JPH07105635B2 - Chip-shaped electronic component mounting method - Google Patents
Chip-shaped electronic component mounting methodInfo
- Publication number
- JPH07105635B2 JPH07105635B2 JP2103336A JP10333690A JPH07105635B2 JP H07105635 B2 JPH07105635 B2 JP H07105635B2 JP 2103336 A JP2103336 A JP 2103336A JP 10333690 A JP10333690 A JP 10333690A JP H07105635 B2 JPH07105635 B2 JP H07105635B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- electronic component
- shaped electronic
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】 （イ）産業上の利用分野 本発明は、プリント基板にチップ状の電子部品を自動的
に装着する場合に利用する部品装着方法に関する。TECHNICAL FIELD The present invention relates to a component mounting method used when a chip-shaped electronic component is automatically mounted on a printed circuit board.
（ロ）従来の技術 従来、プリント基板にチップ状の電子部品を装着する際
に、テレビカメラ等による画像認識手段を用いて基板の
位置ずれを検出し、装着ヘッドとプリント基板との相対
的な位置を補正して装着する方法がよく用いられ、特開
昭62−214692公報にその一例が有る。(B) Conventional Technology Conventionally, when mounting a chip-shaped electronic component on a printed circuit board, the positional displacement of the circuit board is detected using an image recognition means such as a television camera, and the relative position between the mounting head and the printed circuit board is detected. A method of correcting and mounting the position is often used, and an example thereof is disclosed in JP-A-62-214692.
第２図に示す従来例では、照明装置とテレビカメラ等か
らなる撮像手段６と画像認識手段７で構成する基板位置
認識装置を設け、予めプリント基板３に設けられた位置
決め用マーク4a、4bを撮像するようにプリント基板３を
搭載したテーブル８をＸ方向、Ｙ方向に移動する。そし
て、撮像手段６の下に来た位置決め用マーク4a、4bを撮
像し、前記基板位置認識装置で基板位置情報を検出して
プリント基板３と装着ヘッド部９との位置ずれを計算す
る。そして、前記位置ずれ量だけテーブル８を移動し、
プリント基板３と装着ヘッド部９との相対的な位置ずれ
を補正した後、装着ヘッド部９により電子部品を装着す
る。In the conventional example shown in FIG. 2, a board position recognizing device including an image pickup means 6 including an illuminating device and a television camera and an image recognizing means 7 is provided, and positioning marks 4a and 4b provided on the printed board 3 in advance are provided. The table 8 on which the printed circuit board 3 is mounted is moved in the X and Y directions so as to capture an image. Then, the positioning marks 4a and 4b coming under the image pickup means 6 are imaged, the board position recognizing device detects the board position information, and the positional deviation between the printed board 3 and the mounting head portion 9 is calculated. Then, the table 8 is moved by the amount of displacement,
After the relative displacement between the printed circuit board 3 and the mounting head unit 9 is corrected, the mounting head unit 9 mounts the electronic component.
（ハ）発明が解決しようとする課題 上記のような構成のチップ状電子部品装着方法において
は、プリント基板に設けられたプリント配線パターンと
装着ヘッド部との位置ずれは補正することができるが、
前記プリント基板にスクリーン印刷工程で塗布されてい
る半田ペースト等との相対的な位置補正はなされていな
いため、半田ペースト等とチップ状電子部品とのずれに
より半田付け不良などが発生する問題があった。また、
この問題に対処するためスクリーン印刷装置においても
基板位置認識機能を設け、スクリーンとプリント基板位
置とを相対的に補正して印刷ずれを防止することができ
るが、チップ状電子部品の自動装着システム全体として
複雑かつコストアップとなる欠点があった。(C) Problem to be Solved by the Invention In the chip-shaped electronic component mounting method configured as described above, the positional deviation between the printed wiring pattern provided on the printed circuit board and the mounting head portion can be corrected,
Since the relative position of the solder paste or the like applied to the printed circuit board in the screen printing process is not corrected, there is a problem that the solder paste or the like is misaligned with the chip-shaped electronic component to cause a soldering failure or the like. It was Also,
In order to deal with this problem, a screen printing device is also provided with a board position recognition function to relatively correct the screen position and the printed board position to prevent printing misalignment. However, there is a drawback that it is complicated and increases the cost.
（ニ）課題を解決するための手段 このような点を考えて本発明に係るチップ状電子部品装
着方法は、予めプリント基板に位置決め用マークを設け
るのではなく、スクリーン印刷工程で位置決めマークを
印刷し、この位置決めマークの位置と印刷状態を装着工
程で画像認識手段により検出する。そこで半田ペースト
等の印刷ずれ、印刷状態を判別した後、印刷されたパタ
ーンに応じてプリント基板と装着ヘッド部との相対位置
を補正し部品を装着する。(D) Means for Solving the Problem In consideration of such a point, in the chip-shaped electronic component mounting method according to the present invention, the positioning mark is printed in the screen printing step instead of previously providing the positioning mark on the printed board. Then, the position of this positioning mark and the printing state are detected by the image recognition means in the mounting step. Therefore, after determining the printing deviation and the printing state of the solder paste or the like, the relative position between the printed board and the mounting head unit is corrected according to the printed pattern, and the component is mounted.
（ホ）作用 上記のチップ状電子部品装着方法によって、半田クリー
ム等のスクリーン印刷パターンと装着ヘッド部との位置
補正ができるだけでなく、スクリーン印刷のずれ判別及
び、印刷状態の良否判別が可能となる。(E) Action By the above chip-shaped electronic component mounting method, it is possible not only to correct the position of the screen printing pattern such as solder cream and the mounting head portion but also to discriminate the screen printing deviation and the quality of the printing state. .
（ヘ）実施例 第１図は、本発明チップ状電子部品装着方法における相
対位置ずれ補正状況の説明図であり、部品装着装置の構
成そのものは第２図に示す従来例と同じである。(F) Embodiment FIG. 1 is an explanatory diagram of a relative positional deviation correction state in the chip-shaped electronic component mounting method of the present invention, and the configuration itself of the component mounting apparatus is the same as the conventional example shown in FIG.
第１図において、１のスクリーン印刷工程で半田ペース
ト等を印刷する際に、印刷位置認識用マークとして半田
ペースト5a、5bをプリント基板３の黒色印刷抵抗体10
a、10b等の上に印刷する。図示しない搬送コンベア等に
よって部品装着工程２に搬送した前記プリント基板３
は、第２図に示すような基板位置制御テーブル８に搭載
し固定する。そして、撮像手段６の視野中心に、前記印
刷位置認識用マーク5a、5bの中心の有るべき位置が来る
よう前記基板位置制御テーブル８をそれぞれ移動する。
撮像手段が取り込んだ印刷位置認識用マーク5a、5bの画
像情報は、画像認識手段７によって処理し、まず、前記
印刷位置認識用マーク5a、5bが予め規定した面積以上印
刷されているかを判別する。次に、実際の印刷位置認識
用マークの位置が、所定の位置からずれている量を計算
し予め規定したずれ限度基準内に入っているかを判別す
る。In FIG. 1, when printing a solder paste or the like in the screen printing step of 1, the solder pastes 5a and 5b are used as print position recognition marks and the black printed resistor 10 of the printed circuit board 3 is used.
Print on a, 10b, etc. The printed circuit board 3 conveyed to the component mounting step 2 by a conveyor not shown.
Are mounted and fixed on a substrate position control table 8 as shown in FIG. Then, the board position control table 8 is moved so that the positions of the print position recognition marks 5a and 5b should be at the center of the visual field of the image pickup means 6.
The image information of the print position recognition marks 5a, 5b captured by the image pickup means is processed by the image recognition means 7, and first, it is determined whether or not the print position recognition marks 5a, 5b are printed over a predetermined area. . Next, the amount of deviation of the actual print position recognition mark from the predetermined position is calculated, and it is determined whether or not it is within the predetermined deviation limit standard.
前記印刷位置認識用マークが規定の面積を有し、位置ず
れも限度基準内にある場合に、ずれ量だけ基板位置制御
テーブルを移動し、装着ヘッド部との相対位置を補正す
る。補正終了後、装着ヘッド部９によって所定の位置に
チップ状電子部品を装着する。一方、前記印刷位置認識
用マークが規定の面積を有しない、或は、位置ずれが限
度基準を越える場合には、画像認識手段７の信号により
部品装着装置の図示しない制御装置が認識エラーを表明
する。そして、再度前述の画像認識作業を繰り返し、そ
れでも認識エラーとなるとき前記部品装着装置の制御装
置は「印刷不良」を表示し、作業者に警報等で知らせ部
品装着装置を一時停止させる。When the print position recognition mark has a specified area and the positional deviation is within the limit reference, the substrate position control table is moved by the amount of deviation to correct the relative position to the mounting head unit. After the correction is completed, the mounting head unit 9 mounts the chip-shaped electronic component at a predetermined position. On the other hand, when the print position recognition mark does not have a prescribed area or the positional deviation exceeds the limit standard, the control device (not shown) of the component mounting device indicates a recognition error by the signal of the image recognition means 7. To do. Then, the above-mentioned image recognition work is repeated again, and when a recognition error still occurs, the control device of the component mounting apparatus displays "printing failure" and informs the operator by an alarm or the like to suspend the component mounting apparatus.
また、本実施例では、装着ヘッド位置は固定しプリント
基板を搭載するテーブルを移動することにより、所望の
位置にチップ状電子部品を装着する場合について述べた
が、プリント基板位置を固定し装着ヘッド位置を移動し
て所望の位置にチップ状電子部品を装着する場合におい
ても、装着ヘッド位置制御テーブル側を位置補正するこ
とにより同様に適用できる。In this embodiment, the mounting head position is fixed and the table on which the printed circuit board is mounted is moved to mount the chip-shaped electronic component at a desired position. However, the printed circuit board position is fixed and the mounting head is fixed. Even when the position is moved and the chip-shaped electronic component is mounted at a desired position, the same can be applied by correcting the position of the mounting head position control table side.
（ト）発明の効果 以上のように、本発明チップ状電子部品装着方法によっ
て、スクリーン印刷された半田ペースト等の印刷パター
ンと装着ヘッド部との位置ずれ補正による装着精度、稼
動率の向上を図ることができる。さらに、プリント基板
の配線パターンに対して、半田ペースト等のスクリーン
印刷が適切な位置に行われているか、また、適切な分量
が塗布されているかを判別した後に部品を装着するた
め、装着したプリント基板の品質向上が可能となる。(G) Effect of the Invention As described above, according to the chip-shaped electronic component mounting method of the present invention, it is possible to improve the mounting accuracy and the operation rate by correcting the positional deviation between the printing pattern of the screen-printed solder paste and the mounting head portion. be able to. In addition, because it is determined whether screen printing of solder paste etc. is performed at an appropriate position on the wiring pattern of the printed circuit board, and whether an appropriate amount is applied, the component is mounted and the mounted print is performed. It is possible to improve the quality of the substrate.
第１図は、本発明チップ状電子部品装着方法における位
置ずれ補正状況の説明図、第２図は、本発明に係わる従
来例を説明する要部斜視図である。 ３…プリント基板、4a、4b…基板位置決め用マーク、5
a、5b…印刷位置認識用マーク、６…撮像手段、７…画
像認識手段、８…基板位置制御テーブル、９…装着ヘッ
ド部、10a、10b…黒色印刷抵抗体。FIG. 1 is an explanatory diagram of a positional deviation correction situation in the chip-shaped electronic component mounting method of the present invention, and FIG. 2 is a perspective view of a main part for explaining a conventional example according to the present invention. 3 ... Printed circuit board, 4a, 4b ... Board positioning mark, 5
a, 5b ... Mark for printing position recognition, 6 ... Imaging means, 7 ... Image recognition means, 8 ... Board position control table, 9 ... Mounting head section, 10a, 10b ... Black printing resistor.
Claims (1)
し、プリント基板の所定の位置に自動的に装着するに際
して、 前記プリント基板に半田ペースト等を塗布するスクリー
ン印刷工程で、予め定めた複数の個所に位置決めマーク
を印刷し、前記位置決めマークを、テレビカメラ等の撮
像手段と画像認識手段とからなる基板位置認識装置で検
出して、スクリーン印刷された半田ペースト等の印刷パ
ターンの位置ずれや印刷状態を判別した後、前記プリン
ト基板が搭載される基板位置制御テーブル若しくは、チ
ップ状電子部品を吸着する装着ヘッドの位置制御テーブ
ルを、前記印刷パターンの位置ずれに応じて移動補正す
ることを特徴とするチップ状電子部品装着方法。1. When a chip-shaped electronic component is adsorbed by an adsorbing means and automatically mounted at a predetermined position on a printed circuit board, a plurality of predetermined plural screen printing steps are performed in which a solder paste or the like is applied to the printed circuit board. A positioning mark is printed at a position, and the positioning mark is detected by a board position recognition device including an image pickup means such as a television camera and an image recognition means, and a positional deviation or printing of a print pattern such as a screen-printed solder paste is detected. After determining the state, the board position control table on which the printed circuit board is mounted or the position control table of the mounting head that sucks the chip-shaped electronic component is moved and corrected according to the positional deviation of the print pattern. Chip-shaped electronic component mounting method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2103336A JPH07105635B2 (en) | 1990-04-19 | 1990-04-19 | Chip-shaped electronic component mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2103336A JPH07105635B2 (en) | 1990-04-19 | 1990-04-19 | Chip-shaped electronic component mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH042200A JPH042200A (en) | 1992-01-07 |
| JPH07105635B2 true JPH07105635B2 (en) | 1995-11-13 |
Family
ID=14351315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2103336A Expired - Lifetime JPH07105635B2 (en) | 1990-04-19 | 1990-04-19 | Chip-shaped electronic component mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07105635B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3238943B2 (en) * | 1992-05-12 | 2001-12-17 | 三洋電機株式会社 | Parts assembly method |
| JP3656533B2 (en) | 2000-09-08 | 2005-06-08 | 松下電器産業株式会社 | Electronic component mounting apparatus and electronic component mounting method |
| JP4715009B2 (en) * | 2001-03-26 | 2011-07-06 | ソニー株式会社 | How to recognize workpiece reference marks |
| JP5577770B2 (en) * | 2010-03-15 | 2014-08-27 | 日本電気株式会社 | Coordinate correction method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6346795A (en) * | 1986-08-14 | 1988-02-27 | 松下電器産業株式会社 | Cream solder printer |
| JPH0770871B2 (en) * | 1988-01-19 | 1995-07-31 | 松下電器産業株式会社 | Electronic component mounting device |
-
1990
- 1990-04-19 JP JP2103336A patent/JPH07105635B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH042200A (en) | 1992-01-07 |
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