JPH0589430A - Thin-film magnetic head - Google Patents
Thin-film magnetic headInfo
- Publication number
- JPH0589430A JPH0589430A JP16190791A JP16190791A JPH0589430A JP H0589430 A JPH0589430 A JP H0589430A JP 16190791 A JP16190791 A JP 16190791A JP 16190791 A JP16190791 A JP 16190791A JP H0589430 A JPH0589430 A JP H0589430A
- Authority
- JP
- Japan
- Prior art keywords
- lower core
- core
- magnetic head
- gap
- recessed part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005291 magnetic effect Effects 0.000 title claims abstract description 73
- 239000010409 thin film Substances 0.000 title claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000004020 conductor Substances 0.000 claims abstract description 13
- 238000005530 etching Methods 0.000 abstract description 11
- 239000000696 magnetic material Substances 0.000 abstract description 8
- 238000010030 laminating Methods 0.000 abstract description 2
- 238000005253 cladding Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 31
- 239000011229 interlayer Substances 0.000 description 15
- 239000012792 core layer Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 229910004298 SiO 2 Inorganic materials 0.000 description 6
- 229910000889 permalloy Inorganic materials 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 238000000992 sputter etching Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 229910000702 sendust Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Landscapes
- Magnetic Heads (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、例えばハードディス
ク用磁気記録装置に使用される薄膜磁気ヘッドに関する
もので、特にギャップデプス精度の高い薄膜磁気ヘッド
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film magnetic head used in, for example, a magnetic recording device for a hard disk, and more particularly to a thin film magnetic head having a high gap depth accuracy.
【０００２】[0002]
【従来の技術】薄膜磁気ヘッドの一従来例を図４と図５
に示す。符号１は基板、２は下部絶縁層、３は下部コ
ア、４はギャップ層、５は層間絶縁層、６はコイル導
体、７は上部コア、８は保護層である。また、各コア
３,７の媒体対向面側の先端部をギャップ層４を介して
重ね合わせることでそれらコア３,７の先端部を対の磁
極(ポール)９,１０となしたものである。薄膜磁気ヘッ
ドを製造するにあっては、ウエハ工程、チップスライス
工程、研磨工程、アセンブリ工程等を経るが、これらの
うちのウエハ工程の一例を以下に記す。セラミック(Ａl
2Ｏ3−ＴiＣ等)からなる基板１上に、下部絶縁層２(Ａl
2Ｏ3、ＳiＯ2等)を形成し、その上面にパーマロイやセ
ンダスト等の強磁性材料をスパッタリングして下部コア
３を形成する。次に、下部コア３の上にギャップ層４と
して酸化ケイ素(ＳiＯ2)、酸化アルミニウム(Ａl2Ｏ3)
などをギャップ長を規制する所定厚さにスパッタリング
し、下部コア３と上部コア７とを接続するバックギャッ
プ部１１をエッチングで除去する。さらに、ギャップ層
４の上にアルミニウム(Ａl)や銅(Ｃu)等を蒸着あるいは
スパッタリングし、ドライエッチング法によりコイル導
体６を形成する。その後、層間絶縁層５として、ポリイ
ミド系樹脂もしくはＳiＯ2等でコイル導体６を被包して
平坦化する。次に、フロントギャップ部１２、バックギ
ャップ部１１の層間絶縁層５をエッチングして除去す
る。そして、前記層間絶縁層５の表面上に、パーマロイ
やセンダスト等をスパッタリングして上部コア７を形成
し、所定のコア形状にエッチングする。こうして、両コ
ア３,７の媒体対向面側の先端部が対の磁極９,１０とな
って、それらの間にギャップ層４が形成される。さら
に、Ａl2Ｏ3,ＳｉＯ2等からなる保護層８を形成する。2. Description of the Related Art A conventional example of a thin film magnetic head is shown in FIGS.
Shown in. Reference numeral 1 is a substrate, 2 is a lower insulating layer, 3 is a lower core, 4 is a gap layer, 5 is an interlayer insulating layer, 6 is a coil conductor, 7 is an upper core, and 8 is a protective layer. Further, the tip end portions of the cores 3 and 7 on the medium facing surface side are overlapped with each other via the gap layer 4 to form the tip portions of the cores 3 and 7 into a pair of magnetic poles (poles) 9. .. In manufacturing a thin film magnetic head, a wafer process, a chip slicing process, a polishing process, an assembly process, and the like are performed. An example of the wafer process is described below. Ceramic (Al
On a substrate 1 made of 2 O 3 -TiC, etc.), a lower insulating layer 2 (Al
2 O 3 , SiO 2, etc.) is formed, and a ferromagnetic material such as permalloy or sendust is sputtered on the upper surface thereof to form the lower core 3. Next, silicon oxide (SiO 2 ) and aluminum oxide (Al 2 O 3 ) were formed as the gap layer 4 on the lower core 3.
Etc. are sputtered to a predetermined thickness that regulates the gap length, and the back gap portion 11 connecting the lower core 3 and the upper core 7 is removed by etching. Further, aluminum (Al), copper (Cu) or the like is vapor-deposited or sputtered on the gap layer 4 to form the coil conductor 6 by a dry etching method. After that, as the interlayer insulating layer 5, the coil conductor 6 is covered with a polyimide resin or SiO 2 to be flattened. Next, the interlayer insulating layer 5 in the front gap portion 12 and the back gap portion 11 is removed by etching. Then, on the surface of the interlayer insulating layer 5, permalloy, sendust, or the like is sputtered to form the upper core 7, and the upper core 7 is etched into a predetermined core shape. In this way, the tips of the cores 3 and 7 on the medium facing surface side become the pair of magnetic poles 9 and 10, and the gap layer 4 is formed between them. Further, a protective layer 8 made of Al 2 O 3, SiO 2 or the like is formed.
【０００３】[0003]
【発明が解決しようとする課題】磁気ヘッドではその先
端の磁気ギャップにおいて磁気記録再生を行なうもので
あり、下部磁極９と上部磁極１０がギャップ層４を介し
て対峙してなる磁気ギャップの深さ、即ちギャップデプ
スＧｄが磁気ヘッドの特性に与える影響は大きい。一般
に、ギャップデプスＧｄは±１μm以下という高精度で
形成されることが要求されてきていた。ギャップデプス
Ｇｄの精度は、上部コア７の上部コアエッジ１３の位置
で決まってしまっているが、これは製造時における層間
絶縁層５のエッチング工程で定められるものである。即
ち、フロントギャップ部１２の層間絶縁層５のエッチン
グ精度に左右されてしまうものである。層間絶縁層５に
は、ポリイミド系樹脂等の有機材料やＳiＯ2などが使用
されるが、これらをエッチングするとサイドエッチング
効果が大きく、エッチング精度は低いものである。特
に、層間絶縁層５に有機材料を使用した場合には調整が
困難である。従って、上部コアエッジ１３の位置決め精
度を高めることが困難であった。In the magnetic head, magnetic recording and reproduction are performed in the magnetic gap at the tip of the magnetic head, and the depth of the magnetic gap formed by the lower magnetic pole 9 and the upper magnetic pole 10 facing each other through the gap layer 4. That is, the gap depth Gd has a great influence on the characteristics of the magnetic head. Generally, the gap depth Gd has been required to be formed with high accuracy of ± 1 μm or less. The accuracy of the gap depth Gd is determined by the position of the upper core edge 13 of the upper core 7, which is determined by the etching process of the interlayer insulating layer 5 during manufacturing. That is, it depends on the etching accuracy of the interlayer insulating layer 5 in the front gap portion 12. An organic material such as a polyimide resin, SiO 2 or the like is used for the interlayer insulating layer 5, but when these are etched, the side etching effect is large and the etching accuracy is low. In particular, adjustment is difficult when an organic material is used for the interlayer insulating layer 5. Therefore, it is difficult to improve the positioning accuracy of the upper core edge 13.
【０００４】本発明は前記課題を解決するためになされ
たもので、下部コアに凹部を形成することで、下部コア
エッジの位置決めを行ない、もってギャップデプスの形
成精度を高めるものである。The present invention has been made in order to solve the above-mentioned problems, and forms a recess in the lower core to position the lower core edge, thereby improving the accuracy of forming the gap depth.
【０００５】[0005]
【課題を解決するための手段】本発明の薄膜磁気ヘッド
は、基板の表面にコイル導体を被包した絶縁層とギャッ
プ層とを介して積層した下部コア及び上部コアのそれぞ
れの先端面を前記基板の側面側に露出させることによ
り、それら下部コアと上部コアの先端部をそれらの間に
ギャップ層を介する対の下部磁極と上部磁極となした薄
膜磁気ヘッドにおいて、下部磁極のコイル導体側の後方
に凹部が形成され、凹部の先端が下部コアエッジを規定
してなることを特徴とするものである。In the thin film magnetic head of the present invention, the tip surfaces of the lower core and the upper core, which are laminated on the surface of the substrate with an insulating layer enclosing a coil conductor and a gap layer, respectively By exposing to the side surface side of the substrate, the tips of the lower core and the upper core form a pair of lower magnetic pole and upper magnetic pole with a gap layer between them to form a pair of lower magnetic pole and upper magnetic pole. It is characterized in that a recess is formed on the rear side and the tip of the recess defines the lower core edge.
【０００６】[0006]
【作用】本発明の薄膜磁気ヘッドでは、下部コアに凹部
を形成する。この凹部の先端が下部コアエッジを規定
し、また、ギャップデプスは磁気ヘッドの先端から下部
コアエッジまでの距離とすることができる。磁性体から
構成される下部コアのエッチング精度は高くすることが
できるので、凹部の位置決め精度は高いものである。よ
って、下部コアエッジの位置決め精度も高く、もってギ
ャップデプスの精度を高くすることができる。In the thin film magnetic head of the present invention, the recess is formed in the lower core. The tip of this recess defines the lower core edge, and the gap depth can be the distance from the tip of the magnetic head to the lower core edge. Since the etching accuracy of the lower core made of a magnetic material can be increased, the positioning accuracy of the recess is high. Therefore, the positioning accuracy of the lower core edge is also high, and thus the accuracy of the gap depth can be increased.
【０００７】[0007]
（実施例１）本実施例の薄膜磁気ヘッドを図１に示す。
本実施例の薄膜磁気ヘッドは、アルチックからなる基板
１２上にパーマロイ等の磁性材料からなる下部コア１６
が形成され、さらにその上に二酸化ケイ素等からなるギ
ャップ層２０と銅等からなるコイル導体２２、２２を被
包する層間絶縁層２４が積層されている。下部コア１６
の厚さは５μm程度が好ましい。また、層間絶縁層２４
は従来例同様、ポリイミド系樹脂もしくはＳiＯ2等から
なるものであってもかまわない。さらに、層間絶縁層２
４上にはこれを覆う上部コア１８が形成されている。
尚、上部コア１８上には図１では図示されていないが、
図４に示す薄膜磁気ヘッド同様、保護層が形成されてい
る。また、層間絶縁層２４を覆う上部コア１８の傾斜角
度Ｒは４５゜位が好ましい。下部コア１６と上部コア１
８の先端は基板１２の側面側（図１においては、左方）
に露出されており、下部コア１６と上部コア１８の先端
部は、それらの間にギャップ層２０のみを介する一対の
下部磁極２８と上部磁極３０を構成している。そして、
下部磁極２８のコイル導体２２側の後方には凹部２６が
形成されている。その際、凹部２６の先端は下部磁極２
８の後端（下部コアエッジ３４）をその一端としてい
る。この際、ギャップ層２０は下部コア１６の表面に沿
って形成されているので、ギャップ層２０は凹部２６の
表面に沿っている。実施例１の薄膜磁気ヘッドでは、凹
部２６は、深さが２.５μm程度で、長さが３μm程度で
あることが好ましい。尚、凹部２６の内側面の側面角度
θは実施例１の薄膜磁気ヘッドでは、４５゜に設定され
ている。さらに、下部磁極２８と基板１２の間にはアル
ミナやポリイミド等の非磁性体からなる非コア層１４が
形成されている。以上の構成の薄膜磁気ヘッドでは、ギ
ャップデプスＧｄは上部コアエッジ３２で規定されるの
でなく、凹部２６の端末でもある下部コアエッジ３４で
規定されている。尚、ギャップデプスＧｄは一般に２〜
３μmが適当である。(Embodiment 1) A thin film magnetic head of this embodiment is shown in FIG.
The thin film magnetic head of this embodiment has a lower core 16 made of a magnetic material such as permalloy on a substrate 12 made of AlTiC.
And a gap layer 20 made of silicon dioxide or the like and an interlayer insulating layer 24 covering the coil conductors 22 made of copper or the like are further laminated thereon. Lower core 16
The thickness is preferably about 5 μm. In addition, the interlayer insulating layer 24
Similarly to the conventional example, may be made of polyimide resin, SiO 2, or the like. Further, the interlayer insulating layer 2
An upper core 18 for covering this is formed on the surface 4.
Although not shown in FIG. 1 on the upper core 18,
Similar to the thin film magnetic head shown in FIG. 4, a protective layer is formed. The inclination angle R of the upper core 18 that covers the interlayer insulating layer 24 is preferably about 45 °. Lower core 16 and upper core 1
The tip of 8 is the side of the substrate 12 (left in FIG. 1).
The front ends of the lower core 16 and the upper core 18 form a pair of lower magnetic pole 28 and upper magnetic pole 30 with only the gap layer 20 interposed therebetween. And
A recess 26 is formed behind the lower magnetic pole 28 on the coil conductor 22 side. At that time, the tip of the concave portion 26 has the lower magnetic pole 2
The rear end of 8 (lower core edge 34) is one end thereof. At this time, since the gap layer 20 is formed along the surface of the lower core 16, the gap layer 20 extends along the surface of the recess 26. In the thin film magnetic head of the first embodiment, the recess 26 preferably has a depth of about 2.5 μm and a length of about 3 μm. The side surface angle θ of the inner side surface of the recess 26 is set to 45 ° in the thin film magnetic head of the first embodiment. Further, a non-core layer 14 made of a non-magnetic material such as alumina or polyimide is formed between the lower magnetic pole 28 and the substrate 12. In the thin film magnetic head having the above structure, the gap depth Gd is not defined by the upper core edge 32 but by the lower core edge 34 which is also the end of the recess 26. The gap depth Gd is generally 2 to
3 μm is suitable.
【０００８】本実施例の薄膜磁気ヘッドの製造方法を図
３を参照して説明する。まず、図３（ａ）で示すよう
に、基板１２上の所定の位置に、非磁性体からなる非コ
ア層１４を形成する。その後、基板１２と非コア層１４
上にパーマロイ等の磁性体をスパッタリング等で積層し
て下部コア１６ａを形成する。そして、図３（ｂ）に示
すように、非コア層１４を下方に介さない部分の下部コ
ア１６ａ上にレジスト３６を塗布する。その後、これを
上方からエッチングして図３（ｃ）に示すように、非コ
ア層１４と下部コア１６ａを平坦化する。さらに、この
平坦化された非コア層１４と下部コア１６ａの上に磁性
体を積層して下部コア１６ｂを形成する。こうして図３
（ｄ）に示すように、基板１２上に非コア層１４と下部
コア１６が形成される。尚、下部磁極２８の厚さは下部
コア１６ｂの厚さによって調節できる。そして、下部コ
ア１６上に、凹部２６の形成部分を除いてレジスト３８
を塗布する（図３（ｅ））。そして、レジスト３８のベ
ーク後に、イオンミリング加工をして、深さ２.５μm程
度の凹部２６を形成し、さらにレジスト３８を除去する
ことで図３（ｆ）に示すように、凹部２６の形成された
下部コア１６が形成される。その後は、従来技術同様
に、層間絶縁層２４とコイル導体２２を順次積層し、さ
らに、上部コア１８と保護層を成膜して形成する。さら
に、これら積層工程終了後に、先端から研磨加工を施し
て所定長のギャップデプスＧｄを有する薄膜磁気ヘッド
が製造される。A method of manufacturing the thin film magnetic head of this embodiment will be described with reference to FIG. First, as shown in FIG. 3A, the non-core layer 14 made of a non-magnetic material is formed at a predetermined position on the substrate 12. Then, the substrate 12 and the non-core layer 14
A lower core 16a is formed by laminating a magnetic material such as permalloy on the top by sputtering or the like. Then, as shown in FIG. 3B, a resist 36 is applied on the lower core 16a in a portion where the non-core layer 14 is not interposed below. Then, this is etched from above to planarize the non-core layer 14 and the lower core 16a as shown in FIG. Further, a magnetic material is laminated on the flattened non-core layer 14 and the lower core 16a to form the lower core 16b. Thus, FIG.
As shown in (d), the non-core layer 14 and the lower core 16 are formed on the substrate 12. The thickness of the lower magnetic pole 28 can be adjusted by the thickness of the lower core 16b. Then, the resist 38 is formed on the lower core 16 except for the portion where the recess 26 is formed.
Is applied (FIG. 3 (e)). Then, after the resist 38 is baked, ion milling is performed to form the recess 26 having a depth of about 2.5 μm, and the resist 38 is removed to form the recess 26 as shown in FIG. The formed lower core 16 is formed. After that, as in the conventional technique, the interlayer insulating layer 24 and the coil conductor 22 are sequentially laminated, and the upper core 18 and the protective layer are further formed. Further, after the completion of these lamination steps, polishing is performed from the tip to manufacture a thin film magnetic head having a gap depth Gd of a predetermined length.
【０００９】本実施例の薄膜磁気ヘッドでは、凹部２６
の先端である下部コアエッジ３４から先端側に磁気ギャ
ップが形成されている。即ち、ギャップデプスＧｄは磁
気ヘッドの先端から、従来例のように上部コアエッジま
での長さでなく、下部コアエッジ３４までの長さで定ま
っている。そして、その下部コアエッジ３４は凹部２６
を形成することでその位置が定まるものである。下部コ
ア１６のエッチングは、ケミカルエッチングやイオンエ
ッチングが使用できるが、パーマロイ等の磁性体からな
る下部コア１６のエッチングではサイドエッチング効果
が起こらず、高精度に凹部２６を形成することができ
る。従って、ギャップデプスＧｄの精度を格段に高める
ことができる。ギャップデプスＧｄの精度の高い本実施
例の薄膜磁気ヘッドでは、磁気記録特性が向上されてお
り、また信頼性が高いものである。In the thin film magnetic head of this embodiment, the recess 26
A magnetic gap is formed from the lower core edge 34, which is the tip of, to the tip side. That is, the gap depth Gd is determined not by the length from the tip of the magnetic head to the upper core edge as in the conventional example, but by the length from the lower core edge 34. Then, the lower core edge 34 is formed into the recess 26.
The position is determined by forming. As the etching of the lower core 16, chemical etching or ion etching can be used, but the side etching effect does not occur in the etching of the lower core 16 made of a magnetic material such as permalloy, and the recess 26 can be formed with high accuracy. Therefore, the accuracy of the gap depth Gd can be significantly improved. The thin film magnetic head of the present embodiment having a high gap depth Gd has improved magnetic recording characteristics and high reliability.
【００１０】また、凹部２６を形成する本実施例の製造
方法では、下部磁極２８の厚みが大き過ぎてしまうこと
があるが、基板１２と下部磁極２８の間に非コア層１４
を形成することで、下部磁極２８の厚みを好適範囲内に
設定することができる。Further, in the manufacturing method of the present embodiment in which the recess 26 is formed, the thickness of the lower magnetic pole 28 may be too large, but the non-core layer 14 is formed between the substrate 12 and the lower magnetic pole 28.
By forming the, the thickness of the lower magnetic pole 28 can be set within a suitable range.
【００１１】さらにまた、非コア層１４上に下部コア１
６を積層することで、下部コア１６には斜部４０が形成
され、その下部コア１６の斜部４０に凹部２６が形成さ
れるために、下部コア１６の斜部４０が細くなってしま
う可能性があるが、これは凹部２６の側面を斜面にする
ことで解決できる。Furthermore, the lower core 1 is formed on the non-core layer 14.
Since the slanted portions 40 are formed in the lower core 16 and the recesses 26 are formed in the slanted portions 40 of the lower core 16 by stacking the six layers 6, the slanted portion 40 of the lower core 16 may be thin. However, this can be solved by forming the side surface of the recess 26 into an inclined surface.
【００１２】（実施例２）実施例２の薄膜磁気ヘッドを
図２に示す。実施例２の薄膜磁気ヘッドは実施例１の薄
膜磁気ヘッドとほぼ同様であるが、凹部２６の側面の側
面角度θを変えたものである。即ち、側面角度θは実施
例１の薄膜磁気ヘッドでは４５゜であったが、実施例２
の薄膜磁気ヘッドでは６０゜に設定した。この側面角度
θを大きくすることで、下部コア１６の斜部４０を必要
に応じて太くすることができる。側面の側面角度θは４
５゜〜７０゜が好ましい。また、凹部２６の側面の側面
角度θの調製方法は、図６（ａ）に示すように、レジス
ト３８を形成した後に、レジスト３８をベークするが、
この時にレジスト３８に傾斜角度α、α’が形成される
（図６（ｂ））。その後にイオンミリングをして、レジ
スト３８を除去することで、図６（ｃ）に示すように、
下部コア１６に、側面角度θの内側面を有する凹部２６
が形成される。従って、側面角度θは傾斜角度αに対応
するわけだが、傾斜角度αはベーク温度を制御すること
で調製できる。(Embodiment 2) A thin film magnetic head of Embodiment 2 is shown in FIG. The thin film magnetic head of the second embodiment is almost the same as the thin film magnetic head of the first embodiment, but the side surface angle θ of the side surface of the recess 26 is changed. That is, the side surface angle θ was 45 ° in the thin film magnetic head of the first embodiment, but
The thin film magnetic head of No. 1 was set at 60 °. By increasing the side surface angle θ, the slant portion 40 of the lower core 16 can be thickened as necessary. The side angle θ of the side is 4
5 ° to 70 ° is preferable. Further, in the method of adjusting the side surface angle θ of the side surface of the recess 26, as shown in FIG. 6A, the resist 38 is baked after the resist 38 is formed.
At this time, the inclination angles α and α ′ are formed on the resist 38 (FIG. 6B). After that, ion milling is performed to remove the resist 38, so that as shown in FIG.
The lower core 16 has a recess 26 having an inner side surface with a side surface angle θ.
Is formed. Therefore, the side surface angle θ corresponds to the inclination angle α, but the inclination angle α can be adjusted by controlling the baking temperature.
【００１３】[0013]
【発明の効果】本発明の薄膜磁気ヘッドでは、下部コア
に、凹部を形成し、その凹部の先端を下部コアエッジと
したもので、凹部の形成精度は高くできるために、先端
から下部コアエッジまでの距離であるギャップデプスの
精度を格段に高めることができる。従って、本発明の薄
膜磁気ヘッドでは、ギャップデプスが高精度に形成され
ているので、磁気特性が良好で、信頼性の高いものであ
る。In the thin-film magnetic head of the present invention, the lower core is provided with a recess and the tip of the recess is used as the lower core edge. Since the accuracy of forming the recess can be increased, the distance from the tip to the lower core edge can be increased. The accuracy of the gap depth, which is the distance, can be significantly improved. Therefore, in the thin film magnetic head of the present invention, since the gap depth is formed with high accuracy, the magnetic characteristics are good and the reliability is high.
【図１】実施例１の薄膜磁気ヘッドの断面図である。FIG. 1 is a cross-sectional view of a thin film magnetic head of Example 1.
【図２】実施例２の薄膜磁気ヘッドの断面図である。FIG. 2 is a cross-sectional view of a thin film magnetic head of Example 2.
【図３】実施例の薄膜磁気ヘッドの製造方法を説明する
ための工程断面図である。FIG. 3 is a process sectional view for explaining the method of manufacturing the thin-film magnetic head of the embodiment.
【図４】従来例の薄膜磁気ヘッドの断面図である。FIG. 4 is a sectional view of a conventional thin film magnetic head.
【図５】従来例の薄膜磁気ヘッドの部分拡大断面図であ
る。FIG. 5 is a partially enlarged sectional view of a conventional thin film magnetic head.
【図６】実施例の薄膜磁気ヘッドの製造方法を説明する
ための工程断面図である。FIG. 6 is a process sectional view for explaining the manufacturing method for the thin-film magnetic head of the embodiment.
１ 基板 ３ 下部コア ４ ギャップ層 ５ 層間絶縁層 ６ コイル導体 ７ 上部コア ９ 下部磁極 １０ 上部磁極 １２ 基板 １４ 非コア層 １６ 下部コア １６ａ 下部コア １６ｂ 下部コア １８ 上部コア ２０ ギャップ層 ２２ コイル導体 ２４ 層間絶縁層 ２６ 凹部 ２８ 下部磁極 ３０ 上部磁極 ３２ 上部コアエッジ ３４ 下部コアエッジ 1 Substrate 3 Lower Core 4 Gap Layer 5 Interlayer Insulation Layer 6 Coil Conductor 7 Upper Core 9 Lower Magnetic Pole 10 Upper Magnetic Pole 12 Substrate 14 Non-Core Layer 16 Lower Core 16a Lower Core 16b Lower Core 18 Upper Core 20 Gap Layer 22 Coil Conductor 24 Interlayer Insulating layer 26 Recess 28 Lower magnetic pole 30 Upper magnetic pole 32 Upper core edge 34 Lower core edge
Claims (1)
層とギャップ層とを介して積層した下部コア及び上部コ
アのそれぞれの先端面を前記基板の側面側に露出させる
ことにより、それら下部コアと上部コアの先端部をそれ
らの間にギャップ層を介する対の下部磁極と上部磁極と
なした薄膜磁気ヘッドにおいて、下部磁極のコイル導体
側の後方に凹部が形成され、凹部の先端が下部コアエッ
ジを規定してなることを特徴とする薄膜磁気ヘッド。1. A lower core and an upper core, which are laminated via an insulating layer and a gap layer enclosing a coil conductor on the surface of a substrate, are exposed at the side surfaces of the substrate to expose the respective end surfaces of the lower core and the upper core. In a thin film magnetic head having a pair of a lower magnetic pole and an upper magnetic pole with a gap layer between the core and the upper core, a concave portion is formed behind the coil conductor side of the lower magnetic pole, and the tip of the concave portion is lower. A thin-film magnetic head characterized by defining a core edge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3161907A JP2740698B2 (en) | 1991-07-02 | 1991-07-02 | Thin film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3161907A JP2740698B2 (en) | 1991-07-02 | 1991-07-02 | Thin film magnetic head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0589430A true JPH0589430A (en) | 1993-04-09 |
| JP2740698B2 JP2740698B2 (en) | 1998-04-15 |
Family
ID=15744290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3161907A Expired - Lifetime JP2740698B2 (en) | 1991-07-02 | 1991-07-02 | Thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2740698B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6388845B1 (en) * | 1998-04-02 | 2002-05-14 | Tdk Corporation | Thin film magnetic head and method of manufacturing the same |
| US6597543B1 (en) | 1998-06-08 | 2003-07-22 | Tdk Corporation | Thin-film magnetic head and magnetic storage apparatus using the same |
| US6804088B1 (en) | 1998-07-15 | 2004-10-12 | Nec Corporation | Thin film magnetic head, manufacturing method thereof and magnetic storage |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6358610A (en) * | 1986-08-28 | 1988-03-14 | Fuji Photo Film Co Ltd | Thin film magnetic head |
| JPH02302916A (en) * | 1989-05-17 | 1990-12-14 | Hitachi Ltd | Thin film magnetic head |
| JPH0411310A (en) * | 1990-04-27 | 1992-01-16 | Victor Co Of Japan Ltd | Thin-film magnetic head |
| JPH04276305A (en) * | 1991-03-04 | 1992-10-01 | Tdk Corp | Thin-film magnetic head |
-
1991
- 1991-07-02 JP JP3161907A patent/JP2740698B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6358610A (en) * | 1986-08-28 | 1988-03-14 | Fuji Photo Film Co Ltd | Thin film magnetic head |
| JPH02302916A (en) * | 1989-05-17 | 1990-12-14 | Hitachi Ltd | Thin film magnetic head |
| JPH0411310A (en) * | 1990-04-27 | 1992-01-16 | Victor Co Of Japan Ltd | Thin-film magnetic head |
| JPH04276305A (en) * | 1991-03-04 | 1992-10-01 | Tdk Corp | Thin-film magnetic head |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6388845B1 (en) * | 1998-04-02 | 2002-05-14 | Tdk Corporation | Thin film magnetic head and method of manufacturing the same |
| US6558561B2 (en) | 1998-04-02 | 2003-05-06 | Tdk Corporation | Thin film magnetic head and method of manufacturing the same |
| US6597543B1 (en) | 1998-06-08 | 2003-07-22 | Tdk Corporation | Thin-film magnetic head and magnetic storage apparatus using the same |
| US7054107B2 (en) | 1998-06-08 | 2006-05-30 | Tdk Corporation | Thin-film magnetic head with nonmagnetic body filled concave portion formed on a pole layer and magnetic storage apparatus using the same |
| US7230794B2 (en) | 1998-06-08 | 2007-06-12 | Tdk Corporation | Thin-film magnetic head with nonmagnetic body filled concave portion formed on a pole layer and magnetic storage apparatus using the same |
| US7239482B2 (en) | 1998-06-08 | 2007-07-03 | Tdk Corporation | Thin-film magnetic head and nonmagnetic body filled concave portion formed on a pole layer and magnetic storage apparatus using the same |
| US6804088B1 (en) | 1998-07-15 | 2004-10-12 | Nec Corporation | Thin film magnetic head, manufacturing method thereof and magnetic storage |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2740698B2 (en) | 1998-04-15 |
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