JPH05169603A - Multilayer oriented film - Google Patents
Multilayer oriented filmInfo
- Publication number
- JPH05169603A JPH05169603A JP3341392A JP34139291A JPH05169603A JP H05169603 A JPH05169603 A JP H05169603A JP 3341392 A JP3341392 A JP 3341392A JP 34139291 A JP34139291 A JP 34139291A JP H05169603 A JPH05169603 A JP H05169603A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- ethylene
- resin
- vinyl acetate
- polyamide resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 29
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims abstract description 21
- 239000005038 ethylene vinyl acetate Substances 0.000 claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- 229920006223 adhesive resin Polymers 0.000 claims description 22
- 239000004840 adhesive resin Substances 0.000 claims description 22
- 239000005022 packaging material Substances 0.000 abstract description 14
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000004888 barrier function Effects 0.000 abstract description 4
- 238000010030 laminating Methods 0.000 abstract description 4
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 abstract description 2
- 238000007334 copolymerization reaction Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 41
- 238000000034 method Methods 0.000 description 24
- 239000004677 Nylon Substances 0.000 description 18
- 229920001778 nylon Polymers 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 7
- 239000002994 raw material Substances 0.000 description 7
- 229920000092 linear low density polyethylene Polymers 0.000 description 6
- 239000004707 linear low-density polyethylene Substances 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- -1 polypropylene Polymers 0.000 description 5
- 239000004743 Polypropylene Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 235000013305 food Nutrition 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- QIVUCLWGARAQIO-OLIXTKCUSA-N (3s)-n-[(3s,5s,6r)-6-methyl-2-oxo-1-(2,2,2-trifluoroethyl)-5-(2,3,6-trifluorophenyl)piperidin-3-yl]-2-oxospiro[1h-pyrrolo[2,3-b]pyridine-3,6'-5,7-dihydrocyclopenta[b]pyridine]-3'-carboxamide Chemical compound C1([C@H]2[C@H](N(C(=O)[C@@H](NC(=O)C=3C=C4C[C@]5(CC4=NC=3)C3=CC=CN=C3NC5=O)C2)CC(F)(F)F)C)=C(F)C=CC(F)=C1F QIVUCLWGARAQIO-OLIXTKCUSA-N 0.000 description 3
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 3
- 229920001684 low density polyethylene Polymers 0.000 description 3
- 239000004702 low-density polyethylene Substances 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- 101000576320 Homo sapiens Max-binding protein MNT Proteins 0.000 description 2
- 229920006121 Polyxylylene adipamide Polymers 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 2
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 229920000554 ionomer Polymers 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920001179 medium density polyethylene Polymers 0.000 description 2
- 239000004701 medium-density polyethylene Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 2
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- 239000004230 Fast Yellow AB Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- UFRKOOWSQGXVKV-UHFFFAOYSA-N ethene;ethenol Chemical compound C=C.OC=C UFRKOOWSQGXVKV-UHFFFAOYSA-N 0.000 description 1
- QHZOMAXECYYXGP-UHFFFAOYSA-N ethene;prop-2-enoic acid Chemical compound C=C.OC(=O)C=C QHZOMAXECYYXGP-UHFFFAOYSA-N 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 1
- 239000004715 ethylene vinyl alcohol Substances 0.000 description 1
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 1
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007127 saponification reaction Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、袋、ピロー包装さらに
印刷したポリエステルフィルムや延伸ポリプロピレンフ
ィルム等とラミネートして蓋材用など包装分野に広く使
用出来る透明性、機械的強度、ガスバリア性等に優れた
多層延伸フィルムに関するものである。INDUSTRIAL APPLICABILITY The present invention has a transparency, mechanical strength, gas barrier property, etc. which can be widely used in the packaging field such as a lid material by laminating it with a bag, a pillow package, a printed polyester film or a stretched polypropylene film. The present invention relates to an excellent multilayer stretched film.
【0002】[0002]
【従来の技術】消費者の生活水準の向上によるライフス
タイルの多様化やグルメ指向等により食品分野の包装材
はますます高機能化を求められ、包装形態も個包装から
業務用包装まで多岐にわたっている。例えば添加物の減
量や加熱殺菌条件の変更等により高い酸素ガスバリア性
や水蒸気バリア性が求められ、冷凍・冷蔵流通の発達に
より流通過程における破袋を防止するために、機械強度
の優れた包装材が必要となる。このような状況下におい
て包装材には複数の機能を満足できることが必要不可欠
であり、そのために包装材は何層かの多層構成にして各
層に種々の機能を分散させる。さらに薄物包装材の場合
には、深絞り成形等の成形用を除く袋、ピロー包装、蓋
材等の用途は機械強度の高い包装材が基本的に必要であ
り、一般には延伸フィルムが用いられる。2. Description of the Related Art Packaging materials in the food field are required to have higher functionality due to diversification of lifestyles due to improvement of consumers' standard of living and gourmet orientation, and various packaging forms from individual packaging to commercial packaging. There is. For example, high oxygen gas barrier properties and water vapor barrier properties are required by reducing the amount of additives and changing heat sterilization conditions, etc. Packaging materials with excellent mechanical strength to prevent bag breakage in the distribution process due to the development of freezing and refrigerating distribution. Is required. Under such circumstances, it is indispensable for the packaging material to be able to satisfy a plurality of functions. Therefore, the packaging material has a multi-layered structure of several layers to disperse various functions in each layer. Further, in the case of a thin packaging material, a packaging material with high mechanical strength is basically required for applications such as bags, pillow packaging, lid materials, etc., except for forming such as deep drawing, and a stretched film is generally used. .
【0003】一方延伸フィルムを含む多層構成の包装材
の製造方法としては、ドライラミネート、押出ラミネー
ト、コーティング、蒸着等が用いられるが、これらの方
法では多くの機能を付与するために層構成が複雑にな
り、製造工程が増えてコストアップが避けられぬ問題が
あった。そのため工程簡略化の方法として共押出したフ
ィルムを延伸する多層延伸が実用化されている。本発明
者等も食品分野の包装材に携わるなかで、従来に比べて
機械強度、特に耐破袋性、耐ピンホール性の優れた包装
材の要求が強くなりドライラミネート、押出ラミネート
や共押出等で包装材の検討に取り組んだが性能、コスト
両面で満足できるもの作れなかった。On the other hand, as a method for producing a multi-layered packaging material containing a stretched film, dry lamination, extrusion lamination, coating, vapor deposition and the like are used. However, in these methods, the layer construction is complicated in order to impart many functions. Therefore, there is a problem that the manufacturing process is increased and the cost is inevitably increased. Therefore, as a method for simplifying the process, multi-layer stretching for stretching a co-extruded film has been put into practical use. While the present inventors have been involved in packaging materials in the food field, the demand for packaging materials having excellent mechanical strength, particularly bag puncture resistance and pinhole resistance, has become stronger than before, and dry laminating, extrusion laminating and co-extrusion However, we tried to consider packaging materials, but couldn't make products that are satisfactory in terms of both performance and cost.
【0004】[0004]
【発明が解決しようとする課題】本発明は耐破袋性、耐
ピンホール性の特に優れた包装材の要求に対しフィルム
の層構成や生産方式を種々検討した結果なされたもので
あり、その目的とするところは食品分野において最近増
えている冷凍・冷蔵流通される商品の流通過程における
破袋やピンホール発生を防止し品質の安定化をなし得る
多層延伸フィルムを提供するにある。DISCLOSURE OF THE INVENTION The present invention has been made as a result of various studies on film layer constitutions and production methods in response to the demand for a packaging material having particularly excellent bag-breaking resistance and pinhole resistance. It is an object of the present invention to provide a multilayer stretched film capable of stabilizing the quality by preventing bag breakage and pinholes in the distribution process of frozen / refrigerated products, which has recently been increasing in the food field.
【0005】[0005]
【課題を解決するための手段】本発明はポリアミド樹脂
層(A)(A’)、エチレン−酢酸ビニル共重合体けん
化物樹脂層(B)、接着性樹脂層(C)(C’)
(C’’)及びシール層(D)のいずれかを含み、その
積層順序が (1)A−C−A’、(2)A−C−B−A’、(3)
A−C−B−C’−A’、(4)A−C−A’−C’−
D、(5)A−C−B−A’−C’−D 又は(6)A
−C−B−C’−A’−C’’−D であることを特徴とする多層延伸フィルムである。The present invention provides a polyamide resin layer (A) (A '), an ethylene-vinyl acetate copolymer saponified resin layer (B), an adhesive resin layer (C) (C').
(C '') or the sealing layer (D) is included, and the stacking order is (1) A-C-A ', (2) A-C-B-A', (3).
A-C-B-C'-A ', (4) A-C-A'-C'-
D, (5) A-C-B-A'-C'-D or (6) A
-C-B-C'-A'-C ''-D is a multilayer stretched film.
【0006】本発明において用いられるポリアミド樹脂
(A)及び(A’)は同一樹脂である場合も異なる場合
もある。ポリアミド樹脂としては、一般に称される6ナ
イロン、6−6ナイロン、6−10ナイロン、6−12
ナイロン、11ナイロン、12ナイロン、及びこれらの
共重合体、非晶性ナイロン、メタキシリレンジアミンと
アジピン酸との重縮合により得られるMXD6ナイロ
ン、さらにこれらのブレンド物等が用いられる。The polyamide resins (A) and (A ') used in the present invention may be the same resin or different. As the polyamide resin, generally known 6 nylon, 6-6 nylon, 6-10 nylon, 6-12
Nylon, 11 nylon, 12 nylon, and copolymers thereof, amorphous nylon, MXD6 nylon obtained by polycondensation of metaxylylenediamine and adipic acid, and blends thereof are used.
【0007】エチレン−酢酸ビニル共重合体けん化物樹
脂(以下EVOHと略す)(B)はエチレン含有率が2
5〜75モル%、共重合体中の酢酸ビニルに対するけん
化度が90%以上のものである。The ethylene-vinyl acetate copolymer saponified resin (hereinafter abbreviated as EVOH) (B) has an ethylene content of 2
5 to 75 mol%, and the degree of saponification with respect to vinyl acetate in the copolymer is 90% or more.
【0008】接着性樹脂(C)、(C’)及び
(C’’)は同一樹脂の場合も異なる場合もある。接着
性樹脂としてはポリエチレン、ポリプロピレン、これら
の共重合体やさらに異なるα−オレフィンとの共重合
体、またはエチレン−酢酸ビニル共重合体等にアクリル
酸、メタクリル酸等の一塩基性不飽和脂肪酸、あるいは
マレイン酸、フタル酸、イタコン酸等の二塩基性不飽和
脂肪酸の無水物すなわち無水マレイン酸等を化学的に結
合させて得られる酸変性オレフィン系樹脂が用いられ
る。The adhesive resins (C), (C ') and (C'') may be the same resin or different. As the adhesive resin, polyethylene, polypropylene, copolymers of these copolymers and further different α-olefins, or ethylene-vinyl acetate copolymers with acrylic acid, methacrylic acid and other monobasic unsaturated fatty acids, Alternatively, an acid-modified olefin resin obtained by chemically binding an anhydride of a dibasic unsaturated fatty acid such as maleic acid, phthalic acid, or itaconic acid, that is, maleic anhydride is used.
【0009】シール層樹脂(D)は低密度ポリエチレン
(LDPE)、直鎖状低密度ポリエチレン(LLDP
E)、中密度ポリエチレン(MDPE)、高密度ポリエ
チレン(HDPE)、ポリプロピレン(PP)等のポリ
オレフィン系樹脂及びエチレン共重合体であるエチレン
−酢酸ビニル共重合体(EVA)、エチレン−メチルメ
タアクリレート共重合体(EMMA)、エチレン−エチ
ルアクリレート共重合体(EEA)、エチレン−メチル
アクリレート共重合体(EEA)、エチレン−エチルア
クリレート−無水マレイン酸共重合体(E−EA−MA
H)、エチレン−アクリル酸共重合体(EAA)、エチ
レン−メタクリル酸共重合体(EMMA)、アイオノマ
ー(ION)等の樹脂が使用できる。The sealing layer resin (D) is low density polyethylene (LDPE), linear low density polyethylene (LLDP).
E), medium density polyethylene (MDPE), high density polyethylene (HDPE), polypropylene (PP) and other polyolefin resins, and ethylene copolymers such as ethylene-vinyl acetate copolymer (EVA) and ethylene-methyl methacrylate copolymer. Polymer (EMMA), ethylene-ethyl acrylate copolymer (EEA), ethylene-methyl acrylate copolymer (EEA), ethylene-ethyl acrylate-maleic anhydride copolymer (E-EA-MA)
H), ethylene-acrylic acid copolymer (EAA), ethylene-methacrylic acid copolymer (EMMA), ionomer (ION) and other resins can be used.
【0010】本発明の多層延伸フィルムの層構成につい
てさらに詳しく述べると、該多層延伸フィルムの接着性
樹脂層は本来の接着層としての役割だけでなく、より重
要な役割として外部からの衝撃に対する緩衝帯の機能を
発揮し得ることである。そのため接着性樹脂層の厚みは
極端に薄いとその機能が充分にでない。各種の接着性樹
脂層の厚みについて検討した結果、緩衝帯の機能が認め
られる厚み比率は総厚みに対し5%以上である。多層延
伸フィルムの製造方法について述べると,まず原反フィ
ルムの製造方法としては共押出方式が望ましい。次の延
伸工程は1軸延伸方式及び2軸延伸方式が用いられる。
2軸延伸方式は同時2軸延伸方式であるチューブラー法
及びフラット法や逐次2軸延伸方式が使用される。また
延伸後は用途により熱処理を行うこともある。The layer structure of the multi-layer stretched film of the present invention will be described in more detail. The adhesive resin layer of the multi-layer stretched film not only functions as the original adhesive layer, but also plays a more important role as a buffer against external impact. It is possible to exert the function of the belt. Therefore, if the adhesive resin layer is extremely thin, its function will not be sufficient. As a result of examining the thicknesses of various adhesive resin layers, the thickness ratio at which the function of the buffer zone is recognized is 5% or more with respect to the total thickness. To describe the method for producing a multilayer stretched film, the coextrusion method is desirable as the method for producing a raw film. A uniaxial stretching method and a biaxial stretching method are used in the subsequent stretching step.
As the biaxial stretching method, a tubular method and a flat method which are simultaneous biaxial stretching methods and a sequential biaxial stretching method are used. After stretching, heat treatment may be performed depending on the application.
【0011】[0011]
(実施例−1)共押出方式でポリアミド樹脂1/接着性
樹脂1/エチレン−酢酸ビニル共重合体けん化物樹脂/
ポリアミド樹脂2/接着性樹脂1/エチレン−酢酸ビニ
ル共重合体の層構成のフィルム(総厚み450μm)を
作った。各層の厚み比率を測定したところ上記層構成の
順に15/10/15/10/5/45(%)であっ
た。又各層に使用した原料は下記のものであった。 ポリアミド樹脂1:6ナイロン(1030B 宇部興産
製)と非晶性ナイロン(PA3426 三井デユポンポ
リケミカル製)とのブレンド物(ブレンド比=95:
5) ポリアミド樹脂2:6−6,6共重合ナイロン(501
3B 宇部興産製) エチレン−酢酸ビニル共重合体けん化物樹脂: (エバールEP−F101 クラレ製) 接着性樹脂1:酸変性直鎖状低密度ポリエチレン (アドマーNF−300 三井石油化学工業製) エチレン−酢酸ビニル共重合体:(エバテートD201
1 住友化学工業製) 得られた原反フィルムを逐次二軸延伸方式で延伸倍率を
縦×横=3×3で延伸を行い総厚み50μmの多層延伸
フィルムを作った。耐ピンホール性の評価はゲルボテス
ターによる屈曲疲労耐性とピン曲率半径0.5mmによ
る突き刺し強度の測定で行った。(Example-1) Polyamide resin 1 / adhesive resin 1 / ethylene-vinyl acetate copolymer saponified resin / by coextrusion method
A film (total thickness 450 μm) having a layer structure of polyamide resin 2 / adhesive resin 1 / ethylene-vinyl acetate copolymer was prepared. When the thickness ratio of each layer was measured, it was 15/10/15/10/5/5/45 (%) in the order of the above layer constitution. The raw materials used for each layer were as follows. Polyamide resin 1: 6 Nylon (1030B manufactured by Ube Industries) and amorphous nylon (PA3426 manufactured by Mitsui Deyupon Polychemical) (blend ratio = 95:
5) Polyamide resin 2: 6-6,6 copolymer nylon (501
3B Ube Industries, Ltd.) Ethylene-vinyl acetate copolymer saponified resin: (Eval EP-F101 made by Kuraray) Adhesive resin 1: Acid-modified linear low-density polyethylene (Admer NF-300 manufactured by Mitsui Petrochemical Industries) Ethylene- Vinyl acetate copolymer: (Evatate D201
1 Sumitomo Chemical Co., Ltd.) The obtained raw film was sequentially stretched by a biaxial stretching method at a stretching ratio of length × width = 3 × 3 to form a multilayer stretched film having a total thickness of 50 μm. The pinhole resistance was evaluated by measuring the bending fatigue resistance with a gel bot tester and the puncture strength with a pin curvature radius of 0.5 mm.
【0012】(実施例−2)共押出方式でポリアミド樹
脂1/接着性樹脂1/ポリアミド樹脂1の層構成のフィ
ルム(総厚み180μm)を作った。各層の厚み比率を
測定したところ上記層構成の順に40/20/40
(%)であった。又各層に使用した原料は下記のもので
あった。 ポリアミド樹脂1:6−ナイロン(1030B 宇部興
産製)とMXD6ナイロン(6001 三菱瓦斯化学
製)とのブレンド物(ブレンド比=80:20) 接着性樹脂1:酸変性エチレン−酢酸ビニル共重合体 (モディックE−300H 三菱油化製) 得られた原反フィルムを同時二軸延伸方式で延伸倍率を
縦×横=3×4で延伸を行い総厚み15μmの多層延伸
フィルムを作った。耐ピンホール性の評価は実施例−1
と同様に行った。Example 2 A film (total thickness 180 μm) having a layer structure of polyamide resin 1 / adhesive resin 1 / polyamide resin 1 was prepared by a coextrusion method. When the thickness ratio of each layer was measured, it was 40/20/40 in the order of the above layer constitution.
(%)Met. The raw materials used for each layer were as follows. Polyamide resin 1: 6-nylon (1030B manufactured by Ube Industries) and MXD6 nylon (6001 manufactured by Mitsubishi Gas Chemical Co., Inc.) (blend ratio = 80: 20) Adhesive resin 1: Acid-modified ethylene-vinyl acetate copolymer ( The obtained raw fabric film was stretched by a simultaneous biaxial stretching method with a stretching ratio of length × width = 3 × 4 to obtain a multilayer stretched film having a total thickness of 15 μm. The evaluation of the pinhole resistance is Example-1.
I went the same way.
【0013】(実施例−3)共押出方式でポリアミド樹
脂1/接着性樹脂1/エチレン−酢酸ビニル共重合体け
ん化物樹脂/接着性樹脂1/ポリアミド樹脂2/接着性
樹脂2/直鎖状低密度ポリエチレンの層構成のフィルム
(総厚み300μm)を作った。各層の厚み比率を測定
したところ上記層構成の順に10/10/10/10/
10/10/40(%)であった。又各層に使用した原
料は下記のものであった。 ポリアミド樹脂1:6ナイロン(1030B 宇部興産
製)と6−12ナイロン(7128B 宇部興産製)と
のブンド物 (ブレンド比=90:10) ポリアミド樹脂2:6−6,6共重合ナイロン(501
3B 宇部興産製) エチレン−酢酸ビニル共重合体けん化物樹脂: (エバールEP−E105 クラレ製) 接着性樹脂1:酸変性直鎖状低密度ポリエチレン (アドマーNF−300 三井石油化学工業製) 接着性樹脂2:エチレン・アクリル酸エステル・無水マ
レイン酸三元共重合体 (ボンダインTX8030 住化CDF化学製) 直鎖状低密度ポリエチレン:(スミカセンL FAー20
3ー1 住友化学工業製) 得られた原反フィルムを逐次二軸延伸方式で延伸倍率を
縦×横=3×4で延伸を行い総厚み25μmの多層延伸
フィルムを作った。耐ピンホール性の評価は実施例−1
と同様に行った。(Example-3) Polyamide resin 1 / adhesive resin 1 / ethylene-vinyl acetate copolymer saponified resin / adhesive resin 1 / polyamide resin 2 / adhesive resin 2 / linear chain by coextrusion method A film having a layered structure of low density polyethylene (total thickness 300 μm) was prepared. When the thickness ratio of each layer was measured, it was 10/10/10/10 / in the order of the above layer constitution.
It was 10/10/40 (%). The raw materials used for each layer were as follows. Polyamide resin 1: 6 nylon (1030B made by Ube Industries) and 6-12 nylon (7128B made by Ube Industries) Bund product (blend ratio = 90: 10) Polyamide resin 2: 6-6,6 Copolymer nylon (501
3B Ube Industries) ethylene-vinyl acetate copolymer saponified resin: (Eval EP-E105 made by Kuraray) Adhesive resin 1: Acid-modified linear low-density polyethylene (Admer NF-300 manufactured by Mitsui Petrochemical Industries) Adhesion Resin 2: Ethylene / acrylic acid ester / maleic anhydride terpolymer (Bondaine TX8030 manufactured by Sumika CDF Chemicals) Linear low-density polyethylene: (Sumikasen L FA-20
3-1 Sumitomo Chemical Co., Ltd.) The obtained raw film was sequentially stretched by a biaxial stretching method at a stretching ratio of length × width = 3 × 4 to form a multilayer stretched film having a total thickness of 25 μm. The evaluation of the pinhole resistance is Example-1.
I went the same way.
【0014】(実施例−4)共押出方式でポリアミド樹
脂1/接着性樹脂1/エチレン−酢酸ビニル共重合体け
ん化物樹脂/接着性樹脂1/ポリアミド樹脂1の層構成
のフィルム(総厚み130μm)を作った。各層の厚み
比率を測定したところ上記層構成の順に30/7/20
/10/33(%)であった。又各層に使用した原料は
下記のものであった。 ポリアミド樹脂1:6ナイロン(1030B 宇部興産
製)と非晶性ナイロン(PA3426 三井デユポンポ
リケミカル製)とのブレンド物(ブレンド比=80:2
0) エチレン−酢酸ビニル共重合体けん化物樹脂: (エバールEP−F101 クラレ製) 接着性樹脂1:酸変性直鎖状低密度ポリエチレン (メルセンP2030W 東洋曹達工業製) 得られた原反フィルムを逐次二軸延伸方式で延伸倍率を
縦×横=2.5×3.5で延伸を行い総厚み約15μm
の多層延伸フィルムを作った。耐ピンホール性の評価は
実施例−1と同様に行った。Example 4 A film having a layer structure of polyamide resin 1 / adhesive resin 1 / saponified ethylene / vinyl acetate copolymer / adhesive resin 1 / polyamide resin 1 by coextrusion method (total thickness 130 μm) )made. When the thickness ratio of each layer was measured, it was 30/7/20 in the order of the above layer constitution.
It was / 10/33 (%). The raw materials used for each layer were as follows. Polyamide resin 1: 6 Nylon (1030B made by Ube Industries) and amorphous nylon (PA3426 made by Mitsui Dupont Polychemical) blended product (blend ratio = 80: 2)
0) Saponified ethylene-vinyl acetate copolymer resin: (Eval EP-F101, manufactured by Kuraray) Adhesive resin 1: Acid-modified linear low-density polyethylene (Mersen P2030W, manufactured by Toyo Soda Kogyo Co., Ltd.) The total thickness is about 15μm by the biaxial stretching method with a stretching ratio of length x width = 2.5 x 3.5
A multilayer stretched film of The evaluation of pinhole resistance was performed in the same manner as in Example-1.
【0015】(比較例−1)共押出方式でポリアミド樹
脂1/エチレン−酢酸ビニル共重合体けん化物樹脂/ポ
リアミド樹脂1の層構成のフィルム(総厚み130μ
m)を作った。各層の厚み比率を測定したところ上記層
構成の順に40/20/40(%)であった。各層に使
用した原料は実施例−4のポリアミド樹脂1、エチレン
−酢酸ビニル共重合体けん化物樹脂と同様であった。得
られた原反フィルムは実施例−4と同一条件で延伸し,
さらに耐ピンホール性の評価は実施例−1と同様に行っ
た。(Comparative Example 1) A film having a layer structure of polyamide resin 1 / ethylene-vinyl acetate copolymer saponified resin / polyamide resin 1 by a coextrusion method (total thickness 130 μm).
m) made. When the thickness ratio of each layer was measured, it was 40/20/40 (%) in the order of the above layer constitution. The raw materials used for each layer were the same as those of the polyamide resin 1 and the ethylene-vinyl acetate copolymer saponified resin of Example-4. The obtained raw film was stretched under the same conditions as in Example-4,
Furthermore, the evaluation of pinhole resistance was performed in the same manner as in Example-1.
【0016】(比較例−2)共押出方式でポリアミド樹
脂1/エチレン−酢酸ビニル共重合体けん化物樹脂/ポ
リアミド樹脂2/接着性樹脂1/エチレン−酢酸ビニル
共重合体の層構成のフィルム(総厚み450μm)を作
った。各層の厚み比率を測定したところ上記層構成の順
に15/15/10/4/56(%)であった。又各層
に使用した原料は実施例−1のポリアミド樹脂1、ポリ
アミド樹脂2、エチレン−酢酸ビニル共重合体けん化物
樹脂、接着性樹脂1及びエチレン−酢酸ビニル共重合体
と同様であった。得られた原反フィルムは実施例−1と
同一条件で延伸し、さらに耐ピンホール性の評価も実施
例−1と同様に行った。(Comparative Example 2) A film having a layer structure of polyamide resin 1 / ethylene-vinyl acetate copolymer saponified resin / polyamide resin 2 / adhesive resin 1 / ethylene-vinyl acetate copolymer by a coextrusion method ( A total thickness of 450 μm) was made. When the thickness ratio of each layer was measured, it was 15/15/10/4/56 (%) in the order of the above layer constitution. The raw materials used for each layer were the same as the polyamide resin 1, polyamide resin 2, ethylene-vinyl acetate copolymer saponified resin, adhesive resin 1 and ethylene-vinyl acetate copolymer of Example-1. The obtained raw film was stretched under the same conditions as in Example-1, and the pinhole resistance was evaluated in the same manner as in Example-1.
【0017】(比較例−3)単層ダイによる押出方式で
ポリアミド樹脂1の層構成のフィルム(厚み180μ
m)を作った。又使用した原料は実施例−2のポリアミ
ド樹脂1と同様であった。得られた原反フィルムは実施
例−2と同一条件で延伸し、さらに耐ピンホール性の評
価は実施例−1と同様に行った。(Comparative Example 3) A film having a layer structure of polyamide resin 1 (thickness: 180 μm) is formed by an extrusion method using a single layer die.
m) made. The raw material used was the same as the polyamide resin 1 of Example-2. The obtained raw film was stretched under the same conditions as in Example-2, and the pinhole resistance was evaluated in the same manner as in Example-1.
【0018】実施例−1〜4及び比較例−1〜3の耐ピ
ンホール性の評価結果を表1にまとめた。ゲルボテスタ
ーによる屈曲疲労耐性は25℃雰囲気中の1000回で
のピンホール発生個数で評価した。又突き刺し強度の測
定は25℃雰囲気中でポリアミド樹脂1側をピンに当て
突き刺し速度は500mm/分で行った。比較例に比べ
実施例はゲルボフレックスのピンホール発生個数が大幅
に少なくなっており、突き刺し強度も高くなっている。Table 1 shows the evaluation results of the pinhole resistance of Examples-1 to 4 and Comparative Examples-1 to 3. The flex fatigue resistance by the gel bot tester was evaluated by the number of pinholes generated 1000 times in an atmosphere of 25 ° C. The puncture strength was measured by applying the polyamide resin 1 side to the pin in a 25 ° C. atmosphere at a puncture speed of 500 mm / min. Compared to the comparative example, the number of pinholes generated in the gelbo flex was significantly reduced in the example, and the piercing strength was also increased.
【0019】 表1 厚み ゲルボフレックス 突き刺し強度 (μm) (個/1000回) (Kgf) 実施例−1 50 3 1.7 実施例−2 15 0 1.2 実施例−3 25 1 1.9 実施例−4 15 3 1.1 比較例−1 15 42 0.7 比較例−2 50 18 1.2 比較例−3 15 25 0.8Table 1 Thickness Gelbo flex Puncture strength (μm) (pieces / 1000 times) (Kgf) Example-1 50 3 1.7 Example-2 15 0 1.2 Example-3 25 1 1.9 Example-4 15 3 1.1 Comparative example-1 15 42 0.7 Comparative example-2 50 18 1.2 Comparative example-3 15 25 0.8
【0020】[0020]
【発明の効果】本発明の多層延伸フィルムは接着性樹脂
層を総厚みに対し5%以上組み込むことで耐破袋性,耐
ピンホール性を大幅に改善出来,食品分野において最近
増えている冷凍・冷蔵流通される商品の流通過程におけ
る破袋やピンホール発生を防止し品質の安定化をなし得
る包装材である。EFFECTS OF THE INVENTION The multilayer stretched film of the present invention can significantly improve bag breaking resistance and pinhole resistance by incorporating an adhesive resin layer in an amount of 5% or more with respect to the total thickness, and has been increasing in the food field in recent years. -A packaging material that can prevent bag breakage and pinholes during the distribution process of refrigerated products and stabilize the quality.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 B29L 9:00 4F ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI Technical display location B29L 9:00 4F
Claims (1)
レン−酢酸ビニル共重合体けん化物樹脂層(B)、接着
性樹脂層(C)(C’)(C’’)及びシール層(D)
のいずれかを含み,その積層順序が (1)A−C−A’、(2)A−C−B−A’、(3)
A−C−B−C’−A’、(4)A−C−A’−C’−
D、(5)A−C−B−A’−C’−D 又は(6)A
−C−B−C’−A’−C’’−D であることを特徴とする多層延伸フィルム。1. A polyamide resin layer (A) (A '), an ethylene-vinyl acetate copolymer saponified resin layer (B), an adhesive resin layer (C) (C') (C '') and a seal layer. (D)
Which includes any of the following, and the stacking order is (1) A-C-A ', (2) A-C-B-A', (3).
A-C-B-C'-A ', (4) A-C-A'-C'-
D, (5) A-C-B-A'-C'-D or (6) A
-C-B-C'-A'-C ''-D which is a multilayer stretched film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3341392A JPH05169603A (en) | 1991-12-24 | 1991-12-24 | Multilayer oriented film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3341392A JPH05169603A (en) | 1991-12-24 | 1991-12-24 | Multilayer oriented film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05169603A true JPH05169603A (en) | 1993-07-09 |
Family
ID=18345712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3341392A Pending JPH05169603A (en) | 1991-12-24 | 1991-12-24 | Multilayer oriented film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05169603A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0585459A4 (en) * | 1992-03-18 | 1994-08-24 | Sumitomo Bakelite Co | Multilayered stretched film |
| JP2014128884A (en) * | 2012-12-28 | 2014-07-10 | Mitsubishi Plastics Inc | Coextruded composite film for retort packaging |
-
1991
- 1991-12-24 JP JP3341392A patent/JPH05169603A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0585459A4 (en) * | 1992-03-18 | 1994-08-24 | Sumitomo Bakelite Co | Multilayered stretched film |
| JP2014128884A (en) * | 2012-12-28 | 2014-07-10 | Mitsubishi Plastics Inc | Coextruded composite film for retort packaging |
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