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JP7113291B2 - Exterior resin molding method for electronic component module - Google Patents

Exterior resin molding method for electronic component module Download PDF

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Publication number
JP7113291B2
JP7113291B2 JP2018110772A JP2018110772A JP7113291B2 JP 7113291 B2 JP7113291 B2 JP 7113291B2 JP 2018110772 A JP2018110772 A JP 2018110772A JP 2018110772 A JP2018110772 A JP 2018110772A JP 7113291 B2 JP7113291 B2 JP 7113291B2
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mold
metal plate
exterior
electronic component
molding method
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JP2019214127A (en
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英機 細川
則充 穂積
翔太 岡坂
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Description

本発明は、各種電子部品の製造工程で使用される電子部品モジュールの外装樹脂成形方法に関するものである。 The present invention relates to an exterior resin molding method for an electronic component module used in the manufacturing process of various electronic components.

以下、従来の成形方法について図面を用いて説明する。図９は従来の成形方法の第１工程を示した断面図、図１０は従来の成形方法の第２工程を示した断面図であり、先ず第１工程で第１金型１と第２金型２との間に形成された空間３に、電子部品４とリード５とが実装された放熱板６が配置される。その後に第２工程で、未硬化状態の樹脂材料７がプランジャ８によって押圧されることによって空間３へ樹脂材料７が充填される。これにより、電子部品４とリード５と放熱板６とが、樹脂材料７によって封止される。 A conventional molding method will be described below with reference to the drawings. FIG. 9 is a sectional view showing the first step of the conventional molding method, and FIG. 10 is a sectional view showing the second step of the conventional molding method. A heat sink 6 on which an electronic component 4 and leads 5 are mounted is arranged in a space 3 formed between the mold 2 and the mold 2 . After that, in the second step, the uncured resin material 7 is pressed by the plunger 8 to fill the space 3 with the resin material 7 . As a result, the electronic component 4 , the leads 5 , and the heat sink 6 are sealed with the resin material 7 .

ここで、第１金型１および第２金型２と放熱板６とは、第２金型に形成された突起９と放熱板６に形成された凹部１０とが互いに組み合うことによって、特に樹脂材料７が放熱板６を覆う領域と放熱板６が樹脂材料７から露出する領域とが規定されていた。
凹部と突起部との双方の寸法精度および組み合い状態によって、成形の精度が変化する。 Here, the first mold 1, the second mold 2, and the heat sink 6 are formed by combining the projections 9 formed on the second mold and the recesses 10 formed on the heat sink 6 with each other. A region where the material 7 covers the heat sink 6 and a region where the heat sink 6 is exposed from the resin material 7 are defined.
The accuracy of molding changes depending on the dimensional accuracy and the combined state of both the recess and the projection.

なお、この出願の発明に関連する先行技術文献情報としては、例えば特許文献１が知られている。 For example, Patent Document 1 is known as prior art document information related to the invention of this application.

実願昭５４－８９１８４号のマイクロフィルムMicrofilm of Japanese Utility Model Application No. 54-89184

しかしながら、従来の成形方法では、第２金型に形成された突起９と放熱板６に形成された凹部１０との組み合い状態は、突起９と凹部１０と双方の寸法精度によって変化することとなる。この結果として、樹脂材料７が放熱板６を覆う厚みや領域と放熱板６が樹脂材料７から露出する領域との面積の変動が大きくなることや、放熱板６に多くの樹脂成形バリ（図示せず）が発生するおそれがあるとの課題を有するものであった。 However, in the conventional molding method, the state of engagement between the projections 9 formed on the second mold and the recesses 10 formed on the heat sink 6 changes depending on the dimensional accuracy of both the projections 9 and the recesses 10. . As a result, variations in the thickness and area of the resin material 7 covering the heat sink 6 and the area where the heat sink 6 is exposed from the resin material 7 increase, and many resin molding burrs (Fig. (not shown) may occur.

そこで本発明は、樹脂材料７が放熱板６を覆う厚みや領域を安定させることを目的とするものである。 Accordingly, the present invention aims at stabilizing the thickness and area of the resin material 7 covering the radiator plate 6 .

そして、この目的を達成するために本発明は、
第１面と前記第１面と反対面の第２面とを有する金属板と、
前記第１面に配置された実装部品と、
前記金属板の一部と前記実装部品をと封止する外装樹脂と、
を有する電子部品モジュールの、外装樹脂成形方法で、
前記第１面の外周を保持する保持部と、
前記保持部の外周に位置して前記保持部に連結される第１結合部と、
前記保持部の内側で前記保持部に連結されて前記実装部品を覆う外装形状に相当する外装対応部と、
前記外装対応部に圧力を加える可動の加圧部と、
を有する第１金型と、
前記保持部に前記金属板を介在して対向する位置で前記第２面を押圧する壁状の突起部が設けられて前記第２面に対面する押圧部と、前記押圧部の外周に位置して前記押圧部に連結される第２結合部と、を有する第２金型と、
が第１設定温度に設定されて前記第１金型と前記第２金型とが対向配置される第１工程と、
前記第１工程の後に、前記加圧部に樹脂材料を配置する第２工程と、
前記第２工程の後に、前記保持部へ前記実装部品が実装された前記金属板を配置する第３工程と、
前記第３工程の後に、前記第１結合部と前記第２結合部とを互いに押圧させて前記第１金型と前記第２金型とを組み合わせる第４工程と、
前記第４工程の後に、前記加圧部により前記樹脂材料を押圧して圧力を加え、前記樹脂材料を前記外装対応部と前記金属板との間に充填する第５工程と、
前記第５工程の後に、所定時間の経過後に前記第１金型と前記第２金型との組み合わせを解除する第６工程と、
前記第６工程の後に、前記電子部品モジュールを前記第１金型および第２金型から取り出す第７工程と、
を有する、ことを特徴としたものである。 And, in order to achieve this object, the present invention
a metal plate having a first surface and a second surface opposite to the first surface;
mounting components arranged on the first surface;
an exterior resin that seals a portion of the metal plate and the mounting component;
An exterior resin molding method for an electronic component module having
a holding portion that holds the outer periphery of the first surface;
a first coupling portion located on the outer circumference of the holding portion and coupled to the holding portion;
an exterior corresponding portion corresponding to an exterior shape that is connected to the holding portion inside the holding portion and covers the mounting component;
a movable pressurizing part that applies pressure to the exterior corresponding part;
a first mold having
a pressing portion that faces the second surface and is provided with a wall-shaped protrusion that presses the second surface at a position facing the holding portion with the metal plate interposed therebetween; a second mold having a second coupling portion connected to the pressing portion;
is set to a first set temperature and the first mold and the second mold are arranged to face each other;
a second step of arranging a resin material in the pressure unit after the first step;
a third step of arranging the metal plate on which the mounting component is mounted on the holding portion after the second step;
After the third step, a fourth step of combining the first mold and the second mold by pressing the first joint portion and the second joint portion against each other;
After the fourth step, a fifth step of applying pressure by pressing the resin material with the pressurizing portion to fill the space between the exterior corresponding portion and the metal plate with the resin material;
After the fifth step, a sixth step of releasing the combination of the first mold and the second mold after a predetermined time has elapsed;
a seventh step of removing the electronic component module from the first mold and the second mold after the sixth step;
It is characterized by having

本発明によれば、第２金型の押圧部に設けられた壁状の突起部が金属板の第２面を、金属板を介在したうえで保持部に対向する位置で押圧する。第２金型の押圧部、特に突起部によって金属板が押圧された状態で、樹脂材料が充填される。この結果、突起部は金属板の第２面を大きな圧力で確実に押圧することができるので、樹脂材料が充填されるときに樹脂材料が放熱板を覆う厚みや領域と、放熱板が樹脂材料から露出する領域との面積の変動が抑制されさらに、金属板に発生する樹脂成形バリが抑制される。 According to the present invention, the wall-shaped protrusion provided on the pressing portion of the second mold presses the second surface of the metal plate at a position facing the holding portion with the metal plate interposed therebetween. The resin material is filled in a state in which the metal plate is pressed by the pressing portion of the second mold, particularly the protrusion. As a result, the protrusion can reliably press the second surface of the metal plate with a large pressure. The variation in the area of the exposed area is suppressed, and resin molding burrs generated in the metal plate are suppressed.

本発明の実施の形態における外装樹脂成形方法を示すフローチャートFlowchart showing exterior resin molding method according to the embodiment of the present invention 本発明の実施の形態における外装樹脂成形方法の第１工程概略断面図1st process schematic sectional drawing of the exterior resin molding method in embodiment of this invention 本発明の実施の形態における外装樹脂成形方法の第２工程概略断面図2nd process schematic sectional drawing of the exterior resin molding method in embodiment of this invention 本発明の実施の形態における外装樹脂成形方法の第３工程概略断面図3rd process schematic sectional drawing of the exterior resin molding method in embodiment of this invention 本発明の実施の形態における外装樹脂成形方法の第４工程概略断面図FIG. 4 is a schematic cross-sectional view of the fourth step of the exterior resin molding method according to the embodiment of the present invention; 本発明の実施の形態における外装樹脂成形方法の第５工程概略断面図5 step schematic cross-sectional view of the exterior resin molding method in the embodiment of the present invention 本発明の実施の形態における外装樹脂成形方法の第６工程と第７工程概略断面図6th step and 7th step schematic cross-sectional view of the exterior resin molding method in the embodiment of the present invention 本発明の実施の形態における外装樹脂成形方法の他の第２工程概略断面図Schematic cross-sectional view of another second step of the exterior resin molding method according to the embodiment of the present invention. （ａ）本発明の実施の形態における外装樹脂成形方法での金属板の第１の正面図、（ｂ）本発明の実施の形態における外装樹脂成形方法での金属板の第２の正面図(a) A first front view of a metal plate in the exterior resin molding method according to the embodiment of the present invention, (b) A second front view of the metal plate in the exterior resin molding method according to the embodiment of the present invention. 従来の成形方法の第１工程を示した断面図Cross-sectional view showing the first step of the conventional molding method 従来の成形方法の第２工程を示した断面図Cross-sectional view showing the second step of the conventional molding method

以下、本発明の実施の形態について図面を用いて説明する。 BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

（実施の形態）
図１は本発明の実施の形態における外装樹脂成形方法を示すフローチャート、図２は本発明の実施の形態における外装樹脂成形方法の第１工程概略断面図、図３は本発明の実施の形態における外装樹脂成形方法の第２工程概略断面図、図４は本発明の実施の形態における外装樹脂成形方法の第３工程概略断面図、図５は本発明の実施の形態における外装樹脂成形方法の第４工程概略断面図、図６は本発明の実施の形態における外装樹脂成形方法
の第５工程概略断面図、図７は本発明の実施の形態における外装樹脂成形方法の第６工程と第７工程概略断面図である。 (Embodiment)
FIG. 1 is a flow chart showing an exterior resin molding method according to an embodiment of the present invention, FIG. 2 is a schematic cross-sectional view of the first step of the exterior resin molding method according to an embodiment of the present invention, and FIG. FIG. 4 is a schematic cross-sectional view of the second step of the exterior resin molding method according to the embodiment of the present invention; FIG. 5 is a schematic cross-sectional view of the third step of the exterior resin molding method according to the embodiment of the present invention; 6 is a schematic cross-sectional view of the fifth step of the exterior resin molding method according to the embodiment of the present invention; FIG. 7 is a schematic cross-sectional view of the sixth and seventh steps of the exterior resin molding method according to the embodiment of the present invention; It is a schematic sectional view.

図７に示す電子部品モジュール１１は、図４から図７に示す金属板１２と実装部品１３と外装樹脂１４とを有する。金属板１２は第１面１２Ａと第１面の反対面の第２面１２Ｂとを有し、実装部品１３は金属板１２の第１面１２Ａに配置されている。外装樹脂１４は金属板１２の一部と実装部品１３とを封止する。 The electronic component module 11 shown in FIG. 7 has the metal plate 12, the mounted component 13, and the exterior resin 14 shown in FIGS. The metal plate 12 has a first surface 12A and a second surface 12B opposite to the first surface. The exterior resin 14 seals a portion of the metal plate 12 and the mounted component 13 .

図２から図７で示した工程では、第１金型１５と第２金型１６とが用いられる。第１金型１５は、保持部１５Ａと第１結合部１５Ｂと外装対応部１５Ｃと加圧部１５Ｄとを有する。保持部１５Ａは、成形時に金属板１２の第１面１２Ａを保持する。第１結合部１５Ｂは保持部１５Ａの外周に位置して保持部１５Ａに連結されている。外装対応部１５Ｃは保持部１５Ａの内側で保持部１５Ａに連結されて実装部品１３を覆う外装に相当する形状を有する。加圧部１５Ｄは、外装対応部１５Ｃに圧力を加えるために可動状態で配置されている。 2 to 7, a first mold 15 and a second mold 16 are used. The first mold 15 has a holding portion 15A, a first coupling portion 15B, an exterior corresponding portion 15C, and a pressing portion 15D. The holding portion 15A holds the first surface 12A of the metal plate 12 during molding. The first coupling portion 15B is positioned on the outer circumference of the holding portion 15A and connected to the holding portion 15A. The exterior corresponding portion 15</b>C has a shape corresponding to an exterior that is connected to the holding portion 15</b>A inside the holding portion 15</b>A and covers the mounting component 13 . The pressurizing portion 15D is arranged in a movable state in order to apply pressure to the exterior corresponding portion 15C.

第２金型１６は、押圧部１６Ａと第２結合部１６Ｂとを有する。押圧部１６Ａは金属板１２の第２面１２Ｂに対面して位置する。そして押圧部１６Ａの保持部１５Ａに金属板１２を介在して対向する位置で金属板１２の第２面１２Ｂを押圧する壁状の突起部１６Ｃが設けられている。第２結合部１６Ｂは、押圧部１６Ａの外周に位置して押圧部１６Ａに連結されている。 The second mold 16 has a pressing portion 16A and a second coupling portion 16B. The pressing portion 16A is positioned facing the second surface 12B of the metal plate 12 . A wall-shaped protrusion 16C that presses the second surface 12B of the metal plate 12 is provided at a position facing the holding portion 15A of the pressing portion 16A with the metal plate 12 interposed therebetween. The second connecting portion 16B is located on the outer periphery of the pressing portion 16A and is connected to the pressing portion 16A.

電子部品モジュール１１の外装樹脂１４の成形についての工程は以下に示す第１工程から第７工程までを有する。先ず、図２に示す第１工程が実施される。第１工程では、第１金型１５と第２金型１６とが対向に配置されて、第１金型１５と第２金型１６とが第１設定温度に設定される。 The process for molding the exterior resin 14 of the electronic component module 11 includes the following first to seventh processes. First, the first step shown in FIG. 2 is performed. In the first step, the first mold 15 and the second mold 16 are arranged to face each other, and the first mold 15 and the second mold 16 are set to the first set temperature.

次に第１工程の後に、図３に示す第２工程が実行される。第２工程では、第１金型１５の加圧部１５Ｄに樹脂材料１７が配置される。 After the first step, the second step shown in FIG. 3 is performed. In the second step, the resin material 17 is placed on the pressure portion 15D of the first mold 15 .

次に第２工程の後に、図４に示す第３工程が実行される。第３工程では、第１金型１５の保持部１５Ａへ実装部品１３が既に実装された状態の金属板１２が配置される。 After the second step, the third step shown in FIG. 4 is performed. In the third step, the metal plate 12 with the mounting component 13 already mounted is placed on the holding portion 15A of the first mold 15 .

次に第３工程の後に、図５に示す第４工程が実行される。第４工程では、第１結合部１５Ｂと第２結合部１６Ｂとが互いに押圧されることによって、第１金型１５と第２金型１６とが組み合わせられる。 Next, after the third step, the fourth step shown in FIG. 5 is performed. In the fourth step, the first mold 15 and the second mold 16 are combined by pressing the first joint portion 15B and the second joint portion 16B against each other.

次に第４工程の後に、図６に示す第５工程が実行される。第５工程では、加圧部１５Ｄによって樹脂材料１７が押圧され、樹脂材料１７に圧力が加えられる。これにより、樹脂材料１７が外装対応部１５Ｃと金属板１２と間の間に充填される。 Next, after the fourth step, the fifth step shown in FIG. 6 is performed. In the fifth step, the resin material 17 is pressed by the pressurizing part 15</b>D and pressure is applied to the resin material 17 . Thereby, the resin material 17 is filled between the exterior corresponding portion 15</b>C and the metal plate 12 .

次に第５工程の後に、図７に示す第６工程が実行される。第６工程では、樹脂材料１７が充填されてから所定時間が経過した後に、第１金型１５と第２金型１６とが組み合わせられた状態から解除される。 Next, after the fifth step, the sixth step shown in FIG. 7 is performed. In the sixth step, the combined state of the first mold 15 and the second mold 16 is released after a predetermined time has elapsed since the resin material 17 was filled.

次に第６工程の後に、同じく図７に示す第７工程が実行される。第７工程では、電子部品モジュール１１が第１金型１５および第２金型１６から取り出される。 Next, after the sixth step, a seventh step likewise shown in FIG. 7 is performed. In the seventh step, electronic component module 11 is removed from first mold 15 and second mold 16 .

以上の成形工程により、第２金型１６の押圧部１６Ａに設けられた壁状の突起部１６Ｃが金属板１２の第２面１２Ｂを、金属板１２を介在したうえで保持部１５Ａに対向する位
置で局部的に押圧する。そして、第２金型１６の押圧部１６Ａ、特に突起部１６Ｃによって金属板１２が押圧された状態で、樹脂材料１７が充填される。この結果、突起部１６Ｃは金属板１２の第２面１２Ｂを大きな圧力で確実に押圧することができるので、樹脂材料１７が充填されるときに樹脂材料１７が金属板１２を覆う厚みや領域と、金属板１２が樹脂材料１７から露出する領域との面積の変動が抑制されさらに、金属板１２の特に第２面１２Ｂに発生する樹脂成形バリが抑制される。 Through the molding process described above, the wall-like protrusion 16C provided on the pressing portion 16A of the second mold 16 faces the holding portion 15A with the second surface 12B of the metal plate 12 interposed therebetween. Apply local pressure in position. Then, the resin material 17 is filled while the metal plate 12 is pressed by the pressing portion 16A of the second mold 16, particularly the projection portion 16C. As a result, the protrusion 16C can reliably press the second surface 12B of the metal plate 12 with a large pressure. In addition, the variation in the area of the metal plate 12 exposed from the resin material 17 is suppressed, and resin molding burrs generated especially on the second surface 12B of the metal plate 12 are suppressed.

以下で、電子部品モジュールの外装樹脂成形方法の詳細について説明する。先に述べたように第１工程で、第１金型１５と第２金型１６とが対向に配置される。ここでは、第１金型１５と第２金型１６とは、組み合わせられていない状態となっている。そして第１金型１５と第２金型１６とが第１設定温度に設定される。ここで第１設定温度は、後の工程で樹脂材料１７に圧力を加えて第１金型１５と第２金型１６との間で任意の形状に成形する際の適切な温度としても、あるいは上記の適切な温度よりも高い温度であっても、さらにあるいは上記の適切な温度よりも低い温度であってもよい。言い換えると、樹脂材料１７に圧力を加え任意の形状に成形する際に適切な温度を円滑に得られるように第１工程では、第１設定温度が設定されていればよい。 Details of the exterior resin molding method for the electronic component module will be described below. As described above, in the first step, the first mold 15 and the second mold 16 are arranged to face each other. Here, the first mold 15 and the second mold 16 are in an uncombined state. Then, the first mold 15 and the second mold 16 are set to the first set temperature. Here, the first preset temperature may be an appropriate temperature when pressure is applied to the resin material 17 in a later step to mold it into an arbitrary shape between the first mold 15 and the second mold 16, or It may be at a temperature higher than the suitable temperature mentioned above, or even at a temperature lower than the suitable temperature mentioned above. In other words, the first set temperature may be set in the first step so that an appropriate temperature can be smoothly obtained when pressure is applied to the resin material 17 to mold it into an arbitrary shape.

また、先に述べたように第２工程では、第１金型１５の加圧部１５Ｄに樹脂材料１７が配置される。第１金型１５の加圧部１５Ｄは図２に示すように、外装対応部１５Ｃに隣接した位置に可動状態で配置され、加圧部１５Ｄと外装対応部１５Ｃとによって外装樹脂１４の成形後の外形が概ね決定されてよい。第１金型１５は、保持部１５Ａと第１結合部１５Ｂと外装対応部１５Ｃとが単一の金属体で形成されている。 Also, as described above, in the second step, the resin material 17 is placed on the pressure portion 15D of the first mold 15 . As shown in FIG. 2, the pressure part 15D of the first mold 15 is arranged in a movable state adjacent to the exterior corresponding part 15C. may be approximately determined. In the first mold 15, the holding portion 15A, the first coupling portion 15B, and the exterior corresponding portion 15C are formed of a single metal body.

この一方で、図８の本発明の実施の形態における外装樹脂成形方法の他の第２工程概略断面図に示すように、第１金型１５の加圧部１５Ｄは外装対応部１５Ｃに対してゲート連結部１５Ｅを介して配置されたうえで、加圧部１５Ｄに樹脂材料１７が配置されてもよい。この場合、外装樹脂１４の成形後の外形は概ね外装対応部１５Ｃの形状のみによって決定される。ここでは突起部１６Ｃの対向領域において、ゲート連結部１５Ｅが存在するために保持部１５Ａが一部で欠落する場合がある。しかしながら、ゲート連結部１５Ｅは非常に小さな径を有する空間であるため、突起部１６Ｃと保持部１５Ａとによって得られる押圧力の低下は殆ど生じることは無い。 On the other hand, as shown in the schematic cross-sectional view of another second step of the exterior resin molding method according to the embodiment of the present invention in FIG. The resin material 17 may be arranged in the pressurizing portion 15D after being arranged through the gate connecting portion 15E. In this case, the outer shape of the exterior resin 14 after molding is generally determined only by the shape of the exterior corresponding portion 15C. Here, in the region facing the protrusion 16C, the holding portion 15A may be partially missing due to the presence of the gate connecting portion 15E. However, since the gate connecting portion 15E is a space having a very small diameter, the pressing force obtained by the projecting portion 16C and the holding portion 15A hardly decreases.

また、先に述べたように第３工程では、電子部品モジュール１１として外装樹脂１４を有する以前の状態である、実装部品１３が実装された状態の金属板１２が第１金型１５の保持部によって保持される。特に金属板１２の外周が全周にわたって第１金型１５の保持部１５Ａによって保持される。また、実装部品１３は金属板１２に直接にはんだ（図示せず）などによって溶接によって実装されても、あるいは、金属板１２と実装部品１３との間に絶縁層（図示せず）が設けられたうえで実装部品１３が金属板１２に実装されてもよい。本実施例では、成形工程に関する説明を主として行うため、絶縁層（図示せず）については図面においても省略している。 In addition, as described above, in the third step, the metal plate 12 with the mounting component 13 mounted thereon, which is the state before the electronic component module 11 has the exterior resin 14 , is placed on the holding portion of the first mold 15 . held by In particular, the outer periphery of the metal plate 12 is held by the holding portion 15A of the first mold 15 over the entire circumference. Mounted component 13 may be mounted directly on metal plate 12 by welding with solder (not shown) or the like, or an insulating layer (not shown) may be provided between metal plate 12 and mounted component 13 . After that, the mounting component 13 may be mounted on the metal plate 12 . In this embodiment, the insulating layer (not shown) is omitted even in the drawings, since the description is mainly about the molding process.

また、先に述べたように第４工程では、第１結合部１５Ｂと第２結合部１６Ｂとが互いに押圧されることによって、第１金型１５と第２金型１６とが組み合わせられる。つまり、第１金型１５、第２金型１６が閉められる。この状態は言い換えると、金属板１２の第２面１２Ｂの外周や外周に沿った部分が全周にわたって第１金型１５の保持部１５Ａと第２金型１６の押圧部１６Ａに設けられた壁状の突起部１６Ｃとによって挟み込まれた状態ともなる。そして、保持部１５Ａと突起部１６Ｃとによって金属板１２が挟み込まれた状態で押圧力を安定させるために、壁状の突起部１６Ｃは金属板１２を介在して保持部１５Ａに対向する位置で閉じた壁状として形成されている。 Further, as described above, in the fourth step, the first mold 15 and the second mold 16 are combined by pressing the first joint portion 15B and the second joint portion 16B against each other. That is, the first mold 15 and the second mold 16 are closed. In other words, the outer circumference of the second surface 12B of the metal plate 12 and the portion along the outer circumference are the walls provided in the holding portion 15A of the first mold 15 and the pressing portion 16A of the second mold 16 over the entire circumference. It is also in a state of being sandwiched between the two projections 16C. In order to stabilize the pressing force in a state where the metal plate 12 is sandwiched between the holding portion 15A and the projection portion 16C, the wall-like projection portion 16C is arranged at a position facing the holding portion 15A with the metal plate 12 interposed therebetween. It is formed as a closed wall.

また、壁状の突起部１６Ｃは必ず金属板１２の外周形状に対応する必要はない。図９（ａ）は本発明の実施の形態における外装樹脂成形方法での金属板の第１の正面図、図９（ｂ）は本発明の実施の形態における外装樹脂成形方法での金属板の第２の正面図であり、これらの正面図は、金属板１２の第２面１２Ｂ側からの上面視での正面図である。外装対応部１５Ｃは第２面１２Ｂの反対面である第１面１２Ａ側に存在し、外装対応部１５Ｃの外形状は概ね外装樹脂１４の上面視における外形状に相当する。 In addition, the wall-like protrusion 16C does not necessarily have to correspond to the outer peripheral shape of the metal plate 12 . FIG. 9(a) is a first front view of the metal plate in the exterior resin molding method according to the embodiment of the present invention, and FIG. 9(b) is a front view of the metal plate in the exterior resin molding method according to the embodiment of the present invention. 2B is a second front view, and these front views are top views from the side of the second surface 12B of the metal plate 12. FIG. The exterior corresponding portion 15C is present on the side of the first surface 12A, which is the opposite surface of the second surface 12B, and the outer shape of the exterior corresponding portion 15C generally corresponds to the outer shape of the exterior resin 14 when viewed from above.

ここで特に重要なのは、第２金型１６の突起部１６Ｃが第２面１２Ｂで接触する接触部１８の軌跡は、外装対応部１５Ｃの外側で、かつ、金属板１２の外周縁よりも内側に存在することである。これは金属板１２の外周縁が切欠部１２Ｃを有し、金属板１２が異形状であっても同様である。これにより、接触部１８の第１面１２Ａ側には、保持部１５Ａが必ず存在するので、突起部１６Ｃは確実に大きな力で金属板１２を押圧固定することができる。また、上記の接触部１８の位置に関する条件が満たされるならば、接触部１８は矩形状や方形状である必要もなく、接触部１８が閉じた曲線であればよい。 What is particularly important here is that the trajectory of the contact portion 18 with which the protrusion 16C of the second mold 16 contacts the second surface 12B is outside the exterior corresponding portion 15C and inside the outer peripheral edge of the metal plate 12. To exist. This is the same even if the outer peripheral edge of the metal plate 12 has a notch portion 12C and the metal plate 12 has an irregular shape. Accordingly, since the holding portion 15A is always present on the first surface 12A side of the contact portion 18, the projecting portion 16C can reliably press and fix the metal plate 12 with a large force. Further, as long as the above conditions regarding the position of the contact portion 18 are satisfied, the contact portion 18 does not need to be rectangular or square, and the contact portion 18 may be a closed curve.

また同時に、突起部１６Ｃに接触する金属板１２の部位は第４工程以前では平坦な状態としていることが望ましい。さらに、突起部１６Ｃの頂部は同一平面に位置し、何れの部分においても突起部１６Ｃは金属板１２を均一な力によって押圧することが望ましい。そして第４工程では突起部１６Ｃに接触する金属板１２の部位が、保持部１５Ａと突起部１６Ｃとによって局部的に挟み込まれ、金属板１２の突起部１６Ｃに対向する限定した領域で変形する。これにより、第１金型１５と第２金型１６とによる保持力が大きな状態となる。第２金型１６は、押圧部１６Ａと第２結合部１６Ｂ突起部１６Ｃとが単一の金属体で形成されている。また、金属板１２の変形が限定した領域で生じるため、実装部品１３の実装領域に応力は発生し難い。この結果として、実装部品１３の実装信頼性も維持される。 At the same time, it is desirable that the portion of the metal plate 12 in contact with the protrusion 16C is in a flat state before the fourth step. Furthermore, it is desirable that the tops of the protrusions 16C are positioned on the same plane and that the protrusions 16C press the metal plate 12 with a uniform force at any portion. In the fourth step, the portion of the metal plate 12 that contacts the protrusion 16C is locally sandwiched between the holding portion 15A and the protrusion 16C, and the metal plate 12 is deformed in a limited area facing the protrusion 16C. As a result, the holding force between the first mold 15 and the second mold 16 is increased. In the second mold 16, the pressing portion 16A, the second coupling portion 16B and the projecting portion 16C are formed of a single metal body. Moreover, since deformation of the metal plate 12 occurs in a limited area, stress is less likely to occur in the mounting area of the mounting component 13 . As a result, the mounting reliability of the mounting component 13 is also maintained.

そして、先に述べた第５工程では加圧部１５Ｄによって樹脂材料１７が押圧され、樹脂材料１７に圧力が加えられ、粘度が低下して流動性が高くなった状態の樹脂材料１７が外装対応部１５Ｃの内側、いわゆるキャビティへ充填される。ここで、第４工程の説明で述べたように、金属板１２は保持部１５Ａと突起部１６Ｃとによって局部的に挟み込まれ、特に金属板１２は外周で限定した領域で変形するので、流動性が高くなった状態の樹脂材料１７は仮に保持部１５Ａと金属板１２の第１面１２Ａとの間を通って金属板１２の第２面１２Ｂへと浸入しても、第２面１２Ｂにおける突起部１６Ｃとの接触面よりも内周側へとは浸入が困難となる。このため、金属板１２の第２面１２Ｂには成形後の樹脂バリなどが生じ難くなる。そして、電子部品モジュール１１として完成した状態では、金属板１２の第２面１２Ｂが放熱部として機能する場合に、金属板１２の適切な露出面積が得られる。その結果として、電子部品モジュール１１の適切な放熱特性が得られる。 Then, in the above-described fifth step, the resin material 17 is pressed by the pressure unit 15D, pressure is applied to the resin material 17, and the resin material 17 in a state where the viscosity is lowered and the fluidity is increased is ready for the exterior. The so-called cavity is filled inside the portion 15C. Here, as described in the explanation of the fourth step, the metal plate 12 is locally sandwiched between the holding portion 15A and the projection portion 16C, and in particular, the metal plate 12 is deformed in a limited area on the outer periphery, so the fluidity is reduced. Even if the resin material 17 with the height increased passes between the holding portion 15A and the first surface 12A of the metal plate 12 and enters the second surface 12B of the metal plate 12, the projection on the second surface 12B Penetration becomes difficult to the inner peripheral side of the contact surface with the portion 16C. Therefore, the second surface 12B of the metal plate 12 is less likely to have resin burrs or the like after molding. In the completed electronic component module 11, when the second surface 12B of the metal plate 12 functions as a heat radiating portion, an appropriate exposed area of the metal plate 12 can be obtained. As a result, appropriate heat dissipation characteristics of the electronic component module 11 are obtained.

また、特に金属板１２は外周で限定した領域で変形し、実装部品１３が実装された領域での金属板１２の変形は小さく、成形時に応力を蓄えたままで外装樹脂１４が成形された状態となり難くなる。この結果、電子部品モジュール１１全体としての信頼性も向上する。 In particular, the metal plate 12 is deformed in a limited area on the outer periphery, and deformation of the metal plate 12 is small in the area where the mounting component 13 is mounted, and the exterior resin 14 is molded while retaining stress during molding. it gets harder. As a result, the reliability of the electronic component module 11 as a whole is also improved.

そして、先に述べた第６工程では、例えば樹脂材料１７に熱硬化性樹脂が用いられるときには、第５工程で充填された樹脂材料１７が、第１金型１５、第２金型１６が閉められた状態で所定時間である樹脂材料１７の硬化時間の間、圧力が継続して加えられた後、第１金型１５、第２金型１６が開かれる。ここで、上記の硬化時間は完全硬化に至る時間でなくてもよい。 In the sixth step described above, for example, when a thermosetting resin is used for the resin material 17, the resin material 17 filled in the fifth step is used to close the first mold 15 and the second mold 16. The first mold 15 and the second mold 16 are opened after the pressure is continuously applied during the curing time of the resin material 17, which is a predetermined time. Here, the above curing time does not have to be the time required for complete curing.

そして、第７工程で樹脂によって封止された状態の電子部品モジュール１１が、第１金
型１５、もしくは第２金型１６から取り出される。 Then, the electronic component module 11 sealed with resin in the seventh step is removed from the first mold 15 or the second mold 16 .

本発明の外装樹脂成形方法は、樹脂材料が放熱板を覆う厚みや領域を安定させることができるという効果を有し、各種電子部品の製造工程において有用である。 INDUSTRIAL APPLICABILITY The exterior resin molding method of the present invention has the effect of stabilizing the thickness and area covered by the resin material on the heat sink, and is useful in the manufacturing process of various electronic components.

１１ 電子部品モジュール
１２ 金属板
１２Ａ 第１面
１２Ｂ 第２面
１２Ｃ 切欠部
１３ 実装部品
１４ 外装樹脂
１５ 第１金型
１５Ａ 保持部
１５Ｂ 第１結合部
１５Ｃ 外装対応部
１５Ｄ 加圧部
１５Ｅ ゲート連結部
１６ 第２金型
１６Ａ 押圧部
１６Ｂ 第２結合部
１６Ｃ 突起部
１７ 樹脂材料
１８ 接触部 REFERENCE SIGNS LIST 11 electronic component module 12 metal plate 12A first surface 12B second surface 12C notch 13 mounting component 14 exterior resin 15 first mold 15A holding portion 15B first coupling portion 15C exterior corresponding portion 15D pressurizing portion 15E gate connecting portion 16 Second mold 16A Pressing portion 16B Second coupling portion 16C Protruding portion 17 Resin material 18 Contacting portion

Claims (7)

第１面と前記第１面と反対面の第２面とを有する金属板と、
前記第１面に配置された実装部品と、
前記金属板の一部と前記実装部品をと封止する外装樹脂と、
を有する電子部品モジュールの外装樹脂成形方法で、
前記第１面の外周を保持する保持部と、
前記保持部の外周に位置して前記保持部に連結される第１結合部と、
前記保持部の内側で前記保持部に連結されて前記実装部品を覆う外装形状に相当する外装対応部と、
前記外装対応部に圧力を加える可動の加圧部と、
を有する第１金型と、
前記保持部に前記金属板を介在して対向する位置で前記第２面を押圧する壁状の突起部が設けられて前記第２面に対面する押圧部と、前記押圧部の外周に位置して前記押圧部に連結される第２結合部と、を有し、前記突起部が前記第２面と接触する接触部の軌跡が前記外装対応部の外側で、かつ、前記金属板の外周縁よりも内側に存在する第２金型と、
が第１設定温度に設定されて前記第１金型と前記第２金型とが対向配置される第１工程と、
前記第１工程の後に、前記加圧部に樹脂材料を配置する第２工程と、
前記第２工程の後に、前記保持部へ前記実装部品が実装された前記金属板を配置する第３工程と、
前記第３工程の後に、前記第１結合部と前記第２結合部とを互いに押圧させて前記第１金型と前記第２金型とを組み合わせる第４工程と、
前記第４工程の後に、前記加圧部により前記樹脂材料を押圧して圧力を加え、前記樹脂材料を前記外装対応部と前記金属板との間に充填する第５工程と、
前記第５工程の後に、所定時間の経過後に前記第１金型と前記第２金型との組み合わせを解除する第６工程と、
前記第６工程の後に、前記電子部品モジュールを前記第１金型および第２金型から取り出す第７工程と、
を有する、
電子部品モジュールの外装樹脂成形方法。 a metal plate having a first surface and a second surface opposite to the first surface;
mounting components arranged on the first surface;
an exterior resin that seals a portion of the metal plate and the mounting component;
An exterior resin molding method for an electronic component module having
a holding portion that holds the outer periphery of the first surface;
a first coupling portion located on the outer circumference of the holding portion and coupled to the holding portion;
an exterior corresponding portion corresponding to an exterior shape that is connected to the holding portion inside the holding portion and covers the mounting component;
a movable pressurizing part that applies pressure to the exterior corresponding part;
a first mold having
a pressing portion that faces the second surface and is provided with a wall-shaped protrusion that presses the second surface at a position facing the holding portion with the metal plate interposed therebetween; a second connecting portion that is connected to the pressing portion by a second connecting portion , wherein the trajectory of the contact portion where the protrusion contacts the second surface is outside the exterior corresponding portion and the outer peripheral edge of the metal plate. A second mold that exists inside the
is set to a first set temperature and the first mold and the second mold are arranged to face each other;
a second step of arranging a resin material in the pressure unit after the first step;
a third step of arranging the metal plate on which the mounting component is mounted on the holding portion after the second step;
After the third step, a fourth step of combining the first mold and the second mold by pressing the first joint portion and the second joint portion against each other;
After the fourth step, a fifth step of applying pressure by pressing the resin material with the pressurizing portion to fill the space between the exterior corresponding portion and the metal plate with the resin material;
After the fifth step, a sixth step of releasing the combination of the first mold and the second mold after a predetermined time has elapsed;
a seventh step of removing the electronic component module from the first mold and the second mold after the sixth step;
having
An exterior resin molding method for an electronic component module. 前記突起部は前記保持部に前記金属板を介在して対向する位置で前記第２面を前記第２面の外周に沿って押圧する、
請求項１に記載の電子部品モジュールの外装樹脂成形方法。 The protrusion presses the second surface along the outer circumference of the second surface at a position facing the holding portion with the metal plate interposed therebetween.
2. The method for molding an exterior resin of an electronic component module according to claim 1. 前記突起部は閉じた壁状で、前記保持部に前記金属板を介在して対向する位置で前記第２面を前記第２面の外周に沿って押圧する、
請求項２に記載の電子部品モジュールの外装樹脂成形方法。 The protrusion is in the form of a closed wall, and presses the second surface along the outer circumference of the second surface at a position facing the holding portion with the metal plate interposed therebetween.
3. The method for molding an exterior resin of an electronic component module according to claim 2. 前記接触部の軌跡が閉じた曲線形状である、The trajectory of the contact portion is a closed curved shape,
請求項１～３のいずれかに記載の電子部品モジュールの外装樹脂成形方法。The exterior resin molding method for an electronic component module according to any one of claims 1 to 3. 前記接触部の軌跡は前記第４工程以前では平坦である、The trajectory of the contact portion is flat before the fourth step,
請求項１～４のいずれかに記載の電子部品モジュールの外装樹脂成形方法。The exterior resin molding method for an electronic component module according to any one of claims 1 to 4. 前記第２金型は、前記押圧部と前記第２結合部と前記突起部とが単一の金属体で形成されている、In the second mold, the pressing portion, the second coupling portion, and the projection portion are formed of a single metal body,
請求項１～５に記載の電子部品モジュールの外装樹脂成形方法。The exterior resin molding method for an electronic component module according to any one of claims 1 to 5. 前記突起部の頂部は同一平面に位置する、the tops of the protrusions are located in the same plane,
請求項１～６のいずれかに記載の電子部品モジュールの外装樹脂成形方法。The exterior resin molding method for an electronic component module according to any one of claims 1 to 6.
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