JPH05175407A - Semiconductor mounting board - Google Patents

Abstract

PURPOSE:To improve the heat radiating characteristic of a substrate by providing a conductor pin, which is connected to a metal core without through an insulating layer and has the shape protruding from the surface of the substrate in addition to a conductor pin, which is used for connection to a printed wiring board. CONSTITUTION:A lower hole 12 is formed in a metal core 11. An insulating resin 13 is embedded in the lower hole 12 and hardened. Prepregs 14 and copper foils 15 are arranged on both surfaces of the metal core 11. The materials are laminated as a unitary body by heating and compression. Thus the substrate having the metal core is formed. A through hole 16, wherein a conductor pin 26 used for connection to a printed wiring board is inserted, is formed. A through hole 17, wherein a conductor pin 27 that is not used for the printed wiring board is inserted, is formed. A semiconductor chip 23 is bonded and mounted on a semiconductor mounting recess part 18 with conductive paste. The connecting conductor pin 26 is inserted into the through hole 16, and the heat radiating conductor pin 27 is inserted into the through hole 17, respectively. Thus, the heat accumulated in the metal core 11 can be discharged into outer air through the conductor pin 27.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor mounting board, and more particularly to a semiconductor mounting board having excellent heat dissipation.

[0002]

2. Description of the Related Art Conventionally, as a method of connecting a substrate on which a semiconductor is mounted to a printed wiring board, there is a method of using a semiconductor mounting substrate such as a pin grid array, a leadless chip carrier or a lead chip carrier. However, in recent years, semiconductor chips have tended toward higher speed, higher integration, and higher capacity, and along with this, the amount of heat generated by the semiconductor chips has also tended to increase. Therefore, it is necessary to add some function to dissipate the heat generated by the semiconductor chip to the substrate in order to avoid problems such as a decrease in processing speed due to a rise in temperature of the chip itself and a decrease in connection reliability due to a rise in temperature around the chip. Is happening.

A general semiconductor mounting substrate is mainly made of an insulating material such as a thermosetting resin or ceramic as shown in FIG. 2, but as shown in FIG. A structure in which a heat sink 39 is connected to a metallic cap 33 attached to the surface of a sealing resin 32 that wraps the semiconductor chip 31 to radiate heat; a substrate 41 having holes for semiconductor mounting portions formed therein, as shown in FIG. A structure in which a substrate 42 having a hole larger than the hole is bonded, a metal plate 43 is bonded to a portion where the hole is formed, and heat is radiated from the metal plate (JP-A-64-39093), FIG. As shown, there is a structure in which the metal core 51 is embedded in the inner layer, the metal core is exposed from the side surface and the lower portion of the semiconductor mounting portion, and heat is radiated from there.

However, the structure of FIG. 3 cannot transfer heat sufficiently because the semiconductor chip and the heat sink are not in direct contact with each other, and the structure of FIG. 4 does not have a sufficiently large exposed metal portion for transferring heat and releasing heat. The structure of 5 has a large heat capacity and is the most excellent in the conventional heat dissipation function, but due to the problem that the exposed metal part is not large enough as in the structure of FIG.
The heat dissipation effect was not sufficient in each structure.

[0005]

SUMMARY OF THE INVENTION The present invention relates to a semiconductor mounting board which is required to have a heat dissipation function as the speed, density and capacity of semiconductor chips increase, and the semiconductor has excellent heat dissipation. An object is to provide a mounting board.

[0006]

That is, according to the present invention, in a pin connection type semiconductor mounting board having a metal core in an inner layer, in addition to a conductor pin used for connection with a printed wiring board, an insulating layer is not provided in the metal core. It is a semiconductor mounting board that has conductor pins that are not connected to the printed wiring board in a shape protruding from the surface of the board that is connected to the. It is characterized in that it is transmitted to a conductor pin which is not used for connection with a wiring board, and the portion of the conductor pin protruding from the substrate surface radiates heat into the air.

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing an example of a manufacturing process of a semiconductor mounting substrate according to the present invention. First, as shown in FIG. 1A, a prepared hole 12 is formed in a metal core 11, and an insulating resin 13 is formed in the prepared hole 12. After burying and hardening, the prepreg 14 and the copper foil 15 are arranged on both surfaces of the metal core 11, and they are laminated and integrated by heating and pressing to obtain a substrate with a metal core.

Next, as shown in FIG. 1 (b), through holes 16 for inserting conductor pins 26 used for connection with the printed wiring board and conductor pins 27 not used for connection with the printed wiring board are inserted. The through hole 17 is formed. Here, the through hole 16 is formed so as to be concentric with the pilot hole 12, and is electrically insulated from the metal core 11 via the insulating resin 13. One of the through holes 17 is formed so as to be connected to the metal core 11 at a position not connected to the circuit pattern 20. However, the metal core 11 is GND
Circuit pattern 20 when used as a layer or a VCC layer
There is no problem even if it is connected to the GND line or the VCC line. Subsequently, the semiconductor mounting recess 18 and the core exposed portion 1
9. A circuit pattern 20 is formed, a solder resist 21 is printed, and nickel / gold plating is performed to obtain a semiconductor mounting substrate 22.

Next, as shown in FIG. 1 (c), the semiconductor chip 23 is mounted in the semiconductor mounting recess 18 by bonding with a conductive paste. Subsequently, the input / output terminal of the semiconductor chip 23 and the bonding pad 24 of the substrate 22 are connected by a gold wire bonding method, and further, the semiconductor chip 2
3 and its periphery are hardened and sealed by the sealing resin 25.

Next, the conductor pin 26 for connection is inserted into the through hole 16 and the conductor pin 27 for heat radiation is inserted into the through hole 17, respectively. In this example, the conductor pin 27 used here has a cylindrical shape with two different diameters, the thin portion is a portion inserted into the through hole 17 and connected to the metal core 11, and the thick portion is larger than the diameter of the through hole 17. It is also thick and thin enough not to make contact with the adjacent conductor pin 26, and protrudes from the substrate surface to act for heat dissipation. further,
It is also possible to enhance the heat dissipation effect by devising the shape and size of the protruding portion and expanding the surface area. Subsequently, the conductor pin 26 is fixed to the through hole 16 and the conductor pin 27 is fixed to the through hole 17 by the dip soldering method. At this time, the solder 28 fills the inside of the through hole 17 without any gap, so that the metal core 1
The heat accumulated in 1 is efficiently transmitted to the conductor pin 27 and radiated to the outside air. Through the steps described above, the target semiconductor mounting board can be obtained.

[0011]

According to the present invention, regarding the problem of the heat radiation area in the conventional semiconductor mounting board with a metal core having the best heat radiation function, the heat dissipation conductor pin is connected to the metal core without an insulating layer. Moreover, the problem can be solved by devising the shape of the portion of the conductor pin projecting from the substrate surface to expand the heat dissipation area, and a pin connection type semiconductor mounting substrate having a high heat dissipation property that has never been obtained is obtained. be able to.

[Brief description of drawings]

FIG. 1 is a sectional view of an embodiment of a pin connection type semiconductor mounting substrate according to the present invention.

FIG. 2 is a cross-sectional view showing the concept of a conventional pin connection type semiconductor mounting substrate having no heat dissipation function.

FIG. 3 is a cross-sectional view showing the concept of a conventional pin connection type semiconductor mounting substrate having a heat dissipation function.

FIG. 4 is a cross-sectional view showing the concept of a conventional pin connection type semiconductor mounting substrate having a heat dissipation function.

FIG. 5 is a cross-sectional view showing the concept of a conventional pin connection type semiconductor mounting substrate having a heat dissipation function.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Internal reference number FI technical display location H01L 23/50 F 9272-4M

Claims (2)

[Claims] 1. A pin connection type semiconductor mounting substrate having a metal core as an inner layer, which is connected to a metal core without an insulating layer and has both surfaces of the substrate in addition to conductor pins used for connection with a printed wiring board. Alternatively, the semiconductor mounting board is characterized in that it has conductor pins that are not used for connection with the printed wiring board and that have a shape protruding from one surface. 2. In the conductor pin not used for connection with the printed wiring board, at least one of the portions protruding from the substrate surface has a shape larger than the diameter of the through hole into which the conductor pin is inserted. Claim 1 characterized by
The semiconductor mounting substrate described.