JPH0582588A - Connection device of semiconductor chip - Google Patents

Abstract

PURPOSE:To provide a semiconductor chip connecting device where adjacent solder bumps are surely prevented from being crashed down so as not to come into contact with each other when the semiconductor chip and the wiring pattern formed on a film substrate are connected together. CONSTITUTION:A bonding base table 1 where a semiconductor chip 4 on which a solder bump 5 is formed is placed is provided, a bonding tool 2 which pressure-welds and holds the semiconductor chip 4 and the film substrate 6 where a prescribed wiring pattern 7 has been formed between the bonding base table 1 and itself is provided above the bonding base table 1 in a vertically freely movable manner, and a stopper mechanism is provided to keep an optional gap between the bonding base table 1 and the bonding tool 2 when the semiconductor chip 4 and the film substrate 4 are pressure-welded.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip connecting device, and more particularly, to connecting a semiconductor chip having solder bumps to a film substrate having a predetermined wiring pattern. Regarding the device.

[0002]

2. Description of the Related Art In recent years, as semiconductor chips such as ICs and LSIs have been miniaturized, highly integrated, and have a large number of pins, a technique of connecting these semiconductor chips to a predetermined substrate at a high density has become indispensable. As a semiconductor chip connection technique, a semiconductor chip connection device that automatically mounts semiconductor chips collectively on a film-like substrate is used.

FIG. 4 shows such a conventional semiconductor chip connecting device, in which a bonding base 1 having a flat upper surface is arranged. Above the bonding base 1, a bonding tool 2 is provided. Is arranged so as to be able to move up and down through the drive shaft 3 by a pressure mechanism such as an air cylinder (not shown).

On the other hand, a semiconductor chip 4 such as an IC or an LSI has a connection pad (not shown) formed thereon, and a substantially spherical solder bump 5 is previously formed on the connection pad portion. A wiring pattern 7 made of copper foil or the like and having a desired shape corresponding to the connection pad portion of the semiconductor chip 4 is formed on the surface of the film substrate 6, and the terminal portion of the wiring pattern 7 of the film substrate 6 is formed. A device hole 8 for exposing the terminal portion of the wiring pattern 7 is formed in the.

In the conventional connection device, when connecting the semiconductor chip 4 and the film substrate 6, first,
As shown in FIG. 5A, a predetermined semiconductor chip 4 is mounted on the upper surface of the bonding base 1 such that the side surface on which the solder bumps 5 are formed is located on the upper surface side, and The film substrate 6 is arranged above so that the terminal portion of the wiring pattern 7 is located at the solder bump 5 portion of the semiconductor chip 4.

Then, as shown in FIG. 5B, the drive shaft 3 is driven to lower the bonding tool 2, and the terminal portions of the wiring pattern 7 and the solder bumps 5 of the semiconductor chip 4 are pressed with a predetermined pressure. Press it. In this state,
By heating, the solder bumps 5 are melted and the semiconductor chips 4 are connected to the film substrate 6, as shown in FIG. 5C.

[0007]

However, in the conventional semiconductor chip 4 connecting device, the bonding tool 2 presses the wiring pattern 7 of the film substrate 6 and the solder bumps 5 of the semiconductor chip 4, The solder bumps 5 are melted to connect the semiconductor chip 4 and the film substrate 6, and when the solder bumps 5 are melted, the pressing force of the bonding tool 2 is applied.
As shown in FIG. 5C, the solder bumps 5 are crushed more than necessary due to the softening of the solder bumps 5 due to melting, whereby the solder bumps 5 spread laterally and the adjacent solder bumps 5 come into contact with each other. Therefore, there is a problem that a circuit short circuit or the like occurs.

In order to prevent such contact between the adjacent solder bumps 5, it is necessary to widen the arrangement pitch of the connection pads of the semiconductor chip 4 and the wiring patterns 7 of the film substrate 6, and the semiconductor chip 4 with respect to the substrate. However, there is a problem that it is impossible to achieve high density.

The present invention has been made in view of the above points, and prevents the bumps of solder bumps from being crushed at the time of connection between the semiconductor chip and the wiring pattern of the film substrate, thereby reliably preventing contact between adjacent solder bumps. It is an object of the present invention to provide a semiconductor chip connecting device capable of achieving the above.

[0010]

In order to achieve the above object, a semiconductor chip connecting device according to the present invention comprises a bonding base on which a semiconductor chip having solder bumps formed on connection pads is mounted. A bonding tool for holding the film substrate on which the semiconductor chip and a predetermined wiring pattern are formed in pressure contact with the bonding base is arranged above the bonding base so as to be vertically movable,
A semiconductor chip is placed on the upper surface of the bonding base, the film substrate is arranged above the semiconductor chip, and the bonding tool is driven to form the solder bumps of the semiconductor chip and the wiring pattern of the film substrate. In a semiconductor chip connecting device for connecting the semiconductor chip and the wiring pattern of the film substrate by heating the solder bumps in a pressed state to melt the solder bumps, the bonding base is bonded when the semiconductor chip and the film substrate are pressed. The present invention is characterized in that a stopper mechanism for holding the gap between the base and the bonding tool at an arbitrary size is provided.

[0011]

According to the present invention, the semiconductor chip is mounted on the upper surface of the bonding base, the film substrate is arranged above the semiconductor chip, and the bonding tool is driven to drive the solder bumps of the semiconductor chip and the film. By heating the wiring pattern of the substrate in pressure contact, the semiconductor chip and the wiring pattern of the film substrate are connected, and at the time of this connection, the bonding mechanism and the bonding base by the stopper mechanism. Since the gap size is kept constant, the solder bumps will not be crushed more than necessary by the bonding tool, and as a result, adjacent solder bumps will contact each other and the circuit will short-circuit. Can be reliably prevented, and the density of semiconductor chips on the substrate can be increased. It is those that can.

[0012]

Embodiments of the present invention will be described below with reference to FIGS.

FIG. 1 shows an embodiment of a semiconductor chip connecting device according to the present invention, in which a bonding base 1 having a flat upper surface is arranged. Above the bonding base 1, The bonding tool 2 is arranged to be movable up and down via a drive shaft 3 by a pressure mechanism such as an air cylinder (not shown). Further, in the present embodiment, a disc-shaped shaft stopper 9 as a stopper mechanism is fixed above the drive shaft 3, and is located near the outer periphery of the drive shaft 3 and below the shaft stopper 9. There is provided a stopper receiver 10 that comes into contact with the shaft stopper 9 when the drive shaft 3 descends and regulates a constant gap between the lower surface of the bonding tool 2 and the bonding base 1.

On the other hand, substantially spherical solder bumps 5 are preliminarily formed on the connection pads (not shown) of the semiconductor chip 4 such as IC and LSI, and the film substrate 6 is also provided.
On the surface of the wiring pattern 7 of a desired shape made of copper foil or the like
A device hole 8 is formed to expose the terminal portion of the wiring pattern 7.

Next, the operation of this embodiment will be described.

First, as shown in FIG. 2A, a predetermined semiconductor chip 4 is placed on the upper surface of the bonding base 1 such that the side surface on which the solder bumps 5 are formed is located on the upper surface side. The film substrate 6 is arranged above the semiconductor chip 4 so that the terminal portions of the wiring pattern 7 are located at the solder bumps 5 of the semiconductor chip 4.

Then, the drive shaft 3 is driven to lower the bonding tool 2, and the terminal portion of the wiring pattern 7 and the solder bump 5 of the semiconductor chip 4 are brought into pressure contact with each other with a predetermined pressure. At this time, as shown in FIG. 2 (b), the shaft stopper 9 of the drive shaft 3 is brought into contact with the stopper receiver 10, whereby the gap between the lower surface of the bonding tool 2 and the upper surface of the bonding base 1 is measured. Is
It is held constant.

By heating in this state, the solder bumps 5 are melted and the semiconductor chips 4 are connected to the film substrate 6.

Therefore, in this embodiment, the shaft stopper 9 of the drive shaft 3 is brought into contact with the stopper receiver 10 and the gap between the lower surface of the bonding tool 2 and the upper surface of the bonding base 1 is kept constant. so,
Since the semiconductor chip 4 and the film substrate 6 are connected by melting the solder bumps 5, even if the solder bumps 5 are softened by heating, the solder bumps 5 are crushed more than necessary by the bonding tool 2. Never. As a result, it is possible to surely prevent adjacent solder bumps 5 from coming into contact with each other and short-circuiting the circuit, and it is possible to prevent the circuit from short-circuiting.
It is not necessary to widen the arrangement pitch of the wiring patterns 7 and it is possible to increase the density of the semiconductor chips 4 on the substrate.

FIG. 3 shows another embodiment of the present invention, in which both sides of the bonding base 1 having a flat upper surface are
A block-shaped base stopper 11 as a stopper mechanism is provided. The height of the base stopper 11 is
The height is set so that the solder bumps 5 formed on the semiconductor chip 4 are not crushed. A bonding tool 2 is disposed above the bonding base 1 so as to be movable up and down via a drive shaft 3 by a pressurizing mechanism such as an air cylinder (not shown). 3 has no shaft stopper.

The other parts are the same as those of the above-mentioned embodiment, and the description thereof will be omitted.

In this embodiment, the bonding base 1
The semiconductor chip 4 is placed on the upper surface of the semiconductor chip 4 and the film substrate 6 is arranged above the semiconductor chip 4, and the drive shaft 3 is driven to lower the bonding tool 2 so that the terminals of the wiring pattern 7 are formed. The portion and the solder bump 5 of the semiconductor chip 4 are brought into pressure contact with each other with a predetermined pressure. At this time, in the present embodiment, the lower surface of the bonding tool 2 is brought into contact with the base stopper 11 via the film substrate 6 and the wiring pattern 7, respectively. The size of the gap with the upper surface of 1 is kept constant.

After that, the semiconductor bumps 4 are connected to the wiring patterns 7 of the film substrate 6 by heating to melt the solder bumps 5.

Therefore, also in the present embodiment, the lower surface of the bonding tool 2 is brought into contact with the base stopper 11 in the same manner as in the previous embodiment, whereby the lower surface of the bonding tool 2 and the upper surface of the bonding base 1 are brought into contact with each other. Since the solder bumps 5 are melted and the semiconductor chip 4 and the film substrate 6 are connected to each other with the gap size of the solder bumps 5 kept constant, the solder bumps 5 are crushed more than necessary by the bonding tool 2. As a result, it is possible to reliably prevent adjacent solder bumps 5 from coming into contact with each other and short-circuiting the circuit, and it is possible to increase the density of the semiconductor chips on the substrate.

The present invention is not limited to the above-mentioned embodiment. For example, when the driving shaft is driven by a pulse motor, the descent stop position of the driving shaft is controlled by setting the driving pulse program. , Can be variously changed as necessary.

[0026]

As described above, in the semiconductor chip connecting apparatus according to the present invention, the solder bumps are melted and the semiconductor is melted by the stopper mechanism while keeping the gap between the bonding tool and the bonding base constant. Since the chip and the film substrate are connected, the solder bumps will not be crushed more than necessary by the bonding tool, and as a result, adjacent solder bumps will contact each other and the circuit will short-circuit. It is possible to surely prevent the above-mentioned problem, and it is possible to achieve high density of the semiconductor chips with respect to the substrate.

[Brief description of drawings]

FIG. 1 is a schematic front view showing an embodiment of a semiconductor chip connecting device according to the present invention.

FIG. 2 (a) is an explanatory view showing a state before connection between a solder bump and a wiring pattern, and FIG. 2 (b) is an explanatory view showing a state after connection between a solder bump and a wiring pattern.

FIG. 3 is a schematic front view showing another embodiment of the present invention.

FIG. 4 is a schematic front view showing a conventional semiconductor chip connecting device.

5A is an explanatory view showing a state before connection between a conventional solder bump and a wiring pattern, FIG. 5B is an explanatory view showing a state before heating the solder bump, and FIG. 5C. Is an explanatory view showing the state after the connection between the solder bump and the wiring pattern

[Explanation of symbols]

 1 Bonding Base 2 Bonding Tool 3 Drive Shaft 4 Semiconductor Chip 5 Solder Bump 6 Film Substrate 7 Wiring Pattern 8 Device Hole 9 Shaft Stopper 10 Stopper Receiver 11 Base Stopper

Claims (1)

[Claims] 1. A bonding base on which a semiconductor chip having solder bumps formed on connection pads is mounted,
A bonding tool for holding the semiconductor substrate and the film substrate on which a predetermined wiring pattern is formed in pressure contact with the bonding base is arranged above the bonding base so as to be vertically movable, and the upper surface of the bonding base is provided. The semiconductor chip is placed on the semiconductor chip, the film substrate is arranged above the semiconductor chip, and the bonding tool is driven to heat the solder bumps of the semiconductor chip and the wiring pattern of the film substrate under pressure. Then, by melting the solder bumps, in a semiconductor chip connection device for connecting the semiconductor chip and the wiring pattern of the film substrate, at the time of pressure contact between the semiconductor chip and the film substrate, the bonding base and the bonding tool. Stopper machine that holds the gap size of the The semiconductor chip of the connecting device, characterized in that the provided.