JP6726531B2 - Endoscope - Google Patents

Description

The present invention relates to an endoscope in which an insertion section is inserted into a space to be inspected and which acquires an image of an object to be inspected.

BACKGROUND ART Conventionally, endoscope apparatuses have been widely used for various examinations in the medical field and industrial field. Among them, the medical endoscope apparatus incises the subject by inserting an elongated flexible insertion portion having an imaging element at the tip into the body cavity of the subject such as a patient. It is widely used because an in-vivo image of a body cavity can be acquired without performing the treatment, and a treatment tool can be protruded from the distal end of the insertion portion to perform a medical treatment if necessary.

At the tip of the insertion portion of such an endoscope, an image sensor, a circuit board on which electronic components such as a capacitor and an IC chip that form a drive circuit of the image sensor and a cable are mounted, an image sensor and a circuit board. An image pickup module including an electrical connection member such as a TAB tape for connecting the above is fitted, and a filler for the purpose of protection is filled around the image pickup element and the electronic component (for example, refer to Patent Document 1).

JP, 2006-94955, A

In the image pickup module of the reference document 1 or the like, the cable is connected to the circuit board after the image pickup device and the circuit board are connected by a TAB tape or the like. Since it is heated at a high temperature, a thermal load is applied to the image pickup device and the optical components mounted on the image pickup device, and there is a concern that the performance may deteriorate.

The present invention has been made in view of the above, and an object of the present invention is to provide an endoscope that prevents performance deterioration of an imaging module due to cable connection and enables transmission of high-quality image signal data. To do.

In order to solve the above-mentioned problems and to achieve the object, an endoscope according to the present invention is located on the distal end side of an insertion portion, and has a first module including an image sensor and a first communication circuit, and A second module having a second communication circuit on the proximal side of the first module of the insertion portion, spaced apart from the first module, and communicating with the first communication circuit by radio, and a power supply. A plurality of cables including a cable and an image signal cable connected to the second module.

Further, in the endoscope according to the present invention, in the above invention, the first module and the second module are separately sealed with a sealing resin, and the endoscope is located at a distal end portion of the insertion portion. Characterize.

Also, in the endoscope according to the present invention, in the above invention, the first module is sealed with a sealing resin and is positioned at a distal end portion of the insertion portion, and the second module is sealed with a sealing resin. It is characterized in that it is stopped and positioned at the curved portion of the insertion portion.

In the endoscope according to the present invention, in the above invention, the first module includes a semiconductor package having the image sensor and the first communication circuit, and a first substrate on which a wireless antenna is mounted. The second module includes a second substrate on which the second communication circuit and the wireless antenna are mounted, and a relay substrate that indirectly connects the cable to the second substrate via solder. To do.

In the endoscope according to the present invention, in the above invention, the first module includes a semiconductor package having the image sensor and the first communication circuit, and a first substrate on which a wireless antenna is mounted. The second module has a main body portion on which the second communication circuit and the wireless antenna are mounted on the front surface, and a connection electrode protruding to the rear surface of the main body portion and connecting the cable to the opposite side surface. And a second substrate having a mounting portion.

Also, in the endoscope according to the present invention, in the above invention, the first module includes a semiconductor package having the image pickup device and the first communication circuit, and a first substrate to which a wireless antenna and a power cable are connected. And the second module includes a second substrate on which the second communication circuit and the wireless antenna are mounted, and a relay substrate that indirectly connects the cable to the second substrate via solder. Is characterized by.

According to the present invention, since the imaging module is composed of the first module and the second module, the thermal load on the imaging element and the optical component due to the cable connection is eliminated, and the first module and the second module are viewed internally. Since it is arranged close to the insertion portion of the mirror, it enables high-quality image signal data transmission.

1 is a diagram schematically showing an overall configuration of an endoscope system according to a first embodiment of the present invention. FIG. 2 is a side view of the image pickup module arranged at the distal end portion of the endoscope shown in FIG. FIG. 3 is a side view of the image pickup module according to the first modification of the first embodiment of the present invention. FIG. 4 is a diagram for explaining the connection between the composite cable and the relay board. FIG. 5 is a diagram for explaining the arrangement of the imaging module shown in FIG. 2 at the endoscope insertion portion. FIG. 6 is a diagram for explaining the arrangement of the imaging module according to the second modification of the first embodiment of the present invention at the endoscope insertion portion. FIG. 7 is a side view of an image pickup module according to Modification 3 of Embodiment 1 of the present invention. FIG. 8 is a side view of the image pickup module according to the second embodiment of the present invention.

In the following description, an endoscope system including an imaging module will be described as a mode for carrying out the present invention (hereinafter, referred to as “embodiment”). Further, the present invention is not limited to the embodiments. Further, in the description of the drawings, the same parts are designated by the same reference numerals. Furthermore, it should be noted that the drawings are schematic, and the relationship between the thickness and width of each member, the ratio of each member, and the like are different from reality. In addition, the drawings include portions having different dimensions and ratios.

(Embodiment 1)
FIG. 1 is a diagram schematically showing an overall configuration of an endoscope system according to an embodiment of the present invention. As shown in FIG. 1, an endoscope system 1 according to the present embodiment is an endoscope 2 that is introduced into a subject and images the inside of the subject to generate an image signal inside the subject. An information processing device 3 that performs predetermined image processing on an image signal captured by the endoscope 2 and controls each unit of the endoscope system 1, a light source device 4 that generates illumination light of the endoscope 2, and information processing. A display device 5 for displaying the image signal after the image processing by the device 3.

The endoscope 2 includes an insertion section 6 to be inserted into a subject, an operation section 7 on the proximal end side of the insertion section 6 which is grasped by an operator, and a flexible universal extending from the operation section 7. And code 8.

The insertion portion 6 is realized by using an illumination fiber 12 (light guide cable, see FIG. 4), an electric cable, an optical fiber, and the like. The insertion portion 6 has a distal end portion 6a containing an image pickup unit described later, a bendable bending portion 6b formed by a plurality of bending pieces, and flexibility provided on the proximal end side of the bending portion 6b. And a flexible tube portion 6c. An illumination unit that illuminates the inside of the subject through an illumination lens, an observation unit that images the inside of the subject, an opening that communicates a treatment tool channel, and an air/water supply nozzle (not shown) are provided on the distal end portion 6a. Is provided.

The operation unit 7 includes a bending knob 7a that bends the bending unit 6b in the up-down direction and the left-right direction, a treatment instrument insertion unit 7b into which a treatment instrument such as a biopsy forceps and a laser knife is inserted into a body cavity of a subject, and an information processing device 3, a light source device 4, a plurality of switch parts 7c for operating peripheral devices such as an air supply device, a water supply device and a gas supply device. The treatment instrument inserted from the treatment instrument insertion portion 7b is exposed from the opening portion at the tip of the insertion portion 6 through the treatment instrument channel provided inside.

The universal cord 8 is composed of an illumination fiber 12, a cable and the like. The universal cord 8 is branched at a base end, one branched end is a connector 8a, and the other base end is a connector 8b. The connector 8a is attachable to and detachable from the connector of the information processing device 3. The connector 8b is detachable from the light source device 4. The universal cord 8 propagates the illumination light emitted from the light source device 4 to the tip portion 6a via the connector 8b and the illumination fiber 12. The universal cord 8 also transmits an image signal captured by an image capturing unit, which will be described later, to the information processing device 3 via the cable and the connector 8a.

The information processing device 3 performs predetermined image processing on the image signal output from the connector 8a and controls the entire endoscope system 1.

The light source device 4 is configured using a light source that emits light, a condenser lens, and the like. Under the control of the information processing device 3, the light source device 4 emits light from the light source to the endoscope 2 connected via the connector 8b and the illumination fiber 12 of the universal cord 8 to the inside of the subject as a subject. Supply as illumination light.

The display device 5 is configured by using a display display using liquid crystal or organic EL (Electro Luminescence). The display device 5 displays various kinds of information including an image that has been subjected to predetermined image processing by the information processing device 3 via the video cable 5a. Thus, the operator can observe the image (in-vivo image) displayed by the display device 5 and operate the endoscope 2 to observe the desired position in the subject and determine the property.

Next, the image pickup unit used in the endoscope system 1 will be described in detail. FIG. 2 is a side view of the image pickup module arranged at the distal end portion of the endoscope shown in FIG. Figure 4 is a diagram illustrating the connection of the composite cable and the relay substrate, FIG. 4 (a) the end face of the front end portion of the composite cable 80, FIG. 4 (b) f5 surface side of the relay board 70, FIG. 4 (C) is a view of the composite cable 80 in a stacked state as viewed from the f5 surface side of the relay board 70.

The image pickup module 100 includes a first module 10, a second module 20, and a composite cable 80. The first module 10 includes a semiconductor package 40 in which an image pickup device chip 41 and a processing circuit chip 42 formed with a signal processing circuit and a first communication circuit are stacked, and an f1 surface which is a surface of the image pickup device chip 41. The glass 30 is attached, and the first substrate 50 is connected to the f2 surface which is the back surface of the semiconductor package 40. The second module 20 includes a second substrate 60 and a relay substrate 70 connected to the f4 surface, which is the back surface of the second substrate 60, via solder 90 and 91 or the like.

In the semiconductor package 40, the light condensed by the lens unit 11 (see FIG. 5) is incident on the f1 surface of the image pickup device chip 41 including the light receiving portion via the surface of the glass 30. The image data picked up by the image pickup device chip 41 is transmitted to the processing circuit chip 42 by a TSV (Through-Silicon Via: Si through electrode) (not shown), a micro bump, or the like, and analog signal processing is performed by the signal processing circuit of the processing circuit chip 42. Converted to digital signal. On the f2 surface of the semiconductor package 40, a sensor electrode 43 and a joining member 44 made of a solder ball or the like are formed. The joining member 44 may be a solder ball, a metal core solder ball, a resin core solder ball, an Au bump, or the like. In the semiconductor package 40, wiring and electrodes are formed on the image pickup device chip in the wafer state, the processing circuit chips in the wafer state are stacked, resin sealing and dicing are performed, and the size of the image pickup device chip is finally unchanged. A CSP (Chip Size Package) that is the size of the semiconductor package is preferable. In the first embodiment, the semiconductor package 40 has the two layers of the image pickup device chip 41 and the processing circuit chip 42 stacked, but three layers including the signal processing circuit layer and the first communication circuit layer as different layers. It may be laminated, or only the signal processing circuit may be formed on the processing circuit chip 42, and the first communication circuit may be mounted as a wireless IC on the first substrate 50 described later.

As the first substrate 50, a ceramic substrate, a glass epoxy substrate, a flexible printed substrate, a glass substrate, a silicon substrate, or the like is used. A plurality of connection electrodes 51 are formed on the surface of the first substrate 50, and are electrically and mechanically connected to the sensor electrodes 43 of the semiconductor package 40 via the bonding members 44. The area around the connection between the connection electrode 51 and the sensor electrode 43 is sealed with a sealing resin 53. A wireless antenna 52 is mounted on the back surface side of the first substrate 50, which is the surface facing the surface on which the connection electrodes 51 are formed. The first communication circuit of the processing circuit chip 42 and the wireless antenna 52 transmit the image signal data to the second module 20, which will be described later, and receive the control signal and the like transmitted from the second module 20. Although not shown in FIG. 2, the periphery of the first substrate 50 and the wireless antenna 52 on the f2 surface side of the semiconductor package 40 is sealed with a sealing resin.

The second substrate 60 has a plate shape by laminating a plurality of substrates on which wiring is formed (a plurality of substrates parallel to the f3 plane and the f4 plane are laminated). As the second substrate 60, a ceramic substrate, a glass epoxy substrate, a flexible printed substrate, a glass substrate, a silicon substrate, or the like is used. A connection electrode that connects the wireless antenna 63 and the wireless IC 64 is formed on the f3 surface that is the surface of the second substrate 60. The wireless IC 64 functions as a second communication circuit. The wireless IC 64 transmits a control signal or the like transmitted from the information processing device 3 via the composite cable 80 via the wireless antenna 63 to the first module 10, and receives image signal data transmitted from the first module 10. , To the information processing device 3. Wireless transmission between the first module 10 and the second module 20 is performed using a millimeter wave in the 60 GHz band or a terahertz wave of 275 GHz or higher. High-speed transmission becomes possible by using millimeter waves and terahertz waves. Although not shown in FIG. 2, the periphery of the wireless antenna 63 and the wireless IC 64 on the f3 surface side of the second substrate 60 is sealed with a sealing resin. The first module 10 and the second module 20 may be integrally formed of a sealing resin, but by sealing the sealing resin separately, the first module 10 and/or the second module 20. Maintenance becomes easy when a failure occurs. Furthermore, when a mechanical load is applied to the vicinity of the first module 10 and/or the second module 20, the stress can be dispersed by separating them from each other. Furthermore, the first module 10 is preferably a hermetically sealed package made of a combination of materials such as ceramics, glass and metal, or ceramics and metal. FIG. 3 is a side view of the image pickup module 100E according to the first modification of the first embodiment of the present invention. In the imaging module 100E, for protection, such as the image pickup device 41, an end portion of the imaging element 41 side of the first module 10E is hermetically sealed with a cap 5 6. By using the hermetically sealed package as in the modified example 1, high temperature water vapor can be blocked even when autoclave sterilization is performed, and therefore deterioration of the imaging element chip 41, the sealing resin, and the like can be suppressed. You can

In the composite cable 80, a plurality of cables 81 are covered with a comprehensive coating 84, and the overall coating 84 and the outer skin 83 of the cable 81 are partially removed on the end side connected to the relay substrate 70 described later, The core wire 82 is exposed. The exposed end surface f7 of the core wire 82 is connected to the f6 surface, which is the back surface of the relay board 70, via solder 90.

As the relay substrate 70, a ceramic substrate, a glass epoxy substrate, a glass substrate, a silicon substrate, or the like is used. As shown in FIGS. 4A to 4C, the relay board 70 is located at a position corresponding to the arrangement position of the core wire 82 of the cable 81 fixed by the comprehensive coating 84 of the composite cable 80, from the diameter r3 of the core wire 82. A through hole 71 having a small diameter r2 is formed. Since the through hole 71 is formed at a position corresponding to the arrangement position of the core wire 82 of the cable 81, it is not necessary to remove the comprehensive coating 84 and rearrange the cable 81 (core wire 82). It suffices that the core wire 82 is positioned so that most of its cross-sectional area overlaps the through hole 71. Since it is not necessary to align the core wire 82 with the through hole 71 so that the core wire 82 is completely aligned with the through hole 71, connection work is facilitated. When connecting the relay board 70 and the plurality of cables 81, the relay board 70 is preferably a transparent material, for example, a glass substrate, from the viewpoint that the relay board 70 can be visually aligned from the f5 surface side. When an opaque material is used as the material of the relay board 70, a through hole may be formed in the relay board 70 in addition to the through hole 71 used for connection, and the alignment may be performed through this through hole. .. The periphery of the connecting portion between the relay board 70 and the cable 81 is sealed with a sealing resin 92.

The connection electrode 62 on the f4 surface of the second substrate 60 is formed at a position corresponding to the arrangement position of the through hole 71, and is connected to the solder 90 in the through hole 71 via the solder 91. The connection electrode 62 of the second substrate 60 is electrically connected to the cable 81 via the solder 91 and the solder 90 that connects the inside of the through hole 71 and the core wire 82 to the end face of the relay substrate 70. The periphery of the connection portion between the second substrate 60 and the relay substrate 70 is sealed with a sealing resin 92.

The connection of the cable 81 to the relay board 70 is performed by filling the through hole 71 of the relay board 70 with the solder 90, and further placing the solder 90 in a convex shape on the through hole 71 of the f6 surface of the relay board 70 to which the cable 81 is connected. After placing, the exposed core wire 82 of the cable 81 is aligned with the solder 90 on the through hole 71, and then the end face f7 of the core wire 82 is pressed onto the solder 90 on the through hole 71 to melt from the f5 surface side of the relay board 70. The solder 90 is supplied to melt the solder 90 in the through hole 71 and the solder 90 on the through hole 71 and suck the melted solder 90 onto the core wire 82. Since the melted solder 90 is supplied to suck up the solder 90 on the core wire 82, sufficient connection strength between the relay board 70 and the cable 81 can be secured.

Further, the connection between the second board 60 and the relay board 70 is performed by removing the solder 90 on the f5 surface side of the relay board 70 to which the cable 81 is connected, and then penetrating the f5 surface of the relay board 70 connecting the second board 60. The solder 91 is placed on the hole 71, the connection electrode 62 of the second substrate 60 is aligned with the solder 91 on the through hole 71, brought into contact with each other, and then heated to melt and connect the solder 91.

In the imaging module 100, the first module 10 including the semiconductor package 40 and the second module 20 to which the cable 81 is connected are not electrically connected. Therefore, the heat generated when the cable 81 is connected to the relay board 70 does not have a thermal effect on the image pickup element chip 41 and the glass 30, and the performance deterioration can be prevented.

In addition, the first substrate 50, the second substrate 60, the relay substrate 70, and the composite cable 80 are arranged at positions that are within the projection plane of the semiconductor package 40 in the optical axis direction. As a result, it is possible to reduce the diameter of the image pickup module 100.

Further, as shown in FIG. 5, the first module 10 and the second module 20 which configure the imaging module 100 are both arranged close to the distal end portion 6 a of the insertion portion 6 of the endoscope 2. FIG. 5 is a diagram for explaining the arrangement of the imaging module 100 shown in FIG. 2 at the insertion portion 6 of the endoscope 2. By arranging the first module 10 and the second module 20 configuring the imaging module 100 close to the distal end portion 6a of the insertion portion 6 of the endoscope 2, millimeter waves and terahertz waves suitable for short-distance transmission are generated. The wireless transmission used enables high speed transmission of image signal data.

Alternatively, as shown in FIG. 6, the first module 10 and the second module 20 constituting the image pickup module 100 may be arranged in the distal end portion 6a of the insertion portion 6 of the endoscope 2A and the bending portion 6b, respectively. .. FIG. 6 is a diagram illustrating an arrangement of the imaging module 100 according to the second modification of the first embodiment of the present invention at the insertion portion 6 of the endoscope 2A. By arranging the first module 10 and the second module 20 close to each other in the insertion portion 6, high speed transmission of image signal data is possible by wireless transmission using millimeter waves and terahertz waves suitable for short distance transmission. In addition, the hard portion length of the endoscope 2A (the length of the distal end portion 6a) can be shortened.

In the imaging module 100 according to the first embodiment, the cable 81 is connected to the second board 60 via the relay board 70. However, the shape of the second board 60 is changed and the cable 81 is directly connected to the second board 60. May be. FIG. 7 is a side view of the image pickup module 100D according to the third modification of the first embodiment of the present invention.

In the imaging module 100D according to the modified example 3, the second substrate 60D protrudes from the main body portion 60D-1 on which the wireless antenna 63 and the wireless IC 64 are mounted on the front surface f3 and the rear surface of the main body portion 60D-1. And a mounting portion 60D-2 in which the connection electrode 62 for connecting the cable 81 is formed on the f8 surface and the f9 surface which are the side surfaces. The main body portion 60D-1 and the attachment portion 60D-2 may be integrally formed substrates or may be a combination of individually produced substrates. Further, both the first module 10 and the second module 20D may be arranged in proximity to the distal end portion 6a of the insertion portion 6 of the endoscope 2, or the distal end portion 6a of the insertion portion 6 and the bending portion 6b. You may arrange in each. The first module 10 and the second module 20D may be integrally formed with a sealing resin, but may be separately sealed with a sealing resin. When the first module 10 and the second module 20D are respectively arranged in the distal end portion 6a of the insertion portion 6 and the curved portion 6b, it is preferable to separately seal with the sealing resin. By separately sealing with the sealing resin, maintenance becomes easy when a failure occurs in the first module 10 and/or the second module 20D. Furthermore, when a mechanical load is applied to the vicinity of the first module 10 and/or the second module 20D, the stress can be dispersed by forming a separate body.

In the imaging module 100D, as in the first embodiment, the first module 10 including the semiconductor package 40 and the second module 20D to which the cable 81 is connected are not electrically connected, so the cable 81 is connected to the second substrate. There is no thermal influence on the image pickup element chip 41 and the glass 30 due to the heat generated when connecting to the 60D, and it is possible to prevent performance deterioration.

Further, in the image pickup module 100D, the first substrate 50, the second substrate 60D, and the composite cable 80D are arranged at positions that are within the projection plane of the semiconductor package 40 in the optical axis direction. As a result, it is possible to reduce the diameter of the image pickup module 100D.

(Embodiment 2)
FIG. 8 is a side view of the image pickup module according to the second embodiment of the present invention. In the second embodiment, power is directly supplied to the first module 10B by the power cable 85.

In the imaging module 100 according to the first embodiment, the power used by the first module 10 is the power transmitted via the cable 81 by the wireless antenna 63, or the solar battery is mounted on the first module 10. The solar cell is irradiated with a part of the illumination light emitted from the illumination fiber 12 to self-power. On the other hand, in the imaging module 100B according to the second embodiment, the power cable 85 is connected to the first board 50B via the solder 55.

The first substrate 50B is composed of a flexible printed circuit board (hereinafter, referred to as “FPC board”) in which a wiring layer is sandwiched by insulating base materials, and the connection electrodes 51 formed on the surface of the FPC board are the same as those of the semiconductor package 40. It is connected to the sensor electrode 43 via a joining member 44. The area around the connection between the connection electrode 51 and the sensor electrode 43 is sealed with a sealing resin 53. The FPC board is bent so as to be within the projection plane of the semiconductor package 40 in the optical axis direction, and the power cable 85 is connected to the base end side of the bent FPC board. The core wire 86 of the power cable 85 can be connected to the connection electrode formed on the surface of the FPC board, but it should be connected to the connection electrode formed inside by removing the insulating base material on one side of the FPC board. Is preferable from the viewpoint of reducing the diameter.

In the imaging module 100B, both the first module 10B and the second module 20 may be arranged in proximity to the distal end portion 6a of the insertion portion 6 of the endoscope 2, or the distal end portion 6a of the insertion portion 6 and You may arrange|position each in the curved part 6b. The first module 10B and the second module 20 may be integrally formed with a sealing resin, but may be separately sealed with a sealing resin. When the first module 10B and the second module 20 are arranged in the distal end portion 6a of the insertion portion 6 and the curved portion 6b, respectively, it is preferable to separately seal with a sealing resin. By separately sealing with the sealing resin, maintenance becomes easy when a failure occurs in the first module 10B and/or the second module 20. Furthermore, when a mechanical load is applied to the vicinity of the first module 10B and/or the second module 20, the stress can be dispersed by forming a separate body.

In the imaging module 100B, since the first module 10B including the semiconductor package 40 and the second module 20 to which the cable 81 is connected are not electrically connected, the heat generated when the cable 81 is connected to the relay board 70. As a result, there is no thermal influence on the image pickup element chip 41 or the glass 30, and the performance deterioration can be prevented. Further, in the image pickup module 100B, since the power cable 85 is connected to the end portion of the first substrate 50B which is separated from the semiconductor package 40, the thermal influence on the image pickup element chip 41 and the glass 30 can be reduced.

Further, in the image pickup module 100B, the first substrate 50B, the power supply cable 85, the second module 20, and the composite cable 80 are arranged at positions that are within the projection plane of the semiconductor package 40 in the optical axis direction, and thus the image pickup module 100B. It is possible to reduce the diameter.

INDUSTRIAL APPLICABILITY The endoscope of the present invention is useful for an endoscope system in which a high quality image and a reduction in the diameter and the size of the tip portion are required.

1 Endoscope system 2 Endoscope 3 Information processing device 4 Light source device 5 Display device 6 Insertion part 6a Tip part 6b Bending part 6c Flexible tube part 7 Operating part 7a Bending knob 7b Treatment tool insertion part 7c Switch part 8 Universal code 8a, 8b Connector 10 1st module 11 Lens unit 12 Illumination fiber 20 2nd module 30 Glass 40 Semiconductor package 41 Imaging element chip 42 Processing circuit chip 43 Sensor electrode 44 Joining member 50 First substrate 51, 62 Connection electrode 52, 63 Wireless Antenna 53, 92 Sealing resin 60 Second substrate 64 Wireless IC
70 Relay Board 71 Through Hole 80 Composite Cable 81 Cable 82 Core Wire 83 Outer Skin 84 Overall Covering 90, 91 Solder 100 Imaging Module

Claims (4)

A first module that is located on the distal end side of the insertion portion and that has an image sensor and a first communication circuit;
A second module having a second communication circuit, which is on the proximal end side of the first module of the insertion section, is arranged apart from the first module, and communicates wirelessly with the first communication circuit;
A plurality of cables including a first power cable and an image signal cable connected to the second module;
Equipped with
Further, the first module includes a semiconductor package having the image sensor and the first communication circuit, and a first substrate on which a wireless antenna is mounted,
The second module includes a second substrate on which the second communication circuit and the radio antenna is mounted, and a relay board that indirectly connected to the second substrate via a plurality of cables solder, the Rukoto includes a The characteristic endoscope. The endoscope according to claim 1, wherein the first module and the second module are separately sealed with a sealing resin, and are located at a distal end portion of the insertion portion. The first module is sealed by a sealing resin and positioned at the tip of the insertion portion,
The endoscope according to claim 1, wherein the second module is sealed by a sealing resin and is located in a curved portion of the insertion portion. Furthermore wherein the first substrate endoscope according to claim 1 in which the second power cable, characterized in that it is connected.

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