JP6575641B1 - シャワーヘッドおよび処理装置 - Google Patents
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- 239000007789 gas Substances 0.000 claims description 276
- 230000002093 peripheral effect Effects 0.000 claims description 31
- 238000007599 discharging Methods 0.000 claims description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 abstract description 115
- 230000000694 effects Effects 0.000 description 12
- 239000010408 film Substances 0.000 description 10
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000000654 additive Substances 0.000 description 6
- 230000000996 additive effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000009530 blood pressure measurement Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 3
- 229910001882 dioxygen Inorganic materials 0.000 description 3
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 3
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 3
- 238000004380 ashing Methods 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45587—Mechanical means for changing the gas flow
- C23C16/45591—Fixed means, e.g. wings, baffles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
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- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
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- Manufacturing & Machinery (AREA)
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- Plasma & Fusion (AREA)
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- Chemical Vapour Deposition (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
被処理体に対向する側に多数のガス噴出穴を有し、前記被処理体に対してガスを供給するシャワーヘッドであって、
前記シャワーヘッドの前記被処理体に対向する面に、前記ガスが噴き出さない領域を、前記シャワーヘッドの外周部から前記シャワーヘッドの中心部に延びるように複数備え、
前記ガスが噴き出さない領域に挟まれた領域に、前記ガス噴出穴が形成された、ことを特徴としている。
前記ガスは、異なる種類の複数のガスであり、
前記シャワーヘッドの前記被処理体に対向する側に、異なる種類のガスをそれぞれ供給するガス噴出穴が備えられた、ことを特徴としている。
前記シャワーヘッドの前記被処理体に対向する側に、前記シャワーヘッドの外側から前記シャワーヘッドの中心部に延びる排気方向制御板が立設された、ことを特徴としている。
前記シャワーヘッドは、前記被処理体に対向する側に、前記シャワーヘッドの外周に沿って立設する排気特性制御板を備える、ことを特徴としている。
被処理体が配置される処理チャンバと、
前記処理チャンバに備えられ、前記被処理体が載置されるステージと、
前記ステージ上に載置された前記被処理体と対向して備えられ、前記被処理体に対してガスを供給するシャワーヘッドと、を備え、
前記シャワーヘッドの前記被処理体と対向する面には、前記ガスが噴き出さない領域が、前記シャワーヘッドの外周部から前記シャワーヘッドの中心部に延びるように複数備えられ、
前記ガスが噴き出さない領域に挟まれた領域に、前記ガスが噴き出すガス噴出穴が複数形成された、ことを特徴としている。
前記ガスは、異なる種類の複数のガスであり、
前記シャワーヘッドの前記被処理体に対向する側に、異なる種類のガスをそれぞれ供給するガス噴出穴が備えられた、ことを特徴としている。
前記シャワーヘッドの前記被処理体に対向する側に、前記シャワーヘッドの外側から前記シャワーヘッドの中心部に延びる排気方向制御板が立設された、ことを特徴としている。
前記シャワーヘッドまたは前記処理チャンバに、前記シャワーヘッドの外周に沿って立設する排気特性制御板を備えた、ことを特徴としている。
前記シャワーヘッドは、前記被処理体と向かい合う側の面が円形であり、
前記処理チャンバには、前記ガスが排出されるスリットが形成された板が、前記シャワーヘッドの外周に沿って、前記被処理体の側面と向かい合うように、備えられ、
前記スリットが形成された板は、前記シャワーヘッドの前記被処理体と向かい合う側の面の中心を軸として回転可能に支持された、ことを特徴としている。
1a…ガス噴出穴、1b…排出ガス流路部(ガスが噴き出さない領域)
2、10、13、16、18、22、23、26…オゾン処理装置(処理装置)
3…ウェハ(被処理体)
4…処理チャンバ
5…回転導入機
6…回転ステージ
7、11…ガス供給口
8…排気口
9…シャワーヘッド
9a…第1シャワーヘッド、9b…第2シャワーヘッド
9c…ガス噴出穴
9d、9g…排出ガス流路部(ガスが噴き出さない領域)
9e…第1ガス噴出穴、9f…第2ガス噴出穴、9h…突出部
12、15、17、21…シャワーヘッド
14…排気方向制御板
19…排気特性制御板、19a…壁部
20…空間部
24…回転スリット、24a…壁部、24b…スリット
25…2軸の回転導入機
Claims (7)
- 被処理体に対向する側に多数のガス噴出穴を有し、前記被処理体に対してガスを供給するシャワーヘッドであって、
前記シャワーヘッドの前記被処理体に対向する面に、前記ガスが噴き出さない領域を、当該シャワーヘッドの外周部から当該シャワーヘッドの中心部に延びるように複数備え、
前記ガスが噴き出さない領域に挟まれた領域に、前記ガス噴出穴が形成され、
前記シャワーヘッドの前記被処理体に対向する側に、当該シャワーヘッドの中心部から当該シャワーヘッドの外周部に延びる排気方向制御板が立設され、
前記排気方向制御板は、前記シャワーヘッドの周方向に隣接する排出ガス流路部間に設けられた、ことを特徴とするシャワーヘッド。 - 前記ガスは、異なる種類の複数のガスであり、
前記シャワーヘッドの前記被処理体に対向する側に、異なる種類のガスをそれぞれ供給するガス噴出穴が備えられた、ことを特徴とする請求項1に記載のシャワーヘッド。 - 前記シャワーヘッドは、前記被処理体に対向する側に、当該シャワーヘッドの外周に沿って立設する排気特性制御板を備える、ことを特徴とする請求項1または請求項2に記載のシャワーヘッド。
- 被処理体が配置される処理チャンバと、
前記処理チャンバに備えられ、前記被処理体が載置されるステージと、
前記ステージ上に載置された前記被処理体と対向して備えられ、前記被処理体に対してガスを供給するシャワーヘッドと、を備え、
前記シャワーヘッドの前記被処理体と対向する面には、前記ガスが噴き出さない領域が、当該シャワーヘッドの外周部から当該シャワーヘッドの中心部に延びるように複数備えられ、
前記ガスが噴き出さない領域に挟まれた領域に、前記ガスが噴き出すガス噴出穴が複数形成され、
前記シャワーヘッドの前記被処理体に対向する側に、当該シャワーヘッドの中心部から当該シャワーヘッドの外周部に延びる排気方向制御板が立設され、
前記排気方向制御板は、前記シャワーヘッドの周方向に隣接する排出ガス流路部間に設けられた、ことを特徴とする処理装置。 - 前記ガスは、異なる種類の複数のガスであり、
前記シャワーヘッドの前記被処理体に対向する側に、異なる種類のガスをそれぞれ供給するガス噴出穴が備えられた、ことを特徴とする請求項4に記載の処理装置。 - 前記シャワーヘッドまたは前記処理チャンバに、当該シャワーヘッドの外周に沿って立設する排気特性制御板を備えた、ことを特徴とする請求項4または請求項5に記載の処理装置。
- 前記シャワーヘッドは、前記被処理体と向かい合う側の面が円形であり、
前記処理チャンバには、前記ガスが排出されるスリットが形成された板が、前記シャワーヘッドの外周に沿って、前記被処理体の側面と向かい合うように、備えられ、
前記スリットが形成された板は、前記シャワーヘッドの前記被処理体と向かい合う側の面の中心を軸として回転可能に支持された、ことを特徴とする請求項4から請求項6のいずれか1項に記載の処理装置。
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018122566A JP6575641B1 (ja) | 2018-06-28 | 2018-06-28 | シャワーヘッドおよび処理装置 |
| KR1020217002516A KR102253872B1 (ko) | 2018-06-28 | 2019-02-20 | 샤워 헤드 및 처리 장치 |
| PCT/JP2019/006199 WO2020003591A1 (ja) | 2018-06-28 | 2019-02-20 | シャワーヘッドおよび処理装置 |
| US17/254,481 US11220750B2 (en) | 2018-06-28 | 2019-02-20 | Shower head and processing device |
| TW108109946A TWI731319B (zh) | 2018-06-28 | 2019-03-22 | 噴灑頭及處理裝置 |
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| Application Number | Priority Date | Filing Date | Title |
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| JP2018122566A JP6575641B1 (ja) | 2018-06-28 | 2018-06-28 | シャワーヘッドおよび処理装置 |
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| JP6575641B1 true JP6575641B1 (ja) | 2019-09-18 |
| JP2020004833A JP2020004833A (ja) | 2020-01-09 |
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| US (1) | US11220750B2 (ja) |
| JP (1) | JP6575641B1 (ja) |
| KR (1) | KR102253872B1 (ja) |
| TW (1) | TWI731319B (ja) |
| WO (1) | WO2020003591A1 (ja) |
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| JP6702514B1 (ja) * | 2018-11-30 | 2020-06-03 | 株式会社明電舎 | 酸化膜形成装置 |
| USD1035598S1 (en) * | 2020-09-02 | 2024-07-16 | Applied Materials, Inc. | Gas distribution plate for a semiconductor processing chamber |
| USD1009816S1 (en) * | 2021-08-29 | 2024-01-02 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
| JP7403592B1 (ja) * | 2022-07-08 | 2023-12-22 | 明電ナノプロセス・イノベーション株式会社 | オゾンガス供給システム |
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| US5900103A (en) * | 1994-04-20 | 1999-05-04 | Tokyo Electron Limited | Plasma treatment method and apparatus |
| US5605637A (en) * | 1994-12-15 | 1997-02-25 | Applied Materials Inc. | Adjustable dc bias control in a plasma reactor |
| US5891350A (en) * | 1994-12-15 | 1999-04-06 | Applied Materials, Inc. | Adjusting DC bias voltage in plasma chambers |
| JP2963975B2 (ja) | 1995-06-06 | 1999-10-18 | 工業技術院長 | シリコン酸化膜の形成方法 |
| JP3868020B2 (ja) * | 1995-11-13 | 2007-01-17 | キヤノンアネルバ株式会社 | 遠距離スパッタ装置及び遠距離スパッタ方法 |
| US5788799A (en) * | 1996-06-11 | 1998-08-04 | Applied Materials, Inc. | Apparatus and method for cleaning of semiconductor process chamber surfaces |
| KR100492258B1 (ko) * | 1996-10-11 | 2005-09-02 | 가부시키가이샤 에바라 세이사꾸쇼 | 반응가스분출헤드 |
| JP4217299B2 (ja) * | 1998-03-06 | 2009-01-28 | 東京エレクトロン株式会社 | 処理装置 |
| US6245192B1 (en) * | 1999-06-30 | 2001-06-12 | Lam Research Corporation | Gas distribution apparatus for semiconductor processing |
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| US20210222299A1 (en) | 2021-07-22 |
| JP2020004833A (ja) | 2020-01-09 |
| TWI731319B (zh) | 2021-06-21 |
| KR20210024111A (ko) | 2021-03-04 |
| KR102253872B1 (ko) | 2021-05-20 |
| WO2020003591A1 (ja) | 2020-01-02 |
| US11220750B2 (en) | 2022-01-11 |
| TW202002006A (zh) | 2020-01-01 |
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