JP6679995B2 - Wiring board for detecting abnormality of structure, structure abnormality detection device, and structure abnormality detection system - Google Patents

Description

  One embodiment of the present invention relates to a member, a device, and a system that detect a change in the state of a structure by a change in electrical characteristics.

  Appropriate maintenance is required for aging structures such as roads, railways, harbors, dams and buildings that compose social capital. For bridges, tunnels, concrete walls on slopes, outer walls of buildings, etc. on automobile roads and railroads, if the walls are peeled off, the safety of the structure will be impaired, causing a major accident. Therefore, it is necessary to carry out regular inspections and inspections.

  Conventionally, the inspection of structures has been performed mainly by visual inspection and tapping inspection by humans. In addition, a method of mounting a sensor on a structure and performing an inspection instead of the visual inspection by humans has been proposed. As an inspection method using a sensor, for example, a method of directly adhering a strain gauge to a concrete structure to detect deterioration, installing a conductive wire inside or on the surface of the structure, and measuring the resistance value of the conductive wire. An evaluation method is disclosed (see Patent Documents 1 and 2).

JP-A-09-004048 JP, 2000-055748, A

  However, the inspection of the structure by hand has a large variation in accuracy, which may cause an oversight. Further, the manual inspection of the structure requires a great deal of time and cost, so the inspection frequency is low, and there is a risk of overlooking the deterioration of the structure in a dangerous situation. The conventional method using the sensor has a problem that the detection accuracy is not good. Further, it is necessary to prepare a power supply facility for supplying electric power to the sensor. On the other hand, when the sensor has a built-in power supply (battery), it is necessary to perform regular power supply management (battery replacement).

  In view of such a problem, one embodiment of the present invention has an object to improve the detection accuracy when an abnormality such as a crack occurs in a structure. Further, one embodiment of the present invention aims to solve the problem of power management of a device that detects an abnormality in a structure.

  A wiring board according to an embodiment of the present invention is a wiring board for detection attached to a structure, the board having an insulating surface, and a first end to a second end arranged on a first surface of the board. The substrate has at least one continuous wiring for detection, and the substrate is made more brittle than the structure.

  A structure abnormality detection device according to an embodiment of the present invention includes a power supply unit, a communication module, and a power supply control circuit that controls the power supply from the power supply unit to the communication module, the power supply control circuit, It has a detection signal input part connected to the detection wiring of the detection wiring board attached to the structure, and when an abnormal signal is input to the detection signal input part from the detection wiring, the power supply part A control unit that supplies power to the communication module is included.

  According to an embodiment of the present invention, by using a wiring board for detection made of a brittle substrate, it is possible to improve detection accuracy when an abnormality such as a crack occurs in a structure. In addition, a power supply control circuit is provided in the structure abnormality detection device, and when the detection wiring board detects an abnormality, power is supplied to the communication module to reduce power consumption and facilitate power management. can do.

It is a figure which shows the structure of the structure abnormality detection apparatus which concerns on one Embodiment of this invention. It is a figure which shows the structure of the power supply control circuit of the structure abnormality detection apparatus which concerns on one Embodiment of this invention. The structure of the wiring board for a detection which concerns on one Embodiment of this invention is shown, (A) is a top view, (B) shows sectional drawing. It is sectional drawing which shows the aspect of the wiring board for a detection which concerns on one Embodiment of this invention, (A) shows the cross section of a wiring board, (B) and (C) attaches a wiring board to a structure. Indicates. It is sectional drawing which shows the aspect of the wiring board for a detection which concerns on one Embodiment of this invention, (A) shows the cross section of a wiring board, (B) and (C) attaches a wiring board to a structure. Indicates. It is sectional drawing which shows the aspect of the wiring board for a detection which concerns on one Embodiment of this invention, (A) shows the cross section of a wiring board, (B) shows the step of attaching a wiring board to a structure. It is sectional drawing which shows the aspect of the wiring board for a detection which concerns on one Embodiment of this invention, (A) and (B) shows the cross section of a wiring board, (C) and (D) shows a wiring board as a structure. It shows the step of attaching to. It is a top view showing composition of a wiring board for detection concerning one embodiment of the present invention. It is a top view showing composition of a wiring board for detection concerning one embodiment of the present invention. It is a top view which shows one aspect which installs the wiring board for a detection which concerns on one Embodiment of this invention in a structure. It is a top view showing composition of wiring provided in a wiring board for detection concerning one embodiment of the present invention. It is a top view showing composition of a wiring board for detection concerning one embodiment of the present invention. It is a top view showing composition of a wiring board for detection concerning one embodiment of the present invention. It is a figure which shows the structure of the structure abnormality detection apparatus which concerns on one Embodiment of this invention. It is a figure which shows the structure of the structure abnormality detection apparatus which concerns on one Embodiment of this invention. It is a figure which shows the structure of the wiring board for a detection which concerns on one Embodiment of this invention, (A) is a perspective view which shows the whole structure, (B) is a top view which shows some wiring boards. . It is a figure which shows the structure of the structure abnormality detection system which concerns on one Embodiment of this invention. It is a figure which shows the structure abnormality detection apparatus which concerns on one Embodiment of this invention, and the one aspect | mode of the wiring board for a detection attached to a structure.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings and the like. However, the present invention can be implemented in many different modes, and should not be construed as being limited to the description of the embodiments illustrated below. In order to make the description clearer, the drawings may schematically show the width, thickness, shape, etc. of each part as compared with the actual mode, but this is merely an example and limits the interpretation of the present invention. Not a thing. In the present specification and each drawing, the same elements as those described in regard to the already-existing drawings are designated by the same reference numerals, and detailed description thereof may be appropriately omitted. Symbols such as “a” and “b” added to the end of the symbol may be used to identify the same element. Furthermore, the letters "first" and "second" added to each element are convenient signs used for distinguishing each element, and have no further meaning unless otherwise specified. .

  In the present specification, when a certain member or area is “above (or below)” another member or area, it is directly above (or immediately below) another member or area unless otherwise specified. Not only in some cases, but also in the case of being above (or below) another member or area, that is, including the case where another component is included above (or below) another member or area. .

  The substrate described in this specification has at least one planar main surface, and the detection wiring is provided on the one main surface. In the following description, in the cross-sectional view, when referring to the one main surface of the substrate as “upper”, “upper layer”, “upper” or “top surface” with respect to the substrate, one main surface of the substrate Will be used as a reference.

[First Embodiment]
FIG. 1 is a block diagram showing the configuration of a structure abnormality detection device 100 according to an embodiment of the present invention. The structure abnormality detection device 100 includes a power supply unit 102, a power supply control circuit 104, and a communication module 106. Further, the structure abnormality detection device 100 is connected to a wiring board that detects an abnormality of the structure to be monitored. In the structure abnormality detection device 100, the power supply control circuit 104 operates when an abnormality is detected by the detection wiring board. The power supply control circuit 104 supplies the power of the power supply unit 102 to the communication module 106, and the communication module 106 outputs information (or signal) notifying that an abnormality has occurred and notifies the administrator. The details of each unit and the operation of the present apparatus will be described below.

  In addition, in one embodiment of the present invention, the "structure" means, for example, road facilities, railway facilities, port facilities, airport facilities, transmission facilities, power transmission facilities, buildings (buildings, etc.), crafts, and other constructions. It is a thing. For example, in the case of road equipment and railway equipment, bridges, bridge piers, tunnels, slopes, and other road equipment accessories (display boards, traffic lights, overhead lines, etc.) are included. Further, the structure may be not only an artificial object, but also a natural object such as the ground, a mountain slope, and a rock.

  The power supply unit 102 supplies electric power necessary for the operation of the structure abnormality detection device 100. The power supply unit 102 is composed of a primary battery or a secondary battery. In addition to this, the power supply unit 102 may be configured by a method of combining a capacitor with an environmental power generation element such as a photovoltaic element (solar cell), a vibration power generation element, a thermoelectric power generation element, or a wireless power feeding method. In the embodiment of the present invention, the power supply unit 102 is mainly configured as an independent power supply (power supply provided independently), but may be connected to a commercial power system as another aspect.

  The communication module 106 outputs information (or a signal) that notifies the occurrence of an abnormality when an abnormality such as a crack, a partial collapse of a wall surface, or a seam shift occurs in a structure to be detected. The communication module 106 transmits information to the server apparatus 112 on the administrator side by an electric communication line such as a wireless LAN (Local Area Network), a wired LAN, or a wired or wireless telephone line. As another mode, the communication module 106 is configured to transmit information to the server apparatus 112 on the administrator side by intervening near field communication (for example, Bluetooth (registered trademark)) in a part of the communication network. May be.

  The communication module 106 having such a function performs a predetermined operation when power is supplied from the power supply unit 102 via the power supply control circuit 104. The predetermined operation includes, for example, an operation of outputting the alarm as described above. The communication module 106 may be configured to automatically output an alarm signal when a signal for detecting an abnormality is output from the sensor element based on the contents programmed in advance.

  In any case, the communication module 106 is not always supplied with power from the power supply unit 102, but is supplied with power according to the operation of the power supply control circuit 104, and is otherwise in a non-power-supply state. . In other words, the communication module 106 is not constantly supplied with power from the power supply unit 102, but the wiring board 122 for detection detects an abnormality, and the power supply control circuit 104 connects the power supply unit 102 to the power supply unit 102. When it is done, communication becomes possible.

  The power supply control circuit 104 is connected to the power supply unit 102 and the communication module 106. The power supply control circuit 104 controls the power supplied from the power supply unit 102 to the communication module 106. For example, the power supply control circuit 104 controls whether power is supplied from the power supply unit 102 to the communication module 106 or not.

  The power supply control circuit 104 has a connecting portion connected to the detection wiring board 122. The power supply control circuit 104 is connected to the detection wiring 124 provided on the detection wiring board 122 by the connecting portion. The power supply control circuit 104 operates so as to supply power from the power supply unit 102 to the communication module 106 in accordance with changes in the electrical characteristics of the wiring board 122 for detection. For example, when the detection wiring board 122 detects an abnormality such as a crack of a structure to be monitored, a partial collapse of a wall surface, or a seam shift, and the electrical characteristics of the detection wiring board 122 change ( For example, when the conductive state is the non-conductive state), the power supply control circuit 104 supplies power from the power supply unit 102 to the communication module 106.

  FIG. 2 shows an example of the power supply control circuit 104. The power supply control circuit 104 includes a regulator 118 and a switching element 120. The regulator 118 includes a switching circuit composed of transistors such as field effect transistors (MOSFETs). For example, the switching circuit is composed of a CMOS circuit, which reduces power consumption. The regulator 118 is connected to the switching element 120, and the operation of “powering” or “not powering” the power supply from the power supply unit 102 to the communication module 106 is controlled. In the present embodiment, the regulator 118 is configured to supply power when the switching element 120 is “on” (in the conductive state) and does not supply power when the switching element 120 is “off”.

  The switching element 120 is realized by a transistor such as a field effect transistor (MOSFET). In this embodiment, it is preferable to use a normally-on type MOSFET. That is, it is a depletion type that turns on (the drain and the source are conductive) when no voltage is applied to the gate, and turns off (the drain and the source is non-conductive) when a predetermined voltage is applied to the gate. It is preferable to use a MOSFET.

  One of the input terminals of the power supply control circuit 104 is connected to one terminal of the wiring board 122 for detection, which is a two-terminal element. This input terminal is a terminal connected to the gate of the switching element 120. The other terminal of the wiring board 122 for detection is connected to the output terminal of the power supply unit 102. That is, the two-terminal detection wiring board 122 is inserted in series between the gate of the switching element 120 and the output terminal of the power supply unit 102.

  FIG. 2 illustrates the function of the wiring board 122 for detection by replacing it with a switch. In the normal state (state where no abnormality is detected), the wiring board 122 for detection is in a state equivalent to the case where the switch is turned on, and shows that the voltage of the power supply unit 102 is applied to the gate of the switching element 120. Become. On the other hand, when the detection wiring board 122 detects an abnormality, a state equivalent to the case where the switch is turned off is formed, and in this case, the voltage of the power supply unit 102 is not applied to the gate of the switching element 120. It becomes a state. The wiring board 122 for detection, which can be turned on and off depending on whether or not there is an abnormality in the structure, can be regarded as an irreversible sensor. The details of the detection wiring board 122 that is preferably used in the embodiment of the present invention will be described later.

  In an embodiment of the present invention, a sensor element that detects a physical quantity such as acceleration, temperature, humidity, or pressure is used instead of the wiring board 122 for detection, and the value of the output signal of the sensor element is binarized. A function equivalent to that of the wiring board 122 for detection may be realized by a logic circuit that outputs a determination result of turning on or off.

  When the wiring board 122 for detection is in a normal state (state in which no abnormality is detected), the power supply voltage is applied to the switching element 120, so that the switching element 120 is turned off and the regulator 118 is not operated. On the other hand, when the detection wiring board 122 detects an abnormality, since the power supply voltage is not applied to the switching element 120, the switching element 120 is turned on and the regulator 118 is operated.

  The gate of the MOSFET used for the switching element 120 is insulated. Therefore, as shown in FIG. 2, even if a circuit for inputting the power supply voltage to the gate is formed, the power consumption is extremely low (ideally zero). As a result, the structure abnormality detection device 100 has extremely low power consumption in the normal state (state in which no abnormality is detected). Although a resistance element is shown in FIG. 2 in addition to the switching element 120, such a circuit element is appropriately provided and the configuration of the power supply control circuit 104 is not particularly limited.

  The power supply control circuit 104 has one or a plurality of connection parts connected to the detection wiring board 122. It is preferable that this connecting portion has a terminal structure that can repeatedly take both states of connecting and disconnecting the wiring board 122 for detection. For example, the wiring board 122 for detection and the power supply control circuit 104 are connected by a male / female connector, a clip, a solder connection, or the like. As a result, the wiring board 122 for detection can be easily replaced with the structure abnormality detection device 100.

  According to the structure abnormality detection device 100 according to the embodiment of the present invention, power is not supplied from the power supply unit 102 to the communication module 106 in a normal state where the detection wiring board 122 does not detect an abnormality. It becomes possible to do. Thus, when the power supply unit 102 is an independent power supply, the frequency of operations such as storage battery replacement and charging can be reduced, and maintenance costs can be reduced.

[Second Embodiment]
The present embodiment shows an aspect of a wiring board for detection that can be applied to the structure abnormality detection device 100 shown in the first embodiment. In one embodiment of the present invention, the detection wiring board is a wiring board including a substrate and a detection wiring provided on the substrate.

  3A and 3B show aspects of a wiring board that can be used as the wiring board 122 for detection according to the present embodiment. FIG. 3A is a plan view of the wiring board, and FIG. 3B shows a cross-sectional structure corresponding to the line AB shown in FIG.

  The wiring board 122 used for detecting the abnormality of the structure is provided with the wiring 124 on one main surface (one flat surface portion included in the board) of the highly brittle board 128. The wiring 124 is formed of a thin film of a conductor and provided in a predetermined pattern. The wiring board 122 includes at least a pair of terminals 126a and 126b and a wiring 124 connecting the pair of terminals.

  Such a wiring board 122 is provided so as to adhere to the structure to be detected. Preferably, the wiring board 122 is provided in close contact with the structure. The board 128 of the wiring board 122 for detection has brittleness equivalent to or higher than that of the structure to be attached. Therefore, when the structure is cracked or deformed, the wiring board 122 for detection is damaged. Since the detection wiring 124 provided on one main surface of the detection wiring board 122 is a thin film of a conductor, it breaks due to breakage of the board 128. Due to the disconnection of the wiring 124 for detection, the potential between the pair of terminals 126a and 126b fluctuates or the current is cut off. The wiring board 122 for detection can detect a change in the state of the object by breaking itself. For example, such a change in the electrical characteristics of the wiring board 122 for detection can be used as the switch shown in FIG.

  In the wiring substrate 122 for detection, the substrate 128 is made of a brittle material, and the wiring 124 for detection is provided on one main surface of the substrate 128. The wiring 124 for detection is provided so that when the base substrate 128 is broken, the wiring 124 is broken accordingly. The wiring board 122 for detection uses a resistance value between the terminals 126a and 126b or the presence or absence of conduction as a detection signal.

  For the substrate 128, a brittle material such as a synthetic resin material, a paper material, or a glass material is used. For example, a brittle film is used as the substrate 128. The brittle film is a film that is more brittle than a film made of a normal vinyl chloride resin, and has a property of being brittle and easily broken. The brittle film is a film containing a large amount of a plasticizer and a filler in a vinyl chloride resin, a mixed resin of a vinyl chloride resin and an acrylic resin, a filler of fused silica, aluminum hydroxide, or barium sulfate. A film filled with a large amount of is used.

  When a glass material is used as the substrate 128, a material having a breaking strength similar to that of the brittle film described above can be used. For example, as the substrate 128, a thin glass plate having a plate thickness of 0.5 mm or less, preferably 0.05 mm or less, for example 0.01 mm can be used.

Such brittleness of the substrate 128 preferably has a breaking strength of 0.5 N / mm to 100 N / mm and a breaking elongation of 10% or less. This value is sufficiently smaller than 400 N / mm ² which is the breaking strength of the reinforced concrete wall exemplified as a structure, and 0.1 mm (10%) of displacement (cracking) is locally generated at a length of 1 mm. ) Is the amount of elongation when it occurs. That is, the breaking strength of the substrate 128 preferably has a breaking strength comparable to or lower than the breaking strength of the structure to be detected. By setting the strength difference between the structure and the substrate 128 in such a range, when the structure is cracked or a part of the wall surface is damaged (falls off), the substrate 128 is broken to cause an abnormality. It becomes possible to detect.

  However, the brittleness of the substrate 128 also depends on the plate thickness. In other words, the sensitivity of the sensor can be adjusted by changing the thickness of the substrate 128. That is, if the thickness of the substrate 128 is thin, the sensitivity is high, and if it is thick, the sensitivity is low.

  The wiring 124 for detection is provided on one plane of the substrate 128. The wiring 124 for detection is formed by printing a conductive paste such as a silver paste or a conductive carbon paste. Further, the wiring 124 for detection is formed by etching a metal thin film, vacuum vapor deposition, or sputtering.

  The wiring 124 for detection is provided in a linear pattern on one main surface of the substrate 128 using such a conductive material. The detection wiring 124 has a pattern for connecting the terminals 126a and 126b. The pattern of the detection wiring 124 is arbitrary and is provided in a linear or curved pattern. For example, the detection wiring 124 is formed in a meandering pattern.

  In the detection wiring substrate 122, a region where the detection wiring 124 extends on one main surface of the substrate 128 serves as a sensing surface. The wiring board 122 for detection can detect the state change in a narrower area of the structure by increasing the density of the pattern formed by the wiring 124 for detection. On the other hand, when the density of the pattern formed by the wiring 124 for detection is lowered, it becomes possible to detect a relatively large state change in the structure. In this way, by varying the density of the wirings 124 for detection provided on one main surface of the substrate 128, the range of the detection target in the structure can be varied.

  The wiring board 122 for detection may be provided with a release film 132 on the other main surface side that faces one main surface of the board 128 on which the wiring 124 for detection is provided. The peeling film 132 is provided so as to be peelable from the substrate 128. Since the substrate 128 has high brittleness, the release film 132 can prevent the wiring substrate 122 for detection from being damaged before the construction. For example, the release film 132 is attached to the substrate 128 during the manufacturing process of the wiring substrate 122 for detection, the distribution process in the market, and the construction of the structure. After the wiring substrate 122 for detection is attached to the structure, the peeling film 132 is preferably peeled off from the substrate 128 in order to exhibit a function as a sensor for detecting abnormality. Thus, by using the release film 132, the wiring board 122 for detection can be easily handled and accidental damage can be prevented. Although not shown in FIG. 3B, an adhesive layer may be formed between the substrate 128 and the release film 132.

  FIGS. 4A to 4C show a method of attaching the detection wiring substrate 122 to the structure. In FIG. 4A, a sticking member 134 is provided on one surface of the structure 140. The attaching member 134 is a member having adhesiveness or adhesiveness such as an adhesive material, an adhesive sheet, an adhesive material, or an adhesive sheet. The construction surface of the structure 140 on which the attaching member 134 is provided may be either a flat surface or a curved surface, or may be a corner portion. The construction surface of the structure 140 may be subjected to primer processing or the like so that the attaching member 134 is in close contact.

  Here, the adhesive material is generally in a semi-solid state with high viscosity and low elastic modulus, and maintains the state or a state close to the initial state even after the joint formation, and the adhesive material after joining the non-adhesive materials. It is solidified by a chemical reaction and exhibits a relatively high adhesive strength at the adhesive interface. As the adhesive material, a rubber-based, acrylic-based or silicone-based adhesive material can be applied. As the adhesive material, an acrylic resin-based, urethane resin-based, epoxy resin-based, silicone resin-based, or vinyl chloride resin-based adhesive material can be applied. As the adhesive material, various kinds of adhesive materials such as photo-curing type and thermosetting type can be applied. The adhesive sheet is a sheet-shaped adhesive material, and the adhesive sheet is a sheet-shaped adhesive material.

  The attaching member 134 is provided with an area substantially the same as or larger than that of the wiring board 122 for detection. As a result, the wiring board 122 for detection is stably fixed to the structure 140. On the other hand, as another aspect, the attaching member 134 may be provided in a stripe shape or a dot shape to fix the detection wiring board 122. Such a configuration will be described later in this embodiment.

  FIG. 4B shows a step of attaching the detection wiring substrate 122 to the structure 140. The wiring board 122 for detection is provided so that the surface on which the wiring 124 for detection is provided is in close contact with the attaching member 134. Since the detection wiring 124 is provided so as to be embedded in the attaching member 134, the detection wiring 124 has a structure not exposed to the outer surface. As a result, the wiring 124 for detection is protected by the substrate 128, damage due to an action from the outside can be prevented, and careless disconnection can be prevented. In other words, the detection wiring 124 used for detecting abnormality is provided between the substrate 128 and the attaching member 134, so that the wiring can be prevented from being broken due to a cause other than the laceration of the substrate 128. .

  When the attaching member 134 is an adhesive material or an adhesive sheet, the wiring substrate 122 for detection is brought into close contact with the adhesive member or the adhesive sheet, and then a curing process is performed. For example, when the attaching member 134 is a photo-curing type adhesive material or an adhesive sheet, a curing process is performed by light irradiation, and the adhesive force is increased. Further, when the pasting member 134 is a thermosetting adhesive material or an adhesive sheet, the heat treatment increases the adhesive force.

  FIG. 4C shows a step of peeling the peeling film 132. The peeling film 132 is used as a protective member so as not to damage the substrate 128 when the wiring substrate 122 for detection is attached to the structure 140. Since the brittle substrate 128 is supported by the attaching member 134 at this stage, the substrate 128 is stably held as long as the structure 140 is not cracked or otherwise abnormal. At this stage, the adhesive material or the adhesive sheet may be cured. The release film 132 provided on the substrate 128 may be omitted.

  In this way, the wiring board 122 for detection is provided on the structure 140. According to this embodiment, since the detection wiring board 122 is provided with the detection wiring 124 on the substrate 128 in advance, there is an advantage that the construction is easy. Even if the structure 140 has a step or a seam, the wiring member 122 for detection is fixed by the attaching member 134, which facilitates the construction.

  On the other hand, in the conventional method of directly forming a conductive paint on a structure, it is difficult to place the structure on the irregularities and joints of the structure, and it is necessary to form a thin detection wiring due to a workplace problem. Is difficult. Therefore, there are problems that fine cracks cannot be detected and workability of construction is extremely poor. On the other hand, according to the present embodiment, by providing the detection wiring 124 on the flat substrate 128, it is easy to miniaturize the detection wiring 124. Furthermore, construction can be performed on a portion of the structure 140 that has irregularities or seams, and construction workability is greatly improved.

[Third Embodiment]
In this embodiment, another example of a wiring board for detection and an example of construction on a structure will be described with reference to FIGS. 5 (A) to 5 (C).

  FIG. 5A shows a wiring board 122 for detection. The wiring board 122 for detection has a wiring 124 for detection provided on one main surface of the substrate 128, and a sticking member 134 so as to embed the wiring 124 for detection. That is, in the wiring substrate 122 for detection according to the present embodiment, the pasting member 134 is provided in advance on the substrate 128 side. The attaching member 134 is a member having adhesiveness or adhesiveness such as an adhesive material, an adhesive sheet, an adhesive material, and an adhesive sheet, as in the second embodiment. A peeling film 132a may be provided on the substrate 128, and a peeling film 132b may be further provided on the upper surface of the attaching member 134 at a stage before the construction. Since the sticking member 134 has a thickness of at least several micrometers to several tens of micrometers, it serves as a protective film for the wiring 124 for detection in a state before construction.

  FIG. 5B shows a step of providing the wiring board 122 for detection on the structure 140. If the release film 132b is provided on the detection wiring substrate 122, the release film 132b is peeled off to expose the attaching member 134 and then brought into contact with the construction surface of the structure 140. After that, as shown in FIG. 5C, the release film 132a on the substrate 128 side is released. The steps of FIGS. 5B and 5C are the same as those of the second embodiment.

  According to this embodiment, in addition to the same effects as those of the second embodiment, the attachment member 134 is provided on the wiring board 122 for detection, so that construction on the structure becomes easier.

[Fourth Embodiment]
In the present embodiment, another mode of a wiring board for detection and an example of construction on a structure will be described with reference to FIGS. 6 (A) and 6 (B).

  FIG. 6A shows the wiring board 122 for detection. The wiring board 122 for detection has a sticking member 134 on one main surface of the board 128, and the wiring 124 for detection on the other surface. Note that the protective layer 135 may be provided so as to cover the surface of the detection wiring 124. That is, in the wiring substrate 122 for detection according to the present embodiment, the pasting member 134 is provided in advance on the substrate 128 side. The attaching member 134 is a member having adhesiveness or adhesiveness such as an adhesive material, an adhesive sheet, an adhesive material, and an adhesive sheet, as in the second embodiment. A peeling film 132 is provided on the attaching member 134.

  FIG. 6B shows a step of providing the wiring board 122 for detection on the structure 140. When the release film 132 is provided, the wiring substrate 122 for detection is peeled off to expose the attaching member 134 and then brought into contact with the construction surface of the structure 140.

  According to this embodiment, in addition to the same effects as those of the second embodiment, the attachment member 134 is provided on the wiring board 122 for detection, so that construction on the structure becomes easier.

[Fifth Embodiment]
In this embodiment, one mode in which an easy-adhesion layer is used as the substrate 128 will be described with reference to FIGS. The easy-adhesion layer can be formed from a paint called an anchor agent or a primer. Examples of the anchor agent and the primer agent include polyurethane resin, polyester resin, polyvinyl chloride resin, polyvinyl acetate resin, vinyl chloride-vinyl acetate copolymer, acrylic resin, polyvinyl alcohol resin, polyvinyl acetal resin, ethylene. With vinyl acetate or acrylic acid, a copolymer with ethylene and styrene and / or butadiene, a thermoplastic resin such as an olefin resin and / or a modified resin thereof, a polymer of a photopolymerizable compound, and At least one of thermosetting resins such as epoxy resin can be used.

  FIG. 7A illustrates a step of providing the easy-adhesion layer 130 and the wiring 124 for detection on the peeling film 132. As the release film 132, a paper material, a plastic film (for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polytrimethylene terephthalate (PTT), polybutylene naphthalate (PBN), etc.) is used. The wiring 124 for detection is provided on the easy-adhesion layer 130. The wiring 124 for detection is formed by printing a conductive paste such as a silver paste or a conductive carbon paste. Further, the wiring 124 for detection is formed by providing a metal film on substantially the entire surface of the easy-adhesion layer 130 by a vacuum deposition method or a sputtering method. A protective film may be provided so as to cover the detection wiring 124. For example, a silicon nitride film or a silicon oxide film may be provided as a protective film for the wiring 124 for detection. By providing such an insulating film, it is possible to prevent corrosion of the detection wiring 124.

  As shown in FIG. 7B, a pasting member 134 is provided on the upper layer side of the detection wiring 124. The attaching member 134 is an adhesive material, an adhesive sheet, an adhesive material, or an adhesive sheet, and is provided on substantially the entire surface of the easy-adhesion layer 130. Although not shown, a release film may be further provided on the upper surface of the attaching member 134. In the present embodiment, the detection wiring board 122 has a form in which the detection wiring 124 is provided on the easy-adhesion layer 130.

  FIG. 7C shows a step of attaching the detection wiring substrate 122 to the structure 140. When the release film is provided on the upper surface of the attaching member 134, the wiring substrate 122 for detection is removed and attached to the structure 140. After that, as shown in FIG. 7D, the peeling film 132 on the side of the easy-adhesion layer 130 is peeled off. The steps of FIGS. 7C and 7D are substantially the same as those of the second embodiment.

  In addition, in order to prevent the peeling film 132 from being easily peeled during the attaching operation to the structure 140 and to facilitate the peeling of the peeling film 132 after the attaching operation to the structure 140, the easy-adhesion layer 130 is thermally reacted or It is desirable that the adhesive layer is a UV-reactive type, and that it is easily peeled off by applying heat or irradiating UV rays.

  According to this embodiment, in addition to the same effects as those of the second embodiment, when the detection wiring board 122 is installed on the structure 140, there is no peeling film 132 or a brittle board. Therefore, it becomes easier to detect an abnormality such as a crack of the structure 140.

[Sixth Embodiment]
The present embodiment shows one mode in which the attaching member 134 is provided by being divided into a plurality of regions in the wiring substrate 122 for detection shown in the second to fifth embodiments.

  FIG. 8 shows a mode in which the attaching member 134 is provided in a stripe shape on the wiring board 122 for detection. Further, FIG. 9 shows a mode in which the attaching members 134 are provided in an island shape or a dot shape on the detection wiring board 122. The attaching member 134 is provided in a plurality of areas on the substrate 128 or the easy-adhesion layer 130 on which the detection wiring 124 is provided. That is, the detection wiring substrate 122 includes a region where the substrate 128 or the easy-adhesion layer 130 is attached to the structure 140 via the attaching member 134 and a region which is not directly fixed to the structure 140.

  With such a configuration of the attaching member 134, as shown in FIG. 10, a wiring board for detection is provided so that the attaching member 134 is not arranged at the joint 142 of the structure 140 (the structures 140a and 140b). 122 may be provided. A region of the detection wiring board 122 where the pasting member 134 is not provided is in a state of being floated from the structure 140, so that it is easier to follow an abnormality such as a crack of the structure, a fluctuation, or a displacement. The mode of the pasting member 134 is not limited to the modes shown in FIGS. 8 and 9, and may have other modes as long as the configuration is provided discretely.

[Seventh Embodiment]
The present embodiment shows one mode of the detection wiring 124 provided on the detection wiring substrate 122 shown in the second to fifth embodiments.

  FIG. 11 shows one mode of the wiring 124 for detection. The detection wiring 124 includes a region in which the wiring width of at least one position on the line is narrower than the wiring width of other regions. In the detection wiring 124, a plurality of regions having narrow wiring widths may be provided. As described above, by providing the region in which the wiring width of the detection wiring 124 is narrowed, it becomes easy to follow an abnormality such as a crack generated in the structure 140, a fluctuation, or a displacement. That is, the sensitivity of the wiring board 122 for detection can be increased.

[Eighth Embodiment]
The present embodiment shows another mode of the substrate 128 used as the wiring substrate 122 for detection in the second and third embodiments.

  FIG. 12 shows a form in which the notch 136 is provided in a part of the substrate 128. The notch 136 is provided at one place or a plurality of places, and is provided at a predetermined depth from the end of the substrate 128 so that the detection wiring is not broken. Further, FIG. 13 shows a form in which the opening 138 is provided in the surface of the substrate 128. The opening 138 is an opening that penetrates the substrate 128, and is provided at one place or a plurality of places. The opening 138 is provided between the wirings of the substrate 128.

  By providing the notch 136 and the opening 138 in the substrate 128 as described above, stress is concentrated on the portion due to abnormality, fluctuation, or displacement such as cracks generated in the structure 140, and the substrate 128 is easily broken. . That is, the wiring 124 for detection is easily cut, and the sensitivity of the wiring board 122 for detection can be increased.

[Ninth Embodiment]
The present embodiment shows one mode in which a plurality of wiring boards 122 for detection are provided in the structure abnormality detection device 100. In the present embodiment, parts different from the first embodiment will be described.

  FIG. 14 shows a structure of the structure abnormality detection device 100b according to this embodiment. The structure abnormality detection device 100b includes a determination circuit 108 in addition to the power supply unit 102, the power supply control circuit 104, and the communication module 106. A plurality of wiring boards for detection are connected to the determination circuit 108. In FIG. 14, the wiring boards 122a to 122d for detection are illustrated.

  The determination circuit 108 includes a circuit that determines which of the plurality of wiring boards 122 for detection has the wiring cut. The determination circuit 108 outputs a signal for operating the power supply control circuit 104 when a disconnection of wiring is detected in at least one of the plurality of wiring boards 122 for detection. As a result, the power supply control circuit 104 operates to supply the power of the power supply unit 102 to the communication module 106, similarly to the operation of detecting an abnormality in the first embodiment. The communication module 106 that has been supplied with power transmits the occurrence of abnormality to the monitoring server or the like.

  Although FIG. 14 shows a plurality of wiring boards 122 for detection, a plurality of wirings 124 for detection may be provided on one board 128 instead of such a mode. That is, wiring patterns that connect a pair of terminals may be provided at a plurality of locations on the substrate 128.

  Further, the discrimination circuit 108 may include an address discrimination circuit that discriminates which of the plurality of wiring boards 122 for detection has an abnormality. Accordingly, it becomes possible to specify in which part of the structure 140 the abnormality has occurred. This facilitates confirmation when an abnormality occurs in the structure 140.

[Tenth Embodiment]
The present embodiment shows a mode in which a plurality of detection wirings are provided on one detection wiring substrate 122 in the structure abnormality detection device 100b shown in the ninth embodiment.

  As shown in FIG. 15, the structure abnormality detection device 100b includes a power supply unit 102, a power supply control circuit 104, a communication module 106, and a determination circuit 108. The detection wiring board 122 is provided with first wirings 124a and second wirings 124b as detection wirings. The first wiring 124a and the second wiring 124b provided on the wiring board 122 for detection are connected to the determination circuit 108, respectively.

  In the wiring board 122 for detection, the first wiring 124a and the second wiring 124b are electrically insulated. That is, even if one of the first wiring 124a and the second wiring 124b is disconnected, the other can be in a conductive state. It is preferable that the first wiring 124a and the second wiring 124b are provided so as to have different line widths. For example, it is preferable to set the line width of the first wiring 124a to 0.2 mm and the line width of the second wiring 124b to 1.0 mm so that the two wirings for detection have different line widths. The difference between the line widths of the first wiring 124a and the second wiring 124b is that the regions of the minimum line width provided in a part of the detection wiring are different, as shown in the seventh embodiment. Good.

  In this way, the ease of disconnection can be made different by making the wiring width different. That is, it is possible to make the detection sensitivity different by making the wiring width different, and to discriminate a plurality of abnormal states by the wiring board 122 for detection. Accordingly, when an abnormality such as a crack occurs in the structure 140, the degree of the abnormality can be determined.

  Both the first wiring 124a and the second wiring 124b are provided on the substrate 128, but as shown in FIG. 15, they may be provided so that both wiring patterns interlock. With such a configuration, it is possible to determine the degree of abnormality at the same location on the structure 140.

[Eleventh Embodiment]
The present embodiment shows one mode of a wiring board for detection. 16A and 16B show a wiring substrate 122 for detection according to an embodiment of the present invention. As shown in FIG. 16A, a wiring board 122d for detection is provided with a wiring 124 continuous to a long board 128. The long wiring board 122d for detection may be provided in a rolled state. A release sheet may be provided on the surface of the substrate 128 opposite to the surface on which the detection wiring is provided and / or on the surface on the side on which the detection wiring is provided.

  FIG. 16B is a plan view showing a part of the long detection wiring substrate 122. The pattern of the detection wiring 124 provided on the substrate 128 is arbitrary, but for example, the pattern of the detection wiring 124 that bends in a meandering shape is continuously provided. A terminal 126 is provided at an end of the substrate 128 in the width direction. The terminals 126 are provided at one end of the substrate 128 in the width direction or at both ends. A plurality of terminals 126 are provided at arbitrary intervals, and each terminal 126 is connected to the wiring 124d for detection.

  The detection wiring board 122 can be cut at any position in the longitudinal direction of the board 128. For example, as shown in FIG. 16B, by cutting the board 128 at the positions D1-D2 and D3-D4, the wiring board 122 for long detection is used for detection of a predetermined length. The wiring board 122 can be taken out. In this case, in the wiring board 122 for detection, the terminal 126a and the terminal 126b form a pair of terminals.

  As described above, by using a long wiring board for detection, the board can be cut into an arbitrary length according to the area of the surface to be detected of the structure and used as a wiring board for detection.

[Twelfth Embodiment]
The present embodiment shows an example of a structure abnormality detection system including a structure abnormality detection device and a server device.

  FIG. 17 shows an example of the structure abnormality detection system 101. In the structure abnormality detection system 101, the structure abnormality detection device 100 is connected to a server device 112 and a server device on the administrator side by an electric communication line such as a wireless LAN, a wired LAN, a wired or wireless telephone line. Specifically, the communication module 106 of the structure abnormality detection device 100 is connected to the server device via an electric communication line.

  The structure abnormality detection device 100 is connected to the detection wiring board 122 attached to the structure 140. When the power supply control circuit 104 detects that an abnormality has occurred in the structure 140 by the detection wiring board 122 (that is, when the detection wiring of the detection wiring board 122 is broken), the power supply unit 102. Power is supplied to the communication module 106. The communication module 106 outputs information (signal) indicating the occurrence of abnormality to the server device 112.

  The server device 112 may be connected to the terminal device 114 on the administrator side. When the server device 112 receives the information (signal) indicating the occurrence of the abnormality from the structure abnormality detection device 100, the server device 112 outputs the information to the terminal device 114. Further, the server device 112 may be configured to be connected to the database 116 and store the history of receiving the information (signal) of the abnormality occurrence. Note that FIG. 17 shows a mode in which the communication module 106 is connected to the server device 112, but the illustrated mode is an example, and the present invention is not limited to this. For example, the terminal device 114 and the relay station may be interposed between the communication module 106 and the server device 112. The server device 112 may be connected to the plurality of communication modules 106.

  The structure abnormality detection device 100 may be connected to the display device 110 that displays the occurrence of an abnormality. The display device 110 is connected to the communication module 106 and displays the occurrence of an abnormality. The display device 110 is installed in the structure 140 itself or in the vicinity thereof. The display device 110 is composed of a warning light such as an electric bulletin board or a patrol light (registered trademark) so that the viewer can visually recognize the abnormality of the structure, and may be accompanied by an alarm sound or a sound. .

  The structure abnormality detection device 100 includes the communication module 106, so that the structure abnormality detection device 100 is installed at a location away from the server device 112. Since the structure abnormality detection device 100 is connected to the detection wiring board 122, the structure abnormality detection device 100 is installed in the structure 140 itself to be detected or in the vicinity thereof.

  FIG. 18 shows an example in which the structure abnormality detection device 100 is installed on a pier 144 of a road facility or a railway facility. As shown in the ninth embodiment, the structure abnormality detection device 100 is connected to a plurality of detection wiring boards 122a to 122d. The wiring boards 122a to 122d for detection are installed at arbitrary places and installed on the pier 144 and the bridge 146. When the structure abnormality detection device 100 detects an abnormality in the bridge pier 144 and the bridge 146 by the wiring boards 122a to 122d for detection, the structure abnormality detection device 100 outputs the abnormality to the server device through the electric communication line. In this case, the structure abnormality detection device 100 may communicate with a wireless base station near a road facility or a railway facility and communicate with the server device via this wireless base station.

  The wiring board 122 for detection can detect peeling of wall surfaces, cracks, displacement or cutting of joints, and the like of bridges and bridge piers. Although FIG. 18 shows an example in which the wiring board 122 for detection is installed on the bridge 146 and the bridge pier 144, in addition to these, an iron pillar that supports structures such as tunnels, slopes, signals, cables, signs, etc. The wiring board 122 for detection may be installed on such a structure. By installing the wiring board 122 for detection on the entire road equipment or railway equipment and connecting it to the structure abnormality detection device 100, it is possible to form a monitoring network and monitor the entire road equipment or the like. Becomes

  According to the present embodiment, the wiring board 122 for detection used as a sensor does not require an active element and is composed of a wiring pattern, so that power consumption during operation is extremely low. Further, the structure abnormality detection device is configured so that the communication module operates when an abnormality occurs. Therefore, power management of the structure abnormality detection device provided in the structure becomes easy.

Reference numeral 100 ... Structural abnormality detection device, 101 ... Structural abnormality detection system 102 ... Power supply unit, 104 ... Power supply control circuit, 106 ... Communication module, 108 ... Discrimination circuit, 110 ... Display device, 112 ... Server device, 114 ... Terminal device, 116 ... Database, 118 ... Regulator, 120 ... Switching element, 122 ... Wiring board, 124 ... Wiring, 126 ... Terminal, 128 ... Substrate, 130 ... Easy adhesive layer, 132 ... Release film, 134 ... Adhesive member, 135 ... Protective layer, 136 ... Notch 138 ... Openings, 140 ... Structures, 142 ... Seams, 144 ... Piers, 146 ... Bridges

Claims (21)

A wiring board for detection attached to a structure,
A substrate having an insulating surface, and at least one detection wiring that is arranged on the first surface of the substrate and that is continuous from the first end to the second end ;
A pasting member for embedding the detection wiring on the first surface of the substrate,
The said board | substrate is high brittleness compared with the said structure, The wiring board characterized by the above-mentioned.   The wiring board according to claim 1, further comprising a release film that can be peeled from the substrate on a second surface of the substrate that faces the first surface.   The wiring board according to claim 1, wherein the wiring for detection is broken together with the board when the board is broken.   The wiring board according to claim 1, wherein the substrate is a brittle film.   The wiring board according to claim 1, wherein the substrate is an easy-adhesion layer. The joining member is provided to divide the area of the multiple wiring board according to claim 1. The wiring board according to claim 1, wherein the attaching member is provided in an island-shaped, stripe-shaped, or grid-shaped pattern.   The wiring board according to claim 1, wherein the detection wiring has a line bent in a meandering shape.   The wiring board according to claim 1, wherein the detection wiring includes a region having a first wiring width and a region having a second wiring width narrower than the first wiring width.   The detection wiring includes a first wiring having a first wiring width and a second wiring having a wiring width larger than the first wiring width, and the first wiring and the second wiring are electrically conductive. The wiring board according to claim 1, which is electrically insulated.   The wiring board according to claim 1, wherein the board includes a slit, a notch, or an opening.   The wiring board according to claim 1, wherein the board is a long board wound in a roll shape, and the detection wiring is continuously provided in a longitudinal direction of the long board.   The wiring board according to claim 12, wherein the long board can be divided into an arbitrary length together with the detection wiring. A wiring board according to any one of claims 1 to 13,
A power supply unit, a communication module, and a power supply control circuit that controls power supply from the power supply unit to the communication module,
The power supply control circuit includes a detection signal input portion connected to the sensing wire having said wiring board for sensing which is attached to the structure, from the detection of the wiring to the detection signal input unit A structure abnormality detecting device comprising: a control unit that supplies power from the power supply unit to the communication module when an abnormality signal is input. The structure abnormality detection device according to claim 14 , wherein the abnormality signal is generated by disconnection of the detection wiring. The structure abnormality detection device according to claim 14 , wherein the detection signal input unit has a connection terminal that is detachable from the detection wiring. The structure abnormality detection device according to claim 14 , wherein the power supply unit applies a voltage to the detection wiring. The structure abnormality detection device according to claim 14 , wherein the communication module is supplied with power from the power supply unit and transmits an abnormality detection signal. 15. The structure according to claim 14 , wherein the detection wiring includes at least a first detection wiring and a second detection wiring arranged in parallel with the first detection wiring. Object abnormality detection device. A structure abnormality detection device according to any one of claims 14 to 19 ,
A structure abnormality detection system including a monitoring server placed in a state of being communicable with the communication module. The structure abnormality detection system according to claim 20 , further comprising an alarm unit that notifies an abnormality when power is supplied to the communication module.

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