature of 0 ° C or lower.