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JP6586535B2 - 蒸発源及び成膜装置 - Google Patents

蒸発源及び成膜装置 Download PDF

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Publication number
JP6586535B2
JP6586535B2 JP2018558778A JP2018558778A JP6586535B2 JP 6586535 B2 JP6586535 B2 JP 6586535B2 JP 2018558778 A JP2018558778 A JP 2018558778A JP 2018558778 A JP2018558778 A JP 2018558778A JP 6586535 B2 JP6586535 B2 JP 6586535B2
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JP
Japan
Prior art keywords
evaporation source
nozzle
opening
reflector
top surface
Prior art date
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Active
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JP2018558778A
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English (en)
Japanese (ja)
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JPWO2018199184A1 (ja
Inventor
寿充 中村
寿充 中村
健児 星川
健児 星川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
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Publication date
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Publication of JPWO2018199184A1 publication Critical patent/JPWO2018199184A1/ja
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Publication of JP6586535B2 publication Critical patent/JP6586535B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
JP2018558778A 2017-04-26 2018-04-25 蒸発源及び成膜装置 Active JP6586535B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017087570 2017-04-26
JP2017087570 2017-04-26
PCT/JP2018/016861 WO2018199184A1 (fr) 2017-04-26 2018-04-25 Source d'évaporation et dispositif de dépôt de film

Publications (2)

Publication Number Publication Date
JPWO2018199184A1 JPWO2018199184A1 (ja) 2019-06-27
JP6586535B2 true JP6586535B2 (ja) 2019-10-02

Family

ID=63919863

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018558778A Active JP6586535B2 (ja) 2017-04-26 2018-04-25 蒸発源及び成膜装置

Country Status (4)

Country Link
JP (1) JP6586535B2 (fr)
KR (1) KR102234985B1 (fr)
CN (1) CN110573647B (fr)
WO (1) WO2018199184A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020126041A1 (fr) * 2018-12-21 2020-06-25 Applied Materials, Inc. Appareil de dépôt en phase vapeur et procédé de revêtement d'un substrat dans une chambre sous vide
CN109652773B (zh) * 2019-02-25 2021-01-22 京东方科技集团股份有限公司 一种防着组件以及蒸镀设备
JP2020132985A (ja) * 2019-02-25 2020-08-31 株式会社アルバック 真空処理装置及び真空処理方法
CN110499492A (zh) * 2019-09-19 2019-11-26 京东方科技集团股份有限公司 一种蒸镀装置及其蒸镀方法
WO2021107224A1 (fr) * 2019-11-29 2021-06-03 엘지전자 주식회사 Appareil de dépôt
CN113122808B (zh) * 2020-01-13 2025-04-04 上海升翕光电科技有限公司 蒸镀装置
US11552283B2 (en) * 2020-08-04 2023-01-10 Applied Materials, Inc. Method of coating a flexible substrate in a R2R deposition system, and vapor deposition system
CN115522167B (zh) * 2022-09-22 2024-07-26 京东方科技集团股份有限公司 一种蒸镀源设备

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1505167B1 (fr) * 2003-08-04 2014-09-17 LG Display Co., Ltd. Source d'évaporation
KR101128745B1 (ko) * 2007-09-10 2012-03-27 가부시키가이샤 알박 증기 방출 장치, 유기 박막 증착 장치 및 유기 박막 증착 방법
KR101181680B1 (ko) * 2007-11-05 2012-09-19 가부시키가이샤 알박 증착원, 유기 ｅｌ 소자의 제조 장치
JP5244723B2 (ja) * 2009-07-10 2013-07-24 株式会社日立ハイテクノロジーズ 成膜装置
KR101760897B1 (ko) 2011-01-12 2017-07-25 삼성디스플레이 주식회사 증착원 및 이를 구비하는 유기막 증착 장치
JP5492120B2 (ja) * 2011-03-08 2014-05-14 株式会社日立ハイテクノロジーズ 蒸発源および蒸着装置
JP2012207263A (ja) * 2011-03-29 2012-10-25 Hitachi High-Technologies Corp 蒸着方法および蒸着装置
JP5520871B2 (ja) * 2011-03-31 2014-06-11 株式会社日立ハイテクノロジーズ 蒸着装置
US20130189424A1 (en) * 2011-06-29 2013-07-25 Sadayuki Okazaki Heating apparatus, vacuum-heating method and method for manufacturing thin film
JP2013211137A (ja) * 2012-03-30 2013-10-10 Samsung Display Co Ltd 真空蒸着方法及びその装置
JP2013211138A (ja) * 2012-03-30 2013-10-10 Hitachi High-Technologies Corp 蒸発源、及びそれを用いた真空蒸着装置
JP2014047382A (ja) * 2012-08-30 2014-03-17 Canon Tokki Corp 蒸発源
JP2014072005A (ja) * 2012-09-28 2014-04-21 Hitachi High-Technologies Corp 蒸発源、真空蒸着装置及び有機ｅｌ表示装置製造方法
JP2015067847A (ja) * 2013-09-27 2015-04-13 株式会社日立ハイテクファインシステムズ 真空蒸着装置
KR102386658B1 (ko) * 2015-08-03 2022-04-14 삼성디스플레이 주식회사 증착원
JP6595568B2 (ja) * 2017-12-12 2019-10-23 キヤノントッキ株式会社 蒸発源装置及び蒸着装置

Also Published As

Publication number Publication date
CN110573647A (zh) 2019-12-13
KR102234985B1 (ko) 2021-04-01
WO2018199184A1 (fr) 2018-11-01
JPWO2018199184A1 (ja) 2019-06-27
KR20190132683A (ko) 2019-11-28
CN110573647B (zh) 2021-10-08

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