JPH04225327A - Electronic circuit mounting structure and electronic optical device and electronic printing device using the same - Google Patents
Electronic circuit mounting structure and electronic optical device and electronic printing device using the sameInfo
- Publication number
- JPH04225327A JPH04225327A JP40786090A JP40786090A JPH04225327A JP H04225327 A JPH04225327 A JP H04225327A JP 40786090 A JP40786090 A JP 40786090A JP 40786090 A JP40786090 A JP 40786090A JP H04225327 A JPH04225327 A JP H04225327A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- electronic circuit
- electrodes
- fpc
- lsi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007639 printing Methods 0.000 title claims description 6
- 230000003287 optical effect Effects 0.000 title claims 2
- 239000000853 adhesive Substances 0.000 claims abstract description 18
- 230000001070 adhesive effect Effects 0.000 claims abstract description 18
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052737 gold Inorganic materials 0.000 abstract description 5
- 239000010931 gold Substances 0.000 abstract description 5
- 238000001465 metallisation Methods 0.000 abstract 2
- 238000004806 packaging method and process Methods 0.000 abstract 2
- 238000007747 plating Methods 0.000 abstract 1
- 101100084627 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) pcb-4 gene Proteins 0.000 description 8
- JAYCNKDKIKZTAF-UHFFFAOYSA-N 1-chloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1Cl JAYCNKDKIKZTAF-UHFFFAOYSA-N 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 101100119847 Phaeodactylum tricornutum FCPE gene Proteins 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Wire Bonding (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Liquid Crystal (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、電子回路素子とそれを
駆動するＬＳＩとフレキシブルプリンティッドサーキッ
ト（以下ＦＰＣと言う）と回路基板（以下ＰＣＢと言う
）からなる電子回路の実装構造に関するものである。[Industrial Application Field] The present invention relates to an electronic circuit mounting structure consisting of an electronic circuit element, an LSI that drives it, a flexible printed circuit (hereinafter referred to as FPC), and a circuit board (hereinafter referred to as PCB). be.
【０００２】0002
【従来の技術】従来の電子回路の実装構造は、電子回路
素子の電極とＰＣＢ上に位置するＬＳＩの電極をワイヤ
ーボンディングで接続し、該ＬＳＩの電極とＰＣＢの電
極を同じくワイヤーボンディングで接続していた。図５
は従来技術を示す図である。電子回路素子（ＬＣＤ）１
に取り付けられたＰＣＢ４上にＬＳＩ２が位置している
。そして電子回路素子の電極１ａには金メッキがしてあ
り、その電子回路素子の電極１ａとＬＳＩの電極２ａが
ボンディングワイヤー６により接続されている。またＰ
ＣＢの電極４ａとＬＳＩの電極２ａも同じくボンディン
グワイヤー６により接続されている。[Prior Art] In a conventional electronic circuit mounting structure, the electrodes of an electronic circuit element and the electrodes of an LSI located on a PCB are connected by wire bonding, and the electrodes of the LSI and the electrodes of the PCB are also connected by wire bonding. was. Figure 5
FIG. 1 is a diagram showing a conventional technique. Electronic circuit element (LCD) 1
The LSI 2 is located on the PCB 4 attached to the PCB 4. The electrode 1a of the electronic circuit element is plated with gold, and the electrode 1a of the electronic circuit element and the electrode 2a of the LSI are connected by a bonding wire 6. Also P
The electrode 4a of the CB and the electrode 2a of the LSI are also connected by a bonding wire 6.
【０００３】0003
【発明が解決しようとする課題】しかしながら、上記従
来技術は、電子回路素子の電極に金などでメタライズ処
理を施さなければならないために、電子回路素子の工程
が複雑で製造コストが非常に高くなってしまうと言う欠
点を有していた。[Problems to be Solved by the Invention] However, in the above-mentioned conventional technology, the electrodes of the electronic circuit element must be metallized with gold or the like, which makes the manufacturing process of the electronic circuit element complicated and the manufacturing cost extremely high. It had the disadvantage that it could be damaged.
【０００４】そこで、本発明は上記欠点を解決するもの
であり、その目的とするところは安価で信頼性が高く高
密度な実装構造を提供することである。SUMMARY OF THE INVENTION The present invention aims to solve the above-mentioned drawbacks, and its object is to provide an inexpensive, highly reliable, and high-density mounting structure.
【０００５】[0005]
【課題を解決するための手段】本発明の電子回路の実装
構造は、電子回路素子の電極とＰＣＢ上に位置するＦＰ
Ｃの電極を異方性導電接着剤で接続し、該ＦＰＣ上に位
置する、該電子回路素子を駆動するＬＳＩの電極と該Ｆ
ＰＣの電極とをワイヤーボンディングで接続し、該ＰＣ
Ｂの電極と該ＦＰＣ上のＬＳＩの電極をワイヤーボンデ
ィングで接続したことを特徴とする。[Means for Solving the Problems] The electronic circuit mounting structure of the present invention includes an electrode of an electronic circuit element and an FP located on a PCB.
The electrodes of C are connected with an anisotropic conductive adhesive, and the electrodes of the LSI that drives the electronic circuit element located on the FPC are connected to the electrodes of the F.
Connect the electrodes of the PC with wire bonding, and
It is characterized in that the electrodes of B and the electrodes of the LSI on the FPC are connected by wire bonding.
【０００６】本発明の電子回路の実装構造は、電子回路
素子の電極とＰＣＢ上に位置するＦＰＣの電極を異方性
導電接着剤で接続し、該ＰＣＢ上に位置する、該電子回
路素子を駆動するＬＳＩの電極と該ＦＰＣの電極とをワ
イヤーボンディングで接続し、該ＰＣＢの電極と該ＦＰ
Ｃ上のＬＳＩの電極をワイヤーボンディングで接続した
ことを特徴とする。[0006] In the electronic circuit mounting structure of the present invention, electrodes of an electronic circuit element and electrodes of an FPC located on a PCB are connected with an anisotropic conductive adhesive, and the electronic circuit element located on the PCB is mounted. The electrodes of the LSI to be driven and the electrodes of the FPC are connected by wire bonding, and the electrodes of the PCB and the FP are connected by wire bonding.
It is characterized in that the electrodes of the LSI on the C are connected by wire bonding.
【０００７】[0007]
【実施例】以下本発明の電子回路の実装構造を実施例に
基づいて具体的に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The mounting structure of an electronic circuit according to the present invention will be explained in detail below based on embodiments.
【０００８】［実施例１］図１は、本発明の電子回路の
実装構造の一実施例を示す断面図である。本実施例では
電子回路素子として液晶表示素子（以下ＬＣＤと言う）
を用いている。ＰＣＢ４上にはＦＰＣ３が接着剤により
固定されており、ＦＰＣ３上にはＬＳＩ２が同じく接着
剤により固定されている。ＦＰＣの電極３ａは、異方性
導電接着剤（異方性導電膜、以下ＡＣＦと言う）５によ
り、ＬＣＤの電極１ａに電気的且つ機械的に接続されて
いる。また該ＦＰＣの電極はボンディングワイヤー６に
よりＬＳＩの電極２ａと電気的に接続されている。そし
てＰＣＢの電極４ａはボンディングワイヤー６によりＰ
ＣＢの電極に電気的に接続されている。ＬＳＩ２及びボ
ンディングワイヤー６はモールド剤７により固められて
外力から保護されている。ＰＣＢ４は、固定部材８によ
りＬＣＤ４に固定されている。固定部材８とＬＣＤ１あ
るいは固定部材８とＰＣＢ４の固定方法は接着剤で固定
しても良いが、粘着剤で固定する方が望ましい。[Embodiment 1] FIG. 1 is a sectional view showing an embodiment of an electronic circuit mounting structure of the present invention. In this embodiment, a liquid crystal display element (hereinafter referred to as LCD) is used as an electronic circuit element.
is used. The FPC 3 is fixed on the PCB 4 with an adhesive, and the LSI 2 is also fixed on the FPC 3 with an adhesive. The electrode 3a of the FPC is electrically and mechanically connected to the electrode 1a of the LCD by an anisotropic conductive adhesive (anisotropic conductive film, hereinafter referred to as ACF) 5. Further, the electrodes of the FPC are electrically connected to the electrodes 2a of the LSI by bonding wires 6. Then, the electrode 4a of the PCB is connected to the P
It is electrically connected to the electrode of CB. The LSI 2 and the bonding wire 6 are hardened by a molding agent 7 and protected from external forces. The PCB 4 is fixed to the LCD 4 by a fixing member 8. The fixing member 8 and the LCD 1 or the fixing member 8 and the PCB 4 may be fixed with an adhesive, but it is preferable to use an adhesive.
【０００９】ＰＣＢ４上のＦＰＣ３の固定方法は前記の
接着剤による方法の他に粘着剤による方法、半田付けに
よる方法、クリップ等で押さえる方法などでも良いし、
固定しなくても良い。同様にＦＰＣ３上のＬＳＩの固定
方法も粘着剤による方法、クリップ等で押さえる方法等
も可能である。またＰＣＢ４上のＦＰＣ３の位置はＬＣ
Ｄ１側に、ＦＰＣ３上のＬＳＩ２の位置はＬＣＤ１から
遠い側にある方が望ましい。[0009] In addition to the adhesive method described above, the FPC 3 may be fixed on the PCB 4 by using an adhesive, soldering, holding it with a clip, etc.
It doesn't have to be fixed. Similarly, the LSI can be fixed on the FPC 3 by using an adhesive or by holding it with a clip or the like. Also, the position of FPC3 on PCB4 is LC
On the D1 side, it is desirable that the LSI 2 on the FPC 3 be located on the far side from the LCD 1.
【００１０】ＬＣＤの電極１ａは透明電極であり、酸化
インジウム（以下ＩＴＯと言う）が用いられているが金
属メッキ処理は施してない。ＡＣＦ５には熱硬化型接着
剤の日立化成工業（株）のアニソルムＡＣ７０５２とソ
ニーケミカルのＣＰ６１３１を用いたがＡＣＦ５として
同等以上の性能を持つ異方性導電膜及び異方性導電接着
剤ならば何でも使用可能である。ＦＰＣ３には熱膨張係
数の低いポリイミドベースフィルムを用いて、その上に
１００μｍピッチ程度の銅箔電極を形成し金メッキを施
してある。該ＬＣＤの電極１ａは該ＦＰＣの電極２ａに
相対する電極を形成してある。ＬＳＩの電極１ａはアル
ミニウムパッドを採用し６５μｍピッチ程度に形成し、
ＰＣＢの電極には銅箔にニッケルメッキと金メッキを施
したものを使用してある。ボンディングワイヤー６には
金ワイヤーでφ１０μｍ〜３０μｍ、アルミニウムワイ
ヤーでφ３０μｍ〜３５μｍ、銅ワイヤーでφ２０〜３
０μｍを用いたがその他のワイヤーでも可能である。モ
ールド剤７にはシリコン系、エポキシ樹脂系、紫外線硬
化系等を用いた。また本実施例の構成で信頼性試験を実
施したが良好な結果が得られた。さらに本実施例の構成
はＬＣＤ１とＬＳＩ２の接続をＦＰＣ３を介して行うこ
とにより実装面が逆転しているため、該ＬＣＤ１の厚さ
内かそれとほぼ同等の厚さ内での実装ができるため従来
に比べて薄型の実装構造となることも特徴のひとつであ
る。The electrode 1a of the LCD is a transparent electrode made of indium oxide (hereinafter referred to as ITO), but is not plated with metal. For ACF5, we used thermosetting adhesives Anisolm AC7052 from Hitachi Chemical Co., Ltd. and CP6131 from Sony Chemical, but any anisotropic conductive film and anisotropic conductive adhesive that have the same or better performance as ACF5 can be used. Available for use. The FPC 3 is made of a polyimide base film with a low coefficient of thermal expansion, on which copper foil electrodes are formed at a pitch of about 100 μm and gold plated. The electrode 1a of the LCD forms an electrode opposite to the electrode 2a of the FPC. The electrodes 1a of the LSI adopt aluminum pads and are formed at a pitch of about 65 μm.
The PCB electrodes are made of copper foil plated with nickel and gold. The bonding wire 6 is a gold wire with a diameter of 10 μm to 30 μm, an aluminum wire with a diameter of 30 μm to 35 μm, and a copper wire with a diameter of 20 to 3 μm.
Although 0 μm was used, other wires are also possible. As the molding agent 7, silicone type, epoxy resin type, ultraviolet curing type, etc. were used. Further, a reliability test was conducted using the configuration of this example, and good results were obtained. Furthermore, in the configuration of this embodiment, the mounting surface is reversed by connecting the LCD 1 and the LSI 2 through the FPC 3, so that it can be mounted within the thickness of the LCD 1 or within a thickness almost equivalent to that of the LCD 1. One of its features is that it has a thinner mounting structure than the previous one.
【００１１】［実施例２］図２は、本発明の実装構造の
一実施例を示す断面図である。本実施例は、実施例１に
対してＬＳＩ２がＰＣＢ４上にあるのが特徴である。[Embodiment 2] FIG. 2 is a sectional view showing an embodiment of the mounting structure of the present invention. This embodiment is different from the first embodiment in that the LSI 2 is located on the PCB 4.
【００１２】［実施例３］図３は、本発明の実装構造の
一実施例を示す断面図である。本実施例は、実施例１に
対してＦＰＣ３をＬＣＤ１の終端部付近で９０゜折り曲
げてあるのが特徴である。この構造はＬＣＤ１の画面の
縁の大きさを小さくするのに有利である。
［実施例４］図４は、本発明の実装構造の一実施例を示
す断面図である。本実施例は、実施例３に対してＦＰＣ
３のベースフィルム側にＬＳＩ２が実装されているのが
特徴である。ＦＰＣ３のベースフィルムには、ボンディ
ング用ホール９が設けられており、そこを通してボンデ
ィングワイヤー６がＦＰＣ３の電極３ａに接続されてい
る。[Embodiment 3] FIG. 3 is a sectional view showing an embodiment of the mounting structure of the present invention. The present embodiment is characterized in that the FPC 3 is bent by 90 degrees near the terminal end of the LCD 1 compared to the first embodiment. This structure is advantageous in reducing the size of the screen edge of the LCD 1. [Embodiment 4] FIG. 4 is a sectional view showing an embodiment of the mounting structure of the present invention. This example is different from Example 3 in that the FPC
The feature is that LSI 2 is mounted on the base film side of 3. A bonding hole 9 is provided in the base film of the FPC 3, and the bonding wire 6 is connected to the electrode 3a of the FPC 3 through the hole 9.
【００１３】［実施例５］図５は、本発明の実装構造の
一実施例を示す断面図である。本実施例は、実施例１に
対して電子回路素子１として電子印字素子を用いた電子
印字装置の実施例である。[Embodiment 5] FIG. 5 is a sectional view showing an embodiment of the mounting structure of the present invention. This embodiment is an embodiment of an electronic printing device using an electronic printing element as the electronic circuit element 1 in contrast to the first embodiment.
【００１４】[0014]
【発明の効果】以上説明したように、本発明は電子回路
素子の電極とＰＣＢ上に位置するＦＰＣの電極を異方性
導電接着剤で接続し、該ＦＰＣ上または該ＰＣＢ上に位
置する、該電子回路素子を駆動するＬＳＩの電極と該Ｆ
ＰＣの電極とをワイヤーボンディングで接続し、該ＰＣ
Ｂの電極と該ＦＰＣ上のＬＳＩの電極をワイヤーボンデ
ィングで接続することにより安価で信頼性が高く、高密
度実装が可能な実装構造を提供すると言う効果を有する
。また本発明の実装構造を用いることにより薄型でコン
パクトな電子光学装置及び電子印字装置を提供すると言
う効果を有する。Effects of the Invention As explained above, the present invention connects the electrodes of an electronic circuit element and the electrodes of an FPC located on a PCB with an anisotropic conductive adhesive, and An electrode of an LSI that drives the electronic circuit element and the F
Connect the electrodes of the PC with wire bonding, and
By connecting the electrodes of B and the electrodes of the LSI on the FPC by wire bonding, it is possible to provide a mounting structure that is inexpensive, highly reliable, and capable of high-density mounting. Further, by using the mounting structure of the present invention, it is possible to provide a thin and compact electro-optical device and an electronic printing device.
【図１】本発明の一実施例を示す断面図である。FIG. 1 is a sectional view showing an embodiment of the present invention.
【図２】本発明の一実施例を示す断面図である。FIG. 2 is a sectional view showing an embodiment of the present invention.
【図３】本発明の一実施例を示す断面図である。FIG. 3 is a sectional view showing an embodiment of the present invention.
【図４】本発明の一実施例を示す断面図である。FIG. 4 is a sectional view showing an embodiment of the present invention.
【図５】本発明の一実施例を示す断面図である。FIG. 5 is a sectional view showing an embodiment of the present invention.
【図６】従来の技術を示す断面図である。FIG. 6 is a sectional view showing a conventional technique.
１ ．電子回路素子（ＬＣＤ、電子印字素子）１ａ．
電子回路素子の電極
２ ．ＬＳＩ
２ａ．ＬＳＩの電極
３ ．ＦＰＣ
３ａ．ＦＰＣの電極
４ ．ＰＣＢ
４ａ．ＰＣＢの電極
５ ．ＡＣＦ
６ ．ボンディングワイヤー
７ ．モールド剤
８ ．補強部材
９ ．ボンディング用ホール1. Electronic circuit element (LCD, electronic printing element) 1a.
Electrode 2 of electronic circuit element. LSI 2a. LSI electrode 3. FPC 3a. FPC electrode 4. PCB 4a. PCB electrode 5. ACF 6. Bonding wire 7. Molding agent 8. Reinforcement member 9. Bonding hole
Claims (4)
ＦＰＣの電極を異方性導電接着剤で接続し、該ＦＰＣ上
に位置する、該電子回路素子を駆動するＬＳＩの電極と
該ＦＰＣの電極とをワイヤーボンディングで接続し、該
ＰＣＢの電極と該ＦＰＣ上のＬＳＩの電極をワイヤーボ
ンディングで接続したことを特徴とする電子回路の実装
構造。1. An electrode of an electronic circuit element and an electrode of an FPC located on a PCB are connected with an anisotropic conductive adhesive, and an electrode of an LSI located on the FPC and driving the electronic circuit element and the FPC are connected. An electronic circuit mounting structure characterized in that the electrodes of the PCB and the electrodes of the LSI on the FPC are connected by wire bonding.
ＦＰＣの電極を異方性導電接着剤で接続し、該ＰＣＢ上
に位置する、該電子回路素子を駆動するＬＳＩの電極と
該ＦＰＣの電極とをワイヤーボンディングで接続し、該
ＰＣＢの電極と該ＦＰＣ上のＬＳＩの電極をワイヤーボ
ンディングで接続したことを特徴とする電子回路の実装
構造。2. An electrode of an electronic circuit element and an electrode of an FPC located on a PCB are connected with an anisotropic conductive adhesive, and an electrode of an LSI located on the PCB and driving the electronic circuit element and the FPC are connected. An electronic circuit mounting structure characterized in that the electrodes of the PCB and the electrodes of the LSI on the FPC are connected by wire bonding.
電極とＰＣＢ上に位置するＦＰＣの電極を異方性導電接
着剤で接続し、該ＦＰＣ上に位置する、該電子回路素子
を駆動するＬＳＩの電極と該ＦＰＣの電極とをワイヤー
ボンディングで接続し、該ＰＣＢの電極と該ＦＰＣ上の
ＬＳＩの電極をワイヤーボンディングで接続したことを
特徴とする電子回路の実装構造を用いた電子光学装置。[Claim 3] The electrodes of the electronic circuit element according to claim 1 or claim 2 and the electrodes of the FPC located on the PCB are connected with an anisotropic conductive adhesive, and the electronic circuit element located on the FPC is connected. An electronic circuit using an electronic circuit mounting structure characterized in that electrodes of an LSI to be driven and electrodes of the FPC are connected by wire bonding, and electrodes of the PCB and electrodes of the LSI on the FPC are connected by wire bonding. optical equipment.
電極とＰＣＢ上に位置するＦＰＣの電極を異方性導電接
着剤で接続し、該ＰＣＢ上に位置する、該電子回路素子
を駆動するＬＳＩの電極と該ＦＰＣの電極とをワイヤー
ボンディングで接続し、該ＰＣＢの電極と該ＦＰＣ上の
ＬＳＩの電極をワイヤーボンディングで接続したことを
特徴とする電子回路の実装構造を用いた電子印字装置。4. The electrode of the electronic circuit element according to claim 1 or claim 2 and the electrode of the FPC located on the PCB are connected with an anisotropic conductive adhesive, and the electronic circuit element located on the PCB is connected. An electronic circuit using an electronic circuit mounting structure characterized in that electrodes of an LSI to be driven and electrodes of the FPC are connected by wire bonding, and electrodes of the PCB and electrodes of the LSI on the FPC are connected by wire bonding. Printing device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40786090A JPH04225327A (en) | 1990-12-27 | 1990-12-27 | Electronic circuit mounting structure and electronic optical device and electronic printing device using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40786090A JPH04225327A (en) | 1990-12-27 | 1990-12-27 | Electronic circuit mounting structure and electronic optical device and electronic printing device using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04225327A true JPH04225327A (en) | 1992-08-14 |
Family
ID=18517394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP40786090A Pending JPH04225327A (en) | 1990-12-27 | 1990-12-27 | Electronic circuit mounting structure and electronic optical device and electronic printing device using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04225327A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04321245A (en) * | 1991-04-19 | 1992-11-11 | Nec Corp | Lcd module |
| JP2000347591A (en) * | 1999-06-07 | 2000-12-15 | Citizen Watch Co Ltd | Display device with external connection |
| JP2000347593A (en) * | 1999-06-07 | 2000-12-15 | Citizen Watch Co Ltd | Display device with external connection |
| JP2010069737A (en) * | 2008-09-18 | 2010-04-02 | Seiko Epson Corp | Line head and image forming apparatus |
| KR20180136499A (en) | 2016-05-31 | 2018-12-24 | 데쿠세리아루즈 가부시키가이샤 | Light emitting device and manufacturing method of light emitting device |
-
1990
- 1990-12-27 JP JP40786090A patent/JPH04225327A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04321245A (en) * | 1991-04-19 | 1992-11-11 | Nec Corp | Lcd module |
| JP2000347591A (en) * | 1999-06-07 | 2000-12-15 | Citizen Watch Co Ltd | Display device with external connection |
| JP2000347593A (en) * | 1999-06-07 | 2000-12-15 | Citizen Watch Co Ltd | Display device with external connection |
| JP2010069737A (en) * | 2008-09-18 | 2010-04-02 | Seiko Epson Corp | Line head and image forming apparatus |
| KR20180136499A (en) | 2016-05-31 | 2018-12-24 | 데쿠세리아루즈 가부시키가이샤 | Light emitting device and manufacturing method of light emitting device |
| KR20200108117A (en) | 2016-05-31 | 2020-09-16 | 데쿠세리아루즈 가부시키가이샤 | Light-emitting device and method for manufacturing light-emitting device |
| US10873016B2 (en) | 2016-05-31 | 2020-12-22 | Dexerials Corporation | Light-emitting device and method for manufacturing the same |
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