JP6406942B2 - Protective tape peeling method and protective tape peeling apparatus - Google Patents

Description

  The present invention relates to a wafer in which a protective tape is integrated by peeling off the release tape after the release tape is attached to a protective tape attached to a circuit forming surface of a semiconductor wafer (hereinafter referred to as “wafer” as appropriate). The present invention relates to a protective tape peeling method and a protective tape peeling device that peels from a tape.

  After the protective tape is applied to the surface of the wafer that has undergone the pattern formation process, the entire back surface is subjected to a back grinding process. The wafer with the protective tape is peeled off from the surface before being transferred to a dicing process in which the wafer is shredded into chips.

  For example, the method of peeling the protective tape from the wafer surface is performed as follows. That is, before peeling off the protective tape, at least a part of the protective tape on the side where the peeling tape is applied is peeled off in advance. Alternatively, after a needle is pierced perpendicularly to the protective tape on the application start side, at least a part of the protective tape is peeled off from the wafer in advance by horizontally moving the needle and the wafer so as to cross each other. That is, the peeling starting point is formed so that the protective tape is easily peeled off.

  After the peeling start point is formed, the protective tape is integrally peeled from the wafer while being peeled by attaching a peeling tape from the peeling starting point (see Patent Document 1).

JP 2007-31735 A

  However, the above conventional method has the following problems.

  In recent years, there has been a demand for thinner wafers in order to enable high-density mounting accompanying rapid progress in applications. In addition, the wafer size tends to increase simultaneously with the reduction in thickness. As the thickness and size of the wafer are reduced, the rigidity of the wafer is lowered, so that the wafer is easily cracked.

  Therefore, in order to reinforce the wafer, various properties such as higher elasticity than the conventionally used protective tape, large elastic limit but low elastic modulus, or thicker than the conventional products with thicker ones. A protective tape having the following is used. When needles are pierced into these protective tapes as in the prior art, there arises a problem that it is not possible to form a separation starting point by separating the protective tape from the wafer. For example, the protective tape is not peeled only by the needle sticking into the adhesive layer. The protective tape is only partially elastically deformed by the needle and is not peeled off. Further, after the needle is removed from the adhesive layer, the adhesive layer returns to its original shape. Further, the protective tape is torn while still attached to the wafer.

  This invention is made | formed in view of such a situation, Comprising: It aims at providing the protective tape peeling method and protective tape peeling apparatus which can peel off a protective tape from the wafer surface accurately.

  In order to achieve such an object, the present invention has the following configuration.

That is, a protective tape peeling method in which the protective tape is attached to the protective tape attached to the surface of the semiconductor wafer, and the protective tape is integrally peeled from the surface of the semiconductor wafer by peeling the release tape,
A first peeling process in which a first peeling member having an opposing surface abutting on the peripheral side surface of the protective tape is pressed against the peripheral side surface, and a part of the peripheral portion of the protective tape is elastically deformed and peeled;
After retracting the first peeling member, the protective tape is peeled off from the semiconductor wafer as a unit by peeling the peeling tape from the elastically deformed portion of the protective tape while applying the peeling tape by the second peeling member. A second peeling process;
Equipped with a,
The first peeling member has an inclined surface from the contact surface with the protective tape to the upper side, and the protective tape that is elastically deformed and peeled by pressing of the first peeling member is placed on the inclined surface. Features.

  (Operation and Effect) According to the above method, the peripheral surface of the protective tape is peeled while being elastically deformed by pressing the contact surface of the first peeling member in contact with the peripheral side surface of the protective tape. The part of the protective tape peeled off in the elastically deformed state has a reduced adhesive force. Therefore, the protective tape can be reliably peeled off from the wafer by peeling while applying the peeling tape starting from the peeling portion. That is, the peeling site | part which becomes a peeling origin can be formed with respect to the protective tape which cannot form a peeling part when the needle of the conventional method is utilized.

  In the above method, the first peeling member has an inclined surface from the contact surface with the protective tape to the upper side, and the protective tape that is elastically deformed and peeled by the pressure of the first peeling member is used as the inclined surface. It may be placed.

  According to this method, when the protective tape peeled from the wafer is placed on the inclined surface, it is possible to suppress the excessive pressing by the first peeling member from acting on the wafer. In other words, the wafer can be prevented from being damaged. Moreover, since the adhesive surface of the peeled protective tape is brought into sliding contact with the inclined surface, the adhesive force can be further reduced. Therefore, it can be avoided that the peeled portion is reattached to the wafer.

  In order to achieve such an object, the present invention has the following configuration.

That is, a protective tape peeling apparatus that peels the protective tape integrally from the surface of the semiconductor wafer by attaching the release tape to the protective tape attached to the surface of the semiconductor wafer and peeling the release tape;
A holding table for mounting and holding the semiconductor wafer;
A peeling tape supply mechanism for supplying a strip-shaped peeling tape toward the semiconductor wafer;
A first peeling member that has a facing surface that comes into contact with the peripheral side surface of the protective tape, presses the facing surface against the peripheral side surface, and peels a part of the protective tape;
A peeling mechanism that peels off the peeling tape from the semiconductor wafer by attaching the peeling tape to the portion peeled by the first peeling member and folding the peeling tape to peel it off from the semiconductor wafer;
A horizontal drive mechanism for horizontally moving the first peeling member and the second peeling member so as to intersect with the holding table;
A tape recovery mechanism for winding and recovering the release tape integrated with the protective tape;
Equipped with a,
The first peeling member has an inclined surface from the contact surface upward .

  (Operation / Effect) According to this configuration, the contact surface of the first peeling member can be pressed while contacting the peripheral surface of the protective tape. Therefore, since it can press in the state which made the 1st peeling member contact the surrounding surface of protection with a large area compared with a needle, it can peel reliably from a semiconductor wafer, elastically deforming a protective tape. Moreover, since the contact force is reduced in the peeled portion that has been elastically deformed, it is possible to reliably start peeling while applying the peeling tape with the second peeling member. That is, the above method can be suitably performed.

  In this configuration, the second peeling member may be configured as follows. For example, the first peeling member has an inclined surface from the contact surface upward. Alternatively, the contact surface of the first peeling member is configured to be concavely curved with the same curvature as that of the semiconductor wafer.

  That is, the protective tape peeled off from the semiconductor wafer during the peeling process of the protective tape is placed on the inclined surface. That is, excessive pressing by the re-peeling member does not act on the protective tape. Therefore, damage to the wafer due to pressing can be suppressed. Further, since the contact surface has a concave curvature with the same curvature as the wafer, the contact surface can be reliably brought into contact with the peripheral side surface of the protective tape. Accordingly, the protective tape can be peeled while being reliably elastically deformed.

  According to the protective tape peeling method and the protective tape peeling apparatus of the present invention, the protective tape can be accurately peeled from the wafer surface.

It is a front view of a protective tape peeling apparatus. It is a top view which shows schematic structure of the principal part of a protective tape peeling apparatus. It is a perspective view of a 1st peeling member. It is a perspective view of a mount frame. It is a figure which shows peeling operation | movement of a protective tape. It is a figure which shows peeling operation | movement of a protective tape. It is a figure which shows peeling operation | movement of a protective tape. It is a figure which shows peeling operation | movement of a protective tape. It is a figure which shows peeling operation | movement of a protective tape. It is a perspective view of the 1st exfoliation member of a modification.

An embodiment of the present invention will be described below with reference to the drawings.
Stop.

  FIG. 1 is a front view showing an overall configuration of a protective tape peeling apparatus according to an embodiment of the present invention, and FIG. 2 is a plan view showing a schematic configuration of a main part of the protective tape peeling apparatus.

  As shown in FIG. 1, the protective tape peeling apparatus includes a holding table 1, a tape supply unit 2, a first peeling mechanism 3, a second peeling mechanism 4, and a tape collecting unit 5.

  As shown in FIG. 2, the holding table 1 is a metal chuck table having a plurality of suction holes 6 on the surface. The holding table 1 is not limited to metal but may be formed of porous ceramic.

  The holding table 1 is supported by a movable table 8 supported so as to be slidable back and forth along a pair of left and right rails 7 arranged horizontally in the front and rear. The movable table 8 is screw-driven by a screw shaft 10 that is driven forward and backward by a pulse motor 9. The rail 7, the movable base 8, the pulse motor 9, the screw shaft 10 and the like constitute the horizontal drive mechanism of the present invention.

  The tape supply unit 2 guides the peeling tape Ts derived from the raw roll to the second peeling unit 21 described later.

  The first peeling mechanism 3 includes a first peeling unit 13 at the lower end of the arm 12 that is cantilevered from the elevator 11. The elevator 11 is supported so as to be slidable up and down via a pair of left and right vertical rails 15 provided on the apparatus base, and is moved up and down by a ball shaft connected and driven by a motor 16.

  The first peeling unit 13 includes a first peeling member 18 attached to the support frame 17. As shown in FIG. 3, the 1st peeling member 18 is comprised with the metal block which has the flat contact surface 19 which contacts the protective tape PT. In the present embodiment, the inclined surface is inclined obliquely downward, but may be a vertical surface. Therefore, the inclined surface is appropriately set in the range of 30 ° to 90 °, for example, according to the characteristics of the protective tape PT used.

  The support frame 17 is connected to the arm via the shaft spring 20 so as to elastically urge upward.

  The 2nd peeling mechanism 4 is comprised from the 2nd peeling unit 21 etc. which can be raised / lowered, as shown in FIG.1 and FIG.2. That is, a support frame 23 made of an aluminum drawing material is fixed across a pair of left and right vertical frames 22 erected on the apparatus base. A box-shaped base 24 is connected to the left and right central portion of the support frame 23. Further, a lifting platform 26 supported so as to be slidable up and down via a pair of left and right vertical rails 25 provided on the base 24 is lifted and lowered by a ball shaft connected and driven by a motor 27. The second peeling unit 21 is equipped on the lifting platform 26.

  The lifting platform 26 is configured in a hollow frame shape penetrating vertically. The 2nd peeling unit 21 is provided in the inner side lower part of the side plate 28 with which the right and left of the raising / lowering stand 26 were equipped. A support frame 29 is fixed across the side plates 28. A second peeling member 30 is attached to the center of the support frame 29.

  The second peeling member 30 has a plate shape shorter than the diameter of the wafer W, and is formed in a tapered shape that tapers toward the tip. The second peeling member 30 is fixed in an obliquely inclined posture.

  In the second peeling mechanism 4, a supply guide roller 31 is pivotally supported behind the side plate 28 so as to freely rotate. A plurality of collection guide rollers 32, nip rollers 33, and tension rollers 34 are disposed above the second peeling unit 21.

  The collection guide roller 32 is pivotally supported so as to be freely rotatable. The tension roller 34 is provided on the support arm 35 so as to be freely rotatable, and is provided so as to be swingable via the support arm 35. Therefore, the tension roller 34 gives an appropriate tension to the peeling tape Ts wound around the guide.

  The collection guide roller 32 and the tension roller 34 are configured as wide rollers having a length larger than the diameter of the wafer W, and the outer peripheral surfaces thereof are hard-to-bond surfaces coated with fluororesin.

  The supply guide roller 31 is configured as a narrow roller that is longer than the width of the peeling tape Ts and shorter than the diameter of the wafer W.

  The tape collecting unit 5 winds and collects the peeling tape Ts with the protective tape PT sent out from the second peeling unit 21.

  Next, one-round operation of the above-described embodiment apparatus will be described with reference to FIGS.

  As shown in FIG. 4, the transfer robot (not shown) is placed on the holding table 1 in the state of a mount frame that is mounted on the ring frame f via the supporting adhesive tape T. The holding table 1 sucks and holds the ring frame f and the wafer W via an adhesive tape.

  At this time, the first peeling unit 13 is lowered to a predetermined height. That is, the contact surface 19 of the first peeling member 18 is lowered to a height at which it contacts only the peripheral side surface of the protective tape PT.

  The holding table 1 starts moving from the standby position toward the application start position of the peeling tape Ts. In the process in which the holding table 1 moves, the second peeling member 30 comes into contact with the peripheral side surface of the protective tape PT as shown in FIG. In this state, it moves a predetermined distance (for example, 2 to 3 mm). At this time, as shown in FIG. 6, the peripheral edge of the protective tape PT is peeled from the surface of the wafer W while being elastically deformed by being pressed in the horizontal direction while being in surface contact with the contact surface 19 of the first peeling member 18. It will be done.

  If a predetermined pressure or more is applied to the protective tape PT during this peeling process, the first peeling unit 13 is slightly swung by the shaft spring 20 that connects and supports the first peeling unit 13. That is, excessive pressing is suppressed from acting on the protective tape PT and the wafer W.

  If a peeling site | part is formed in the peripheral part of the protective tape PT, the 1st peeling member 18 will return to an upper standby position. The holding table 1 moves to the pasting position as it is and stops.

  As shown in FIG. 7, the tip of the second peeling member 30 moves to a position in contact with the peeling portion of the protective tape PT formed by the first peeling member 18. Next, as shown in FIG. 8, the motor 27 operates to lower the second peeling unit 21 to a predetermined height. That is, the peeling tape Ts wound around the second peeling member 30 is pressed and pasted to the peeling site.

  Thereafter, the holding table 1 moves forward as shown in FIG. At this time, the release tape Ts is attached to the protective tape PT by the second release member 30. At the same time, the protective tape PT is integrally peeled from the surface of the wafer W while the peeling tape Ts is folded back by the second peeling member 30. In synchronization with the peeling operation, the peeling tape Ts is fed out from the tape supply unit 2, and the tape collecting unit 5 winds and collects the peeling tape Ts to which the used protective tape PT is attached.

  The wafer W from which the protective tape PT has been peeled moves to the delivery position by the holding table 1.

  This completes one round of the operation of the embodiment device, and thereafter, the same operation is repeated until the predetermined number is reached.

  According to the above-described embodiment device, the peripheral surface of the protective tape PT is pressed by the first peeling member 18 having the contact surface 19 having a larger contact area than the needle, so that the peripheral portion of the protective tape PT is elastically deformed. It can be reliably peeled off. Moreover, the elastic deformation of the peeling site can be maintained.

  In addition, the elastically deformed protective tape PT rides on the inclined surface of the first peeling member 18 when a predetermined pressure or more is applied. In this process, the adhesive surface is brought into sliding contact with the inclined surface, so that the adhesive force is reduced and the tip side can be slightly curled. Therefore, even if the first peeling member 18 is retracted, it can be re-adhered to the wafer W.

  The present invention can also be implemented in the following forms.

(1) In the above embodiment, for example, the first peeling member 18 has a configuration in which the contact surface 19 has a contact surface 19 that is recessed and curved with the same curvature as the curvature of the wafer W, as shown in FIG. May be. According to this configuration, the contact surface 19 contacts the peripheral side surface of the protective tape PT at the same timing.
It is possible to avoid the press acting locally. That is, it is possible to avoid stress due to pressing on the wafer W.

  (2) In the said Example, you may comprise so that the holding table 1 may be fixed and the 1st sticking mechanism 3 and the 2nd sticking mechanism 4 may be moved.

  (3) The above-described embodiment apparatus can also be used to peel the double-sided pressure-sensitive adhesive tape remaining on the wafer side after separating a support plate such as a glass substrate bonded to the wafer with the double-sided pressure-sensitive adhesive tape.

DESCRIPTION OF SYMBOLS 1 ... Holding table 2 ... Tape supply part 3 ... 1st peeling mechanism 4 ... 2nd peeling mechanism 5 ... Tape collection | recovery part 18 ... 1st peeling member 30 ... 2nd peeling member PT ... Protection tape Ts ... Release tape W ... Semiconductor wafer

Claims (3)

A protective tape peeling method in which a protective tape is attached to the surface of a semiconductor wafer, and the protective tape is peeled off integrally from the surface of the semiconductor wafer by peeling the release tape.
A first peeling process in which a first peeling member having an opposing surface abutting on the peripheral side surface of the protective tape is pressed against the peripheral side surface, and a part of the peripheral portion of the protective tape is elastically deformed and peeled;
After retracting the first peeling member, the protective tape is peeled off from the semiconductor wafer as a unit by peeling the peeling tape from the elastically deformed portion of the protective tape while applying the peeling tape by the second peeling member. A second peeling process;
Equipped with a,
The first peeling member has an inclined surface from the contact surface with the protective tape to the upper side, and the protective tape that is elastically deformed and peeled by pressing of the first peeling member is placed on the inclined surface. A method for peeling off a protective tape. A protective tape peeling device for attaching a release tape to a protective tape attached to a surface of a semiconductor wafer and peeling the protective tape integrally from the surface of the semiconductor wafer by peeling the release tape,
A holding table for mounting and holding the semiconductor wafer;
A peeling tape supply mechanism for supplying a strip-shaped peeling tape toward the semiconductor wafer;
A first peeling member that has a facing surface that comes into contact with the peripheral side surface of the protective tape, presses the facing surface against the peripheral side surface, and peels a part of the protective tape;
A peeling mechanism that peels off the peeling tape from the semiconductor wafer by attaching the peeling tape to the portion peeled by the first peeling member and folding the peeling tape to peel it off from the semiconductor wafer;
A horizontal drive mechanism for horizontally moving the first peeling member and the second peeling member so as to intersect with the holding table;
A tape recovery mechanism for winding and recovering the release tape integrated with the protective tape;
Equipped with a,
The protective tape peeling device according to claim 1, wherein the first peeling member has an inclined surface from the contact surface to the upper side . In the protective tape peeling apparatus according to claim 2 ,
The contact surface of the first peeling member is concavely curved with the same curvature as that of the semiconductor wafer.

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