JPH05206638A - Treating method for circuit board - Google Patents
Treating method for circuit boardInfo
- Publication number
- JPH05206638A JPH05206638A JP9212592A JP1259292A JPH05206638A JP H05206638 A JPH05206638 A JP H05206638A JP 9212592 A JP9212592 A JP 9212592A JP 1259292 A JP1259292 A JP 1259292A JP H05206638 A JPH05206638 A JP H05206638A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- liquid
- treatment
- circuit board
- treatment liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims description 7
- 239000007788 liquid Substances 0.000 claims abstract description 59
- 238000010438 heat treatment Methods 0.000 abstract description 15
- 238000001816 cooling Methods 0.000 abstract description 10
- 239000003507 refrigerant Substances 0.000 abstract description 4
- 238000006243 chemical reaction Methods 0.000 description 17
- 239000010949 copper Substances 0.000 description 9
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000005751 Copper oxide Substances 0.000 description 6
- 229910000431 copper oxide Inorganic materials 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- 239000002826 coolant Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000010306 acid treatment Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、回路板を製造する際に
おこなわれる表面処理など、回路板の処理方法に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for treating a circuit board, such as surface treatment which is carried out when manufacturing a circuit board.
【０００２】[0002]
【従来の技術】多層回路板を製造する場合、内層回路板
として使用される回路板１の表面の銅回路と外層の樹脂
との接着性を高めるために、回路板１には銅回路の表面
を粗面化する黒化処理がおこなわれている。この黒化処
理は回路板１を酸化処理液に浸漬して銅回路の表面に酸
化銅被膜を形成することによっておこなわれている。し
かしこの酸化銅被膜は酸に溶解し易いために、回路板を
製造する工程のメッキ処理の際に酸性メッキ液に酸化銅
被膜が溶解するおそれがある。そこで本出願人等によっ
て、回路板１を黒化処理して銅回路の表面に酸化銅被膜
を形成した後、還元処理をして酸化銅被膜を酸に溶解し
にくい状態に還元することがおこなわれている。2. Description of the Related Art In the case of manufacturing a multilayer circuit board, the circuit board 1 is provided with a surface of a copper circuit in order to improve adhesion between a copper circuit on the surface of the circuit board 1 used as an inner layer circuit board and a resin of an outer layer. Is blackened to roughen the surface. This blackening treatment is performed by immersing the circuit board 1 in an oxidizing treatment liquid to form a copper oxide film on the surface of the copper circuit. However, since this copper oxide film is easily dissolved in acid, there is a risk that the copper oxide film will dissolve in the acidic plating solution during the plating process in the process of manufacturing a circuit board. Therefore, the applicant of the present invention performed a blackening treatment on the circuit board 1 to form a copper oxide film on the surface of the copper circuit, and then a reduction treatment to reduce the copper oxide film to a state in which it is difficult to dissolve in acid. Has been.
【０００３】図３は還元処理の工程を示すものであり、
黒化処理工程５で黒化処理をおこなった回路板１はラッ
ク６によって搬送され、先ず亜鉛粉末を分散した亜鉛分
散溶液３ａが入った亜鉛付着処理槽２ａに回路板１を浸
漬して回路板１の銅回路の表面に亜鉛粉末を付着させ、
次に回路板１を亜鉛付着処理槽２ａから引き上げて搬送
し、硫酸などの酸溶液３ｂが入った酸処理槽２ｂに回路
板１を浸漬する。このように亜鉛粉末を付着させた回路
板１を酸溶液３ｂに浸漬すると、次の反応式のように、
亜鉛粉末が酸溶液３ｂに溶解する際に水素が発生し、こ
の水素で銅回路の表面の酸化銅被膜を還元させることが
できるのである。FIG. 3 shows the steps of reduction treatment.
The circuit board 1 subjected to the blackening treatment in the blackening treatment step 5 is conveyed by the rack 6, and the circuit board 1 is first immersed in the zinc adhesion treatment tank 2a containing the zinc dispersion solution 3a in which the zinc powder is dispersed. Zinc powder is attached to the surface of the copper circuit of 1,
Next, the circuit board 1 is pulled up from the zinc adhesion treatment tank 2a and conveyed, and the circuit board 1 is immersed in the acid treatment tank 2b containing the acid solution 3b such as sulfuric acid. When the circuit board 1 to which the zinc powder is attached in this way is immersed in the acid solution 3b, as shown in the following reaction formula,
Hydrogen is generated when the zinc powder is dissolved in the acid solution 3b, and this copper can reduce the copper oxide film on the surface of the copper circuit.
【０００４】 Ｚｎ＋Ｈ2 ＳＯ4 →ＺｎＳＯ4 ＋Ｈ2 ２ＣｕＯ＋Ｈ2 →Ｃｕ2 Ｏ＋Ｈ2 Ｏ ＣｕＯ＋Ｈ2 →Ｃｕ＋Ｈ2 Ｏ 次に回路板１を酸処理槽２ｂから引き上げてアルカリ溶
液３ｃが入った中和処理槽２ｃに浸漬して中和処理し、
さらに回路板１を中和処理槽２ｃから引き上げて洗浄水
３ｄが入った水洗槽２ｄに浸漬して水洗した後、乾燥工
程７へ送って乾燥をおこなう。Zn + H 2 SO 4 → ZnSO 4 + H 2 2 CuO + H 2 → Cu 2 O + H 2 O CuO + H 2 → Cu + H 2 O Next, the circuit board 1 is pulled up from the acid treatment tank 2 b and the neutralization treatment tank 2 c containing the alkaline solution 3 c To neutralize
Further, the circuit board 1 is pulled up from the neutralization treatment tank 2c, immersed in the washing tank 2d containing the washing water 3d, washed with water, and then sent to the drying step 7 for drying.
【０００５】そして上記のように回路板１を各処理槽２
の処理液３に浸漬し、さらに回路板１を引き上げて次の
処理槽２の処理液に浸漬するというようにして処理をお
こなうにあたって、反応処理の安定性のために、各処理
槽２の処理液３の液温を例えば３５±１℃のように一定
温度にコントロールするようにしている。As described above, the circuit board 1 is placed in each processing tank 2
For the stability of the reaction treatment, the treatment of each treatment tank 2 is performed by dipping the circuit board 1 in the treatment liquid 3 of FIG. The liquid temperature of the liquid 3 is controlled to a constant temperature such as 35 ± 1 ° C.
【０００６】[0006]
【発明が解決しようとする課題】しかし、処理槽２の処
理液３の液温を一定温度にコントロールするだけでは、
夏期と冬期とで処理品質に差が発生し、厳密に検査する
と昼と夜とでも処理品質に差が発生するものであった。
さらにはこれに加えて回路板１の板厚などの要因も加わ
って処理品質に差が発生するものであった。そしてこの
原因を検討した結果、処理槽２の雰囲気温度によって処
理品質が左右されていると考えられるに至っている。例
えば、処理槽２への回路板１の浸漬時間を１分間、処理
槽２から回路板１を引上げて搬送するのに必要な時間を
２０秒とすると、雰囲気温度にさらされるこの２０秒間
に反応が影響を受けるものであり、雰囲気温度が高いと
反応が進行し過ぎ、また雰囲気温度が低いと反応が遅れ
てしまい、処理品質が左右されるものと考えられる。特
に回路板１の板厚が薄いと雰囲気温度の影響を受け易い
ために回路板１の板厚も処理品質を左右する要因に結果
的になっていると考えられる。However, only by controlling the liquid temperature of the processing liquid 3 in the processing tank 2 to a constant temperature,
There was a difference in processing quality between summer and winter, and a strict inspection revealed that there was a difference in processing quality between day and night.
Furthermore, in addition to this, factors such as the thickness of the circuit board 1 are added to cause a difference in processing quality. As a result of studying the cause, it has been considered that the treatment quality is influenced by the ambient temperature of the treatment tank 2. For example, assuming that the immersion time of the circuit board 1 in the treatment tank 2 is 1 minute and the time required for pulling up and conveying the circuit board 1 from the treatment tank 2 is 20 seconds, the reaction time is 20 seconds exposed to the ambient temperature. It is considered that when the atmospheric temperature is high, the reaction proceeds too much, and when the atmospheric temperature is low, the reaction is delayed and the treatment quality is affected. Particularly, if the circuit board 1 is thin, it is likely to be affected by the ambient temperature, so that the circuit board 1 thickness is also considered to be a factor affecting the processing quality.
【０００７】本発明は上記の点に鑑みてなされたもので
あり、処理品質を安定させることができる回路板の処理
方法を提供することを目的とするものである。The present invention has been made in view of the above points, and an object of the present invention is to provide a circuit board processing method capable of stabilizing the processing quality.
【０００８】[0008]
【課題を解決するための手段】本発明に係る回路板の処
理方法は、回路板１を処理槽２内の処理液３に浸漬した
後に処理液３から回路板１を引き上げて搬送することに
よって回路板１を処理するにあたって、処理槽２の雰囲
気温度を測定すると共にこの雰囲気温度に基づいて決定
される温度に処理槽２内の処理液３の液温を調整するこ
とを特徴とするものである。In the method for treating a circuit board according to the present invention, the circuit board 1 is immersed in the treatment solution 3 in a treatment tank 2 and then the circuit board 1 is pulled up from the treatment solution 3 and conveyed. In processing the circuit board 1, the atmospheric temperature of the processing bath 2 is measured, and the liquid temperature of the processing liquid 3 in the processing bath 2 is adjusted to a temperature determined based on the atmospheric temperature. is there.
【０００９】[0009]
【作用】処理槽２の雰囲気温度を測定すると共にこの雰
囲気温度に基づいて決定される温度に処理槽２内の処理
液３の液温を調整するようにしているために、雰囲気温
度が高いときには処理液３の液温を低く、雰囲気温度が
低いときには処理液３の液温を高く調整するようにし
て、雰囲気温度の影響による反応に合わせて処理液３の
液温の影響による反応を調整するようにし、雰囲気温度
の変化に対応して処理品質を安定させることができる。Since the atmospheric temperature of the processing bath 2 is measured and the temperature of the processing liquid 3 in the processing bath 2 is adjusted to a temperature determined based on the atmospheric temperature, when the atmospheric temperature is high The liquid temperature of the treatment liquid 3 is low, and when the ambient temperature is low, the liquid temperature of the treatment liquid 3 is adjusted to be high, and the reaction due to the influence of the influence of the ambient temperature is adjusted. In this way, the processing quality can be stabilized in response to changes in the ambient temperature.
【００１０】[0010]
【実施例】以下本発明を実施例によって詳述する。図１
は反応処理装置の一例を示すものであり、処理液３を入
れた処理槽２には循環ポンプ８によって処理液３を循環
させる循環パイプ９が接続してあり、この循環パイプ９
には冷却熱交換器１０と加熱熱交換器１１がそれぞれ接
続してある。冷却熱交換器１０には冷水などの冷媒を通
す冷媒パイプ１２が接続してあり、冷媒パイプ１２には
モーターバルブや電磁バルブなどで形成される冷却操作
バルブ１３を設けて冷却熱交換器１０への冷媒の供給を
制御するようにしてある。また加熱熱交換器１１には冷
水などの冷媒を通す熱媒パイプ１４が接続してあり、熱
媒パイプ１４にはモーターバルブや電磁バルブなどで形
成される加熱操作バルブ１５を設けて加熱熱交換器１１
への熱媒の供給を制御するようにしてある。処理槽２の
上方には排気フード１６が配設してあり、この排気フー
ド１６に処理槽２の雰囲気温度を測定するための雰囲気
温度センサー１７が取り付けてある。さらに処理槽２に
は処理液３の液温を測定するための液温度センサー１８
が取り付けてある。EXAMPLES The present invention will be described in detail below with reference to examples. Figure 1
Shows an example of a reaction treatment apparatus. A circulation pipe 9 for circulating the treatment liquid 3 by a circulation pump 8 is connected to the treatment tank 2 containing the treatment liquid 3.
A cooling heat exchanger 10 and a heating heat exchanger 11 are connected to each other. A coolant pipe 12 for passing a coolant such as cold water is connected to the cooling heat exchanger 10. The coolant pipe 12 is provided with a cooling operation valve 13 formed of a motor valve, an electromagnetic valve, etc. The supply of the refrigerant is controlled. Further, a heating medium pipe 14 for passing a refrigerant such as cold water is connected to the heating heat exchanger 11, and a heating operation valve 15 formed of a motor valve or an electromagnetic valve is provided in the heating medium pipe 14 for heating and heat exchange. Bowl 11
The supply of the heating medium is controlled. An exhaust hood 16 is arranged above the processing bath 2, and an atmospheric temperature sensor 17 for measuring the atmospheric temperature of the processing bath 2 is attached to the exhaust hood 16. Further, the processing bath 2 has a liquid temperature sensor 18 for measuring the temperature of the processing liquid 3.
Is attached.
【００１１】雰囲気温度センサー１７は図２のブロック
回路図に示すようにＦＡコンピュータ１９の温度−電気
信号変換部２０に接続してあり、雰囲気温度センサー１
７で測定された雰囲気温度は変換部２０で電気信号に変
換され、ＦＡコンピュータ１９の演算部２１に出力され
る。演算部２１には回路板１の品番に応じた定数ａ，ｂ
が記憶されており、雰囲気温度をｘとすると処理槽２の
処理液３の目標温度ｙが、ｙ＝−ａｘ＋ｂの演算式によ
って演算される。定数ａ，ｂは経験的及び実験的に割り
出した値であり、回路板１の板厚などに応じた数値が設
定されている。そして雰囲気温度が基準値より高いとき
には処理液３の液温が低くなるように、雰囲気温度が基
準値より低いときには処理液３の液温が高くなるよう
に、目標温度ｙが演算され、このｙの値に応じた信号が
ＦＡコンピュータ１９の制御部２２に出力される。この
制御部２２には液温度センサー１８が接続されており、
目標温度ｙと液温度センサー１８によって測定される処
理液３の温度との差に基づいて、冷却操作バルブ１３を
開閉操作するバルブドライバー２３や加熱操作バルブ１
５を開閉操作するバルブドライバー２４を制御するよう
にしてある。すなわち、目標温度ｙより液温度センサー
１８によって測定される処理液３の温度が高いと、バル
ブドライバー２３を作動させて冷却操作バルブ１３を開
くと共にバルブドライバー２４で加熱操作バルブ１５を
閉じ、冷却熱交換器１０に冷媒を供給して処理液３を冷
却し、処理液３の液温を目標温度ｙに低下させる。逆に
目標温度ｙより液温度センサー１８によって測定される
処理液３の温度が低いと、バルブドライバー２４を作動
させて加熱操作バルブ１５を開くと共にバルブドライバ
ー２３で冷却操作バルブ１３を閉じ、加熱熱交換器１１
に熱媒を供給して処理液３を加熱し、処理液３の液温を
目標温度ｙにまで高める。The atmosphere temperature sensor 17 is connected to the temperature-electric signal conversion section 20 of the FA computer 19 as shown in the block circuit diagram of FIG.
The ambient temperature measured in 7 is converted into an electric signal by the conversion unit 20 and output to the calculation unit 21 of the FA computer 19. The arithmetic unit 21 includes constants a and b corresponding to the product number of the circuit board 1.
Is stored, and the target temperature y of the processing liquid 3 in the processing bath 2 is calculated by an arithmetic expression of y = −ax + b, where x is the ambient temperature. The constants a and b are values empirically and experimentally determined, and numerical values are set according to the thickness of the circuit board 1. Then, the target temperature y is calculated so that the liquid temperature of the processing liquid 3 becomes low when the atmospheric temperature is higher than the reference value, and becomes higher when the atmospheric temperature is lower than the reference value. A signal corresponding to the value of is output to the control unit 22 of the FA computer 19. The liquid temperature sensor 18 is connected to the control unit 22,
Based on the difference between the target temperature y and the temperature of the treatment liquid 3 measured by the liquid temperature sensor 18, the valve driver 23 for opening and closing the cooling operation valve 13 and the heating operation valve 1
The valve driver 24 for opening and closing 5 is controlled. That is, when the temperature of the treatment liquid 3 measured by the liquid temperature sensor 18 is higher than the target temperature y, the valve driver 23 is operated to open the cooling operation valve 13 and the valve driver 24 closes the heating operation valve 15 to cool the cooling heat. Refrigerant is supplied to the exchanger 10 to cool the processing liquid 3, and the liquid temperature of the processing liquid 3 is lowered to the target temperature y. Conversely, when the temperature of the treatment liquid 3 measured by the liquid temperature sensor 18 is lower than the target temperature y, the valve driver 24 is operated to open the heating operation valve 15 and the valve driver 23 closes the cooling operation valve 13 to heat the heat. Exchanger 11
A heating medium is supplied to heat the treatment liquid 3 to raise the temperature of the treatment liquid 3 to the target temperature y.
【００１２】このようにして、雰囲気温度に応じてリア
ルタイムで処理槽２の処理液３の液温を調整することが
できるものであり、雰囲気温度が高い場合にはこれに対
応して処理液３の液温を低く調整することによって、回
路板１を処理液３に浸漬した後に引き上げて搬送する際
の反応が雰囲気温度の影響で進み易くなっている分、処
理液３に浸漬している間の反応を抑制するようにし、逆
に雰囲気温度が低い場合にはこれに対応して処理液３の
液温を高く調整することによって、回路板１を処理液３
に浸漬した後に引き上げて搬送する間の反応が進み難く
なっている分、処理液３に浸漬している間の反応を高め
るようにし、雰囲気温度が変化しても反応が一定になる
ようにすることができるものである。In this way, the liquid temperature of the processing liquid 3 in the processing tank 2 can be adjusted in real time according to the atmospheric temperature, and when the atmospheric temperature is high, the processing liquid 3 can be correspondingly adjusted. By adjusting the temperature of the solution to be low, the reaction when the circuit board 1 is soaked in the treatment liquid 3 and then pulled up and conveyed is likely to proceed due to the influence of the ambient temperature. Of the processing liquid 3 by suppressing the reaction of the processing liquid 3, and conversely, when the ambient temperature is low, the liquid temperature of the processing liquid 3 is adjusted to be high correspondingly.
Since it is difficult for the reaction to proceed while being pulled up and conveyed after being dipped in, the reaction is enhanced while being dipped in the treatment liquid 3 so that the reaction becomes constant even if the atmospheric temperature changes. Is something that can be done.
【００１３】[0013]
【発明の効果】上記のように本発明は、処理槽の雰囲気
温度を測定すると共にこの雰囲気温度に基づいて決定さ
れる温度に処理槽内の処理液の液温を調整するようにし
たので、雰囲気温度が高いときには処理液の液温を低
く、雰囲気温度が低いときには処理液の液温を高く調整
することによって、雰囲気温度の影響による反応に応じ
て処理液の液温の影響による反応を調整することがで
き、雰囲気温度が変化しても反応が一定になるようにし
て処理品質を安定させることができるものである。As described above, according to the present invention, the ambient temperature of the treatment tank is measured and the temperature of the treatment liquid in the treatment tank is adjusted to the temperature determined based on the ambient temperature. By adjusting the liquid temperature of the processing liquid to be low when the ambient temperature is high and to be high when the atmospheric temperature is low, the reaction due to the influence of the liquid temperature of the treatment liquid is adjusted according to the reaction due to the influence of the ambient temperature. It is possible to stabilize the reaction quality by making the reaction constant even if the atmospheric temperature changes.
【図１】本発明の一実施例に使用される処理装置の構成
を示す概略図である。FIG. 1 is a schematic diagram showing a configuration of a processing apparatus used in an embodiment of the present invention.
【図２】同上の処理装置のブロック回路図である。FIG. 2 is a block circuit diagram of the above processing device.
【図３】還元処理の工程を示す概略図である。FIG. 3 is a schematic diagram showing steps of reduction treatment.
１ 回路板 ２ 処理槽 ３ 処理液 1 circuit board 2 treatment tank 3 treatment liquid
Claims (1)
に処理液から回路板を引き上げて搬送する工程で回路板
を処理するにあたって、処理槽の雰囲気温度を測定する
と共にこの雰囲気温度に基づいて決定される温度に処理
槽内の処理液の液温を調整することを特徴とする回路板
の処理方法。1. When treating a circuit board in the process of immersing the circuit board in the treatment liquid in the treatment tank and then pulling up the circuit board from the treatment liquid and transporting the circuit board, the ambient temperature of the treatment tank is measured and the ambient temperature is adjusted to this ambient temperature. A method of treating a circuit board, which comprises adjusting the temperature of a treatment liquid in a treatment tank to a temperature determined based on the temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9212592A JPH05206638A (en) | 1992-01-28 | 1992-01-28 | Treating method for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9212592A JPH05206638A (en) | 1992-01-28 | 1992-01-28 | Treating method for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05206638A true JPH05206638A (en) | 1993-08-13 |
Family
ID=11809622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9212592A Withdrawn JPH05206638A (en) | 1992-01-28 | 1992-01-28 | Treating method for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05206638A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8193966B2 (en) | 2009-10-15 | 2012-06-05 | The Boeing Company | Wire detection systems and methods |
-
1992
- 1992-01-28 JP JP9212592A patent/JPH05206638A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8193966B2 (en) | 2009-10-15 | 2012-06-05 | The Boeing Company | Wire detection systems and methods |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990408 |