JP7295479B2 - Package and light emitting device - Google Patents

Description

TECHNICAL FIELD The present disclosure relates to packages, light emitting devices, and respective manufacturing methods.

2. Description of the Related Art Conventionally, a package having a structure in which two leads are overlapped is known as a package for flip-chip mounting on which a light-emitting element is mounted (see Patent Documents 1 to 3, for example).

Utility Model Registration No. 3192859 JP 2010-021231 A Japanese Unexamined Patent Application Publication No. 2007-300088

In a conventional package, two leads are bonded with resin, solder, or the like. However, such a package has a problem that the bonding strength between leads is insufficient.

Accordingly, an object of the embodiments of the present disclosure is to provide a package, a light-emitting device, and a method for manufacturing each of them, in which the adhesive strength between leads is sufficient.

In order to solve the above problems, a package according to an embodiment of the present disclosure includes: a first lead having a first through hole or a first recess in a first portion; a first molded body holding the first lead; A second portion of the first lead that overlaps the first portion of the first lead on the side that faces and is joined to the first lead is a second recess that communicates with the first through hole, or communicates with the first recess. a second lead having a second through hole; and a second molded body holding the second lead, wherein the first portion of the first lead and the second portion of the second lead are electrode terminals. In the second recess communicating with the first through hole or the second through hole communicating with the first recess and the first recess, the second molded body Part is continuously filled.

Further, the package according to the embodiment of the present disclosure includes: a first lead having a first concave portion in a first portion; a first molded body holding the first lead; a second lead having a second recess communicating with the first recess in a second portion overlapping the first portion of the first lead; and a second compact holding the second lead. and the first portion of the first lead and the second portion of the second lead are electrode terminals, and the second concave portion communicating with the first concave portion is provided with the second molding. Part of the body is continuously filled.

Further, a light-emitting device according to an embodiment of the present disclosure includes the package and a light-emitting element mounted on the package.

Further, in the method of manufacturing a package according to an embodiment of the present disclosure, a first lead having a first through hole or a first recess in a first portion serving as an electrode terminal is provided with a first molded body for holding the first lead. a second recess that communicates with the first through hole in a second portion that serves as an electrode terminal that overlaps the first portion of the first lead on the side that faces and is joined to the first lead; Alternatively, a step of preparing a second lead having a second through hole communicating with the first concave portion; a step of filling the second recess communicating with one through hole or the second through hole communicating between the first recess and the first recess such that a portion of the second compact is continuous; including.

In addition, a method for manufacturing a package according to an embodiment of the present disclosure includes: a first lead having a first recess in a first portion serving as an electrode terminal; and a first molded body for holding the first lead. a second lead having a second recess that communicates with the first recess in a second portion that serves as an electrode terminal that overlaps the first portion of the first lead on the side that faces and is joined to the first lead; forming a second molded body for holding the second lead, and part of the second molded body is continuous with the second recess communicating between the first recess and the first recess. and filling to.

Further, the package according to the embodiment of the present disclosure includes a first lead having a first through hole or a first concave portion in a first portion, and a surface side of the first lead that faces and is joined to the first lead. a second lead having a second recess communicating with the first through hole or a second through hole communicating with the first recess in a second portion overlapping the first portion; a molded body for holding a lead, wherein the first portion of the first lead and the second portion of the second lead are electrode terminals, and the first through hole and the first through hole A portion of the molded body is continuously filled in the communicating second recess or in the second through hole communicating between the first recess and the first recess.

Further, the package according to the embodiment of the present disclosure includes a first lead having a first concave portion in the first portion, and the first portion of the first lead on the surface side that faces and is joined to the first lead. a second lead having a second recess communicating with the first recess in an overlapping second portion; and a molded body holding the first lead and the second lead, wherein the first lead of the first lead and the second portion of the second lead are electrode terminals, and the first recess and the second recess communicating with the first recess are continuously filled with a part of the molded body. .

In addition, a method for manufacturing a package according to an embodiment of the present disclosure includes: a first lead having a first through hole or a first recess in a first portion serving as an electrode terminal; a second lead having a second recess communicating with the first through-hole or a second through-hole communicating with the first recess in a second portion of the first lead overlapping the first portion and serving as an electrode terminal; forming a molded body that holds the first lead and the second lead, and forming the first through hole and the second recess that communicates with the first through hole, or the filling the first recess and the second through hole communicating with the first recess so that a part of the molded body is continuous.

Further, in the method of manufacturing a package according to the embodiment of the present disclosure, a first lead having a first concave portion in a first portion serving as an electrode terminal and a surface side that faces and joins the first lead, the first preparing a second lead having a second recess that communicates with the first recess in a second portion that serves as an electrode terminal that overlaps the first portion of the lead; and holding the first lead and the second lead. forming a molded body to be formed, and filling the first recessed portion and the second recessed portion communicating with the first recessed portion so that a part of the molded body is continuous.

Further, a method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes a step of mounting a light-emitting element on the package manufactured by the method for manufacturing a package.

The package and light emitting device according to the embodiments of the present disclosure have sufficient adhesive strength between leads. Moreover, according to the package manufacturing method according to the embodiment of the present disclosure, a package having sufficient adhesive strength between leads can be manufactured. Further, according to the method for manufacturing a light-emitting device according to the embodiment of the present disclosure, it is possible to manufacture a light-emitting device having a package with sufficient adhesive strength between leads.

1 is a perspective view schematically showing configurations of a package and a light emitting device according to a first embodiment; FIG. 1 is a plan view schematically showing the configuration of a package and a light emitting device according to a first embodiment; FIG. FIG. 1B is a cross-sectional view taken along line IIA-IIA of FIG. 1B; FIG. 1B is a cross-sectional view taken along line IIB-IIB of FIG. 1B; FIG. 1B is a cross-sectional view taken along line IIC-IIC of FIG. 1B; FIG. 4 is a plan view schematically showing the structure of a first lead according to the first embodiment; FIG. 4 is a plan view schematically showing the configuration of a second lead according to the first embodiment; FIG. 4 is a perspective view schematically showing the configuration of the first lead according to the first embodiment provided with the first molded body; FIG. 4 is a perspective view schematically showing the configuration of a second lead according to the first embodiment provided with a second molded body; FIG. 4 is a cross-sectional view showing a step of forming a first molded body on a first lead in the method of manufacturing the package according to the first embodiment; FIG. 4 is a cross-sectional view showing a step of forming a second molded body on a second lead in the method of manufacturing the package according to the first embodiment; FIG. 4 is a cross-sectional view showing a step of mounting a light emitting element in the method of manufacturing the light emitting device according to the first embodiment; FIG. 4 is a cross-sectional view showing a step of forming an underfill in the method of manufacturing the light emitting device according to the first embodiment; FIG. 4 is a cross-sectional view showing a step of forming a frame in the method of manufacturing the light emitting device according to the first embodiment; FIG. 4 is a cross-sectional view showing a step of forming a covering member in the method of manufacturing the light emitting device according to the first embodiment; FIG. 1B is a cross-sectional view schematically showing the configuration of a package and a light-emitting device according to a second embodiment, and is a cross-sectional view corresponding to line IIA-IIA in FIG. 1B. FIG. 1B is a cross-sectional view schematically showing the configuration of a package and a light-emitting device according to a second embodiment, and is a cross-sectional view corresponding to line IIB-IIB in FIG. 1B. FIG. 1B is a cross-sectional view schematically showing the configuration of a package and a light-emitting device according to a second embodiment, and is a cross-sectional view corresponding to line IIC-IIC in FIG. 1B. FIG. 10 is a cross-sectional view showing a state in which second leads are arranged on first leads in the method of manufacturing a package according to the second embodiment; FIG. 10 is a cross-sectional view showing a step of forming molded bodies on first leads and second leads in the method of manufacturing a package according to the second embodiment; FIG. 11 is a plan view schematically showing the configuration of a first lead according to another embodiment; FIG. 11 is a plan view schematically showing the configuration of a second lead according to another embodiment; FIG. 1B is a cross-sectional view schematically showing the configuration of a package according to another embodiment, and is a cross-sectional view corresponding to line IIB-IIB in FIG. 1B. FIG. 1B is a cross-sectional view schematically showing the configuration of a package according to another embodiment, and is a cross-sectional view corresponding to line IIB-IIB in FIG. 1B. FIG. 11 is a plan view schematically showing the configuration of a first lead according to another embodiment; FIG. 11 is a plan view schematically showing the configuration of a second lead according to another embodiment; FIG. 1B is a cross-sectional view schematically showing the configuration of a package according to another embodiment, and is a cross-sectional view corresponding to line IIB-IIB in FIG. 1B. FIG. 10 is a plan view schematically showing the configuration of a light emitting device according to another embodiment; FIG. 11 is a plan view schematically showing the configuration of a first lead according to another embodiment; FIG. 11 is a plan view schematically showing the configuration of a second lead according to another embodiment; FIG. 10 is a plan view schematically showing the configuration of a light emitting device according to another embodiment; FIG. 3B is a cross-sectional view of a first lead according to another embodiment, corresponding to the XIV-XIV line in FIG. 3A; FIG. 10 is a cross-sectional view showing a step of forming a sheet member in a method of manufacturing a light emitting device according to another embodiment; FIG. 10 is a cross-sectional view showing a step of forming a side wall member in a method of manufacturing a light emitting device according to another embodiment;

Embodiments are described below with reference to the drawings. However, the embodiments shown below are intended to exemplify the package, the light emitting device, and the manufacturing method thereof for embodying the technical idea of the present embodiment, and are not limited to the following. In addition, unless there is a specific description, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are not intended to limit the scope of the present invention, but are merely examples. It's nothing more than Note that the sizes and positional relationships of members shown in each drawing may be exaggerated for clarity of explanation.

<<1st Embodiment>>
1A is a perspective view schematically showing the configuration of a package and a light emitting device according to a first embodiment; FIG. 1B is a plan view schematically showing the configuration of the package and the light emitting device according to the first embodiment; FIG. FIG. 2A is a cross-sectional view taken along line IIA-IIA of FIG. 1B. FIG. 2B is a cross-sectional view taken along line IIB-IIB of FIG. 1B. FIG. 2C is a cross-sectional view along line IIC-IIC of FIG. 1B. 3A is a plan view schematically showing the configuration of the first lead according to the first embodiment; FIG. 3B is a plan view schematically showing the configuration of the second lead according to the first embodiment; FIG. FIG. 4A is a perspective view schematically showing the configuration of the first lead according to the first embodiment provided with the first molded body. FIG. 4B is a perspective view schematically showing the configuration of the second lead according to the first embodiment provided with the second molded body.
A light emitting device 100 has a package 1 and a light emitting element 2 mounted on the package 1 . Light emitting device 100 further includes frame 4 formed to surround light emitting element 2 and covering member 5 formed to cover light emitting element 2 within frame 4 .

[package]
First, package 1 will be described.
The package 1 has a first lead 10 , a first molded body 61 , a second lead 20 and a second molded body 62 .
The package 1 includes first leads 10 having first through holes 14 in first portions 11 and 12, a first molded body 61 holding the first leads 10, and a surface side that faces and joins the first leads 10. The second lead 20 has second recesses 21a and 22a communicating with the first through hole 14 in the second portions 21 and 22 overlapping the first portions 11 and 12 of the first lead 10, and the second lead 20 is held. and a second molded body 62 to be formed.
The first parts 11 and 12 of the first lead 10 and the second parts 21 and 22 of the second lead 20 are electrode terminals, and the first through hole 14 and the second recesses 21a and 22a communicating with the first through hole 14 are provided. , a portion of the second molded body 62 is continuously filled.

(first lead)
The first lead 10 is held by the first molded body 61 . The first lead 10 has a predetermined wiring pattern. The first lead 10 includes a P-side first portion (hereinafter referred to as a first P-side electrode terminal) 11 as a P-side electrode terminal and an N-side first portion (hereinafter referred to as an N-side electrode terminal). A third portion (hereinafter referred to as a heat extraction terminal) 13, which is preferably a heat extraction terminal, is arranged in parallel with the first P side electrode terminal 11. and the first N-side electrode terminal 12 .

The first P-side electrode terminal 11 is a member that is connected to a P-side electrode terminal (hereinafter referred to as a second P-side electrode terminal as appropriate) 21 of the second lead 20 to provide electrical continuity. The first P-side electrode terminal 11 is positioned to the left of the center of the first lead 10 in plan view and is formed in a rectangular shape. Also, the first P-side electrode terminal 11 has two first through holes 14 penetrating in the plate thickness direction on one side and the other side in the longitudinal direction.

The first N-side electrode terminal 12 is a member that is connected to an N-side electrode terminal (hereinafter referred to as a second N-side electrode terminal as appropriate) 22 of the second lead 20 to provide electrical continuity. The first N-side electrode terminal 12 is positioned on the right side of the center of the first lead 10 in plan view and is formed in a rectangular shape. In addition, the first N-side electrode terminal 12 has one first through hole 14 penetrating in the plate thickness direction on the central side in the longitudinal direction.

Both surfaces of the first P-side electrode terminal 11 and the first N-side electrode terminal 12 are exposed from the first molding 61 holding the first lead 10 . After the first lead 10 is joined to the second lead 20, the first through holes 14 formed in the first P-side electrode terminal 11 and the first N-side electrode terminal 12 are inserted on the front side and the back side. , part of the second compact 62 holding the second lead 20 is filled through the second recesses 21 a and 22 a of the second lead 20 .

The heat transfer terminal 13 is a member for efficiently conducting the heat generated from the light emitting element 2 to the outside and improving the heat transfer of the light emitting device 100 . The heat transfer terminal 13 is formed in a rectangular shape in the central portion of the first lead 10 in plan view. The heat extraction terminal 13 is provided apart from the first P-side electrode terminal 11 and the first N-side electrode terminal 12, and is electrically independent from the first P-side electrode terminal 11 and the first N-side electrode terminal 12. ing.

The heat transfer terminal 13 is etched to a thickness of about half on the surface side at a portion overlapping with the fourth P-side portion 23 and the fourth N-side portion 24 of the second lead 20 in plan view (hereinafter, appropriately referred to as half-etching). It is The heat transfer terminal 13 has a plurality of third recesses 13a formed by half-etching. Although three third recesses 13a are formed here corresponding to the number of electrodes of the light emitting element 2, the number of the third recesses 13a may be increased or decreased. For example, only two of the three third recesses 13a may be provided at both ends. At this time, the central portion of the heat transfer terminal 13 is electrically connected to the second P-side electrode terminal 21 . This is because the central portion of the heat transfer terminal 13 and the two ends of the heat transfer terminal 13 should be prevented from being short-circuited. The third recess 13 a is a groove extending in the plate width direction to the side surface of the heat transfer terminal 13 . Both surfaces of the heat transfer terminal 13 are exposed from the first molded body 61 except for the third concave portion 13a.
Steps or depressions may be provided on the side surfaces of the first lead 10 and the second lead 20 by pressing, etching, or the like. Thereby, the adhesion and moldability between the first lead 10 and the first molded body 61 and between the second lead 20 and the second molded body 62 can be improved.

(second lead)
The second lead 20 is held by the second compact 62 . The second lead 20 is provided on the first lead 10 and joined to face the first lead 10 . The second lead 20 has a wiring pattern different in shape from the first lead 10 . The second lead 20 has a P-side second portion 21 as a second P-side electrode terminal and an N-side second portion 22 as a second N-side electrode terminal arranged in parallel. A P-side fourth portion (hereinafter, appropriately referred to as a P-side terminal branch portion) 23 that is a terminal branch portion, and an N-side fourth portion (hereinafter, appropriately, an N-side terminal branch portion) 23 that is an N-side terminal branch portion. ) 24 and .

The second P-side electrode terminal 21 overlaps the first P-side electrode terminal 11 of the first lead 10 in plan view. The second P-side electrode terminal 21 is half-etched to have two second recesses 21a communicating with the first through-hole 14 on the rear surface side. Each of the second recesses 21a is a groove that continues to the side surface of the second P-side electrode terminal 21 in the plate width direction. After the second lead 20 is joined to the first lead 10, each of the second recesses 21a, which are grooves, is filled with part of the second compact 62 that holds the second lead 20. . Both surfaces of the second P-side electrode terminal 21 are exposed from the second molding 62 except for the second concave portion 21a.

The second N-side electrode terminal 22 overlaps the first N-side electrode terminal 12 of the first lead 10 in plan view. The second N-side electrode terminal 22 is half-etched to have a second concave portion 22a communicating with the first through hole 14 on the rear surface side. The second concave portion 22 a is a groove portion that continues in the plate width direction to the side surface of the second N-side electrode terminal 22 . After the second lead 20 is joined to the first lead 10, the second recess 22a, which is a groove, is partially filled with the second compact 62. As shown in FIG. Both surfaces of the second N-side electrode terminal 22 are exposed from the second molding 62 except for the second concave portion 22a.

Since the first through-hole 14 and the second concave portions 21a and 22a are partially filled with the second compact 62, the bonding area between the first lead 10 and the second lead 20 is increased. 10 and second lead 20 are joined more firmly.

Further, the first through-hole 14 and the second concave portions 21a and 22a are not filled with the first molded body 61 in advance. As a result, the first molded body 61 does not hinder the subsequent filling of the second molded body 62 into the first through hole 14 . Therefore, the first lead 10 is also held by the second compact 62 via the first through hole 14 and the second recesses 21a and 22a, and the first lead 10 and the second lead 20 are joined more firmly.

The shape of the first through-hole 14 is not particularly limited as long as the first lead 10 and the second lead 20 can be firmly joined by communicating with the second recesses 21a and 22a and being filled with the second molded body 62. , the first through-hole 14 may be cylindrical, frustum-shaped, or have an uneven inner surface. It may be circular, elliptical, rectangular, or the like in a plan view, and circular is preferred. Similarly, the shape of the second recesses 21a and 22a is not particularly limited as long as it communicates with the first through hole 14 and can firmly join the first lead 10 and the second lead 20, and may be semicircular or rectangular. , square shape, etc. are preferable.

The number of first through-holes 14 is not particularly limited as long as the first lead 10 and the second lead 20 can be firmly joined, and is preferably three or more. Since the number of the second recesses 21a and 22a is formed corresponding to the number of the first through holes 14, it is preferable that the number is the same as the number of the first through holes 14, but the number may be increased or decreased.

In the first P-side electrode terminal 11 and the second P-side electrode terminal 21, the portion exposed from the first molded body 61 on the front side of the first lead 10 and the portion exposed from the second molded body 62 on the back side of the second lead 20 The first lead 10 and the second lead 20 are directly joined or joined using a joining member such as an adhesive or solder.

In the first N-side electrode terminal 12 and the second N-side electrode terminal 22, the portion exposed from the first molded body 61 on the front side of the first lead 10 and the portion exposed from the second molded body 62 on the back side of the second lead 20 The first lead 10 and the second lead 20 are directly joined or joined using a joining member such as an adhesive or solder.

It should be noted that the first lead 10 and the second lead 20 are preferably joined by direct joining.
Here, direct bonding means bonding without using another member such as an adhesive. Direct bonding is preferably diffusion bonding. Diffusion bonding is a method in which the base materials are brought into close contact with each other, and pressure is applied to prevent plastic deformation as much as possible at a temperature below the melting point of the base materials, and the atoms are diffused between the surfaces to be bonded. is. Direct bonding improves thermal and electrical conductivity.

The P-side terminal branch portion 23 is a portion to which the P-side electrode 72 of the light emitting element 2 is joined. The P-side terminal branch portion 23 is formed continuously in a direction orthogonal to the second P-side electrode terminal 21 and extends toward the center of the second lead 20 in plan view. The P-side terminal branch portion 23 is formed at a position where a part of the P-side terminal branch portion 23 overlaps with the thermal conduction terminal 13 of the first lead 10 in plan view. The P-side terminal branch portion 23 is perpendicular to the heat transfer terminal 13 and partially overlaps with the heat transfer terminal 13 in a plan view. The heat transfer terminal 13 of the first lead 10 has a third concave portion 13a facing a portion overlapping with a portion of the P-side terminal branch portion 23. As shown in FIG. Therefore, in the heat transfer terminal 13 and the P-side terminal branch portion 23, the first lead 10 and the second lead 20 are separated via the third concave portion 13a. Between the heat transfer terminal 13 and the P-side terminal branch portion 23, a portion of the first molded body 61 is continuously filled with the third concave portion 13a, and the first lead 10 and the second lead are filled. 20 do not come into contact with each other.

The N-side terminal branch portion 24 is a portion to which the N-side electrode 71 of the light emitting element 2 is joined. The N-side terminal branch portion 24 is formed continuously in a direction perpendicular to the second N-side electrode terminal 22 and extends toward the center of the second lead 20 in plan view. The N-side terminal branch portion 24 is formed at a position where a portion thereof overlaps the thermal conduction terminal 13 of the first lead 10 in plan view. The N-side terminal branch portion 24 is orthogonal to and partially overlaps with the heat transfer terminal 13 in plan view. The heat transfer terminal 13 of the first lead 10 has a third concave portion 13a facing a portion overlapping with a portion of the N-side terminal branch portion 24. As shown in FIG. Therefore, in the heat transfer terminal 13 and the N-side terminal branch portion 24, the first lead 10 and the second lead 20 are separated via the third concave portion 13a. Between the heat transfer terminal 13 and the N-side terminal branch portion 24, a portion of the first molded body 61 is continuously filled with the third concave portion 13a, and the first lead 10 and the second lead are filled. 20 do not come into contact with each other.

Since the heat transfer terminal 13 is separated from the P-side terminal branch portion 23 and the N-side terminal branch portion 24, the P-side terminal branch portion 23 on which the light emitting element is mounted is placed on the upper surface of the heat transfer terminal 13. and an N-side terminal branch portion 24 can be arranged. Therefore, different electrode patterns can be formed on the front surface and the back surface of the package 1 . As a result, a mounting substrate having the same wiring pattern as the wiring pattern on the back surface of the package 1 can be used, and a light emitting element having a different number of terminals such as three terminals can be used.

Moreover, since the P-side terminal branching portion 23 and the N-side terminal branching portion 24 are perpendicular to the heat conducting terminal 13 in a plan view, the light emitting element 2 can be easily placed. Moreover, manufacturing of the package 1 becomes easy.

Examples of materials for the first lead 10 and the second lead 20 include copper, copper alloys, iron, iron alloys, and the like.
The first lead 10 and the second lead 20 may be plated. Plating can increase the reflectance of light from the light emitting element 2 .

Plating includes, for example, gold, silver, copper, platinum, or an alloy containing one of these. Plating can further increase the reflectance of the light from the light emitting element 2 with these metals.

(First molded body, second molded body)
The first molded body 61 is a member that holds the first lead 10 . The first molded body 61 is formed with the same thickness as the first lead 10 . The second molded body 62 is a member that holds the second lead 20 . The second molded body 62 is formed with the same thickness as the second lead 20 .

Examples of materials for the first molded body 61 and the second molded body 62 include thermoplastic resins and thermosetting resins. In the case of thermoplastic resin, for example, polyphthalamide resin, liquid crystal polymer, polybutylene terephthalate (PBT), unsaturated polyester, and the like can be used. In the case of thermosetting resins, for example, epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, etc. can be used.

[Light emitting device]
Next, the light emitting device 100 will be described.
The light emitting device 100 has a package 1 , a light emitting element 2 , an underfill 3 , a frame 4 and a covering member 5 . By having the package 1, the light emitting device 100 can improve the bonding strength between the leads. Note that the package 1 is the same as described above, so the description is omitted.

(light emitting element)
The light emitting element 2 has two N-side electrodes 71 and one P-side electrode 72 formed between the two N-side electrodes 71 .
The light emitting element 2 has two N-side electrodes 71 connected to two N-side terminal branch portions 24 of the second lead 20 respectively, and one P-side electrode 72 connected to the P-side terminal branch portion of the second lead 20 . 23. Thereby, the light emitting element 2 is mounted on the second lead 20 of the package 1 . The shape and size of the light emitting element 2 used here are not particularly limited. As the emission color of the light emitting element 2, one having an arbitrary wavelength can be selected according to the application. For example, a GaN-based or InGaN-based light emitting element 2 can be used for the blue light (light having a wavelength of 430 to 490 nm). As an InGaN-based material, In _X Al _Y Ga _1-XY N (0≦X≦1, 0≦Y≦1, X+Y≦1) or the like can be used.

(Underfill)
The underfill 3 is a member that absorbs stress due to the difference in coefficient of thermal expansion between the light emitting element 2 and the package 1, and improves heat dissipation.
Underfill 3 is formed in a gap between package 1 and light emitting element 2 . Examples of materials for the underfill 3 include thermosetting resins such as silicone resins and epoxy resins. By using a light-reflective member such as white resin as the material of the underfill 3, the light emitted from the light-emitting element 2 toward the package 1 can be reflected and the luminous flux can be increased.

(frame body)
The frame 4 is a member forming the wall of the light emitting device 100 . The frame 4 is formed so as to surround the light emitting element 2 .
The frame 4 can be made of a thermoplastic resin, a thermosetting resin, a modified resin thereof, a hybrid resin containing one or more of these resins, or the like. Examples of thermoplastic resins include polyamide resins, polyphthalamide resins, polycarbonate resins, polyphenylene sulfide resins, ABS resins, acrylic resins, polybutylene terephthalate resins, polyethylene terephthalate resins, polycyclohexane terephthalate resins, and liquid crystal polymers. Thermosetting resins include epoxy resins, silicone resins, urea resins, phenol resins, BT resins, polyimide resins, polyurethane resins, and the like. In addition, these base materials may contain coloring agents, fillers, reinforcing fibers, fluorescent substances, etc., which are known in the art. In particular, the coloring agent is preferably a material having good reflectance, and a white one such as titanium oxide or zinc oxide is preferable. Fillers include silica, alumina and the like. Examples of reinforcing fibers include glass, calcium silicate, potassium titanate, and the like.

(coating member)
The covering member 5 is a member that covers the light emitting element 2 .
The covering member 5 is provided inside the frame 4 of the package 1 so as to cover the light emitting element 2 . The covering member 5 is provided to protect the light emitting element 2 from external force, dust, moisture, etc., and to improve the heat resistance, weather resistance, and light resistance of the light emitting element 2 . Examples of materials for the covering member 5 include transparent materials such as thermosetting resins such as silicone resins, epoxy resins, and urea resins. In addition to such materials, fillers such as phosphors and substances with high light reflectance can be contained in order to provide predetermined functions.

The coating member 5 can facilitate the color tone adjustment of the light emitting device 100 by mixing, for example, a phosphor. As the phosphor, a material having a higher specific gravity than the coating member 5 and capable of absorbing the light from the light emitting element 2 and converting the wavelength can be used. It is preferable that the phosphor has a higher specific gravity than the coating member 5 because it settles on the package 1 side. Specifically, for example, yellow phosphors such as YAG (Y ₃ Al ₅ O ₁₂ :Ce) and silicate, red phosphors such as CASN (CaAlSiN ₃ :Eu) and KSF (K ₂ SiF ₆ :Mn), or , green phosphors such as chlorosilicate and BaSiO ₄ :Eu ²⁺ .

As the filler to be contained in the covering member 5, for example, substances having high light reflectance such _{as SiO2, TiO2, Al2O3 , ZrO2 , MgO} can be suitably used. Also, for the purpose of cutting off unwanted wavelengths, for example, organic or inorganic coloring dyes or coloring pigments can be used.

[Package manufacturing method]
Next, a method for manufacturing the package 1 will be described.
5A is a cross-sectional view showing a step of forming a first molded body on a first lead in the method of manufacturing the package according to the first embodiment; FIG. 5B is a cross-sectional view showing a step of forming a second molded body on the second lead in the method of manufacturing the package according to the first embodiment; FIG. 5A and 5B schematically show one package when manufacturing a plurality of packages at the same time.

A method of manufacturing a package includes a step of preparing a first lead and a second lead, and a step of filling a second molded body, which are performed in this order. The material and arrangement of each member are the same as those described in the description of the package 1, and therefore the description thereof will be omitted as appropriate.

(Step of preparing first lead and second lead)
The step of preparing the first lead and the second lead includes the step of placing the second lead 20 on the first lead 10 provided with the first molded body 61, and the step of placing the first lead 10 and the second lead 20 together. This is the step of joining.

In the arranging step, first, the first lead 10 having a predetermined wiring pattern and the second lead 20 having a predetermined wiring pattern are prepared. At this time, the first lead 10 may be half-etched at a predetermined position using a mask to form the third recess 13a. In addition, plating is applied to the non-bonded surfaces of the first lead 10 and the second lead 20 as necessary.

Next, the first molded body 61 is formed on the first lead 10 . In forming the first molded body 61, first, the first lead 10 is sandwiched between an upper mold 81 and a lower mold 82, and resin is injected. Next, the resin injected into the mold is cured to form the first molded body 61 . After that, deburring is performed and the shape is adjusted. Furthermore, the second lead 20 is arranged on the first lead 10 so that the first through-hole 14 and the second recesses 21a and 22a communicate with each other.

The joining step is a step of joining the first lead 10 and the second lead 20 . In this joining step, the first P-side electrode terminal 11 and the second P-side electrode terminal 21 (see FIGS. 3A and 3B), and the first N-side electrode terminal 12 and the second N-side electrode terminal 22 (see FIGS. 3A and 3B) ).

In addition, the joining process includes the first through hole 14 and the second concave portion 21a, The first lead 10 and the second lead 20 are joined so that the lead 22a communicates.
Furthermore, in the step of joining, the heat transfer terminal 13 and the P-side terminal branch portion 23, and the heat transfer terminal 13 and the N-side terminal branch portion 24 are separated from each other by the third concave portion 13a. The lead 10 and the second lead 20 are joined together.

The first lead 10 and the second lead 20 are joined directly or by using a joining member such as an adhesive or solder. For example, when directly joining the first lead 10 and the second lead 20, the second lead 20 is arranged on the first lead 10, and the first lead 10 and the second lead 20 are connected to the upper die 81 and the lower die. It is sandwiched between metal molds 82, heated at a predetermined temperature, and pressed with a predetermined pressure. Thereby, the first P-side electrode terminal 11 and the second P-side electrode terminal 21, and the first N-side electrode terminal 12 and the second N-side electrode terminal 22 are directly joined.

(Step of filling the second compact)
The step of filling the second molded body includes forming the second molded body 62 that holds the second lead 20, and partially filling the first through hole 14 and the second recesses 21a and 22a with the second molded body 62. This is the step of filling the first lead 10 continuously and holding the first lead 10 even in the second compact 62 .

In this step, the resin is injected while the first lead 10 and the second lead 20 are sandwiched between the upper mold 81 and the lower mold 82 . As a result, the resin is also injected into the through hole 14 via the second recesses 21a and 22a. Next, the resin injected into the mold is cured to form the second molded body 62 . After that, deburring is performed and the shape is adjusted.

In this step, the second molded body 62 is formed in the through hole 14, thereby increasing the bonding area between the first lead 10 and the second lead 20, thereby obtaining the package 1 with improved bonding strength between the leads. can be done.

[Method for manufacturing light-emitting device]
Next, a method for manufacturing the light emitting device 100 will be described.

6A is a cross-sectional view showing a step of mounting a light emitting element in the method of manufacturing the light emitting device according to the first embodiment; FIG. 6B is a cross-sectional view showing a step of forming an underfill in the method of manufacturing the light emitting device according to the first embodiment; FIG. 6C is a cross-sectional view showing a step of forming a frame in the method of manufacturing the light emitting device according to the first embodiment; FIG. 6D is a cross-sectional view showing a step of forming a covering member in the method of manufacturing the light emitting device according to the first embodiment; FIG. 6A to 6D schematically show one light emitting device when manufacturing a plurality of light emitting devices at the same time.

A method for manufacturing a light-emitting device includes a step of placing a light-emitting element, a step of forming an underfill, a step of forming a frame, a step of forming a covering member, and a step of singulating, Do it in this order. Note that the material and arrangement of each member are the same as those described in the description of the light emitting device 100 described above, so description thereof will be omitted as appropriate.

(Step of placing light emitting element)
The step of mounting the light emitting element is a process of mounting the light emitting element 2 on the package 1 manufactured by the manufacturing method described above.
In this step, the P-side electrode 72 of the light-emitting element 2 is joined to the P-side terminal branch portion 23 of the second lead 20, and the N-side electrode 71 of the light-emitting element 2 is joined to the N-side terminal branch portion 24 of the second lead 20. (see FIGS. 1B and 3B). For bonding, for example, solder paste may be used.

In this process, by using the package 1 manufactured by the manufacturing method described above, the light-emitting device 100 with improved bonding strength between the leads can be obtained.

(Step of forming underfill)
The process of forming the underfill is a process of forming the underfill 3 in the gap between the package 1 and the light emitting element 2 .
The underfill 3 is formed by injecting the material of the underfill 3 between the package 1 and the light emitting element 2 to fill the gap between the package 1 and the light emitting element 2 . Next, the injected material of the underfill 3 is thermally cured. Thus, an underfill 3 is formed between the package 1 and the light emitting element 2. Next, as shown in FIG. Note that the underfill 3 may be formed by providing the material of the underfill 3 on the package 1 before mounting the light emitting element 2 and thermally curing the material after mounting the light emitting element 2 .

(Step of forming frame)
The step of forming the frame is a step of forming the frame 4 so as to surround the light emitting element 2 .
The frame 4 is formed, for example, on the upper side of the fixed second lead 20 using a dispenser (dispenser) that can be moved (moved) vertically or horizontally with respect to the second lead 20. It can be carried out.

(Step of forming covering member)
The step of forming the covering member is a step of forming the covering member 5 inside the frame 4 .
The coating member 5 can be formed by coating the coating member 5 inside the frame 4 . Formation of the covering member 5 can also be carried out by, for example, injection, compression or extrusion.

(Step of singulating)
The step of singulating is a step of cutting the assembly of the light emitting devices 100 to singulate.
The aggregate can be singulated by a conventionally known method such as a dicing method for cutting with a blade.

<<Second embodiment>>
FIG. 7A is a cross-sectional view schematically showing the configuration of a package and a light-emitting device according to the second embodiment, and is a cross-sectional view corresponding to line IIA-IIA in FIG. 1B. FIG. 7B is a cross-sectional view schematically showing the configuration of the package and the light-emitting device according to the second embodiment, and is a cross-sectional view corresponding to line IIB-IIB in FIG. 1B. FIG. 7C is a cross-sectional view schematically showing the configuration of the package and the light-emitting device according to the second embodiment, and is a cross-sectional view corresponding to line IIC-IIC in FIG. 1B.

[Package and Light Emitting Device]
First, the package 1A and the light emitting device 100A will be described.
The package 1</b>A has first leads 10 , second leads 20 and a molded body 6 .
The package 1A includes a first lead 10 having a first through hole 14 in the first portion, and a second portion overlapping the first portion of the first lead 10 on the surface side facing the first lead 10 to be joined. It has a second lead 20 having second recesses 21 a and 22 a that communicate with the first through hole 14 , and a molded body 6 that holds the first lead 10 and the second lead 20 .
The first portion of the first lead 10 and the second portion of the second lead 20 are electrode terminals, and the first through hole 14 and the second concave portions 21a and 22a communicating with the first through hole 14 are provided with one portion of the molded body 6. The parts are continuously filled.
The light emitting device 100A has a package 1A, a light emitting element 2, an underfill 3, a frame 4, and a covering member 5.

In the package 1A and the light emitting device 100A according to the second embodiment, the molded body holding the first lead 10 and the molded body holding the second lead 20 are integrated to form one molded body 6. . Other matters are the same as those of the package 1 and the light emitting device 100 according to the first embodiment.

[Package manufacturing method]
Next, a method for manufacturing the package 1A will be described.
FIG. 8A is a cross-sectional view showing a state in which a second lead is arranged on a first lead in the package manufacturing method according to the second embodiment; FIG. 8B is a cross-sectional view showing a step of forming molded bodies on the first leads and the second leads in the method of manufacturing the package according to the second embodiment. 8A and 8B schematically show one package when manufacturing a plurality of packages at the same time.

A method of manufacturing a package includes a step of preparing a first lead and a second lead, and a step of filling a compact, which are performed in this order. The material and arrangement of each member of the package 1A are the same as those described in the description of the package 1, and therefore the description thereof will be omitted as appropriate.

(Step of preparing first lead and second lead)
In the package manufacturing method according to the first embodiment, the first molded body 61 is formed on the first lead 10 as shown in FIG. 5A, but in the package manufacturing method according to the second embodiment, as shown in FIG. , the first molded body 61 is not formed on the first lead 10 . Other matters are the same as those of the package manufacturing method according to the first embodiment.

(Step of filling compact)
The step of filling the compact is a step of forming the compact 6 that holds the first lead 10 and the second lead 20 after the first lead 10 and the second lead 20 are joined.
In this step, resin is injected into the first lead 10 and the second lead 20 while the first lead 10 and the second lead 20 are sandwiched between the upper mold 81 and the lower mold 82 . As a result, the resin is injected into the through hole 14 via the second recesses 21a and 22a. Next, the molded body 6 is formed by curing the resin injected into the mold. After that, deburring is performed and the shape is adjusted.

[Method for manufacturing light-emitting device]
Next, a method for manufacturing the light emitting device 100A will be described.
The manufacturing method of the light emitting device 100A is the same as the manufacturing method of the light emitting device 100 according to the first embodiment, except that the package 1A in which the molded body 6 of the first lead 10 and the molded body 6 of the second lead 20 are integrated is used. Similar to the method.

<<Other embodiments>>
First, the package 1B and its manufacturing method will be described.
9A is a plan view schematically showing the configuration of a first lead according to another embodiment; FIG. FIG. 9B is a plan view schematically showing the configuration of a second lead according to another embodiment; FIG. 9C is a cross-sectional view schematically showing the configuration of a package according to another embodiment, and is a cross-sectional view corresponding to line IIB-IIB in FIG. 1B.

In the package 1B, as shown in FIG. 9A, the first lead may be a first lead 10A having first recesses 11a and 12a on the first P-side electrode terminal 11 and the first N-side electrode terminal 12. FIG. In the package 1B, as shown in FIG. 9B, the second lead may be a second lead 20A having the second through hole 15 in the second P-side electrode terminal 21 and the second N-side electrode terminal 22 . Then, as shown in FIG. 9C, in the package 1B, the first concave portions 11a and 12a and the second through holes 15 are continuously partially filled with the second compact 62 . Alternatively, a molded body in which the first molded body 61 and the second molded body 62 are integrated may be used. The shape, number, etc. of the first recesses 11a, 12a and the second through holes 15 are the same as those of the second recesses 21a, 22a and the first through holes 14 of the first embodiment.

In the package 1B, the first recesses 11a and 12a and the second through holes 15 are continuously partially filled with the second compact 62, so that the bonding strength between the first leads 10A and the second leads 20A is increased. improves.

The method of manufacturing the package 1B is the same as the method of manufacturing the packages 1 and 1A described above. Further, by using the package 1B in manufacturing the light-emitting devices 100 and 100A, it is possible to obtain a light-emitting device with improved bonding strength between leads.

Next, the package 1C and its manufacturing method will be described.
FIG. 10 is a cross-sectional view schematically showing the configuration of a package according to another embodiment, and is a cross-sectional view corresponding to line IIB-IIB in FIG. 1B.
The package 1C has a first lead 10A (see FIG. 9A) having first recesses 11a and 12a on the first P-side electrode terminal 11 and the first N-side electrode terminal 12, and a second lead on the second P-side electrode terminal 12. The second lead 20 (see FIG. 3B) having second concave portions 21a and 22a in the electrode terminal 21 and the second N-side electrode terminal 22 may be used. In the package 1C, the first recesses 11a, 12a and the second recesses 21a, 22a are continuously partially filled with the second molded body 62. As shown in FIG. Alternatively, a molded body in which the first molded body 61 and the second molded body 62 are integrated may be used. The shape, number, etc. of the first recesses 11a, 12a and the second recesses 21a, 22a are the same as those of the second recesses 21a, 22a of the first embodiment.

In the package 1C, the first recesses 11a and 12a and the second recesses 21a and 22a are continuously partially filled with the second molded body 62, thereby increasing the bonding strength between the first leads 10A and the second leads 20A. improves.

The method of manufacturing the package 1C is the same as the method of manufacturing the packages 1 and 1A described above. Further, by using the package 1C in manufacturing the light-emitting devices 100 and 100A, it is possible to obtain a light-emitting device with improved bonding strength between leads.

Next, the package 1D and its manufacturing method will be described.
11A is a plan view schematically showing the configuration of a first lead according to another embodiment; FIG. 11B is a plan view schematically showing the configuration of a second lead according to another embodiment; FIG. FIG. 11C is a cross-sectional view schematically showing the configuration of a package according to another embodiment, and is a cross-sectional view corresponding to line IIB-IIB in FIG. 1B.

In the package 1D, as shown in FIG. 11A, the first lead may be a first lead 10B that does not have the third concave portion 13a in the heat transfer terminal 13. As shown in FIG. 11B, the second lead of the package 1D may be a second lead 20B having fourth concave portions 23a and 24a on the back side of the P-side terminal branch portion 23 and the N-side terminal branch portion 24. . Then, as shown in FIG. 11C, in the package 1D, part of the second molded body 62 is continuously filled in the fourth concave portions 23a and 24a. Alternatively, a molded body in which the first molded body 61 and the second molded body 62 are integrated may be used. The shape, number, etc. of the fourth recesses 23a and 24a are the same as those of the third recesses 13a of the first embodiment.

The package 1D has the fourth concave portions 23a and 24a, so that the heat transfer terminal 13 is separated from the P-side terminal branch portion 23 and the N-side terminal branch portion 24. As shown in FIG. Thereby, the P-side terminal branch portion 23 and the N-side terminal branch portion 24 on which the light emitting element is mounted can be arranged on the upper surface of the heat transfer terminal 13 . Therefore, different electrode patterns can be formed on the front surface and the back surface of the package 1D. Moreover, a mounting substrate having the same wiring pattern as the wiring pattern on the back surface of the package 1D can be used, and a light emitting element with three terminals can be used.

The method for manufacturing the package 1D is the same as the method for manufacturing the packages 1 and 1A described above. In addition, by using the package 1D in manufacturing the light emitting devices 100 and 100A, it is possible to obtain a light emitting device with improved bonding strength between leads.

Next, the light emitting device 100B will be described.
FIG. 12 is a plan view schematically showing the configuration of a light emitting device according to another embodiment. As in a light-emitting device 100B shown in FIG. 12, the light-emitting element may be a hexagonal light-emitting element 2B in plan view. By using the hexagonal light emitting element 2B in a plan view, the distance from the side surface of the light emitting element 2B to the frame 4 is shortened, and the light extraction efficiency is improved. Also, the light-emitting element may have another polygonal shape in plan view. Also, the manufacturing method of the light emitting device 100B is the same as that of the light emitting devices 100 and 100A described above.

Next, the package 1E, the light emitting device 100C and the manufacturing method thereof will be described.
13A is a plan view schematically showing the configuration of a first lead according to another embodiment; FIG. 13B is a plan view schematically showing the configuration of a second lead according to another embodiment; FIG. FIG. 13C is a plan view schematically showing the configuration of a light emitting device according to another embodiment;

The package 1E, as shown in FIG. 13A, may be a first lead 10C in which one third concave portion 13a is formed in a region excluding the upper and lower end portions of the heat transfer terminal 13. As shown in FIG. In the package 1E, as shown in FIG. 13B, the second lead has two P-side terminal branch portions 23, and two P-side terminal branches are provided between the two N-side terminal branch portions 24. It may be the second lead 20C on which the branch portion 23 is arranged. Then, as shown in FIG. 13C, the light-emitting device prepares two light-emitting elements 2B having one N-side electrode 71 and one P-side electrode 72, and mounts the two light-emitting elements 2B on the package 1E. The light-emitting device 100C may be a light-emitting device 100C.

The method of manufacturing the package 1E is the same as the method of manufacturing the packages 1 and 1A described above. Further, by using the package 1E in manufacturing the light emitting devices 100 and 100A, it is possible to obtain the light emitting device 100C in which the bonding strength between the leads is improved.

Next, another form of the through hole of the package will be described.
FIG. 14 is a cross-sectional view of a first lead according to another embodiment, and is a cross-sectional view corresponding to line XIV-XIV in FIG. 3A.
In the package 1, the through hole 14 of the first P-side electrode terminal 11 of the first lead 10 consists of two holes with different inner diameters, and the inner diameter of the hole 14b on the back side is larger than the inner diameter of the hole 14a on the front side. is preferred. As a result, the resin of the second molded body filled in the through-holes 14 can be prevented from coming off from the back side, and the bonding strength of the first leads 10 can be further improved. Also, the other through hole 14 of the first lead 10 is preferably composed of two holes 14a and 14b. Furthermore, it is preferable that the through-hole 14 of the package 1A shown in FIGS. 7A and 7B, the package 1D shown in FIG. 11C, and the package 1E shown in FIGS. 13A and 13C also consist of two holes 14a and 14b.

Next, another form of the package will be described.
2B, 7B, 9C, 10, 11C, 13A, and 13C, the first leads 10 and 10A to 10C are not provided with the heat sink terminals 13. may be
In the packages 1, 1A to 1E, none of the heat transfer terminal 13, the P-side terminal branching portion 23, and the N-side terminal branching portion 24 have recesses formed by half-etching. A portion of the first molded body 61, the second molded body 62, or the molded body 6 may not be filled between the terminal branch portion 23 and the N-side terminal branch portion 24. FIG.

Next, another method of manufacturing the package will be described.
15A is a cross-sectional view showing a step of forming a sheet member in a method for manufacturing a light emitting device according to another embodiment; FIG. FIG. 15B is a cross-sectional view showing a step of forming sidewall members in a method of manufacturing a light emitting device according to another embodiment.

As shown in FIG. 15B, the light emitting device includes a sheet member 7 provided on the upper surface of the light emitting element 2, side wall members provided on the side surfaces of the sheet member 7, the side surface of the light emitting element 2, and the side surface of the underfill 3. 8 and the light emitting device 100D.
As the material of the sheet member 7, the same material as that of the covering member can be used. The sheet member 7 can also contain a filler such as a phosphor or a substance having a high light reflectance. As a material of the side wall member, the same material as that of the frame can be used.

The method of manufacturing the light emitting device 100D can be performed, for example, after the step of forming the underfill 3, as follows.
First, as shown in FIG. 15A, a sheet member 7 having a predetermined size is attached to the upper surface of the light emitting element 2 with an adhesive resin or the like (step of forming the sheet member). Next, as shown in FIG. 15B, the side wall member 8 is applied around the light emitting element 2 (step of forming the side wall member). After that, the assembly of the light emitting devices 100D is cut into individual pieces. Other matters are the same as those of the method for manufacturing the light emitting device 100 according to the first embodiment.

As described above, the package, the light-emitting device, and the manufacturing method thereof according to the present embodiment have been specifically described by the modes for carrying out the invention. It should be interpreted broadly based on the statement of the claims. Further, various changes and modifications based on these descriptions are also included in the gist of the present invention.

For example, the method for manufacturing a package and the method for manufacturing a light-emitting device may include other steps between, or before and after each of the steps, as long as they do not adversely affect the steps. For example, a foreign matter removing step for removing foreign matter mixed in during manufacturing may be included.

1, 1A, 1B, 1C, 1D, 1E Package 2, 2A, 2B Light emitting element 3 Underfill 4 Frame 5 Coating member 6 Molded body 7 Sheet member 8 Side wall member 10, 10A, 10B, 10C First lead 11 First P Side electrode terminal (first part)
11a First concave portion 12 First N-side electrode terminal (first portion)
12a First concave portion 13 Heat transfer terminal (third portion)
13a Third recess 14 First through hole 15 Second through holes 20, 20A, 20B, 20C, 20D Second lead 21 Second P-side electrode terminal (second portion)
21a Second concave portion 22 Second N-side electrode terminal (second portion)
22a Second concave portion 23 P-side terminal branch portion (fourth portion)
23a Fourth concave portion 24 N-side terminal branch portion (fourth portion)
24a Fourth concave portion 61 First molded body 62 Second molded body 71 N-side electrode 72 P-side electrode 81 Upper mold 82 Lower mold 100, 100A, 100B, 100C, 100D Light emitting device

Claims (15)

a first lead having a first recess in the first portion;
a first molded body holding the first lead;
a second lead having a second recess that communicates with the first recess in a second portion that overlaps the first portion of the first lead on the side that faces and is joined to the first lead;
a second compact holding the second lead,
the first lead and the second lead are directly bonded or bonded using a bonding member;
A package in which a part of the second molded body is continuously filled in the first concave portion and the second concave portion communicating with the first concave portion. 2. The package according to claim 1, wherein a step or a recess is formed on side surfaces of said first lead and said second lead . 3. The package according to claim 1 or 2 , wherein said direct bonding is diffusion bonding. 4. The package according to any one of claims 1 to 3, wherein said first compact has the same thickness as said first lead. 5. The package according to claim 1, wherein said second compact has the same thickness as said second lead. 2. The package according to claim 1, wherein said first recess is not filled with said first compact. When the first recess is provided, the first recess is a groove extending to the side surface of the first lead, and when the second recess is provided, the second recess is the side surface of the second lead. 7. The package according to any one of claims 1 to 6, wherein the groove continues to the . the first lead has a third recess in a third portion spaced apart from the first portion and overlapping the second lead;
The third portion of the first lead is a terminal electrically independent of the first portion , and the fourth portion of the second lead overlapping with the third portion is a terminal branch portion continuous with the second portion. wherein the third recess is a groove extending to the side surface of the first lead, and a portion of the first molded body is continuously filled between the third recess and the fourth portion. 8. The package of any one of claims 1-7 . the second lead has a fourth recess in a fourth portion that is continuous with the second portion and overlaps with the first lead;
The fourth portion of the second lead is a terminal branch portion continuous with the second portion , and the third portion of the first lead overlapping with the fourth portion is a terminal electrically independent of the first portion. can be,
The fourth recess is a groove extending to the side surface of the second lead, and a portion of the second molded body is continuously filled between the fourth recess and the third portion. 9. Package according to any one of the preceding claims. a first lead having a first through hole or a first recess in the first portion;
a first molded body holding the first lead;
A second portion of the first lead that overlaps the first portion of the first lead on the side that faces and is joined to the first lead is a second recess that communicates with the first through hole, or communicates with the first recess. a second lead having a second through hole;
a second compact holding the second lead,
the first lead and the second lead are directly bonded or bonded using a bonding member;
A part of the second molded body is continuous with the second recess communicating with the first through hole or the second through hole communicating with the first recess and the first recess. is filled with
the first lead has a third recess in a third portion spaced apart from the first portion and overlapping the second lead;
The third portion of the first lead is a terminal electrically independent of the first portion, and the fourth portion of the second lead overlapping with the third portion is a terminal branch portion continuous with the second portion. wherein the third recess is a groove extending to the side surface of the first lead, and a portion of the first molded body is continuously filled between the third recess and the fourth portion. I have a package. a first lead having a first through hole or a first recess in the first portion;
a first molded body holding the first lead;
A second portion of the first lead that overlaps the first portion of the first lead on the side that faces and is joined to the first lead is a second recess that communicates with the first through hole, or communicates with the first recess. a second lead having a second through hole;
a second compact holding the second lead,
the first lead and the second lead are directly bonded or bonded using a bonding member;
A part of the second molded body is continuous with the second recess communicating with the first through hole or the second through hole communicating with the first recess and the first recess. is filled with
the second lead has a fourth recess in a fourth portion that is continuous with the second portion and overlaps with the first lead;
The fourth portion of the second lead is a terminal branch portion continuous with the second portion, and the third portion of the first lead overlapping with the fourth portion is a terminal electrically independent of the first portion. can be,
The fourth recess is a groove extending to the side surface of the second lead, and a portion of the second molded body is continuously filled between the fourth recess and the third portion. , package. The package according to claim 10 or 11 , wherein the first through-hole has a cylindrical, frustum-shaped, or uneven inner surface. A package according to any one of claims 1 to 12;
and a light emitting element mounted on the package. 14. The light-emitting device according to claim 13, comprising a frame body formed to surround the light-emitting element, and a covering member formed in the frame body to cover the light-emitting element. 15. The light-emitting device according to claim 13, wherein the light-emitting element is polygonal in plan view.

Images