JP7486009B1 - Wave soldering equipment - Google Patents

Abstract

[Problem] To provide a jet soldering device capable of preventing the scattering of molten solder. [Solution] The jet soldering device has a storage tank 110 for storing molten solder S, supply units 120, 130 for supplying the molten solder S, and a guide member 150 for guiding the molten solder S supplied from the supply units 120, 130 to the molten solder S in the storage tank 110. The guide member 150 is immersed at an angle of 40 degrees or less with respect to the liquid surface of the molten solder S. [Selected Figure] Figure 2

Description

The present invention relates to a jet soldering device that supplies molten solder to a substrate.

A jet soldering device for supplying molten solder to a board has been known for some time. For example, Patent Document 1 discloses a jet soldering tank that jets molten solder from a jet nozzle provided in a solder tank main body that contains the molten solder to solder an object. The jet soldering tank of Patent Document 1 is equipped with a solder guide section that has an outlet at one end and is provided around the jet nozzle to guide the molten solder jetted by the jet nozzle out of the outlet and to the solder tank main body, a first basket that is open at the top and has multiple holes drilled in the bottom and sides, and a second basket that is provided below the first basket and has an open top and multiple holes drilled in the bottom and sides. The solder flow mitigation section takes in the molten solder that has flowed out from the outlet from the top of the first basket and discharges it from the holes in the first basket and the second basket.

JP 2011-124453 A

In the embodiment of Patent Document 1, the molten solder jetted by the jet nozzle flows out of the outlet and is guided to the solder bath main body, but the present invention provides a jet soldering device that employs an embodiment different from that of Patent Document 1 and can prevent the molten solder from splashing onto the board.

[Concept 1]
A jet soldering apparatus according to a first aspect of the present invention comprises:
a supply unit for supplying molten solder;
a storage tank for storing molten solder;
a guide member for guiding the molten solder supplied from the supply unit to the molten solder in the storage tank;
Equipped with
The guide member may be immersed at an angle of 40 degrees or less with respect to the liquid surface of the molten solder in the reservoir.

[Concept 2]
In the wave soldering apparatus according to concept 1,
the guide member has a first guide member located on a distal end side, a second guide member located on a proximal end side, and a guide bent portion provided between the first guide member and the second guide member,
the first guide member is immersed at an angle of 40 degrees or less with respect to the liquid surface of the molten solder in the storage tank;
An angle of the second guide member with respect to the liquid level of the molten solder in the reservoir tank may be larger than an angle of the first guide member with respect to the liquid level of the molten solder in the reservoir tank.

[Concept 3]
In the wave soldering apparatus according to concept 1 or 2,
The guide member may include a cover member located above at least a portion where the guide member is immersed in the liquid surface of the molten solder in the reservoir.

[Concept 4]
In the wave soldering apparatus according to concept 3,
The cover member extends toward the supply portion,
A tip of the cover member may be located closer to the supply portion than a point where the guide member is immersed in the liquid surface of the molten solder in the reservoir.

[Concept 5]
In the wave soldering apparatus according to concept 3 or 4,
The cover member has a first cover member located on a distal end side, a second cover member located on a proximal end side, and a cover bent portion provided between the first cover member and the second cover member,
The first cover member may be bent downward relative to the second cover member via the cover bending portion.

[Concept 6]
In the wave soldering apparatus according to concept 5,
the guide member has a first guide member located on a distal end side, a second guide member located on a proximal end side, and a guide bent portion provided between the first guide member and the second guide member,
A tip end of the first cover member may be located closer to the supply portion than the guide bent portion.

[Concept 7]
7. A wave soldering apparatus according to any one of claims 1 to 6, comprising:
The guide member may be immersed at an angle exceeding 0 degrees with respect to the liquid surface of the molten solder in the reservoir.

[Concept 8]
8. A wave soldering apparatus according to any one of claims 1 to 7,
The guide member may have a plurality of holes.

[Concept 9]
A jet soldering apparatus according to a second aspect of the present invention comprises:
a supply unit for supplying molten solder;
a storage tank for storing molten solder;
a guide member for guiding the molten solder supplied from the supply unit to the molten solder in the storage tank;
Equipped with
the guide member has a first guide member located on a distal end side, a second guide member located on a proximal end side, and a guide bent portion provided between the first guide member and the second guide member,
The first guide member may be immersed in a liquid surface of the molten solder in the reservoir.

[Concept 10]
A jet soldering apparatus according to a second aspect of the present invention comprises:
a cover member provided above the molten solder in the storage tank and extending from a side surface of the storage tank toward a supply point of the supply unit for the molten solder;
The cover member has a first cover member located on a distal end side, a second cover member located on a proximal end side, and a cover bent portion provided between the first cover member and the second cover member,
An imaginary line connecting a landing position of the first guide member on the molten solder and a tip of the first cover member may be positioned on a side surface of the supply portion.

[Concept 11]
A jet soldering apparatus according to a third aspect of the present invention comprises:
a supply unit for supplying molten solder;
a storage tank for storing molten solder;
a cover member provided above the molten solder in the storage tank and extending from a side surface of the storage tank toward a supply point of the supply unit where the molten solder is supplied;
Equipped with
The tip of the cover member and the supply point may be spaced apart in a plan view.

[Concept 12]
A jet soldering apparatus according to a third aspect of the present invention comprises:
a guide member for guiding the molten solder supplied from the supply unit to the molten solder in the storage tank,
the guide member is immersed at an angle of 40 degrees or less with respect to the liquid surface of the molten solder in the reservoir;
An imaginary line connecting a position where the guide member lands on the molten solder and a tip of the cover member may be positioned on a side surface of the supply section.

By adopting an aspect of the present invention, it is possible to provide a jet soldering device that can prevent molten solder from splashing onto a substrate.

FIG. 1 is a schematic diagram showing a soldering apparatus according to the present embodiment. FIG. 2 is a side cross-sectional view showing a state in which an upstream guide member is immersed in the liquid surface of molten solder in the jet soldering apparatus according to the present embodiment. FIG. 3 is a side cross-sectional view showing an aspect in which an upstream guide member is immersed in the liquid surface of the molten solder and an upstream cover member is provided in the jet soldering apparatus according to the present embodiment. FIG. 4 is a side cross-sectional view showing an aspect in which an upstream guide member has an upstream first guide member, an upstream second guide member and an upstream guide bent portion, and an upstream cover member is provided in the jet soldering apparatus according to the present embodiment. Figure 5 is a side cross-sectional view showing an embodiment of the jet soldering apparatus in which the upstream guide member has an upstream first guide member, an upstream second guide member, and an upstream guide bending portion, and the upstream cover member has an upstream first cover member, an upstream second cover member, and an upstream cover bending portion. FIG. 6A is a perspective view of a guide member that can be used in the present embodiment. FIG. 6B is a side view of a guide member that can be used in this embodiment. FIG. 7A is a perspective view of a guide member having a first guide member, a second guide member, and a guide bend portion that can be used in the present embodiment. FIG. 7B is a side view of a guide member having a first guide member, a second guide member, and a guide flexure that may be used in the present embodiment. FIG. 8 is a plan view showing the soldering apparatus according to this embodiment, in which the cover member is shown but the guide member is not shown. Figure 9 is a side cross-sectional view showing an embodiment of the jet soldering apparatus in which the upstream guide member has an upstream first guide member, an upstream second guide member, and an upstream guide bending portion, the upstream cover member has an upstream first cover member, an upstream second cover member, and an upstream cover bending portion, and a downstream guide member and downstream cover member are provided. Figure 10 is a side cross-sectional view showing an embodiment of the jet soldering apparatus in which the upstream guide member and the downstream guide member each have a first guide member, a second guide member and a guide bend portion, and the upstream cover member and the downstream cover member each have a first cover material, a second cover member and a cover bend portion. FIG. 11 is a side cross-sectional view showing an example of the relationship between the position of the first guide member where the molten solder is applied and the tip of the first cover material in the jet soldering apparatus according to the present embodiment. FIG. 12 is a side cross-sectional view showing an outline of the guide member and the cover member in the first embodiment. FIG. 13 is a side cross-sectional view showing an outline of a guide member and a cover member in the second embodiment. FIG. 14A is a photograph showing the scattering of molten solder in a comparative example in which a guide member and a cover member are not provided. FIG. 14B is a photograph showing that molten solder did not splash in Example 1. FIG. 14C is a photograph showing that molten solder did not splash in Example 2. FIG. 15 is a side cross-sectional view showing an embodiment in which a guide member is not provided in the jet soldering apparatus according to the present embodiment, and an upstream cover member and a downstream cover member are each provided. Figure 16 is a side cross-sectional view showing an embodiment of the jet soldering apparatus in which a guide member is not provided and the upstream cover member and the downstream cover member each have a first cover material, a second cover member, and a cover bend portion.

Embodiment <Configuration>
The soldering device shown in FIG. 1 is a device that performs a soldering process on a board 200 on which electronic components such as semiconductor elements, resistors, and capacitors are mounted on a circuit. Typically, the electronic components are positioned on the lower side of the board 200. The soldering device has a main body 1 and a conveying section 5 that conveys the board 200. The main body 1 has an inlet 2 through which the board 200 is conveyed and an outlet 3 through which the board 200 is conveyed. The board 200 may be conveyed at a predetermined angle, for example, an inclination of about 3 to 6 degrees as viewed from the side (see FIGS. 2 to 5, 9, and 10). In this case, the downstream side of the board conveying direction A is positioned higher than the upstream side. However, this is not limited to this, and the board 200 may be conveyed horizontally, for example. The conveying section 5 may have a conveying drive section (not shown) that imparts a driving force for conveying the board 200, and a conveying rail 6 that guides the board 200.

As shown in FIG. 1, the main body 1 may be provided with a fluxer 10 that applies flux to the board 200, a preheater section 15 that preheats the board 200 to which the flux has been applied, a jet soldering device 100 that jets molten solder to contact the board 200, and a cooler 20 that cools the soldered board 200. The board 200 transported along the transport rail 6 of the transport section 5 passes through the fluxer 10, the preheater section 15, the jet soldering device 100, and the cooler 20 in that order. The jet soldering device 100 may have a control section 50 that issues commands to each component to control it, a memory section 60 that stores various information, and an operation section 70 that allows an operator to input various information to operate the soldering device. In FIG. 1, the soldering device is shown in a top plan view except for the control section 50, the memory section 60, and the operation section 70.

The fluxer 10 is used to apply flux to the transported substrate 200. The flux may contain a solvent, an activator, etc. The fluxer 10 may be provided with multiple application devices. Different types of flux may be used depending on the type of solder and the type of substrate 200.

The preheater section 15 heats the substrate 200, thereby raising the temperature of the substrate 200 uniformly to a predetermined temperature. Heating the substrate 200 in this manner makes it easier for solder to adhere to predetermined locations on the substrate 200. For example, a far-infrared panel heater is used as the preheater section 15. The far-infrared panel heater can rapidly heat the substrate 200 to a set temperature. Also, gas (hot air) heated by the heater may be blown onto the substrate 200 by a fan to heat the substrate 200. Also, a halogen heater or the like may be used as the preheater section 15.

The cooling machine 20 has a cooling fan (not shown) and cools the board 200 that has been soldered by the jet soldering device 100. The cooling fan may be controlled simply by turning it on and off, but it may also be controlled by adjusting the air speed, etc. Also, a chiller or the like may be used as the cooling machine 20 to cool the board 200 to a predetermined temperature.

The control unit 50 shown in FIG. 1 is communicatively connected to the conveying unit 5 including the conveying rail 6, the fluxer 10, the preheater unit 15, the jet soldering device 100, the cooling machine 20, the operation unit 70, and the memory unit 60. The communicative connections include both wired and wireless connections. The operation unit 70 may have a liquid crystal display panel or a numeric keypad, and is typically a personal computer, a smartphone, a tablet, or the like. When an operator operates the operation unit 70, the control unit 50 may control the conveying speed by the conveying unit 5, the timing of conveying the board 200, the temperature of the flux in the fluxer 10, the amount of flux applied, the temperature of the preheater unit 15, the temperature of the molten solder S of the jet soldering device 100, the jet flow rate, the jet speed, the ON/OFF of the cooling fan of the cooling machine 20, and the like. The memory unit 60 may store information input by the operation unit 70, instructions from the control unit 50, the operating time of the jet soldering device 100, and the like.

2 to 5, 9 and 10, the jet soldering device 100 has a storage tank 110 for storing molten solder S, and supply units 120, 130 for supplying the molten solder S to the substrate 200. In this embodiment, the supply units 120, 130 have a first supply unit 120 and a second supply unit 130. The first supply unit 120 may have a first pump 141, which is a first driving unit. Similarly, the second supply unit 130 may have a second pump 146, which is a second driving unit. The molten solder S sprayed from the first supply unit 120 and the second supply unit 130 is sprayed from below to above. The molten solder S that has received the driving force from the first pump 141 is pressure-fed through the duct and sprayed toward the substrate 200, and the solder adheres to a predetermined location on the substrate 200. Similarly, the molten solder S receiving the driving force from the second pump 146 is pumped through the duct and sprayed toward the substrate 200, and the solder adheres to a predetermined location on the substrate 200. The molten solder S is heated to a temperature of, for example, about 180°C to 250°C by a heater (not shown). The molten solder S supplied from the first supply unit 120 and the second supply unit 130 may be circulated for use. In this case, the molten solder S may be circulated through a filter (not shown). The first pump 141 and the second pump 146 are typically each composed of a single pump, but the first pump 141 and the second pump 146 may each be composed of multiple pumps.

The first supply unit 120 of the jet soldering device 100 shown in Figures 2 to 5, 9 and 10 has multiple first openings 126 (see Figure 8, etc.). The multiple first openings 126 are used to forcefully supply a large amount of molten solder S to the board 200. The second openings 136 of the second supply unit 130 are used to supply molten solder S to the board 200 with a weaker force than the first supply unit 120. The jet solder supplied from the first supply unit 120 is a dynamic supply that causes the molten solder S to collide with the board 200 with force, and is a supply for spreading the molten solder S to every corner of the board 200. On the other hand, the jet solder supplied from the second supply unit 130 is a static supply, and is a supply for neatly attaching the solder to the electrodes of the board 200 by passing through the molten solder S, which is a gentle flow.

2 to 5, 9 and 10, the first supply unit 120 has a first housing 121 and one or more first openings 126 that are provided on the upper surface of the first housing 121 and supply the molten solder S. In this embodiment, the first opening 126 has a nozzle shape that protrudes upward from the upper surface of the first housing 121. The second supply unit 130 has a second housing 131 and one or more second openings 136 that are provided on the upper surface of the second housing 131 and supply the molten solder S. The first housing 121 and the second housing 131 may be provided separately, or they may be provided integrally. In this embodiment, as an example, the first opening 126 consisting of a plurality of nozzles 127 and one slit-shaped second opening 136 will be described (see FIG. 8, etc.). However, this is not limited to such a mode, and for example, a plurality of slit-shaped second openings 136 may be provided, and in this case, a plurality of slit-shaped second openings 136 may be provided in a mode extending in parallel. The second opening 136 may also be made of a plurality of nozzles. In this embodiment, the first opening 126 and the second opening 136 are the supply points of the molten solder S in the supply sections 120 and 130.

During the supply of the molten solder S, the molten solder S supplied from the first supply unit 120 and the molten solder S supplied from the second supply unit 130 may be mixed. The molten solder S mixed in this manner may be configured not to be separated from the substrate 200 transported by the transport unit 5 between the first supply unit 120 and the second supply unit 130. The substrate 200 is supported and transported by the transport rail 6, and the upper surface of the mixed molten solder S may not be positioned lower than the lower end of the transport rail 6 transporting the substrate 200 when viewed from the side in the entire length region along the substrate transport direction A between the first supply unit 120 and the second supply unit 130. In this case, the molten solder S is configured not to be separated from the substrate 200 transported by the transport unit 5 between the first supply unit 120 and the second supply unit 130.

The molten solder S supplied from the first supply unit 120 and the molten solder S supplied from the second supply unit 130 may be integrated and sprayed to a position higher than the transport position of the substrate 200, but this is not limited to the above embodiment. A portion where the molten solder S does not come into contact with the substrate 200 may be provided between the molten solder S supplied from the first supply unit 120 and the molten solder S supplied from the second supply unit 130, and the molten solder S may be sprayed in two distinct stages.

The temperature of the molten solder S is generally about 50°C above the melting temperature of the solder. In recent years, there has been an increasing need to lower the working temperature in order to reduce damage to parts and reduce machine power consumption. In addition, the market prices of Sn and Ag have risen sharply, and the use of solder that does not use these metals has been considered. Typically, Sn-58Bi (melting point 139°C) is being considered instead of Sn-3Ag-0.5Cu (melting point 217°C). Sn-58Bi is a low-temperature eutectic solder. Note that, when Sn-58Bi is used, soldering can be performed at a temperature of 200°C or less. On the other hand, Sn-58Bi has a low surface tension, so that when the molten solder S supplied from the supply unit falls into the molten solder S stored in the storage tank, it tends to scatter. This tendency is seen in solders containing Bi, and is particularly noticeable in solders containing 35% or more by mass of Bi. For this reason, it is very beneficial to adopt this embodiment for solder containing 35% or more by mass of Bi. In addition, the tendency for molten solder S to scatter increases when soldering is performed by the jet soldering device 100 under an inert gas such as a nitrogen atmosphere, so it is very beneficial to adopt this embodiment even under an inert gas such as a nitrogen atmosphere. It is believed that molten solder S is more likely to scatter under an inert gas such as a nitrogen atmosphere because oxides are not generated under such an inert gas.

In this embodiment, a guide member 150 is provided to guide the molten solder S supplied from the supply units 120 and 130 to the molten solder S in the storage tank 110. In this embodiment, the guide member 150 has an upstream guide member 151 located upstream of the supply units 120 and 130 in the board transport direction A, and a downstream guide member 152 located downstream of the supply units 120 and 130 in the board transport direction A, but at least one of these may be immersed at an angle of more than 0 degrees and less than 40 degrees with respect to the liquid surface of the molten solder S in the storage tank 110. When the angle θ1 of the guide member 150 with respect to the liquid level of the molten solder S in the storage tank 110 exceeds 40 degrees (for example, when it is 45 degrees), the molten solder S is more likely to scatter when the molten solder S supplied from the supply units 120 and 130 falls into the molten solder S stored in the storage tank 110, so it is beneficial for the angle θ1 of the guide member 150 with respect to the liquid level of the molten solder S in the storage tank 110 to be 40 degrees or less. The height position of the liquid level of the molten solder S in this embodiment is typically the height position of the liquid level assumed in the design of the device.

6A to 7B, the guide member 150 may have a plurality of holes 159. By providing such holes 159, the molten solder S will fall from the holes 159. However, since the molten solder S will continue to fall from the holes 159 while the molten solder is being supplied to the board 200, the molten solder S is unlikely to adhere to the board 200 due to the scattering of the molten solder S that has fallen through the holes 159. On the other hand, providing such holes 159 is beneficial in that the molten solder S can be more smoothly guided to the molten solder S in the storage tank 110.

3 to 5, 9 and 10, a cover member 160 may be provided above the portion where at least the guide member 150 is immersed in the liquid surface of the molten solder S. Even if the angle θ1 of the guide member 150 with respect to the liquid surface of the molten solder S in the storage tank 110 is set to 40 degrees or less, the molten solder S may scatter when the molten solder S supplied from the supply units 120 and 130 falls into the molten solder S stored in the storage tank 110. For this reason, by providing a cover member 160 such as in this embodiment, the scattered molten solder S can be prevented from adhering to the substrate 200. In particular, by providing the cover member 160 above the portion where at least the guide member 150 is immersed in the liquid surface of the molten solder S, the effect of preventing the scattered molten solder S from adhering to the substrate 200 can be enhanced.

The supply units 120 and 130 may be provided with a guide member 150 and a cover member 160 that are immersed in the molten solder S on the upstream side of the board transport direction A, or with a guide member 150 and a cover member 160 that are immersed in the molten solder S on the downstream side of the board transport direction A, or with a guide member 150 and a cover member 160 that are immersed in the molten solder S on both the upstream and downstream sides of the board transport direction A. Figures 2 to 5 show a mode in which an upstream guide member 151 is provided on the upstream side of the board transport direction A immersed in the molten solder S for the supply units 120 and 130, and Figures 9 and 10 show a mode in which an upstream guide member 151 is provided on the upstream side of the board transport direction A immersed in the molten solder S for the supply units 120 and 130, and a downstream guide member 152 is provided on the downstream side. 3 to 5, the cover member 160 has an upstream cover member 161 provided on the upstream side of the substrate transport direction A, and in FIGS. 9 and 10, the cover member 160 has an upstream cover member 161 provided on the upstream side of the substrate transport direction A and a downstream cover member 162 provided on the downstream side of the substrate transport direction A.

When the transport position of the board 200 is positioned higher downstream than upstream in the board transport direction A, splashing of molten solder S upstream of the supply units 120, 130 in the board transport direction A is more likely to be a problem than splashing of molten solder S downstream of the supply units 120, 130 in the board transport direction A. Therefore, it is beneficial to provide an upstream guide member 151 or an upstream cover member 161 upstream of the supply units 120, 130 in the board transport direction A.

7A and 7B, the guide member 150 may have a first guide member 150a located at the tip side, a second guide member 150b located at the base end side, and a guide bend portion 150c provided between the first guide member 150a and the second guide member 150b. When adopting such an embodiment, the second guide member 150b prevents the molten solder S supplied from the supply unit 120, 130 from stopping midway, while the first guide member 150a can prevent the molten solder S from scattering when it falls into the molten solder S stored in the storage tank 110. In addition, when the guide member 150 is provided without the cover member 160, solder scattering can be suppressed by suppressing (adjusting) the angle of the guide member 150. On the other hand, when the cover member 160 is provided together with the guide member 150, the drop point of the molten solder S can be set in the lower area (rear side) of the cover member 160, so that solder scattering can be further prevented.

The first guide member 150a may be immersed at an angle of more than 0 degrees and not more than 40 degrees with respect to the liquid surface of the molten solder S. The angle θ2 of the second guide member 150b with respect to the liquid surface of the molten solder S (basically a horizontal plane) may be greater than the angle θ1 of the first guide member 150a with respect to the liquid surface of the molten solder S (basically a horizontal plane). By setting such an angle restriction, the molten solder S supplied from the supply units 120 and 130 by the second guide member 150b is prevented from stopping midway, and the effect of suppressing the scattering of the molten solder S when it falls into the molten solder S stored in the storage tank 110 by the first guide member 150a can be further enhanced.

In addition, since the second guide member 150b is not immersed in the molten solder S in the storage tank 110, the angle θ2 of the second guide member 150b with respect to the liquid surface of the molten solder S is the angle with respect to the liquid surface of the molten solder S in the storage tank 110 when the second guide member 150b is virtually extended. This angle is basically equal to the angle with respect to the horizontal plane.

In the embodiment shown in FIG. 4, FIG. 5 and FIG. 9, the upstream guide member 151 has an upstream first guide member 151a located at the tip side, an upstream second guide member 151b located at the base end side, and an upstream guide bend portion 151c provided between the upstream first guide member 151a and the upstream second guide member 151b. In the embodiment shown in FIG. 10, the upstream guide member 151 has an upstream first guide member 151a located at the tip side, an upstream second guide member 151b located at the base end side, and an upstream guide bend portion 151c provided between the upstream first guide member 151a and the upstream second guide member 151b, and the downstream guide member 152 has a downstream first guide member 152a located at the tip side, a downstream second guide member 152b located at the base end side, and a downstream guide bend portion 152c provided between the downstream first guide member 152a and the downstream second guide member 152b.

The cover member 160 may extend from the side of the storage tank 110 toward the supply units 120 and 130. More specifically, the upstream cover member 161 may be provided extending from the side of the storage tank 110 on the upstream side of the substrate transport direction A toward the downstream side of the substrate transport direction A where the supply units 120 and 130 are located. The tip of the upstream cover member 161 may be located on the supply unit 120, 130 side (downstream side) from the point where the upstream guide member 151 is immersed in the liquid surface of the molten solder S. When the molten solder S guided by the upstream guide member 151 toward the upstream side of the substrate transport direction A falls onto the liquid surface, the molten solder S tends to scatter toward the upstream side of the substrate transport direction A, but by providing the upstream cover member 161 from the side of the storage tank 110 toward the supply units 120 and 130, the effect of preventing the scattered molten solder S from adhering to the substrate 200 can be further enhanced. Similarly, the downstream cover member 162 may be provided extending from the downstream side of the storage tank 110 in the substrate transport direction A toward the upstream side of the substrate transport direction A where the supply units 120 and 130 are located. The tip of the downstream cover member 162 may be located on the supply unit 120, 130 side (upstream side) from the point where the downstream guide member 152 is immersed in the liquid surface of the molten solder S. When the molten solder S guided by the downstream guide member 152 toward the downstream side of the substrate transport direction A falls onto the liquid surface, the molten solder S tends to scatter toward the downstream side of the substrate transport direction A, but by providing the downstream cover member 162 from the side of the storage tank 110 toward the supply units 120 and 130 side, the effect of preventing the scattered molten solder S from adhering to the substrate 200 can be further enhanced.

In addition, by providing the cover member 160 and adopting an embodiment in which the guide bend portion 150c is provided, the angle of the first guide member 150a with respect to the horizontal plane can be made gentle, and the position where the first guide member 150a contacts the liquid surface of the molten solder S can be positioned closer to the base end side (rear side) of the cover member 160. This further enhances the effect of preventing the molten solder S from splashing onto the board 200.

5, 9 and 10, the cover member 160 may have a first cover member 160a located at the tip side, a second cover member 160b located at the base end side, and a cover bend portion 160c provided between the first cover member 160a and the second cover member 160b. The first cover member 160a may be bent downward relative to the second cover member 160b via the cover bend portion 160c. By adopting such an embodiment, the effect of preventing the molten solder S that is scattered when the molten solder S guided by the guide member 150 falls onto the liquid surface of the molten solder S from adhering to the substrate 200 can be further enhanced. In the upstream cover member 161 located on the upstream side, the upstream first cover member 161a is located downstream of the substrate transport direction A (right side in FIG. 5, FIG. 9 and FIG. 10), and the upstream second cover member 161b is located upstream of the substrate transport direction A (left side in FIG. 5, FIG. 9 and FIG. 10). On the other hand, in the downstream cover member 162 located on the downstream side, the downstream first cover member 162a is located on the upstream side of the substrate transport direction A, and the downstream second cover member 162b is located on the downstream side of the substrate transport direction A.

5 and 9, the upstream cover member 161 has an upstream first cover member 161a located at the tip side, an upstream second cover member 161b located at the base end side, and an upstream cover bend portion 161c provided between the upstream first cover member 161a and the upstream second cover member 161b. In the embodiment shown in FIG. 10, the upstream cover member 161 has an upstream first cover member 161a located at the tip side, an upstream second cover member 161b located at the base end side, and an upstream cover bend portion 161c provided between the upstream first cover member 161a and the upstream second cover member 161b, and the downstream cover member 162 has a downstream first cover member 162a located at the tip side, a downstream second cover member 162b located at the base end side, and a downstream cover bend portion 162c provided between the downstream first cover member 162a and the downstream second cover member 162b.

When the guide member 150 has a first guide member 150a located at the tip side, a second guide member 150b located at the base end side, and a guide bent portion 150c provided between the first guide member 150a and the second guide member 150b, the tip of the first cover member 160a may be located closer to the supply unit 120, 130 than the guide bent portion 150c. By adopting such an embodiment, the gap formed between the tip of the first cover member 160a and the second guide member 150b can be reduced, and the effect of preventing the molten solder S that is scattered when the molten solder S guided by the guide member 150 falls onto the liquid surface of the molten solder S from adhering to the substrate 200 can be further enhanced.

Also, as shown in FIG. 11, the imaginary line L connecting the surface position of the first guide member 150a located at the tip side with respect to the molten solder S and the tip of the first cover member 160a may be positioned on the side of the supply unit 120, 130. FIG. 11 shows an aspect in which the imaginary line L connecting the surface position of the upstream first guide member 151a located at the tip side with respect to the molten solder S and the tip of the upstream first cover member 161a is positioned so as to abut against the side of the first supply unit 120.

In the present embodiment, the description has been given mainly of a configuration in which the guide member 150 or both the guide member 150 and the cover member 160 are provided, but a configuration in which only one of the guide member 150 and the cover member 160 is provided can also be adopted, and a configuration in which the cover member 160 is provided and the guide member 150 is not provided can also be adopted, as shown in Figures 15 and 16. If the guide member 150 is not provided, the molten solder S will splash when the molten solder S supplied from the supply units 120 and 130 falls into the molten solder S in the storage tank 110, but by providing the cover member 160, it is possible to prevent the molten solder S from adhering to the substrate 200 to some extent.

In this embodiment, the tip of the cover member 160 is spaced apart from the first opening 126 and the second opening 136, which are the supply points of the molten solder S, in a plan view. More specifically, in a plan view, the tip of the upstream cover member 161 (the right end in Figures 3 to 5, 9, 10, 15, and 16) is spaced apart from the first opening 126 (see G1 in Figure 8). Also, in a plan view, the tip of the downstream cover member 162 (the left end in Figures 9, 10, 15, and 16) is spaced apart from the second opening 136 (see G2 in Figure 8).

To promote the separation of dross generated by the oxidation of solder, the molten solder S may be provided with an oxidation separating agent such as rice bran, wheat bran, beans, sesame, sunflower, palm, rapeseed, vegetable oil, sugars such as wood flour, pine resin, ammonium chloride, amine halides, etc.

Next, an example of a method for processing the substrate 200 will be described.

When an operator places the substrate 200 on the transport rail 6, the transport section 5 transports the substrate 200, and the substrate 200 is transported into the main body section 1 through the transport entrance 2. When the substrate 200 reaches the fluxer 10, the fluxer 10 applies flux to a predetermined location on the substrate 200.

The transport section 5 transports the substrate 200, on which flux has been applied by the fluxer 10, to the preheater section 15. The preheater section 15 heats the substrate 200 to a predetermined temperature.

Next, the conveying section 5 conveys the substrate 200 heated to a predetermined temperature by the preheater section 15 to the jet soldering device 100. The jet soldering device 100 solders a predetermined portion of the substrate 200. While the jet soldering device 100 is supplying the molten solder S, the molten solder S supplied from the first supply section 120 and the molten solder S supplied from the second supply section 130 are mixed together, and the molten solder S is supplied above the conveying rail 6. At this time, the molten solder S supplied from the supply sections 120 and 130 is guided by the guide member 150 to the molten solder S in the storage tank 110, so that the molten solder S can be prevented from scattering when the molten solder S supplied from the supply sections 120 and 130 lands on the molten solder S in the storage tank 110. Furthermore, by providing the cover member 160, even if the molten solder S supplied from the supply units 120 and 130 splashes when it lands on the molten solder S in the storage tank 110, the molten solder S can be prevented from adhering to the substrate.

Then, the transport unit 5 transports the soldered board 200 to the cooler 20. For example, a cooling fan of the cooler 20 cools the soldered board 200 for a predetermined period of time. After the board 200 has been cooled, the transport unit 5 ejects the board 200 from the discharge port 3, and the soldering process on the board 200 is completed.

Next, we will explain the results of experiments conducted by the inventors of this application to confirm the effects of this embodiment.

Soldering was carried out under the following soldering conditions.
(Soldering conditions)
Soldering device: Senju Metal "BITHUS-Wave MTF-300"
Flux application device: Spray fluxer (Senju Metal "SSF-400")
Flux application amount: 70 mL/ ^m2
Conveyor speed (conveying speed of conveying section 5): 1.2 m/min
Substrate temperature (average temperature): 120°C
Solder bath temperature: 199℃
Solder alloy composition: Sn-58Bi

As Example 1, the configuration shown in FIG. 12 was adopted. The angle (angle with respect to the horizontal plane) θ2 of the second guide member 150b located on the base end side (supply section side) with respect to the liquid surface of the molten solder S was set to 40 degrees, and the angle (angle with respect to the horizontal plane) θ1 of the first guide member 150a located on the tip end side (opposite the supply section) with respect to the liquid surface of the molten solder S was set to 20 degrees. As Example 2, the configuration shown in FIG. 13 was adopted. The angle (angle with respect to the horizontal plane) θ1 of the guide member 150 with respect to the liquid surface of the molten solder S was set to 40 degrees. As a comparative example, a configuration in which the guide member 150 and the cover member 160 were not provided was also adopted.

The soldering device was operated under the above conditions for two hours. After that, the state of scattering of the molten solder S attached to the underside of the member installed at the upper position of the conveyor rail 6 was checked, and countless scatterings occurred in the comparative example in which the guide member 150 and the cover member 160 were not provided (see FIG. 14A). On the other hand, in the aspects of Examples 1 and 2, scattering of the molten solder S attached to the underside of the member installed at the upper position of the conveyor rail 6 was slight (see FIG. 14B and FIG. 14C). More specifically, in the aspect of Example 1, scattering of the molten solder S attached to the underside of the member installed at the upper position of the conveyor rail 6 could hardly be confirmed (see FIG. 14B), and in the aspect of Example 2, scattering of a small amount of the molten solder S on the underside of the member installed at the upper position of the conveyor rail 6 could be confirmed (see FIG. 14C). Therefore, it was confirmed that beneficial effects could be obtained by adopting the aspect of this embodiment, and in particular, it was confirmed that very beneficial effects could be obtained by adopting the aspect in which θ1 is set to θ1<θ2 and the angle of θ1 is small as in Example 1.

The above-mentioned description of each embodiment and the disclosure of the drawings are merely examples for explaining the invention described in the claims, and the above-mentioned description of each embodiment or the disclosure of the drawings do not limit the invention described in the claims. Furthermore, the description of the claims at the time of filing is merely an example, and the description of the claims may be changed as appropriate based on the description in the specification, drawings, etc.

110 Storage tank S Molten solder 120 First supply unit 130 Second supply unit 150 Guide member 150a First guide member 150b Second guide member 150c Guide bending portion 160 Cover member 160a First cover member 160b Second cover member 160c Cover bending portion

Claims (9)

a supply unit for supplying molten solder;
a storage tank for storing molten solder;
a guide member for guiding the molten solder supplied from the supply unit to the molten solder in the storage tank;
Equipped with
The guide member has a plurality of holes, and is immersed at an angle of 40 degrees or less with respect to the liquid surface of the molten solder in the reservoir. the guide member has a first guide member located on a distal end side, a second guide member located on a proximal end side, and a guide bent portion provided between the first guide member and the second guide member,
the first guide member is immersed at an angle of 40 degrees or less with respect to the liquid surface of the molten solder in the storage tank;
2. The jet soldering apparatus according to claim 1, wherein an angle of the second guide member with respect to the liquid surface of the molten solder in the reservoir tank is larger than an angle of the first guide member with respect to the liquid surface of the molten solder in the reservoir tank. The jet soldering device according to claim 1 or 2, further comprising a cover member located above at least the portion where the guide member is immersed in the liquid surface of the molten solder in the storage tank. The cover member extends toward the supply portion,
4. The jet soldering device according to claim 3, wherein a tip of said cover member is located closer to the supply unit than a portion where said guide member is immersed in the liquid surface of the molten solder in said storage tank. The cover member has a first cover member located on a distal end side, a second cover member located on a proximal end side, and a cover bent portion provided between the first cover member and the second cover member,
The jet soldering device according to claim 3 , wherein the first cover member is bent downward relative to the second cover member via the cover bend portion. the guide member has a first guide member located on a distal end side, a second guide member located on a proximal end side, and a guide bent portion provided between the first guide member and the second guide member,
The jet soldering device according to claim 5 , wherein a tip end of the first cover member is located closer to the supply portion than the guide bent portion. The jet soldering device according to claim 1 or 2, wherein the guide member is immersed at an angle of more than 0 degrees relative to the liquid surface of the molten solder in the storage tank. a supply unit for supplying molten solder;
a storage tank for storing molten solder;
a cover member provided above the molten solder in the storage tank and extending from a side surface of the storage tank toward a supply point of the supply unit where the molten solder is supplied;
a guide member for guiding the molten solder supplied from the supply unit to the molten solder in the storage tank;
Equipped with
the guide member has a first guide member located on a distal end side, a second guide member located on a proximal end side, and a guide bent portion provided between the first guide member and the second guide member,
the first guide member is immersed in a liquid surface of the molten solder in the storage tank ;
The cover member has a first cover member located on a distal end side, a second cover member located on a proximal end side, and a cover bent portion provided between the first cover member and the second cover member,
a virtual line connecting a landing position of the first guide member on the molten solder surface and a tip of the first cover member is positioned on a side surface of the supply section . a supply unit for supplying molten solder;
a storage tank for storing molten solder;
a cover member provided above the molten solder in the storage tank and extending from a side surface of the storage tank toward a supply point of the supply unit where the molten solder is supplied;
a guide member for guiding the molten solder supplied from the supply unit to the molten solder in the storage tank, the guide member having a tip immersed in a liquid surface of the molten solder in the storage tank;
Equipped with
The tip of the cover member and the supply point are spaced apart in a plan view,
a virtual line connecting a landing position of the guide member on the molten solder surface and a tip of the cover member is positioned on a side surface of the supply unit.