JP7272003B2 - THIN-FILM ELECTRONIC PARTS BOARD AND MANUFACTURING METHOD THEREOF - Google Patents

Description

The present invention relates to a thin film electronic component mounting board and its manufacturing method, and more particularly to a thin film electronic component mounting board having thin film electronic components mounted on the outermost layer of a circuit board and its manufacturing method.

A circuit board on which an IC is mounted usually has a decoupling capacitor mounted thereon in order to stabilize the potential of the power supply supplied to the IC. Laminated ceramic chip capacitors are generally used as decoupling capacitors, and required decoupling capacity is ensured by mounting a large number of laminated ceramic chip capacitors on the surface of a circuit board.

In recent years, due to the miniaturization of circuit boards, there is sometimes a shortage of space for mounting a large number of multilayer ceramic chip capacitors. For this reason, thin-film capacitors that can be embedded in circuit boards are sometimes used instead of multilayer ceramic chip capacitors (Patent Documents 1 and 2).

JP 2010-251530 A JP 2006-173544 A

However, in recent years, since the thickness of circuit boards has become extremely thin, it is necessary to make thin film capacitors embedded in circuit boards extremely thin, and there has been the problem that fabrication is not easy. Such a problem occurs not only when embedding a thin film capacitor in a circuit board but also when embedding other thin film electronic components in a circuit board.

Moreover, when the thin film capacitor is embedded in the circuit board, the distance between the IC and the thin film capacitor is increased by the depth of the embedded thin film capacitor.

Therefore, the present invention provides a thin film that can integrate a circuit board and a thin film electronic component without being embedded in the circuit board and can ensure electrical connection between the wiring pattern provided on the circuit board and the thin film electronic component. An object of the present invention is to provide an electronic component mounting board and a manufacturing method thereof.

A thin-film electronic component mounting board according to the present invention comprises a circuit board having a land pattern formed on the outermost layer, a thin-film electronic component mounted on the outermost layer of the circuit board, and a circuit board that covers the land pattern and the thin-film electronic component. and a conductive material for interconnecting the land pattern and the terminal electrodes of the thin-film electronic component through the openings formed in the insulating resin layer.

According to the present invention, the thin film electronic component is not embedded in the circuit board, but is mounted on the outermost layer of the circuit board. Moreover, since the terminal electrodes of the thin-film electronic components are connected to the land pattern through the conductive material formed in the openings of the insulating resin layer, the wiring patterns provided on the circuit board and the thin-film electronic components are properly connected. It becomes possible to

In the present invention, the conductive material may be solder and the insulating resin layer may be solder resist. According to this, it is possible to connect the terminal electrodes of the thin-film electronic component and the land pattern through the solder formed in the openings of the solder resist. In this case, the thin film electronic component mounting board according to the present invention may further include a semiconductor chip mounted on the circuit board and commonly connected to the land pattern and the terminal electrodes of the thin film electronic component via solder. According to this, it is possible to connect the land pattern, the thin-film electronic component, and the semiconductor chip to each other through solder. Furthermore, in this case, the thin film electronic component may be a thin film capacitor. According to this, since the distance between the semiconductor chip and the thin film capacitor is extremely short, it is possible to obtain a high decoupling effect.

In the present invention, the opening may be a common opening that exposes both the land pattern and the terminal electrode of the thin-film electronic component. It may include a second opening for exposing the electrode. According to the former, since both are connected via the conductive material formed in the common opening, it is possible to ensure high connection reliability. On the other hand, according to the latter, different openings are assigned to the land pattern and the terminal electrode of the thin-film electronic component. Makes it easier to form parts.

In the present invention, part of the conductive material may be positioned between the side surface of the land pattern and the side surface of the thin-film electronic component. Thus, even if the opening is deep, filling the inside of the opening with a conductive material can eliminate cavities that may cause a decrease in reliability.

The thin-film electronic component mounting board according to the present invention further includes another thin-film electronic component mounted on the outermost layer of the circuit board, and the terminal electrode of the thin-film electronic component and the terminal electrode of the other thin-film electronic component are formed in an insulating resin layer. They may be connected to each other through another conductive material provided in another opening formed in the . According to this, it is possible to connect a plurality of thin film electronic components to each other on the outermost layer of the circuit board.

A method for manufacturing a thin-film electronic component mounting board according to the present invention includes a first step of forming a land pattern on the outermost layer of a circuit board, a second step of mounting a thin-film electronic component on the outermost layer of the circuit board, and a land pattern. and a third step of forming an insulating resin layer on the outermost layer of the circuit board so as to cover the thin film electronic components, and forming openings in the insulating resin layer to expose the land pattern and the terminal electrodes of the thin film electronic components. A fourth step and a fifth step of connecting the land pattern and the terminal electrode of the thin-film electronic component to each other by forming a conductive material in the opening are provided.

According to the present invention, since the thin film electronic component is mounted on the outermost layer of the circuit board instead of being embedded in the circuit board, there is no need to make the thin film electronic component excessively thin. Moreover, since the terminal electrodes of the thin-film electronic components are connected to the land pattern through the conductive material formed in the openings of the insulating resin layer, the wiring patterns provided on the circuit board and the thin-film electronic components are properly connected. It becomes possible to

In the fourth step, a common opening may be formed to expose the land pattern and the terminal electrode of the thin-film electronic component. According to this, since the land pattern and the terminal electrode of the thin-film electronic component are connected via the conductive material formed in the common opening, high connection reliability can be ensured.

Thus, according to the present invention, since the thin film electronic component is mounted on the outermost layer of the circuit board instead of being embedded in the circuit board, it is not necessary to make the thin film electronic component excessively thin. Moreover, since the terminal electrodes of the thin-film electronic component are connected to the land pattern through the conductive material formed in the opening of the insulating resin layer, the wiring pattern provided on the circuit board and the thin-film electronic component can be properly connected. becomes possible.

FIG. 1 is a schematic cross-sectional view for explaining the structure of a thin film electronic component mounting board 1 according to a first embodiment of the present invention. FIG. 2 is a schematic cross-sectional view for explaining the structure of the thin film capacitor 20. As shown in FIG. FIG. 3 is a schematic cross-sectional view for explaining the structure of the thin film capacitor 20a. FIG. 4 is a schematic plan view for explaining the formation positions of the openings 13A and 13B. FIG. 5 is a process diagram for explaining the method of manufacturing the thin-film electronic component mounting board 1. As shown in FIG. FIG. 6 is a schematic cross-sectional view for explaining the structure of a thin film electronic component mounting board 2 according to a second embodiment of the present invention. FIG. 7 is a schematic cross-sectional view for explaining the structure of a thin-film electronic component mounting substrate 3 according to a third embodiment of the invention. FIG. 8 is a schematic cross-sectional view for explaining the structure of a thin-film electronic component mounting substrate 4 according to a fourth embodiment of the invention. FIG. 9 is a schematic cross-sectional view for explaining the structure of a thin film electronic component mounting board 5 according to a fifth embodiment of the present invention.

Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

<First embodiment>
FIG. 1 is a schematic cross-sectional view for explaining the structure of a thin film electronic component mounting board 1 according to a first embodiment of the present invention.

As shown in FIG. 1, the thin-film electronic component mounting board 1 according to the first embodiment includes a circuit board 10, a thin-film capacitor 20 mounted face-up on the outermost layer 11 of the circuit board 10, and the thin-film capacitor 20. and a semiconductor chip 30 mounted on the circuit board 10 via the semiconductor chip 30 . Thin film capacitor 20 functions as a decoupling capacitor for semiconductor chip 30 . Here, the face-up system refers to a system in which the terminal electrodes face upward. Normally, when mounting components on the outermost layer 11 of the circuit board 10, a face-down method is used in which the terminal electrodes face downward. are doing.

The circuit board 10 is, for example, a module board having a multilayer wiring structure, and land patterns 12A and 12B are formed on the outermost layer 11 thereof. The land pattern 12A is, for example, a power supply pattern, and the land pattern 12B is, for example, a ground pattern. Here, the "outermost layer" means the wiring layer closest to the surface when the circuit board 10 has a multilayer wiring structure. The thin film capacitor 20 is mounted on the outermost layer 11 of the circuit board 10 via an adhesive or the like so as to be sandwiched between the land patterns 12A and 12B. In the example shown in FIG. 1, the land patterns 12A, 12B and the thin film capacitor 20 have substantially the same thickness, for example, about 50 μm.

As shown in FIG. 2, the thin film capacitor 20 includes a carrier layer 22 made of nickel, copper, silicon, resin, or the like, a capacitor layer 23 provided on the carrier layer 22, and a rewiring layer provided on the capacitor layer 23. A layer 24 and terminal electrodes 21A and 21B provided on the rewiring layer 24 are provided. The capacitive layer 23 has a structure in which capacitive insulating films 23a and internal electrode films 23b are alternately laminated. The surface of the capacitive layer 23 is covered with a first protective layer 25 made of the same material as the capacitive insulating film 23a and a second protective layer 26 made of an inorganic material such as silicon oxide.

The capacitive insulating film 23a is made of, for example, a perovskite-based dielectric material. Perovskite-based dielectric materials include BaTiO ₃ (barium titanate), (Ba _1-X Sr _X )TiO ₃ (barium strontium titanate), (Ba _1-X Ca _X )TiO ₃ , PbTiO ₃ , Pb( ( _Ferro )electric materials with a perovskite structure such as ZrXTi1 _-X ) _O3 , and composite perovskite relaxor-type ferroelectric materials such as Pb(Mg1 _{/ 3Nb2/3} ) _O3 . _Bi4Ti3O12 , _{SrBi2Ta2O9 and} other bismuth layered _{compounds ,} (Sr1 _{- XBaX} ) _{Nb2O6 , PbNb2O6 and} other _tungsten bronze strong compounds Examples include dielectric materials. Here, in the perovskite structure, the perovskite relaxor type ferroelectric material, the bismuth layered compound, and the tungsten bronze type ferroelectric material, the ratio of the A site to the B site is usually an integer ratio. You can deviate from the integer ratio. In order to control the characteristics of the capacitive insulating film 23a, the capacitive insulating film 23a may appropriately contain an additive substance as a subcomponent. The capacitive insulating film 23a is fired and has a dielectric constant (ε _r ) of 100 or more, for example. It should be noted that the dielectric constant of the capacitive insulating film 23a is preferably as large as possible, and the upper limit thereof is not particularly limited. The thickness of one capacitive insulating film 23a is, for example, 10 nm to 1000 nm.

The internal electrode film 23b is made of a conductive material containing, for example, nickel (Ni) or platinum (Pt), and in particular, a conductive material containing nickel (Ni) as a main component is preferably used. “Main component” means a component that accounts for 50% by mass or more of the whole. Further, when the main component of the internal electrode film 23b is nickel (Ni), platinum (Pt), palladium (Pd), iridium (Ir), rhodium (Rh), ruthenium (Ru), osmium (Os), rhenium ( Re), tungsten (W), chromium (Cr), tantalum (Ta) or silver (Ag) may be added. By adding these elements, the internal electrode film 23b is less likely to break, and the continuity of the film can be improved. Note that the internal electrode film 23b may contain a plurality of additive elements. Each thickness of the internal electrode film 23b is, for example, about 10 nm to 1000 nm.

The rewiring layer 24 has an insulating resin layer 27, wiring patterns 28, and via conductors 29A and 29B. The via conductor 29A reaches, for example, the odd-numbered internal electrode films 23b among the internal electrode films 23b forming the capacitive layer 23, and is connected to the terminal electrode 21A via the wiring pattern . On the other hand, the via conductors 29B reach, for example, the even-numbered internal electrode films 23b among the internal electrode films 23b forming the capacitive layer 23, and are connected to the terminal electrodes 21B via the wiring patterns 28. FIG.

If the thickness of the thin film capacitor 20 is too thick with respect to the land patterns 12A and 12B, part or all of the carrier layer 22 may be removed like the thin film capacitor 20a according to the modified example shown in FIG.

Returning to FIG. 1, a solder resist 13 is formed on the outermost layer 11 of the circuit board 10 so as to cover the land patterns 12A and 12B and the thin film capacitors 20 . The surface of solder resist 13 constitutes the outermost surface of circuit board 10 . As shown in FIG. 1, openings 13A and 13B are formed in the solder resist 13, and the insides of the openings 13A and 13B are filled with solders 14A and 14B, respectively. Here, as shown in FIG. 4, which is a schematic plan view, the opening 13A is formed at a position exposing a portion of the land pattern 12A and a portion of the terminal electrode 21A, and the opening 13B is formed in the land pattern. 12B and a portion of the terminal electrode 21B are exposed. The land patterns 12A and 12B are connected to wiring patterns 15A and 15B formed on the outermost layer 11 of the circuit board 10, respectively.

As a result, the solder 14A formed in the opening 13A connects the land pattern 12A and the terminal electrode 21A, and the solder 14B formed in the opening 13B connects the land pattern 12B and the terminal electrode 21B. It will be. That is, instead of embedding the thin film capacitor 20 inside the circuit board 10, the thin film capacitor 20 is mounted on the outermost layer 11 of the circuit board 10 in a face-up manner, and the land patterns 12A, 12B and the terminal electrodes 21A, 21B are electrically connected. Secured.

Further, a semiconductor chip 30 connected to solders 14A and 14B is mounted on the circuit board 10. As shown in FIG. The semiconductor chip 30 is mounted at a position overlapping the thin film capacitor 20 in plan view, and is commonly connected to the land pattern 12A and the terminal electrode 21A via the solder 14A, and is connected to the land pattern 12B and the terminal electrode 21B via the solder 14B. connected in common to As a result, power supply noise generated by the operation of the semiconductor chip 30 is absorbed by the thin film capacitor 20 functioning as a decoupling capacitor. Moreover, in this embodiment, since the distance between the semiconductor chip 30 and the thin film capacitor 20 is extremely short, the parasitic inductance component is extremely small. Therefore, compared to the case where the thin film capacitor 20 is embedded inside the circuit board 10, it is possible to obtain a high decoupling effect.

In this embodiment, the opening 13A is a common opening that exposes both the land pattern 12A and the terminal electrode 21A, and the opening 13B is a common opening that exposes both the land pattern 12B and the terminal electrode 21B. Since the openings 13A and 13B are filled with the solders 14A and 14B, the connection reliability between the two can be made more reliable.

Next, a method for manufacturing the thin-film electronic component mounting substrate 1 according to this embodiment will be described.

FIG. 5 is a process chart for explaining the method of manufacturing the thin-film electronic component mounting substrate 1 according to this embodiment.

First, as shown in FIG. 5(a), land patterns 12A and 12B are formed on the outermost layer 11 of the circuit board 10, and then thin film capacitors are formed on the outermost layer 11 of the circuit board 10 as shown in FIG. 20 is installed. The bonding between the thin film capacitor 20 and the circuit board 10 may be performed by applying an adhesive to the outermost layer 11 of the circuit board 10 in advance, or by attaching the die attach film 40 to the back surface of the thin film capacitor 20 . You can go by the way. The mounting position of the thin film capacitor 20 is a region between the land pattern 12A and the land pattern 12B, and must be mounted so as not to overlap the land patterns 12A and 12B.

Next, as shown in FIG. 5C, after forming a solder resist 13 on the outermost layer 11 of the circuit board 10 so as to cover the land patterns 12A and 12B and the thin film capacitors 20, openings 13A and 13A are formed in the solder resist 13. Next, as shown in FIG. 13B. As described with reference to FIG. 4, the opening 13A is formed at a position where a portion of the land pattern 12A and a portion of the terminal electrode 21A are exposed, and the opening 13B is formed at a portion of the land pattern 12B and the terminal electrode. 21B is formed at a position where a part of 21B is exposed. The method of forming the openings 13A and 13B is not particularly limited, and if the solder resist 13 has photosensitivity, the openings 13A and 13B may be formed by photolithography. Alternatively, the openings 13A and 13B can be formed in the solder resist 13 by laser processing or blast processing.

Next, as shown in FIG. 5(d), solders 14A and 14B are supplied to the openings 13A and 13B, respectively. As a result, the land pattern 12A and the terminal electrode 21A are connected to each other via the solder 14A, and the land pattern 12B and the terminal electrode 21B are connected to each other via the solder 14B. Then, as shown in FIG. 5(e), by mounting the semiconductor chip 30 so as to be connected to the solders 14A and 14B, the thin film electronic component mounting board 1 according to the present embodiment is completed.

As described above, according to the method of manufacturing the thin-film electronic component mounting board 1 according to the present embodiment, the thin-film capacitor 20 is mounted on the outermost layer 11 of the circuit board 10 . An embedding process is unnecessary. This facilitates fabrication of the thin-film electronic component mounting board 1, and also enables the degree of freedom in designing the circuit board 10 to be enhanced.

<Second embodiment>
FIG. 6 is a schematic cross-sectional view for explaining the structure of a thin film electronic component mounting board 2 according to a second embodiment of the present invention.

As shown in FIG. 6, in the thin-film electronic component mounting board 2 according to the second embodiment, part of the solder 14A reaches the side surface of the land pattern 12A and the side surface of the thin-film capacitor 20, and part of the solder 14B reaches the land pattern 12B. and the side surface of the thin film capacitor 20 is different from the thin film electronic component mounting board 1 according to the first embodiment. Since other basic configurations are the same as those of the thin-film electronic component mounting substrate 1 according to the first embodiment, the same elements are denoted by the same reference numerals, and overlapping descriptions are omitted.

The structure of the thin-film electronic component mounting substrate 2 according to the second embodiment is such that when the openings 13A and 13B are formed in the solder resist 13, the depths of the openings 13A and 13B are adjusted to the surfaces of the land patterns 12A and 12B and the thin-film capacitor 20. obtained by forming deeper than the surface of When the depth of the openings 13A and 13B is deep, if cavities remain at the bottoms of the openings 13A and 13B, this may cause a decrease in reliability. If the sides of 20 are covered with solder 14A, 14B, it is possible to eliminate cavities that may cause reliability deterioration.

<Third Embodiment>
FIG. 7 is a schematic cross-sectional view for explaining the structure of a thin-film electronic component mounting substrate 3 according to a third embodiment of the invention.

As shown in FIG. 7, in the thin film electronic component mounting board 3 according to the third embodiment, the opening 13A provided in the solder resist 13 is divided into a first opening _13A1 and a second opening _13A2 . , and differs from the thin film electronic component mounting substrate 1 according to the first embodiment in that the opening 13B is divided into a first opening _13B1 and a second opening _13B2 . Further, in the present embodiment, the thin film capacitor 20 is thicker than the land patterns 12A and 12B. Since other basic configurations are the same as those of the thin-film electronic component mounting substrate 1 according to the first embodiment, the same elements are denoted by the same reference numerals, and overlapping descriptions are omitted.

In this embodiment, the first opening _13A1 exposes the land pattern 12A, and the second opening _13A2 exposes the terminal electrode 21A. Similarly, the first opening _13B1 exposes the land pattern 12B, and the second opening _13B2 exposes the terminal electrode 21B. The solder 14A is embedded inside both the first and second openings 13A ₁ and 13A ₂ , thereby connecting the land pattern 12A and the terminal electrode 21A to each other. Similarly, the solder 14B is embedded inside both the first and second openings 13B ₁ and 13B ₂ , thereby connecting the land pattern 12B and the terminal electrode 21B to each other.

The structure of the thin-film electronic component mounting substrate 3 according to the third embodiment is advantageous when the land patterns 12A, 12B and the thin-film capacitor 20 are greatly different in thickness. That is, when the land patterns 12A, 12B and the thin-film capacitor 20 are greatly different in thickness, forming a common opening as in the first embodiment results in a deep groove between the land patterns 12A, 12B and the thin-film capacitor 20. However, if openings are assigned to the land patterns 12A and 12B and the terminal electrodes 21A and 21B as in the present embodiment, such a problem does not occur. In this embodiment, the solders 14A and 14B are partially formed on the surface of the solder resist 13, and the land patterns 12A and 12B and the terminal electrodes 21A are connected to the solder resist 13 via the solders 14A and 14B formed on the surface of the solder resist 13. , 21B are to be connected, a process for increasing the wettability of the solder in this portion of the solder resist 13 may be performed in advance. The configuration of this embodiment is also effective when the thin film capacitor 20 is thinner than the land patterns 12A and 12B.

<Fourth Embodiment>
FIG. 8 is a schematic cross-sectional view for explaining the structure of a thin-film electronic component mounting substrate 4 according to a fourth embodiment of the invention.

As shown in FIG. 8, the thin film electronic component mounting board 4 according to the fourth embodiment includes another thin film capacitor 50 mounted on the outermost layer 11 of the circuit board 10 . The thin film capacitor 50 has terminal electrodes 51C and 51D, a land pattern 12C is provided near the terminal electrode 51C, and a land pattern 12D is provided near the terminal electrode 51D. Further, openings 13C and 13D are provided in the solder resist 13, and solders 14C and 14D are provided in the openings 13C and 13D. As a result, the land pattern 12C and the terminal electrode 51C are connected to each other through the solder 14C provided inside the opening 13C, and the land pattern 12D and the terminal electrode 51D are connected to each other by the solder provided inside the opening 13D. 14D. Since other basic configurations are the same as those of the thin-film electronic component mounting substrate 1 according to the first embodiment, the same elements are denoted by the same reference numerals, and overlapping descriptions are omitted.

As illustrated in this embodiment, a plurality of thin film capacitors may be mounted on the outermost layer 11 of the circuit board 10 . In this case, the capacitance can be increased by connecting a plurality of thin film capacitors in parallel. Also, by mounting a plurality of thin film capacitors having different self-resonant frequencies and connecting them in parallel, it is possible to expand the frequency band in which the decoupling effect can be obtained.

<Fifth Embodiment>
FIG. 9 is a schematic cross-sectional view for explaining the structure of a thin film electronic component mounting board 5 according to a fifth embodiment of the present invention.

As shown in FIG. 9, the thin-film electronic component mounting substrate 5 according to the fifth embodiment is provided with an opening 13E for exposing the terminal electrode 21B of the thin-film capacitor 20 and the terminal electrode 51C of the thin-film capacitor 50. It is different from the thin-film electronic component mounting substrate 4 according to the fourth embodiment in that solder 14E is provided inside 13E. Since other basic configurations are the same as those of the thin-film electronic component mounting substrate 4 according to the fourth embodiment, the same elements are denoted by the same reference numerals, and overlapping descriptions are omitted.

With such a configuration, the terminal electrode 21B of the thin film capacitor 20 and the terminal electrode 51C of the thin film capacitor 50 are connected to each other by the solder 14E without a land pattern. Accordingly, when a plurality of thin film capacitors are mounted on the outermost layer 11 of the circuit board 10, the mounting density can be increased.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention. Needless to say, it is included within the scope.

For example, in each of the above-described embodiments, an example in which a thin film capacitor is mounted on the outermost layer of a circuit board has been described. For example, other types of thin film electronic components may be mounted.

In each of the above-described embodiments, the land pattern and the terminal electrode of the thin-film electronic component are connected by solder, but the present invention is not limited to this, and a conductive material other than solder, such as conductive paste, may be used. do not have. Therefore, the insulating resin layer covering the outermost layer of the circuit board need not be a solder resist.

1 to 5 thin film electronic component mounting board 10 circuit board 11 outermost layer of circuit board 12A to 12D land pattern 13 solder resist (insulating resin layer)
13A to 13E openings 13A ₁ , 13B ₁ first openings 13A ₂ , 13B ₂ second openings 14A to 14E solder (conductive material)
15A, 15B wiring patterns 20, 20a, 50 thin film capacitor (thin film electronic component)
21A, 21B, 51C, 51D terminal electrode 22 carrier layer 23 capacitive layer 23a capacitive insulating film 23b internal electrode film 24 rewiring layer 25 first protective layer 25
26 second protective layer 26
27 insulating resin layer 28 wiring patterns 29A, 29B via conductor 29B via conductor 30 semiconductor chip 40 die attach film

Claims (9)

a circuit board having a land pattern formed on the outermost layer;
a thin film electronic component mounted on the outermost layer of the circuit board;
an insulating resin layer formed on the outermost layer of the circuit board so as to cover the land pattern and the thin-film electronic component;
a conductive material that interconnects the land pattern and the terminal electrode of the thin film electronic component through an opening formed in the insulating resin layer ;
A thin film electronic component mounting board , wherein the conductive material is solder, and the insulating resin layer is a solder resist . 2. The thin film electronic component according to claim 1 , further comprising a semiconductor chip mounted on said circuit board and commonly connected to said land pattern and said terminal electrodes of said thin film electronic component via said solder. mounting board. 3. The thin film electronic component mounting board according to claim 2 , wherein the thin film electronic component is a thin film capacitor. a circuit board having a land pattern formed on the outermost layer;
a thin film electronic component mounted on the outermost layer of the circuit board;
an insulating resin layer formed on the outermost layer of the circuit board so as to cover the land pattern and the thin-film electronic component;
a conductive material that interconnects the land pattern and the terminal electrode of the thin film electronic component through an opening formed in the insulating resin layer ;
A thin film electronic component mounting substrate, wherein the opening is a common opening exposing both the land pattern and the terminal electrode of the thin film electronic component . 4. The opening according to claim 1 , wherein the opening includes a first opening exposing the land pattern and a second opening exposing the terminal electrode of the thin film electronic component. The thin-film electronic component-mounted substrate according to the above item. a circuit board having a land pattern formed on the outermost layer;
a thin film electronic component mounted on the outermost layer of the circuit board;
an insulating resin layer formed on the outermost layer of the circuit board so as to cover the land pattern and the thin-film electronic component;
a conductive material that interconnects the land pattern and the terminal electrode of the thin film electronic component through an opening formed in the insulating resin layer ;
A thin film electronic component mounting substrate, wherein a part of the conductive material is positioned between a side surface of the land pattern and a side surface of the thin film electronic component . a circuit board having a land pattern formed on the outermost layer;
a thin film electronic component mounted on the outermost layer of the circuit board;
an insulating resin layer formed on the outermost layer of the circuit board so as to cover the land pattern and the thin-film electronic component;
a conductive material that interconnects the land pattern and the terminal electrode of the thin-film electronic component through an opening formed in the insulating resin layer;
Further comprising another thin film electronic component mounted on the outermost layer of the circuit board,
Another terminal electrode of the thin film electronic component and a terminal electrode of the another thin film electronic component are connected to each other through another conductive material provided in another opening formed in the insulating resin layer. A thin-film electronic component mounting board characterized by : a first step of forming a land pattern on the outermost layer of a circuit board;
a second step of mounting a thin film electronic component on the outermost layer of the circuit board;
a third step of forming an insulating resin layer on the outermost layer of the circuit board so as to cover the land pattern and the thin-film electronic component;
a fourth step of exposing the land pattern and the terminal electrode of the thin film electronic component by forming an opening in the insulating resin layer;
and a fifth step of connecting the land pattern and the terminal electrode of the thin film electronic component to each other by forming a conductive material in the opening. . 9. The method of manufacturing a thin film electronic component mounting board according to claim 8 , wherein in said fourth step, a common opening is formed to expose said land pattern and said terminal electrode of said thin film electronic component.

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