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JP7573241B2 - Infrared emitting device - Google Patents

Infrared emitting device Download PDF

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JP7573241B2
JP7573241B2 JP2021066575A JP2021066575A JP7573241B2 JP 7573241 B2 JP7573241 B2 JP 7573241B2 JP 2021066575 A JP2021066575 A JP 2021066575A JP 2021066575 A JP2021066575 A JP 2021066575A JP 7573241 B2 JP7573241 B2 JP 7573241B2
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JP2022161627A (en
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智大 宇治野
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Panasonic Intellectual Property Management Co Ltd
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Description

本発明は、特定の波長領域のみの赤外線を被加熱物に照射して加熱する赤外線放射装置に関するものである。 The present invention relates to an infrared radiation device that irradiates an object to be heated with infrared rays of only a specific wavelength range.

従来、特定の波長領域に吸収特性を有する被加熱物を加熱する加熱装置として、特定の波長領域の赤外線を放射する赤外線放射装置が知られている(例えば、特許文献1参照)。 Conventionally, infrared emitting devices that emit infrared rays in a specific wavelength range have been known as heating devices that heat objects that have absorption characteristics in a specific wavelength range (see, for example, Patent Document 1).

図4は特許文献1の概略構成図である。特許文献1で開示されている構成は、以下のような構成である。 Figure 4 is a schematic diagram of Patent Document 1. The configuration disclosed in Patent Document 1 is as follows:

赤外線放射装置101は、内壁を反射層103で構成された円筒状の外管104の内部空間に、特定の波長領域の赤外線を放射する特性を有する放射部102が配置されている。外管104には、外管104内の放射部102から放射された赤外線を外管104外に射出するための出射部105が設置されている。出射部105は、赤外線を透過する材料で構成されており、出射部105の外周面のうち、外管104内側に位置する入射面105aから入射した赤外線を、出射部105の入射面105aと反対側に位置する出射面105bから射出する。出射部105では、入射面105aと出射面105bと以外の外周面において、赤外線を内側に全反射させることで、入射面105aから入射した赤外線を出射面105bまで導く。よって、放射部102から放射された特定の波長領域の赤外線は、直接出射部105の入射面105aに到達するか、あるいは外管104内の反射層103で反射され、出射部105の入射面105aに到達すると、出射部105によって、出射面105bまで導かれ、外部の出射面105b近傍に局在的に赤外線を射出する。 In the infrared emitting device 101, a radiation part 102 having a characteristic of emitting infrared rays in a specific wavelength range is arranged in the internal space of a cylindrical outer tube 104 whose inner wall is made of a reflective layer 103. An emission part 105 is installed in the outer tube 104 for emitting infrared rays emitted from the radiation part 102 in the outer tube 104 to the outside of the outer tube 104. The emission part 105 is made of a material that transmits infrared rays, and emits infrared rays incident from an entrance surface 105a located on the inside of the outer tube 104 among the outer peripheral surfaces of the emission part 105 from an exit surface 105b located on the opposite side to the entrance surface 105a of the emission part 105. In the exit part 105, infrared rays are totally reflected inward on the outer peripheral surfaces other than the entrance surface 105a and the exit surface 105b, so that the infrared rays incident from the entrance surface 105a are guided to the exit surface 105b. Therefore, infrared rays in a specific wavelength range emitted from the radiation unit 102 reach the incident surface 105a of the emission unit 105 directly, or are reflected by the reflective layer 103 in the outer tube 104. When they reach the incident surface 105a of the emission unit 105, they are guided by the emission unit 105 to the emission surface 105b, and emit infrared rays locally near the external emission surface 105b.

特開2020-17433号公報JP 2020-17433 A

しかしながら、前記特許文献1の構成では、赤外線放射装置から射出する赤外線の波長領域を変更できないため、吸収波長領域が異なる材料に合わせて、個別に赤外線放射装置の作製、及び、加熱設備への付け替えが必要であり、コストと作業者の負担とが増加する、という問題がある。 However, in the configuration of Patent Document 1, the wavelength range of the infrared light emitted from the infrared emitting device cannot be changed, so it is necessary to create individual infrared emitting devices and attach them to heating equipment in accordance with materials with different absorption wavelength ranges, which increases costs and the burden on workers.

本発明は、このような点を鑑み、射出する赤外線の波長領域が変化する赤外線放射装置を提供することを目的とする。 In view of these points, the present invention aims to provide an infrared emitting device that changes the wavelength range of the infrared light it emits.

前記目的を達成するために、本発明の1つの態様にかかる赤外線放射装置は、
赤外線を射出する赤外線放射装置であって、
放射される前記赤外線の放射方向とその放射面とのなす角度によって、放射される前記赤外線の波長領域が変化する前記放射面を有する放射部と、
内壁面が反射層で構成された半球状の形状を有し、その球心の位置に配置されて前記赤外線を射出する第1出射部を有し、前記放射部の前記放射面を前記第1出射部に向けた状態で前記放射部を筐体空間内に配置する筐体と、
前記筐体の前記第1出射部に対する前記放射部の前記放射面の前記角度を調整する角度調整部とを備える。
In order to achieve the above object, an infrared emitting device according to one aspect of the present invention comprises:
An infrared emitting device that emits infrared rays,
a radiation unit having a radiation surface in which a wavelength range of the radiated infrared light changes depending on an angle between the radiation direction of the radiated infrared light and the radiation surface;
a housing having a hemispherical shape with an inner wall surface formed of a reflective layer, the housing having a first emission section disposed at a position of the center of the sphere and emitting the infrared rays, the emission section being disposed within a housing space with the emission surface of the emission section facing the first emission section;
and an angle adjustment unit that adjusts the angle of the radiation surface of the radiation unit with respect to the first emission unit of the housing.

以上のように、本発明の前記態様の赤外線放射装置によれば、放射部の放射面の角度を角度調整部で調整することで、複数の材料の吸収波長領域に対応できるため、吸収波長領域が異なる材料に対応するための赤外線放射装置の製作コストと加熱設備への付け替えの作業者の負担とを削減することができる。 As described above, according to the infrared emitting device of the above aspect of the present invention, the angle of the emitting surface of the emitting unit can be adjusted by the angle adjustment unit to accommodate the absorption wavelength ranges of multiple materials, thereby reducing the manufacturing costs of the infrared emitting device to accommodate materials with different absorption wavelength ranges and the burden on the worker of replacing it with heating equipment.

本発明の第1実施形態における赤外線放射装置を側面から見た概略構成図FIG. 1 is a schematic configuration diagram of an infrared emitting device according to a first embodiment of the present invention, as viewed from the side; 本発明の第1実施形態における赤外線放射装置を正面から見た概略構成図FIG. 1 is a schematic front view of an infrared emitting device according to a first embodiment of the present invention; 放射面における放射角度αを説明するための、本発明の第1実施形態における赤外線放射装置を側面から見た概略構成の部分拡大図FIG. 2 is a partially enlarged schematic side view of the infrared emitting device according to the first embodiment of the present invention, for explaining the radiation angle α on the radiation surface; 放射面における放射角度10°で放射される赤外線の放射率スペクトルを示す図FIG. 1 is a diagram showing the emissivity spectrum of infrared rays emitted at a radiation angle of 10° on a radiation surface. 放射角度によって放射される赤外線の波長領域が変化する放射面における放射率スペクトルと放射角度の関係を示す図A diagram showing the relationship between the emissivity spectrum and radiation angle for a radiation surface in which the wavelength range of infrared radiation changes depending on the radiation angle. 本発明の第2実施形態における赤外線放射装置の概略構成図FIG. 1 is a schematic diagram of an infrared emitting device according to a second embodiment of the present invention; 従来の赤外線放射装置の概略構成図Schematic diagram of a conventional infrared emitting device

以下、本発明の実施の形態について、図面を参照しながら説明する。 The following describes an embodiment of the present invention with reference to the drawings.

図1A及び図1Bは、それぞれ、本発明の第1実施形態における赤外線放射装置1を側面と正面から見た概略構成図である。 Figures 1A and 1B are schematic diagrams of the infrared emitting device 1 according to the first embodiment of the present invention, seen from the side and the front, respectively.

赤外線放射装置1は、筐体3と、放射部2と、角度調整部5とを少なくとも備えて、赤外線20を射出する。赤外線放射装置1は、さらに、出力制御部10と、角度調整制御部6とを備えている。 The infrared emitting device 1 includes at least a housing 3, a radiation unit 2, and an angle adjustment unit 5, and emits infrared rays 20. The infrared emitting device 1 further includes an output control unit 10 and an angle adjustment control unit 6.

筐体3は、内壁面が鏡面などの反射層4で覆われている半球状の形状をしており、半球状の筐体空間3d内のその球心3aと頂点3bとを結ぶ線3c上の位置に、円形平板状の放射部2を配置している。反射層4は、Au、Ag、Cu、又は、鏡面研磨したSUS等の金属によって形成される。
放射部2は、出力制御部10によって供給された電力によって加熱され、その表面から赤外線20を放射する。
The housing 3 has a hemispherical shape with the inner wall surface covered with a reflective layer 4 such as a mirror surface, and the circular flat radiation part 2 is disposed on a line 3c connecting the center 3a and the apex 3b of the hemispherical housing space 3d. The reflective layer 4 is made of a metal such as Au, Ag, Cu, or mirror-polished SUS.
The radiating section 2 is heated by the power supplied by the output control section 10 and radiates infrared rays 20 from its surface.

筐体3は、その球心3aの位置に、中心軸が線3c沿いとなるように、赤外線20を透過する円形平板状の第1出射部7を備えている。放射部2の放射面9を第1出射部7に向けた状態で、放射部2を筐体3の筐体空間3d内に配置している。第一出射部7は、CaF、BaF、MgF、又は、SiO等の紫外から10μm前後に至る赤外領域において、透過性の高い材料によって形成される。よって、放射部2から放射され第1出射部7に到達した赤外線20は、第1出射部7から前記線3cの延長線沿いに筐体3外へ射出され、被加熱物としてのワーク8に照射される。放射部2の第1出射部7側に面している表面は、詳細は後述するが、特定の波長領域の赤外線20を放射し、さらにその赤外線20の放射方向と放射面9とのなす角度αによって、放射される赤外線20の波長領域が変化する放射面9を有している。放射部2における放射面9以外の表面は、任意の材料で構成されているが、放射率の低い材料で構成されていることが望ましい。放射率の低い材料としては、Au、Ag、Cu、W、又は、Mo等の金属が用いられる。
放射部2は、赤外線20の放射方向と放射面9とのなす角度α、すなわち、第1出射部7の入射面7aに平行な面に対する赤外線20の放射面9の角度αを調整できるように角度調整部5が接続されている。角度調整部5を制御する角度調整制御部6によって、第1出射部7の入射面7aに平行な面に対して放射面9が平行なときの角度αを0°としたときに、例えば、-80°~80°の間の任意の角度に放射面9の角度αを調整することができる。放射面9の角度αが、80°~90°(ただし、80°は除く。)又は-80°~-90°(ただし、-80°は除く。)のとき、放射される赤外線20における波長領域の変化が、数%以下と小さい。このため、放射面9の角度αが-80°~80°までの範囲であれば、放射面9の角度における波長領域の変化特性を十分に活用することができる。
角度調整部5の一例としては、2本のSUS製のロッドが用いられる。放射部2の裏面において、放射部2の中点を通る、放射部2の回転軸に垂直な線上における放射部2の両端部の位置に、放射面9に対してロッドが垂直になるように、2本のロッドの端部をそれぞれ取り付ける。角度αを変化させるときは、2本のロッドのうちの一方のロッドを出射部7方向に、他方のロッドを出射部7と反対側の方向に、同時に等距離だけ動かすことにより、角度αを任意に調整することができる。
角度調整制御部6の一例としては、放射部2と同じ大きさのプレートを、放射部2と平行になるように、2本のロッド(角度調整部5)の放射部2と反対側の端部にそれぞれ取り付ける。そして、プレートの角度を、角度αと同じ回転方向に変更できるように、プレートに回転機構を設ける。放射部2とプレートとは、2本のロッドである角度調整部5で接続されているため、プレートの角度を任意に調整することで、放射部2の角度αも同じように調整することができる。
放射部2の直径の長さは、角度調整部5によって放射部2の角度αを変化させたときに、筐体3と干渉しない長さに設定される。第1出射部7の直径の長さは、放射部2を第1出射部7の入射面7aに平行な面に対して、角度αの絶対値が最大となる角度だけ傾けたとき、すなわち、本第1実施形態では±80°傾けたときの第1出射部7の入射面7aに平行な面に対する射影となる楕円の短径の長さ以下に設定される。
The housing 3 is provided with a circular flat first emission section 7 that transmits infrared rays 20 at the position of the spherical center 3a, with the central axis along the line 3c. The emission section 2 is disposed in the housing space 3d of the housing 3 with the emission surface 9 of the emission section 2 facing the first emission section 7. The first emission section 7 is formed of a material that has high transparency in the infrared region from ultraviolet to around 10 μm, such as CaF 2 , BaF 2 , MgF 2 , or SiO 2 . Therefore, the infrared rays 20 emitted from the emission section 2 and reaching the first emission section 7 are emitted from the first emission section 7 to the outside of the housing 3 along the extension line of the line 3c, and are irradiated to the workpiece 8 as the heated object. The surface of the radiation unit 2 facing the first emission unit 7 has a radiation surface 9 which emits infrared rays 20 in a specific wavelength range, and the wavelength range of the emitted infrared rays 20 changes depending on the angle α between the radiation direction of the infrared rays 20 and the radiation surface 9, as will be described in detail later. The surfaces of the radiation unit 2 other than the radiation surface 9 may be made of any material, but are preferably made of a material with low emissivity. Examples of materials with low emissivity include metals such as Au, Ag, Cu, W, and Mo.
The angle adjustment unit 5 is connected to the radiation unit 2 so that the angle α between the radiation direction of the infrared rays 20 and the radiation surface 9, that is, the angle α of the radiation surface 9 of the infrared rays 20 with respect to the plane parallel to the incident surface 7a of the first emission unit 7, can be adjusted. When the angle α when the radiation surface 9 is parallel to the plane parallel to the incident surface 7a of the first emission unit 7 is set to 0°, the angle α of the radiation surface 9 can be adjusted to any angle between -80° and 80°, for example, by the angle adjustment control unit 6 that controls the angle adjustment unit 5. When the angle α of the radiation surface 9 is 80° to 90° (excluding 80°) or -80° to -90° (excluding -80°), the change in the wavelength region of the radiated infrared rays 20 is small, at a few percent or less. Therefore, if the angle α of the radiation surface 9 is in the range of -80° to 80°, the change characteristic of the wavelength region at the angle of the radiation surface 9 can be fully utilized.
Two SUS rods are used as an example of the angle adjustment unit 5. On the rear surface of the radiation unit 2, the ends of the two rods are attached to both ends of the radiation unit 2 on a line that passes through the midpoint of the radiation unit 2 and is perpendicular to the rotation axis of the radiation unit 2, so that the rods are perpendicular to the radiation surface 9. When changing the angle α, one of the two rods is moved toward the emission unit 7 and the other rod is moved in the direction opposite to the emission unit 7 by an equal distance at the same time, thereby allowing the angle α to be arbitrarily adjusted.
As an example of the angle adjustment control unit 6, a plate of the same size as the radiation unit 2 is attached to each end of two rods (angle adjustment units 5) opposite the radiation unit 2 so as to be parallel to the radiation unit 2. A rotation mechanism is provided on the plate so that the angle of the plate can be changed in the same rotation direction as the angle α. Since the radiation unit 2 and the plate are connected by the angle adjustment units 5, which are two rods, the angle of the plate can be adjusted arbitrarily, and therefore the angle α of the radiation unit 2 can also be adjusted in the same way.
The diameter of the radiation unit 2 is set to a length that does not interfere with the housing 3 when the angle α of the radiation unit 2 is changed by the angle adjustment unit 5. The diameter of the first emission unit 7 is set to be equal to or less than the length of the minor axis of an ellipse that is projected onto a plane parallel to the incident surface 7a of the first emission unit 7 when the radiation unit 2 is tilted by an angle at which the absolute value of the angle α is maximized with respect to a plane parallel to the incident surface 7a of the first emission unit 7, that is, when tilted by ±80° in this first embodiment.

本第1実施形態では、一例として放射部2と第1出射部7とのそれぞれの形状は円形状にしているが、正方形状、又は直方形状でも構わない。そのときの放射部2の各辺の長さは、角度調整部5によって放射部2の角度αを変化させたときに、筐体3と干渉しない長さに設定される。第1出射部7の各辺の長さは、円形状のときと同様に、放射部2を第1出射部7の入射面7aに平行な面に対して、角度αの絶対値が最大となる角度だけ傾けたとき、すなわち、本第1実施形態では±80°傾けたときの第1出射部7の入射面7aに平行な面に対する射影部分のそれぞれに対応する辺の長さ以下に設定される。 In the first embodiment, the shape of each of the radiation unit 2 and the first emission unit 7 is circular as an example, but they may be square or rectangular. The length of each side of the radiation unit 2 is set to a length that does not interfere with the housing 3 when the angle α of the radiation unit 2 is changed by the angle adjustment unit 5. As in the case of a circular shape, the length of each side of the first emission unit 7 is set to be equal to or less than the length of the side corresponding to each projected portion onto a plane parallel to the incidence surface 7a of the first emission unit 7 when the radiation unit 2 is tilted by an angle at which the absolute value of the angle α is maximum with respect to a plane parallel to the incidence surface 7a of the first emission unit 7, that is, when tilted by ±80° in the first embodiment.

なお、角度調整部5により、放射部2を調整できる最大の角度αは、放射面9から放射される赤外線20の特性又は放射部2の大きさ等を鑑みて設定される。 The maximum angle α to which the radiation unit 2 can be adjusted by the angle adjustment unit 5 is set in consideration of the characteristics of the infrared rays 20 emitted from the radiation surface 9 or the size of the radiation unit 2, etc.

ここで、特定の波長領域の赤外線20を放射する放射部2の詳細について記述する。一般的な赤外線放射体から放射される赤外線20の波長分布は、プランクの法則に従い、絶対温度によって一意的に決まる完全黒体の熱輻射スペクトルと、金属又は誘電体などで構成される赤外線放射体の発熱部の材料が持つ固有の放射率スペクトルとの積によって決まる。完全黒体の熱輻射スペクトルはブロードな波長分布を示し、材料が持つ放射率スペクトルも、材料によっては特定の波長に偏りのある分布を示すものの、特定の材料を構成する分子が持つ官能基の吸収波長と同程度の狭帯域なピークを持つような波長分布の赤外線を放射することは難しかった。しかし、近年、発熱部の表面構造を微細加工し、放射率スペクトルを制御する研究が盛んに行われている。放射率制御に用いられている構造としては、金属と誘電体との2層の薄膜層の上に金属の孔又は突起を2次元平面状に周期的に配列した構造、又は、金属層の上に屈折率の異なる2種類の誘電体を交互に積層した積層構造などがある。このように、赤外線放射体の発熱部の表面の微細構造を設計することによって、任意の波長において狭帯域にピークを持つ波長分布の赤外線20を放射することが可能となる。 Here, the details of the radiation unit 2 that radiates infrared rays 20 in a specific wavelength range will be described. The wavelength distribution of infrared rays 20 radiated from a general infrared radiator is determined by the product of the thermal radiation spectrum of a perfect black body, which is uniquely determined by absolute temperature according to Planck's law, and the inherent emissivity spectrum of the material of the heat generating part of the infrared radiator, which is made of metal or dielectric. The thermal radiation spectrum of a perfect black body shows a broad wavelength distribution, and the emissivity spectrum of a material also shows a distribution biased to a specific wavelength depending on the material, but it was difficult to radiate infrared rays with a wavelength distribution that has a narrow band peak similar to the absorption wavelength of the functional group of the molecule that constitutes a specific material. However, in recent years, research has been actively conducted on microfabricating the surface structure of the heat generating part to control the emissivity spectrum. Structures used for emissivity control include a structure in which metal holes or protrusions are periodically arranged in a two-dimensional plane on two thin layers of metal and dielectric, or a laminated structure in which two types of dielectrics with different refractive indices are alternately stacked on a metal layer. In this way, by designing the microstructure of the surface of the heat generating part of the infrared radiator, it is possible to emit infrared rays 20 with a wavelength distribution that has a peak in a narrow band at any wavelength.

さらに、上記のような特定の波長領域の赤外線20を放射するように、表面に微細構造を施した放射面9における放射角度αによって、放射する赤外線20の波長領域が変化する特性を有する微細構造がある。 Furthermore, there is a microstructure that has the characteristic that the wavelength range of the radiated infrared rays 20 changes depending on the radiation angle α at the radiation surface 9, which has a microstructure applied to its surface so as to radiate infrared rays 20 in the specific wavelength range described above.

図2Aは、金属層の上に2種類の誘電体を交互に複数層積層したある多層構造体について、多層構造体の放射面9に垂直な方向から10°傾いた方向に放射される赤外線をシミュレーションで解析した、
放射率スペクトルのグラフである。波長3.3μm付近に高い放射率を示すピークがあり、特定の波長領域の赤外線を放射する特性を示していることがわかる。多層構造体の金属層としては、Au、Ag,Cu,W,又は、Mo等の金属によって形成され、膜厚は100~500nm程度に設定される。多層構造体の2種類の誘電体としては、Si,Ge、SiO,TiO、Al、HfO、又は、SiC等から選択され、それぞれの膜厚は、100nm程度から数μmの間に設定される。
FIG. 2A shows a simulation analysis of infrared radiation emitted in a direction tilted by 10° from a direction perpendicular to the radiation surface 9 of a certain multilayer structure in which two types of dielectrics are alternately laminated on a metal layer.
1 is a graph of an emissivity spectrum. It can be seen that there is a peak showing high emissivity near a wavelength of 3.3 μm, and that the material has the characteristic of emitting infrared rays in a specific wavelength range. The metal layer of the multilayer structure is formed of a metal such as Au, Ag, Cu, W, or Mo, and the film thickness is set to about 100 to 500 nm. The two types of dielectric materials of the multilayer structure are selected from Si, Ge, SiO 2 , TiO 2 , Al 2 O 3 , HfO 2 , or SiC, and the film thickness of each is set to between about 100 nm and several μm.

また、図2Bは、同じ多層構造体において、横軸を放射される赤外線の波長、縦軸を赤外線の放射角度α、赤外線の放射率を明暗で表したコンター図である。 Figure 2B is a contour diagram of the same multilayer structure, with the horizontal axis representing the wavelength of the infrared radiation, the vertical axis representing the radiation angle α of the infrared radiation, and the infrared emissivity represented by light and dark.

図2Bを見てわかる通り、放射面9に対する放射角度αが0°から90°まで変化するにつれて、放射面9から出射部7の方向へ放射する赤外線20の波長領域である、図2Aで示されている放射率のピークの位置が長波長側から短波長側に推移している。
このように、放射角度αによって赤外線の波長領域が変化する放射面9を有する放射部2において、第1出射部7の入射面7aの平面に対する放射面9の角度αを角度調整部5で調整することで、任意の波長領域の赤外線20を第1出射部7から射出することができる。
As can be seen from FIG. 2B , as the radiation angle α with respect to the radiation surface 9 changes from 0° to 90°, the position of the peak emissivity shown in FIG. 2A , which is the wavelength region of the infrared rays 20 radiated from the radiation surface 9 in the direction of the exit portion 7, shifts from the long wavelength side to the short wavelength side.
In this way, in the radiation section 2 having the radiation surface 9 in which the wavelength range of infrared rays changes depending on the radiation angle α, by adjusting the angle α of the radiation surface 9 relative to the plane of the incident surface 7a of the first emission section 7 using the angle adjustment section 5, infrared rays 20 in any wavelength range can be emitted from the first emission section 7.

放射部2から放射され、第1出射部7から射出されず、反射層4で反射された赤外線は、筐体3内で多重反射し、放射部2に再び吸収されることで、筐体3内に一定程度閉じ込めることができるため、赤外線の利用効率を向上することができる。 Infrared rays that are emitted from the radiation unit 2, do not exit from the first emission unit 7, and are reflected by the reflective layer 4 are multiple-reflected within the housing 3 and are absorbed again by the radiation unit 2, so that they can be confined to a certain extent within the housing 3, improving the efficiency of infrared utilization.

前記第1実施形態によれば、放射部2の放射面9の角度αを角度調整制御部6の制御の下に角度調整部5で調整することで、複数の材料の吸収波長領域に対応できるため、吸収波長領域が異なる材料に対応するための赤外線放射装置の製作コストと加熱設備への付け替えの作業者の負担とを削減することができる。
図3は、本発明の第2実施形態における赤外線放射装置1の構成図である。
According to the first embodiment, the angle α of the radiation surface 9 of the radiation unit 2 is adjusted by the angle adjustment unit 5 under the control of the angle adjustment control unit 6, thereby making it possible to accommodate the absorption wavelength ranges of a plurality of materials, thereby reducing the manufacturing costs of an infrared radiation device for accommodating materials with different absorption wavelength ranges and the burden on workers of replacing the device with heating equipment.
FIG. 3 is a diagram showing the configuration of an infrared emitting device 1 according to a second embodiment of the present invention.

第2実施形態では、第1実施形態の赤外線放射装置1に対して、内壁面が鏡面などの反射層12で構成され、半球状の筐体3の平面3eに対して、面対称に配置されている半球状の反射部材11をさらに備えている。 In the second embodiment, the infrared emitting device 1 of the first embodiment further includes a hemispherical reflective member 11 whose inner wall surface is formed of a reflective layer 12 such as a mirror surface, and which is arranged symmetrically with respect to the plane 3e of the hemispherical housing 3.

反射部材11は、線3cの延長線上の第1出射部7に対向する位置に、筐体3の第1出射部7の入射面7aと平行な入射面13aを有しかつ赤外線を通過させる第2出射部13を有している。放射部2から放射され、第1出射部7を通過し、第2出射部13に到達した赤外線を、第2出射部13を透過して反射部材11外へ射出する。第2出射部13は、出射部7を通過した赤外線を透過する材料で構成されているか、又は、入射面としての入射口を持ちかつ貫通して開口している。 The reflecting member 11 has a second emission section 13 that has an incident surface 13a parallel to the incident surface 7a of the first emission section 7 of the housing 3 and that passes infrared rays, located at a position facing the first emission section 7 on the extension of the line 3c. The infrared rays that are emitted from the radiation section 2, pass through the first emission section 7, and reach the second emission section 13 are emitted outside the reflecting member 11 through the second emission section 13. The second emission section 13 is made of a material that transmits the infrared rays that have passed through the emission section 7, or has an entrance as an incident surface and opens through it.

第2実施形態によれば、第1実施形態の作用効果に加えて、以下の作用効果を奏することができる。すなわち、放射部2の放射面9から放射され、第1出射部7を通過した赤外線の一部は、第2出射部13に到達し、第2出射部13から射出されワーク8に照射される。第1出射部7の線3c沿いではなく、線3cに対して傾斜して入り、第1出射部7を通過したが第2出射部13の方向に向かわない赤外線は、反射部材11の反射層12で反射され、反射部材11内あるいは筐体3内で多重反射し、一部を放射部2で吸収させることで、一定程度閉じ込めることができる。このように、放射面9と第1出射部7と第2出射部13とを結んだ方向に沿う角度で放射された赤外線を、第2出射部13の下方に局所的に照射することができる。 According to the second embodiment, in addition to the effects of the first embodiment, the following effects can be achieved. That is, a part of the infrared rays emitted from the radiation surface 9 of the radiation unit 2 and passing through the first emission unit 7 reaches the second emission unit 13, is emitted from the second emission unit 13, and is irradiated to the workpiece 8. The infrared rays that enter the first emission unit 7 at an angle to the line 3c, not along the line 3c, and pass through the first emission unit 7 but do not head toward the second emission unit 13 are reflected by the reflective layer 12 of the reflecting member 11, are multiple-reflected within the reflecting member 11 or the housing 3, and are partially absorbed by the radiation unit 2, so that they can be confined to a certain extent. In this way, the infrared rays emitted at an angle along the direction connecting the radiation surface 9, the first emission unit 7, and the second emission unit 13 can be locally irradiated below the second emission unit 13.

なお、前記様々な実施形態又は変形例のうちの任意の実施形態又は変形例を適宜組み合わせることにより、それぞれの有する効果を奏するようにすることができる。また、実施形態同士の組み合わせ又は実施例同士の組み合わせ又は実施形態と実施例との組み合わせが可能であると共に、異なる実施形態又は実施例の中の特徴同士の組み合わせも可能である。 In addition, by appropriately combining any of the various embodiments or modifications described above, it is possible to achieve the effects of each. In addition, it is possible to combine embodiments with each other, or to combine examples with each other, and it is also possible to combine features of different embodiments or examples.

本発明の前記態様にかかる赤外線放射装置は、様々な吸収波長領域を有する材料に合わせた波長の赤外線を放射して被加熱物を加熱できるため、低コスト且つ高効率で所望の熱処理を実施できる。そのため、本発明の前記態様にかかる赤外線放射装置は、高効率な加熱装置として、工業製品又は家電製品の製造工程又は各種電子部品の製造工程における乾燥炉、焼成炉、キュア炉、又はリフロー炉などの各種熱処理を行う熱処理装置に適用できる。 The infrared radiation device according to the above aspect of the present invention can heat the object to be heated by emitting infrared rays with wavelengths that match materials having various absorption wavelength ranges, so that the desired heat treatment can be performed at low cost and with high efficiency. Therefore, the infrared radiation device according to the above aspect of the present invention can be applied as a highly efficient heating device to heat treatment devices that perform various heat treatments, such as drying furnaces, baking furnaces, curing furnaces, and reflow furnaces, in the manufacturing process of industrial products or home appliances, or in the manufacturing process of various electronic components.

1 赤外線放射装置
2 放射部
3 筐体
3a 球心
3b 頂点
3c 球心と頂点とを結ぶ線
3d 筐体空間
3e 平面
4 反射層
5 角度調整部
6 角度調整制御部
7 第1出射部
7a 入射面
8 ワーク
9 放射面
10 出力制御部
11 反射部材
12 反射層
13 第2出射部
13a 入射面
20 赤外線
101 赤外線放射装置
102 放射部
103 反射層
104 外管
105 出射部
105a 入射面
105b 出射面
α 出射部の入射面に対する放射面のなす角度
Reference Signs List 1 Infrared emitting device 2 Radiation section 3 Housing 3a Center of sphere 3b Vertex 3c Line connecting the center of sphere and the vertex 3d Housing space 3e Plane 4 Reflection layer 5 Angle adjustment section 6 Angle adjustment control section 7 First emission section 7a Incident surface 8 Work 9 Radiation surface 10 Output control section 11 Reflection member 12 Reflection layer 13 Second emission section 13a Incident surface 20 Infrared ray 101 Infrared emitting device 102 Radiation section 103 Reflection layer 104 Outer tube 105 Emission section 105a Incident surface 105b Emission surface α Angle between the emission surface and the incident surface of the emission section

Claims (2)

赤外線を射出する赤外線放射装置であって、
放射される前記赤外線の放射方向とその放射面とのなす角度によって、放射される前記赤外線の波長領域が変化する前記放射面を有する放射部と、
内壁面が反射層で構成された半球状の形状を有し、その球心の位置に配置されて前記赤外線を射出する第1出射部を有し、前記放射部の前記放射面を前記第1出射部に向けた状態で前記放射部を筐体空間内に配置する筐体と、
前記筐体の前記第1出射部に対する前記放射部の前記放射面の前記角度を調整する角度調整部とを備える赤外線放射装置。
An infrared emitting device that emits infrared rays,
a radiation unit having a radiation surface in which a wavelength range of the radiated infrared light changes depending on an angle between the radiation direction of the radiated infrared light and the radiation surface;
a housing having a hemispherical shape with an inner wall surface formed of a reflective layer, the housing having a first emission section disposed at a position of the center of the sphere and emitting the infrared rays, the emission section being disposed within a housing space with the emission surface of the emission section facing the first emission section;
an angle adjustment unit that adjusts the angle of the radiation surface of the radiation unit with respect to the first emission unit of the housing.
内壁面を反射層で構成され、半球状の前記筐体における平面に対して面対称に配置した半球状の反射部材をさらに設け、前記反射部材における前記第1出射部と対向する位置に、前記筐体の前記第1出射部の入射面と平行な入射面を有する第2出射部を備える、請求項1に記載の赤外線放射装置。 The infrared radiation device according to claim 1, further comprising a hemispherical reflecting member whose inner wall surface is made of a reflecting layer and arranged in plane symmetry with respect to the plane of the hemispherical housing, and a second emission section having an entrance surface parallel to the entrance surface of the first emission section of the housing, at a position facing the first emission section of the reflecting member.
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JP2012225829A (en) 2011-04-21 2012-11-15 Panasonic Corp Infrared radiation element and infrared light source
WO2014192478A1 (en) 2013-05-30 2014-12-04 日本碍子株式会社 Infrared heating unit, infrared heating device and drying device
WO2019225726A1 (en) 2018-05-25 2019-11-28 国立研究開発法人物質・材料研究機構 Laminated radiation light source
JP2020017433A (en) 2018-07-26 2020-01-30 日本碍子株式会社 Infrared radiation apparatus
JP2021044192A (en) 2019-09-13 2021-03-18 株式会社浅野研究所 Heating apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012225829A (en) 2011-04-21 2012-11-15 Panasonic Corp Infrared radiation element and infrared light source
WO2014192478A1 (en) 2013-05-30 2014-12-04 日本碍子株式会社 Infrared heating unit, infrared heating device and drying device
WO2019225726A1 (en) 2018-05-25 2019-11-28 国立研究開発法人物質・材料研究機構 Laminated radiation light source
JP2020017433A (en) 2018-07-26 2020-01-30 日本碍子株式会社 Infrared radiation apparatus
JP2021044192A (en) 2019-09-13 2021-03-18 株式会社浅野研究所 Heating apparatus

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