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JP7003986B2 - 研削液の再生装置及び研削液の再生方法 - Google Patents

研削液の再生装置及び研削液の再生方法 Download PDF

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Publication number
JP7003986B2
JP7003986B2 JP2019506936A JP2019506936A JP7003986B2 JP 7003986 B2 JP7003986 B2 JP 7003986B2 JP 2019506936 A JP2019506936 A JP 2019506936A JP 2019506936 A JP2019506936 A JP 2019506936A JP 7003986 B2 JP7003986 B2 JP 7003986B2
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Prior art keywords
grinding fluid
grinding
membrane
debris
filtration membrane
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JP2019506936A
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Japanese (ja)
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JPWO2018173376A1 (ja
Inventor
岳 松本
啓一 池田
徹 森田
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Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
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  • Separation Using Semi-Permeable Membranes (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
JP2019506936A 2017-03-23 2017-12-04 研削液の再生装置及び研削液の再生方法 Active JP7003986B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017057082 2017-03-23
JP2017057082 2017-03-23
PCT/JP2017/043460 WO2018173376A1 (fr) 2017-03-23 2017-12-04 Dispositif de régénération de liquide de meulage et procédé de régénération de liquide de meulage

Publications (2)

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JPWO2018173376A1 JPWO2018173376A1 (ja) 2020-01-23
JP7003986B2 true JP7003986B2 (ja) 2022-01-21

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JP2019506936A Active JP7003986B2 (ja) 2017-03-23 2017-12-04 研削液の再生装置及び研削液の再生方法

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JP (1) JP7003986B2 (fr)
CN (1) CN110461544A (fr)
WO (1) WO2018173376A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001149760A (ja) 1999-11-29 2001-06-05 Kuraray Co Ltd クーラントの使用方法
JP2001198823A (ja) 2000-01-14 2001-07-24 Kurita Water Ind Ltd 研磨材の回収装置
JP2001347456A (ja) 1999-05-27 2001-12-18 Sanyo Electric Co Ltd Cmp排水の濾過方法
JP2008034827A (ja) 2006-06-26 2008-02-14 Nippon Valqua Ind Ltd 化学的機械研磨材のリサイクル方法及びその装置
JP2015142902A (ja) 2013-12-26 2015-08-06 住友電気工業株式会社 再生濾過モジュール、使用済みアルカリ脱脂液の再生装置及び使用済みアルカリ脱脂液の再生方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100437925C (zh) * 2003-03-18 2008-11-26 野村微科学股份有限公司 半导体研磨浆料精制用原材料、半导体研磨浆料精制用模块和半导体研磨浆料的精制方法
CN101500754A (zh) * 2006-08-16 2009-08-05 旭硝子株式会社 从研磨剂浆料废液中回收研磨剂的方法及装置
KR20110132458A (ko) * 2009-03-25 2011-12-07 어플라이드 머티어리얼스, 인코포레이티드 화학기계적 폴리싱 슬러리의 소요지 재생 시스템
DE102009044204A1 (de) * 2009-10-08 2011-04-28 Fab Service Gmbh Wiederaufbereitungsverfahren und Wiederaufbereitungsvorrichtung zur Wiederaufbereitung von Slurry-Abwasser aus einem Halbleiterbearbeitungs-prozess, insbesondere aus einem chemisch-mechanischen Polierprozess
KR20150030237A (ko) * 2012-07-25 2015-03-19 코니카 미놀타 가부시키가이샤 연마재 재생 방법
JP5941995B2 (ja) * 2012-11-28 2016-06-29 株式会社クラレ クーラント再生方法、及びクーラント再生装置
CN203045492U (zh) * 2012-12-15 2013-07-10 焦作市科瑞斯达光电材料有限公司 一种led基板的研磨抛光系统
JP6137945B2 (ja) * 2013-06-04 2017-05-31 株式会社クラレ 使用済みシリコンクーラント処理装置及び使用済みシリコンクーラント処理方法
CN203471976U (zh) * 2013-07-22 2014-03-12 可乐丽股份有限公司 浆料再生装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001347456A (ja) 1999-05-27 2001-12-18 Sanyo Electric Co Ltd Cmp排水の濾過方法
JP2001149760A (ja) 1999-11-29 2001-06-05 Kuraray Co Ltd クーラントの使用方法
JP2001198823A (ja) 2000-01-14 2001-07-24 Kurita Water Ind Ltd 研磨材の回収装置
JP2008034827A (ja) 2006-06-26 2008-02-14 Nippon Valqua Ind Ltd 化学的機械研磨材のリサイクル方法及びその装置
JP2015142902A (ja) 2013-12-26 2015-08-06 住友電気工業株式会社 再生濾過モジュール、使用済みアルカリ脱脂液の再生装置及び使用済みアルカリ脱脂液の再生方法

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JPWO2018173376A1 (ja) 2020-01-23
CN110461544A (zh) 2019-11-15
WO2018173376A1 (fr) 2018-09-27

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